High-precision and small-size module closing automatic detection system

Abstract

A high-precision and small-size module die assembly automatic detection system comprises a conductive contact assembly, a conductive chip assembly and a PLC, the conductive contact assembly is installed on a moving module, and the conductive chip assembly is installed on a fixed module; the conductive contact assembly is provided with two conductive contacts, the two conductive contacts are connected through a wire, and the conductive chip assembly is provided with two conductive chips; in conclusion, the technology of'contact conduction and signal triggering 'is applied, conductive positive and negative electrode contacts are installed on the motion module, a conductive chip is installed on the fixed module, when the motion module moves to a correct position, the conductive contacts make contact with the conductive chip on the fixed module, the conductive chip is conducted, and an OK signal is generated and fed back to the PLC. Therefore, the contact stroke of the control contact and the chip is automatically judged, the conductive contact is of a spring needle structure, it is guaranteed that under the condition that errors exist in module processing and installation, the conductive contact and the conductive chip are conductive, and the detection precision is controlled.

Description

Technical Field

[0001] The utility model belongs to the technical field of mold closing detection, and in particular relates to a high-precision and small-volume module mold closing automatic detection system. Background Art

[0002] The flexible plate bending mechanical modules have the characteristics of large number, small application space, and high movement precision. In particular, the tolerance of the gap between modules has always been one of the biggest problems in the bending industry. It is a major factor that reduces the production yield and efficiency, and it is extremely difficult to be found in advance. The abnormal mold gap directly affects the quality of the products produced. The movement of mechanical modules in the industry is generally driven by cylinders. Magnetic sensors are installed on the cylinders to indirectly determine whether the cylinders are moving. The actual gap of the modules needs to be checked and measured manually on a regular basis. The above method has the following disadvantages: a) The detection accuracy is poor, generally between 0.5-2mm, which cannot meet the module matching accuracy requirements; b) Indirect judgment, can only be judged by the magnetic induction inside the cylinder, and cannot directly judge the movement of the module; c) It occupies a large space and cannot be 100% installed when the bending modules are densely distributed; d) The error rate is high, and manual inspection and measurement are prone to misjudgment, resulting in batch quality risks. Utility Model Content

[0003] The utility model aims to provide a high-precision and small-volume automatic mold detection system for modules, and solves the technical problems of poor precision and high error rate of the existing manual periodic mold clearance inspection.

[0004] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0005] A high-precision and small-volume module mold automatic detection system includes a conductive contact assembly, a conductive chip assembly and a PLC controller, wherein the conductive contact assembly is mounted on a moving module and the conductive chip assembly is mounted on a fixed module;

[0006] The conductive contact assembly has two conductive contacts, which are connected by wires. The conductive chip assembly has two conductive chips, which are located directly below the two conductive contacts respectively. The two conductive chips are connected to the PLC controller via signal lines.

[0007] Furthermore, the conductive contact assembly includes an adapter plate and a connecting plate. The adapter plate is mounted on the motion module by fixing screws, and the connecting plate is fixed to the bottom of the adapter plate by a number of positioning pins and fixing screws. The adapter plate is made of insulating material, and the connecting plate is made of metal conductive material. The two conductive contacts are mounted on the connecting plate.

[0008] Furthermore, the conductive chip assembly includes a chip fixing block, which is fixed to the fixing module by a plurality of fixing screws. The chip fixing block is made of insulating material, and the two conductive chips are mounted on the chip fixing block.

[0009] Furthermore, the conductive chip and the conductive contacts are both made of metal copper.

[0010] Furthermore, the conductive contact is a spring pin structure.

[0011] Furthermore, the adapter plate and the chip mounting block are made of PEEK material, and the connecting plate is made of S45C material.

[0012] Compared with the prior art, the beneficial effects of the utility model are as follows: the utility model uses the "contact conduction, trigger signal" technology, installs conductive positive and negative contacts on the moving module, and installs a conductive chip on the fixed module. When the moving module moves to the correct position, the conductive contacts contact the conductive chip on the fixed module, and the conductive chip is turned on, that is, an OK signal is generated and fed back to the PLC, thereby automatically judging the contact stroke between the control contacts and the chip. The conductive contacts are spring pin structures, which ensure that when there are errors in module processing and installation, the conductive contacts and the conductive chips are conductive to control the detection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0014] Figure 1 This is an exploded view of a high-precision and small-volume module mold automatic detection system of the utility model;

[0015] Figure 2 This is a circuit diagram of a high-precision and small-volume module mold automatic detection system of the utility model;

[0016] Figure 3 It is a state diagram of the conductive chip contacting the conductive contact point when there is a gap between the moving module and the fixed module;

[0017] Figure 4 It is the state in which the conductive contacts are compressed and in contact with the conductive chip when the moving module contacts the fixed module. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] The present invention is further described in detail below in conjunction with the embodiments.

