Electrocaloric refrigeration element, electrocaloric refrigeration device and refrigeration equipment

Abstract

The utility model relates to the technical field of refrigeration, and discloses an electrocaloric refrigeration element, comprising: an electrocaloric chip capable of alternately generating heat and cold, the electrocaloric chip comprising a first electrocaloric end and a second electrocaloric end opposite to each other; the negative thermal expansion supporting element comprises a first supporting end and a second supporting end which are opposite to each other, the first electric card end is connected with the first supporting end, the second electric card end is connected with the second supporting end, the electric card chip comprises a first heat dissipation surface and a second heat dissipation surface, and the negative thermal expansion supporting element is arranged on the second heat dissipation surface of the electric card chip. The electrocaloric chip releases heat when an electric field is applied, the negative thermal expansion supporting element is heated and shrunk, and the electrocaloric chip deforms. The electrocaloric refrigeration element disclosed by the utility model can alternatively generate deformation or recover shape according to the change of heat and cold, so that cold and hot separation is realized, and the complexity of equipment for cold and hot separation of an electrocaloric chip is simplified. The utility model further provides an electrocaloric refrigeration device and refrigeration equipment.

Description

Technical Field

[0001] The present application relates to the field of refrigeration technology, for example, to an electric card refrigeration element, an electric card refrigeration device and a refrigeration device. Background Art

[0002] Compressor refrigeration equipment uses fluorinated refrigerants, which will produce a greenhouse effect during production and use, and there is a risk of leakage and environmental pollution. With the development of modern society, the huge demand for refrigeration equipment has aggravated the frequent occurrence of global energy crises, extreme high temperature weather and natural disasters. Therefore, a new refrigeration technology is urgently needed to replace the existing refrigeration technology.

[0003] The new solid-state refrigeration technology based on the electrocaloric effect is one of the most likely technologies to replace compressor refrigeration. However, ferroelectric materials do not have the natural hot-cold separation characteristics of thermoelectric materials, so it is necessary to separate the heat and cold generated by the electrocaloric material to achieve refrigeration applications.

[0004] In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art:

[0005] Generally speaking, the electric card refrigeration system includes: a hot end heat exchanger, a cold end heat exchanger, an electric card material module, a fluid pumping system, an electric field generator and a shell. The electric card material module is arranged in the shell. When the electric field is applied, the electric card material generates heat. At this time, a spray device is used to spray a fluid heat exchange medium to the electric card material. After the fluid heat exchange medium receives the heat, the temperature rises. Then, the high-temperature heat exchange medium is pumped to the hot end heat exchanger through the pumping system to separate the heat generated by the electric card material; when the electric field is removed, the electric card material generates cold. At this time, a spray device is used to spray a fluid heat exchange medium to the electric card material. After the fluid heat exchange medium receives the cold, the temperature drops. Then, the low-temperature heat exchange medium is pumped to the cold end heat exchanger through the pumping system to separate the cold generated by the electric card material.

[0006] However, in the process of realizing the hot and cold separation of electric card materials in the existing electric card refrigeration system, the separation equipment is relatively complicated.

[0007] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0008] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0009] An embodiment of the present disclosure provides an electric card refrigeration element.

[0010] In some embodiments, the electric card cooling element includes: an electric card chip that can alternately generate heat and cold, the electric card chip including a first electric card end and a second electric card end relative to each other; and a negative thermal expansion support element, including a first support end and a second support end relative to each other, and the first electric card end is connected to the first support end, and the second electric card end is connected to the second support end, wherein the electric card chip includes a first heat dissipation surface and a second heat dissipation surface, and the negative thermal expansion support element is arranged on the second heat dissipation surface of the electric card chip, and the electric card chip releases heat when an electric field is applied, the negative thermal expansion support element shrinks due to the heat, and the electric card chip deforms.

[0011] In some optional embodiments, the negative thermal expansion support element comprises a plurality of interconnected reverse chiral units.

