Device for inhibiting deformation of semiconductor lead frame

Abstract

The utility model provides a device for inhibiting deformation of a semiconductor lead frame, and relates to the field of integrated circuits. The device for inhibiting the deformation of the semiconductor lead frame comprises a frame plate, the surface of which is provided with a first identification hole and a second identification hole; a plurality of base islands are uniformly distributed on the surface of the frame plate, the first identification holes are formed between every two base islands in each row of base islands, the second identification holes are formed between every two base islands in each column of base islands, positioning grooves are formed in the middle parts of the base islands, and the first identification holes and the second identification holes are formed in the middle parts of the base islands. A chip groove is formed in the middle of the positioning groove, and pins which are symmetrically distributed are mounted on the outer side surface of the base island; and the thickened frame is fixedly mounted on the outer side of the frame plate. The problem that in the prior art, due to the fact that the number of pins of a semiconductor integrated circuit lead frame is large, positioning installation is not convenient, and the pins are prone to deviation in the installation and use process is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, in particular to a device for suppressing the deformation of a semiconductor lead frame. Background Art

[0002] As the chip carrier of integrated circuits, the lead frame is a key structural component that uses bonding materials to achieve electrical connection between the internal circuit lead ends of the chip and the external leads to form an electrical circuit. It serves as a bridge to connect with external wires. Lead frames are required in most semiconductor integrated blocks and are an important basic material in the electronic information industry.

[0003] Since the semiconductor integrated circuit lead frame has a large number of pins, it is not easy to position and install it, so the pins are easily offset during installation and use. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a device for suppressing the deformation of a semiconductor lead frame, thereby solving the problem in the prior art that the semiconductor integrated circuit lead frame has a large number of pins, which makes it inconvenient to position and install, and thus the pins are easily offset during installation and use.

[0005] The purpose of this disclosure can be achieved through the following technical solutions:

[0006] A device for suppressing deformation of a semiconductor lead frame, comprising:

[0007] A frame plate, wherein a first identification hole and a second identification hole are formed on a surface of the frame plate;

[0008] A base island, a plurality of base islands are evenly arranged on the surface of the frame plate, the first identification hole is arranged between every two base islands in each row of the base islands, the second identification hole is arranged between every two base islands in each column of the base islands, a positioning groove is opened in the middle of the base island, a chip groove is opened in the middle of the positioning groove, and symmetrically distributed pins are installed on the outer side of the base island; and

[0009] A thickened frame is fixedly installed on the outer side of the frame plate.

[0010] The principle and effect of the above technical solution are as follows:

[0011] By setting the first identification hole and the second identification hole and setting a thickened frame at the same time, the deformation or displacement of the entire frame during installation is effectively reduced; at the same time, positioning grooves and chip grooves are set to facilitate the use of the entire device; the problem that the pins of the semiconductor integrated circuit lead frame are prone to displacement during installation and use due to the large number of pins and the inconvenience of positioning and installation is effectively solved.

[0012] Preferably, the positioning groove is provided with second positioning holes distributed at four corners.

[0013] Preferably, fourth identification holes distributed at four corners are provided at the bottom of the chip slot.

[0014] Preferably, a barrier sheet is provided between every two of the pins on the same side of each base island, and the barrier sheet is fixedly mounted on the side of the base island.

[0015] Preferably, a connecting hole is transversely arranged in the middle of the baffle plate, the connecting hole is connected to the side of the base island, and a heat dissipation hole is opened in the baffle plate above the connecting hole, and the heat dissipation hole is through-connected with the connecting hole.

[0016] Preferably, a plurality of evenly distributed third identification holes are provided on the surface of the thickened frame.

[0017] Preferably, a first positioning hole is formed on the surface of the thickened frame located on one side of each of the third identification holes.

[0018] The nouns, conjunctions or adjectives involved in the above technical solution are explained as follows:

[0019] Sliding connection means that two objects are in contact but not fixed, and they can slide relative to each other;

[0020] A fixed connection means that there can be no relative movement between the connecting parts.