[0020] like Figure 1 and Figure 2 As shown, a specific embodiment 1 of a high-precision and small-volume module mold automatic detection system provided by the utility model:

[0021] A high-precision and small-volume module mold automatic detection system includes a conductive contact assembly, a conductive chip assembly and a PLC controller, wherein the conductive contact assembly is mounted on a motion module 1, and the conductive chip assembly is mounted on a fixed module 2;

[0022] The conductive contact assembly includes an adapter plate 3 and a connecting plate 4. The adapter plate 3 is mounted on the motion module 1 by fixing screws. The connecting plate 4 is fixed to the bottom of the adapter plate 3 by a plurality of positioning pins 5 and fixing screws. The positioning pins 5 are provided to ensure the fixed position accuracy of the connecting plate 4 and the adapter plate 3. The adapter plate 3 is made of an insulating material, and the connecting plate 4 is made of a metal conductive material. Two conductive contacts 6 are provided on the connecting plate 4.

[0023] The conductive chip assembly includes a chip fixing block 7, which is fixed to the fixing module 2 by a plurality of fixing screws. The chip fixing block 7 is made of insulating material. Two conductive chips 8 are arranged on the chip fixing block 7. The two conductive chips 8 are located directly below the two conductive contacts 6. The two conductive chips 8 are connected to the PLC controller through signal lines. Preferably, the conductive chips 8 and the conductive contacts 6 are both made of metal copper, which has good conductive properties. The adapter plate 3 and the chip mounting block are made of PEEK material, and the connecting plate 4 is made of S45C material.

[0024] After the motion module 1 moves into position, the conductive contact 6 contacts and conducts with the conductive chip 8, generating an open circuit signal, which is fed back to the PLC controller as the open circuit signal; when the motion module 1 has not moved into position, the conductive contact 6 has no contact with the conductive chip 8 and cannot conduct, generating a circuit break signal, which is fed back to the PLC controller as the circuit break signal, and the PLC controller automatically determines whether the module has moved into position based on the feedback signal type.

[0025] In addition, the conductive contact 6 is a spring pin structure to solve the cumulative error problem generated during the module processing and installation process, and ensure that the conductive contact 6 can contact the conductive chip 8 and complete the conduction; specifically, when the motion module 1 moves downward until the conductive contact 6 contacts the conductive chip 8, there is a gap of 0.1 mm (such as Figure 3 or the motion module 1 moves downward, and the motion module 1 contacts the fixed module 2 (as shown in FIG. Figure 4 As shown), there is no gap. At this time, the spring needle structure is compressed. In the above state, the conductive contact 6 and the conductive chip 8 are in contact and conductive state. The PLC controller can automatically determine that the module is in the correct position, that is, the mold gap is only within a certain range, the conductive contact 6 and the conductive chip 8 can be conductive, so the detection accuracy is between 0-0.1mm.

[0026] It should be noted that, in this article, terms such as "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0027] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-precision and small-volume module mold automatic detection system, characterized by: It includes a conductive contact assembly, a conductive chip assembly and a PLC controller, wherein the conductive contact assembly is mounted on the motion module and the conductive chip assembly is mounted on the fixed module; The conductive contact assembly has two conductive contacts, which are connected by wires. The conductive chip assembly has two conductive chips, which are located directly below the two conductive contacts respectively. The two conductive chips are connected to the PLC controller via signal lines.

2. According to claim 1, a high-precision and small-volume module mold automatic detection system is characterized by: The conductive contact assembly includes an adapter plate and a connecting plate. The adapter plate is installed on the motion module by fixing screws, and the connecting plate is fixed to the bottom of the adapter plate by a number of positioning pins and fixing screws. The adapter plate is made of insulating material, and the connecting plate is made of metal conductive material. The two conductive contacts are installed on the connecting plate.

3. According to claim 2, a high-precision and small-volume module mold automatic detection system is characterized by: The conductive chip assembly comprises a chip fixing block, which is fixed on the fixing module by a plurality of fixing screws. The chip fixing block is made of insulating material, and the two conductive chips are mounted on the chip fixing block.

4. According to claim 3, a high-precision and small-volume module mold automatic detection system is characterized by: The conductive chip and the conductive contacts are both made of metallic copper.

5. The high-precision and small-volume module mold automatic detection system according to claim 4 is characterized by: The conductive contact is a spring pin structure.

6. The high-precision and small-volume module mold automatic detection system according to claim 5 is characterized by: The adapter plate and the chip mounting block are made of PEEK material, and the connecting plate is made of S45C material.

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