[0012] In some optional embodiments, the backhand unit includes: a central connecting node; and a plurality of bi-material bending rods, each bi-material bending rod including a first connecting end connected to the central connecting node, and a second connecting end opposite to the first connecting end, wherein the second connecting end is provided with an end connecting node.

[0013] In some optional embodiments, the negative thermal expansion support element further includes a third support end and a fourth support end relative to each other, wherein a plurality of end connection nodes of the third support end are connected to the first connecting rod, and a plurality of end connection nodes of the fourth support end are connected to the second connecting rod.

[0014] In some optional embodiments, the dual-material bending rod includes a first high thermal conductivity material bending rod and a second high thermal conductivity material bending rod connected to each other, wherein the first high thermal conductivity material bending rod is arranged on the outside of the second high thermal conductivity material bending rod, and the thermal expansion coefficient of the first high thermal conductivity material bending rod is greater than the thermal expansion coefficient of the second high thermal conductivity material bending rod.

[0015] In some optional embodiments, the electric card cooling element further includes: a thermally conductive adhesive layer, which is disposed between the second heat dissipation surface of the electric card chip and the negative thermal expansion support element.

[0016] The disclosed embodiment also provides an electric card cooling device.

[0017] In some optional embodiments, the electric card cooling device includes: a heat-conducting shell, which encloses a sealed electric card accommodating space, the heat-conducting shell includes a heat receiving side plate and a cold receiving side plate, and a preset distance is set between the heat receiving side plate and the cold receiving side plate; and, an electric card cooling element, which is arranged in the electric card accommodating space, and the negative thermal expansion support element of the electric card cooling element is attached to the cold receiving side plate, the electric card chip of the electric card cooling element releases heat when an electric field is applied, the negative thermal expansion support element shrinks due to the heat, and the electric card chip is deformed, so that the first heat dissipation surface of the electric card chip is attached to the heat receiving side plate, wherein the electric card cooling element is the aforementioned electric card cooling element.

[0018] In some optional embodiments, the heat receiving side plate of the heat conductive shell is an arc-shaped plate, and the concave side of the arc-shaped plate faces the cold receiving side plate; and / or the cold receiving side plate of the heat conductive shell is a flat plate.

[0019] The embodiment of the present disclosure also provides a refrigeration device.

[0020] In some optional embodiments, the refrigeration equipment includes: a refrigerated box body, which encloses a storage cavity; and an electric card refrigeration device, which is arranged in the refrigerated box body, and the cold receiving side plate of the electric card refrigeration device faces the inside of the storage cavity, and the heat receiving side plate of the electric card refrigeration device is exposed to the outside of the refrigerated box body, wherein the electric card refrigeration device is the electric card refrigeration device as described above.

[0021] In some optional embodiments, the refrigeration device further includes: a first fan, disposed in the storage cavity; and / or a second fan, disposed at a heat receiving end of the electric card refrigeration device.

[0022] The electric card refrigeration element, electric card refrigeration device and refrigeration equipment provided by the embodiments of the present disclosure can achieve the following technical effects:

[0023] The electric card refrigeration element includes an electric card chip and a negative thermal expansion support element connected to both ends of the electric card chip. The electric card chip can generate heat and cold alternately, and when the electric card chip generates heat, the negative thermal expansion support element contracts due to heat. Since the electric card chip is connected to both ends of the negative thermal expansion support element, the electric card chip is subjected to the squeezing force of the two ends of the negative thermal expansion support element during the contraction process, causing the electric card chip to deform.

[0024] It can be seen that in the electric card cooling element provided by the embodiment of the present disclosure, the negative thermal expansion support element attached to the bottom of the electric card chip can cause the electric card chip to deform when heat is generated. Based on the deformation of the electric card chip, the heat generated by the electric card chip can be separated, which greatly simplifies the hot and cold separation process of the electric card chip.