[0021] Beneficial effects of the present disclosure:

[0022] The utility model provides a device for suppressing the deformation of a semiconductor lead frame, which solves the problem in the prior art that the semiconductor integrated circuit lead frame has a large number of pins and is inconvenient to position and install, so the pins are prone to offset during installation and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the overall structure of the device for suppressing the deformation of a semiconductor lead frame according to the utility model;

[0024] Figure 2 This is the structural diagram of the frame plate of the utility model;

[0025] Figure 3 This is the base island structure diagram of the utility model;

[0026] Figure 4 This is a diagram showing the internal structure of the baffle plate of the utility model.

[0027] Among them, 100, frame plate; 101, first identification hole; 102, second identification hole; 200, thickened frame; 201, third identification hole; 202, first positioning hole; 300, base island; 310, positioning groove; 311, second positioning hole; 320, chip groove; 321, fourth identification hole; 330, pin; 340, partition plate; 341, connection hole; 342, heat dissipation hole. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] Example

[0030] According to the concept of this application, Figures 1 to 4 An embodiment of a device for suppressing the deformation of a semiconductor lead frame that facilitates frame installation is described below. Specifically, the device for suppressing the deformation of a semiconductor lead frame is constructed as a split structure, which has three components, namely, a frame plate 100, a base island 300, and a thickened frame 200. The device for suppressing the deformation of a semiconductor lead frame is used to suppress the deformation of a semiconductor lead frame.

[0031] Please refer to Figures 1 to 4 , a device for suppressing deformation of a semiconductor lead frame, comprising:

[0032] A frame plate 100, a first identification hole 101 and a second identification hole 102 are formed on the surface of the frame plate 100;

[0033] A plurality of base islands 300 are evenly arranged on the surface of the frame plate 100, a first identification hole 101 is provided between every two base islands 300 in each row of base islands 300, a second identification hole 102 is provided between every two base islands 300 in each column of base islands 300, a positioning groove 310 is provided in the middle of the base island 300, a chip groove 320 is provided in the middle of the positioning groove 310, and symmetrically distributed pins 330 are installed on the outer side of the base island 300; and

[0034] A thickened frame 200 is fixedly installed on the outer side of the frame plate 100 .

[0035] The number of base islands 300 is determined by actual conditions. The base island 300 is mainly used to install the chip structure. At the same time, each base island 300 installed on the frame plate 100 does not affect each other. In some embodiments, the cross-sectional shape of the base island 300 can be set to be square or polygonal. For this application, the cross-sectional shape of the base island 300 is square.

[0036] The thickened frame 200 is mainly used to wrap the side edges of the frame plate 100. Each side edge of the frame plate 100 is wrapped and protected by the thickened frame 200. The cross-sectional shape of the thickened frame 200 is determined by the shape of the frame plate 100. The thickened frame 200 is also provided to improve the stability of the entire frame.

[0037] By providing the first identification hole 101 and the second identification hole 102 and providing the thickened frame 200, deformation or displacement of the entire frame during installation is effectively reduced; and positioning grooves 310 and chip grooves 320 are provided to facilitate the use of the entire device.

[0038] In order to facilitate positioning during installation, the positioning groove 310 is further provided with second positioning holes 311 distributed at four corners.

[0039] To facilitate installation, further, fourth identification holes 321 distributed at four corners are opened at the bottom of the chip slot 320 .

[0040] In order to separate the pins 330 so that the pins 330 are not easily deformed, further, a barrier sheet 340 is provided between every two pins 330 on the same side of each base island 300 , and the barrier sheet 340 is fixedly installed on the side of the base island 300 .

[0041] In order to improve the heat dissipation effect of the chip, further, a connecting hole 341 is arranged horizontally in the middle of the partition plate 340, and the connecting hole 341 is connected to the side of the base island 300. The partition plate 340 located above the connecting hole 341 is provided with a heat dissipation hole 342, and the heat dissipation hole 342 is connected with the connecting hole 341.

