Semiconductor wafer thickness detection device

Abstract

The utility model relates to a semiconductor wafer thickness detection device which comprises a workbench, the bottom of the workbench is fixedly connected with a supporting plate, the top of the supporting plate is provided with a collecting assembly, the top of the supporting plate is provided with a detection assembly, and the detection assembly comprises a supporting frame fixedly connected to the back face of the workbench. According to the semiconductor wafer thickness detection device, a semiconductor wafer needing to be detected is placed in a placement groove, a motor is started to drive a first gear, a second gear and a placement plate to rotate, the rotating placement plate rotates the wafer to the bottom of a pointer, and a first electric push rod is started to drive a detection head to move downwards; the detection head moving downwards is used in cooperation with the pointer and the graduated scale, the thickness of the wafer can be detected, the wafer is rotated to the top plate through the rotating placement plate, the second electric push rod is started to drive the top plate to move upwards, the wafer can be ejected out, and then a new wafer needing to be detected is placed in the placement groove, so that the effect of continuous operation can be achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a device for detecting the thickness of semiconductor wafers. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion, etc. In the semiconductor manufacturing process, the substrate (wafer) needs to be ground to a specified thickness and then the chips are separated (slicing and cutting process).

[0003] The Chinese patent with the authorization announcement number CN216694746U discloses a semiconductor wafer thickness detection device, which is provided with a reset spring, a protective plate, a limit column, a positioning plate, an adjustment component, a sleeve rod, a measuring rod and a magnifying glass. The device can measure the thickness of the wafer while using the measuring rod and the magnifying glass together to allow the inspector to visually see the wafer thickness, and can prevent damage to the crystal caused by hard collision, thereby ensuring its service life;

[0004] However, the above device has low detection efficiency when in use, and can only detect one semiconductor at a time. After detecting a semiconductor wafer, the detected wafer is removed and another wafer is placed for detection, resulting in low detection efficiency and general practicality. Therefore, a semiconductor wafer thickness detection device is proposed to solve the above problem. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a device for detecting the thickness of a semiconductor wafer, which has the advantages of high detection efficiency and strong practicality, and solves the problems mentioned in the above background technology.

[0006] To achieve the above objectives, the utility model provides the following technical solutions: a device for detecting the thickness of a semiconductor wafer, comprising a workbench, a support plate fixedly connected to the bottom of the workbench, a collecting component arranged on the top of the support plate, and a detection component arranged on the top of the support plate.

[0007] Further, the detection assembly includes a support frame fixedly connected to the back side of the workbench, a first electric push rod fixedly connected to the top of the support frame, a detection head fixedly connected to the bottom of the first electric push rod, a pointer fixedly connected to the right side of the detection head, a scale fixedly connected to the bottom of the support frame, a motor fixedly connected to the top of the support plate, a first gear fixedly connected to the top of the motor, a second gear meshingly connected to the right side of the first gear, a rotating rod fixedly connected to the top of the second gear, a placement plate fixedly connected to the top of the rotating rod, a placement groove is provided inside the placement plate, a top groove is provided inside the placement plate, a second electric push rod is fixedly connected to the top of the support plate, and a top plate is fixedly connected to the top of the second electric push rod.

[0008] Furthermore, the collection assembly includes a collection box that is clamped inside the workbench, and a handle is fixedly connected to the top of the collection box.

[0009] Furthermore, the rotating rod is limited to be rotatably connected to the inside of the workbench, the pointer is located on the left side of the scale, and the pointer is located on the top of the placement plate.

[0010] Furthermore, the cross-sectional shape of the top groove is rectangular, the cross-sectional shape of the top plate is rectangular, and a through groove matching the size of the top plate is provided inside the workbench.

[0011] Furthermore, a limiting rod is fixedly connected to the bottom of the placing plate, a limiting groove is arranged on the top of the workbench, the cross-section of the limiting groove is circular, and the limiting rod is limitedly slidably connected to the inside of the limiting groove.

[0012] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0013] The device for detecting the thickness of semiconductor wafers places a semiconductor wafer to be detected in a placing groove, starts a motor to drive a first gear, a second gear and a placing plate to rotate, the rotating placing plate rotates the wafer to the bottom of a pointer, starts a first electric push rod to drive a detection head to move downward, the detection head moving downward is used in conjunction with a pointer and a scale to detect the thickness of the wafer, the rotating placing plate rotates the wafer to a top plate, starts a second electric push rod to drive the top plate to move upward, the wafer can be ejected, and then a new wafer to be detected is placed in the placing groove to achieve a continuous operation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of the utility model;

[0015] Figure 2 It is a cross-sectional view of the utility model;

[0016] Figure 3 This is a schematic diagram of the internal structure of the placement plate of the utility model.

[0017] In the figure: 1 workbench, 2 support plate, 3 collection component, 301 handle, 302 collection box, 4 detection component, 401 support frame, 402 first electric push rod, 403 detection head, 404 pointer, 405 scale, 406 motor, 407 first gear, 408 second gear, 409 rotating rod, 410 placement plate, 411 placement slot, 412 top slot, 413 limit rod, 414 second electric push rod, 415 top plate, 416 limit slot. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] See also Figure 1-3 In this embodiment, a device for detecting the thickness of a semiconductor wafer includes a workbench 1, a support plate 2 is fixedly connected to the bottom of the workbench 1, a collecting component 3 is arranged on the top of the support plate 2, and a detection component 4 is arranged on the top of the support plate 2.