[0025] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Devices with the same reference numerals in the drawings are shown as similar devices, and the drawings do not constitute a scale limitation, and wherein:

[0027] Figure 1 is a schematic diagram of an electric card refrigeration element provided by an embodiment of the present disclosure;

[0028] Figure 2 is a schematic diagram of a reverse chirality unit provided by an embodiment of the present disclosure;

[0029] Figure 3 is a schematic diagram of another reverse chirality unit provided by an embodiment of the present disclosure;

[0030] Figure 4 is a schematic diagram of a negative thermal expansion support element provided by an embodiment of the present disclosure;

[0031] Figure 5 is a schematic diagram of another electric card cooling element provided by an embodiment of the present disclosure;

[0032] Figure 6 is a schematic diagram of another electric card cooling element provided by an embodiment of the present disclosure;

[0033] Figure 7 is a schematic diagram of an electric card cooling device provided by an embodiment of the present disclosure;

[0034] Figure 8 It is a schematic diagram of hot and cold separation of an electric card refrigeration device provided by an embodiment of the present disclosure;

[0035] Fig. 9 It is a schematic diagram of a refrigeration device provided in an embodiment of the present disclosure.

[0036] Reference numerals:

[0037] 1: electrical card chip; 101: first electrical card terminal; 102: second electrical card terminal;

[0038] 2: negative thermal expansion support element; 201: first support end; 202: second support end; 21: reverse chirality unit; 211: center connection node; 212: end connection node; 213: first high thermal conductivity material bending rod; 214: second high thermal conductivity material bending rod;

[0039] 31: first connecting rod; 41: second connecting rod;

[0040] 5: Refrigerated box;

[0041] 61: heat receiving side plate; 62: cold receiving side plate. DETAILED DESCRIPTION

[0042] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0043] The terms "first", "second", etc. in the specification and claims of the disclosed embodiments and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate to describe the disclosed embodiments here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0044] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, components or components to have a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0045] In addition, the terms "disposed", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to the specific circumstances.

[0046] Unless otherwise stated, the term "plurality" means two or more.

[0047] The term "and / or" is a description of the association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.

[0048] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

[0049] The electrocaloric effect is a hot-cold effect of ferroelectric materials under an electric field. It releases heat when an electric field is applied and absorbs heat when the electric field is removed. Ferroelectric thin films apply high electric fields through electrodes on both sides to stimulate the periodic electrocaloric effect. The electrocaloric chip is a component based on the electrocaloric effect, which releases heat to generate heat when an electric field is applied and absorbs heat to generate cold when the electric field is removed.

[0050] The present disclosure provides an electric card cooling element, such as Figures 1 to 6 shown.

[0051] Optionally, the electric card cooling element includes an electric card chip 1 and a negative thermal expansion support element 2. The electric card chip 1 can generate heat and cold alternately, and the electric card chip 1 includes a first electric card end 101 and a second electric card end 102. The negative thermal expansion support element 2 includes a first support end 201 and a second support end 202, and the first electric card end 101 is connected to the first support end 201, and the second electric card end 102 is connected to the second support end 202, wherein the electric card chip 1 includes a first heat dissipation surface and a second heat dissipation surface, and the negative thermal expansion support element 2 is arranged on the second heat dissipation surface of the electric card chip 1. When an electric field is applied, the electric card chip 1 releases heat, the negative thermal expansion support element 2 shrinks due to heat, and the electric card chip 1 is deformed.

[0052] The second heat dissipation surface of the electric card chip 1 of the electric card refrigeration element provided in the embodiment of the present disclosure is provided with a negative thermal expansion support element 2, and the first support end 201 and the second support end 202 of the negative thermal expansion support element 2 are respectively connected to the first electric card end 101 and the second electric card end 102 of the electric card chip 1, and the third support end and the fourth support end of the negative thermal expansion support element 2 may not be connected to the electric card chip 1. The electric card chip 1 releases heat when an electric field is applied, and the negative thermal expansion support element 2 shrinks after being heated, and its size is reduced, and the distance between the first support end 201 and the second support end 202 is reduced, thereby causing the electric card chip 1 to deform. The deformed electric card chip 1 is roughly arc-shaped, such as Figure 5 shown.