[0042] To facilitate installation, further, a plurality of evenly distributed third identification holes 201 are provided on the surface of the thickened frame 200 .

[0043] To facilitate positioning, further, a first positioning hole 202 is provided on the surface of the thickened frame 200 located on one side of each third identification hole 201 .

[0044] The scheme of describing the drawings in sequence is carried out simply based on the examples in the drawings and according to the distribution method of the claims.

[0045] A device for suppressing deformation of a semiconductor lead frame, comprising:

[0046] A frame plate 100, a first identification hole 101 and a second identification hole 102 are formed on the surface of the frame plate 100;

[0047] The base island 300 is evenly arranged on the surface of the frame plate 100. A first identification hole 101 is provided between every two base islands 300 in each row of the base islands 300. A second identification hole 102 is provided between every two base islands 300 in each column of the base islands 300. A positioning groove 310 is provided in the middle of the base island 300. A chip groove 320 is provided in the middle of the positioning groove 310. The outer side of the base island 300 is provided with symmetrically distributed pins 330. The positioning groove 310 is provided with four corners of the second identification hole 101. two positioning holes 311; a fourth identification hole 321 distributed at four corners is opened at the bottom of the chip slot 320; a baffle 340 is arranged between every two pins 330 on the same side of each base island 300, and the baffle 340 is fixedly installed on the side of the base island 300; a connecting hole 341 is arranged across the middle of the baffle 340, and the connecting hole 341 is connected to the side of the base island 300, and a heat dissipation hole 342 is opened on the baffle 340 above the connecting hole 341, and the heat dissipation hole 342 is connected to the connecting hole 341; and

[0048] A thickened frame 200 is fixedly installed on the outside of the frame plate 100; a plurality of evenly arranged third identification holes 201 are opened on the surface of the thickened frame 200, and a first positioning hole 202 is opened on the surface of the thickened frame 200 located on one side of each third identification hole 201.

[0049] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

Claims

1. A device for suppressing deformation of a semiconductor lead frame, characterized in that: include: A frame plate (100), wherein a first identification hole (101) and a second identification hole (102) are formed on a surface of the frame plate (100); A base island (300), wherein a plurality of base islands (300) are evenly arranged on the surface of the frame plate (100), a first identification hole (101) is provided between every two base islands (300) in each row of the base islands (300), a second identification hole (102) is provided between every two base islands (300) in each column of the base islands (300), a positioning groove (310) is provided in the middle of the base island (300), a chip groove (320) is provided in the middle of the positioning groove (310), and symmetrically distributed pins (330) are installed on the outer side of the base island (300); and A thickened frame (200) is fixedly mounted on the outer side of the frame plate (100).

2. The device for suppressing deformation of a semiconductor lead frame according to claim 1, characterized in that: The positioning groove (310) is provided with second positioning holes (311) distributed at four corners.

3. The device for suppressing deformation of a semiconductor lead frame according to claim 2, characterized in that: The bottom of the chip slot (320) is provided with fourth identification holes (321) distributed at four corners.

4. The device for suppressing deformation of a semiconductor lead frame according to claim 1, characterized in that: A barrier sheet (340) is provided between every two pins (330) on the same side of each base island (300), and the barrier sheet (340) is fixedly mounted on the side of the base island (300).

5. The device for suppressing deformation of a semiconductor lead frame according to claim 4, characterized in that: A connecting hole (341) is disposed transversely in the middle of the baffle plate (340), and the connecting hole (341) is connected to the side of the base island (300). A heat dissipation hole (342) is disposed on the baffle plate (340) above the connecting hole (341), and the heat dissipation hole (342) is connected to the connecting hole (341).

6. The device for suppressing deformation of a semiconductor lead frame according to claim 1, characterized in that: The surface of the thickened frame (200) is provided with a plurality of evenly arranged third identification holes (201).

7. The device for suppressing deformation of a semiconductor lead frame according to claim 6, characterized in that: A first positioning hole (202) is provided on the surface of the thickened frame (200) located on one side of each of the third identification holes (201).

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