[0020] Among them, the detection component 4 includes a support frame 401 fixedly connected to the back of the workbench 1, a first electric push rod 402 is fixedly connected to the top of the support frame 401, a detection head 403 is fixedly connected to the bottom of the first electric push rod 402, a pointer 404 is fixedly connected to the right side of the detection head 403, a scale 405 is fixedly connected to the bottom of the support frame 401, the pointer 404 is located on the left side of the scale 405, and the pointer 404 is located on the top of the placement plate 410.

[0021] Secondly, a motor 406 is fixedly connected to the top of the support plate 2, a first gear 407 is fixedly connected to the top of the motor 406, a second gear 408 is meshedly connected to the right side of the first gear 407, a rotating rod 409 is fixedly connected to the top of the second gear 408, the rotating rod 409 is limited to rotation and connected to the inside of the workbench 1, a placing plate 410 is fixedly connected to the top of the rotating rod 409, a placing groove 411 is opened inside the placing plate 410, a top groove 412 is opened inside the placing plate 410, a second electric push rod 414 is fixedly connected to the top of the support plate 2, and a top plate 415 is fixedly connected to the top of the second electric push rod 414.

[0022] In addition, the collecting assembly 3 includes a collecting box 302 that is snap-fitted to the inside of the workbench 1, and a handle 301 is fixedly connected to the top of the collecting box 302. The cross-sectional shape of the top groove 412 is rectangular, and the cross-sectional shape of the top plate 415 is rectangular. A through groove that matches the size of the top plate 415 is provided inside the workbench 1. When the top plate 415 moves upward, the wafer can be pushed upward to facilitate material removal. In this embodiment, a limiting rod 413 is fixedly connected to the bottom of the placement plate 410, and a limiting groove 416 is provided on the top of the workbench 1. The cross-sectional shape of the limiting groove 416 is circular, and the limiting rod 413 is limited to sliding connection inside the limiting groove 416, so that the placement plate 410 can be more stable when rotating.

[0023] The working principle of the above embodiment is:

[0024] The device for detecting the thickness of semiconductor wafers is as follows: a semiconductor wafer to be detected is placed in a placement slot 41; a motor 406 is started to drive a first gear 407, a second gear 408 and a placement plate 410 to rotate; the rotating placement plate 410 rotates the wafer to the bottom of a pointer 404; the first electric push rod 402 is started to drive a detection head 403 to move downward; the detection head 403 moving downward is used in conjunction with the pointer 404 and a scale 405 to detect the thickness of the wafer; the rotating placement plate 410 rotates the wafer to a top plate 415; the second electric push rod 414 is started to drive the top plate 415 to move upward to eject the wafer; and a new wafer to be detected is placed in the placement slot 411 to achieve a continuous operation effect.

[0025] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A device for detecting the thickness of a semiconductor wafer, comprising a workbench (1), characterized in that: The bottom of the workbench (1) is fixedly connected to a support plate (2), the top of the support plate (2) is provided with a collecting component (3), and the top of the support plate (2) is provided with a detecting component (4); The detection assembly (4) comprises a support frame (401) fixedly connected to the back of the workbench (1); a first electric push rod (402) is fixedly connected to the top of the support frame (401); a detection head (403) is fixedly connected to the bottom of the first electric push rod (402); a pointer (404) is fixedly connected to the right side of the detection head (403); a scale (405) is fixedly connected to the bottom of the support frame (401); a motor (406) is fixedly connected to the top of the support plate (2); and a first gear (406) is fixedly connected to the top of the motor (406). (407), the first gear (407) is meshedly connected to the right side with a second gear (408), the second gear (408) is fixedly connected to the top of a rotating rod (409), the top of the rotating rod (409) is fixedly connected to a placement plate (410), a placement groove (411) is provided inside the placement plate (410), a top groove (412) is provided inside the placement plate (410), the top of the support plate (2) is fixedly connected to a second electric push rod (414), and the top of the second electric push rod (414) is fixedly connected to a top plate (415).

2. A semiconductor wafer thickness detection device according to claim 1, characterized in that: The collection assembly (3) comprises a collection box (302) which is clamped inside the workbench (1), and a handle (301) is fixedly connected to the top of the collection box (302).

3. The device for detecting the thickness of a semiconductor wafer according to claim 1, characterized in that: The rotating rod (409) is connected to the inside of the workbench (1) in a limited rotation manner, the pointer (404) is located on the left side of the scale (405), and the pointer (404) is located on the top of the placement plate (410).

4. The device for detecting the thickness of a semiconductor wafer according to claim 1, characterized in that: The cross-sectional shape of the top groove (412) is rectangular, the cross-sectional shape of the top plate (415) is rectangular, and a through groove matching the size of the top plate (415) is provided inside the workbench (1).

5. The device for detecting the thickness of a semiconductor wafer according to claim 1, characterized in that: The bottom of the placement plate (410) is fixedly connected to a limiting rod (413), the top of the workbench (1) is provided with a limiting groove (416), the cross-section of the limiting groove (416) is circular, and the limiting rod (413) is limitedly slidably connected inside the limiting groove (416).

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