[0053] Optionally, the electric card material adopts inorganic thin film ferroelectric material, which has a large adiabatic temperature change, a wide ferroelectric phase change temperature range and a low driving voltage, so it can realize refrigeration applications with a wide temperature range and a large temperature difference.

[0054] Optionally, a clamp or glue is used to connect the first electrical card end 101 to the first support end 201 , and the second electrical card end 102 to the second support end 202 .

[0055] Optionally, the distance between the first electric card end 101 and the second electric card end 102 is the length of the electric card chip 1, and the distance between the first support end 201 and the second support end 202 is the length of the negative thermal expansion support element 2. Optionally, when the negative thermal expansion support element 2 is not heated, or when the electric card chip 1 is not subjected to an electric field, the length of the electric card chip 1 is equal to the length of the negative thermal expansion support element 2, such as Figure 1 In this way, the electric card chip 1 can be deformed after the negative thermal expansion support element 2 shrinks due to heat.

[0056] The electric card refrigeration element provided in the embodiment of the present disclosure can realize the deformation of the electric card chip 1 through the negative thermal expansion support element 2 arranged on the second heat dissipation surface of the electric card chip 1. When the electric field is applied, the electric card chip 1 generates heat, the negative thermal expansion support element 2 shrinks due to the heat, and the electric card chip 1 is deformed. The deformed electric card chip 1 can fit with the heat receiving side plate 61, thereby realizing the heat separation of the electric card chip 1; when the electric field is removed, the electric card chip 1 generates cold energy, the shape of the negative thermal expansion support element 2 is restored, and the shape of the electric card chip 1 is restored accordingly. The electric card chip 1 after the shape recovery fits with the cold energy receiving side plate 62, thereby realizing the cold energy separation of the electric card chip 1.

[0057] It can be seen that the electric card refrigeration element provided in the embodiment of the present disclosure can deform with the change of heat and cold, and then alternately separate the heat and cold, without the need to spray heat exchange medium, which greatly simplifies the structural equipment of the hot and cold separation of the electric card refrigeration element.

[0058] Optionally, the negative thermal expansion support element 2 comprises a plurality of interconnected reverse chirality units 21, such as Figures 1 to 4 shown.

[0059] The reverse chiral unit 21 in the negative thermal expansion support element 2 can produce counterintuitive abnormal deformation under the action of physical fields such as force and heat, such as the negative thermal expansion phenomenon of thermal contraction and cold expansion. In the embodiment of the present disclosure, a plurality of reverse chiral units 21 with the negative thermal expansion phenomenon of thermal contraction and cold expansion are interconnected and arranged periodically to obtain a negative thermal expansion support element 2 with the negative thermal expansion phenomenon. Every two or more adjacent reverse chiral units 21 are interconnected to form a complete and continuous negative thermal expansion support element 2.

[0060] Optionally, the backhand unit 21 includes a central connection node 211 and a plurality of bi-material bending rods. The plurality of bi-material bending rods each include a first connection end connected to the central connection node 211 and a second connection end opposite to the first connection end, wherein the second connection end is provided with an end connection node 212.

[0061] Adjacent anti-chiral units 21 are connected via end connection nodes 212. Optionally, the central connection nodes 211 and / or the end connection nodes 212 are both square.

[0062] Optionally, each bi-material bending rod has a shape of a quarter circle, a straight line or other irregular shapes. Optionally, the shapes and lengths of the plurality of bi-material bending rods in the reverse chirality unit 21 are equal. Optionally, four bi-material bending rods are evenly connected to each central connection node 211.

[0063] Optionally, the negative thermal expansion support element 2 further includes a third support end and a fourth support end. The plurality of end connection nodes 212 of the third support end are connected to the first connecting rod 31, and the plurality of end connection nodes 212 of the fourth support end are connected to the second connecting rod 41. Figure 4 shown.

[0064] The distance between the third support end and the fourth support end is the width of the negative thermal expansion support element 2. Similarly, the electric card chip 1 also includes a third electric card end and a fourth electric card end, and the distance between the third electric card end and the fourth electric card end is the width of the electric card chip 1. Optionally, the width of the electric card chip 1 is equal to the width of the negative thermal expansion support element 2.

[0065] Optionally, the multiple backhandedness units 21 include multiple end connection nodes 212 located at the third support end, and the multiple end connection nodes 212 located at the third support end are all connected to the first connection rod 31. Similarly, the multiple backhandedness units 21 include multiple end connection nodes 212 located at the fourth support end, and the multiple end connection nodes 212 located at the fourth support end are all connected to the second connection rod 41. The arrangement of the first connection rod 31 and the second connection rod 41 can enable the negative thermal expansion support element 2 to deform after being heated, and the first connection rod 31 and the second connection rod 41 can provide fixed support points for the third support end and the fourth support end respectively.

[0066] Optionally, the extended lengths of the multiple end connection nodes 212 located at the third support end are equal, so that the shape of the first connecting rod 31 can be linear, and the linear first connecting rod 31 can be used to connect the multiple end connection nodes 212 located at the third support end; similarly, the extended lengths of the multiple end connection nodes 212 located at the fourth support end are equal, so that the shape of the second connecting rod 41 can also be linear, and the linear second connecting rod 41 can be used to connect the multiple end connection nodes 212 located at the fourth support end. The electric card refrigeration element after heating presents as follows Figure 5 The structure shown.

[0067] Optionally, the third support end and the fourth support end may not be provided with the first connecting rod 31 and the second connecting rod 41, so that after the negative thermal expansion support element 2 is heated, the entire negative thermal expansion support element 2 is deformed. That is, the first support end 201, the second support end 202, the third support end and the fourth support end of the negative thermal expansion support element 2 are deformed, so that the negative thermal expansion support element 2 is bent as a whole and supports the electric card chip 1 to deform. After being heated, the electric card refrigeration element presents as follows Figure 6 It is understandable that in order to distinguish the electric card chip 1 and the negative thermal expansion support element 2, Figure 6 There is a gap between the electric card chip 1 and the negative thermal expansion support element 2 in the figure, but in actual products, there may be no gap between the electric card chip 1 and the negative thermal expansion support element 2.

[0068] Optionally, the dual-material bent rod includes a first high thermal conductivity material bent rod 213 and a second high thermal conductivity material bent rod 214 connected to each other, wherein the first high thermal conductivity material bent rod 213 is arranged on the outside of the second high thermal conductivity material bent rod 214, and the thermal expansion coefficient of the first high thermal conductivity material bent rod 213 is greater than the thermal expansion coefficient of the second high thermal conductivity material bent rod 214.

[0069] The first high thermal conductivity material curved rod 213 is located outside the second high thermal conductivity material curved rod 214. It can be understood that the second high thermal conductivity material curved rod 214 is curved in an arc shape, and the first high thermal conductivity material curved rod 213 is attached to the convex side of the second high thermal conductivity material curved rod 214. Optionally, the first high thermal conductivity material curved rod 213 is attached to the entire convex side of the second high thermal conductivity material curved rod 214. Optionally, the first high thermal conductivity material curved rod 213 and the second high thermal conductivity material curved rod 214 have the same curvature.

[0070] Optionally, the central connection node 211 and / or the end connection node 212 are made of the same material as the first high thermal conductivity material bent rod 213 .

[0071] Optionally, the electric card cooling element further includes a thermally conductive adhesive layer, which is disposed between the second heat dissipation surface of the electric card chip 1 and the negative thermal expansion support element 2, thereby improving the connection stability between the second heat dissipation surface of the electric card chip 1 and the negative thermal expansion support element 2.

[0072] The disclosed embodiment also provides an electric card cooling device.

[0073] Optionally, the electric card cooling device provided in the embodiment of the present disclosure includes a heat-conducting shell and an electric card cooling element. The heat-conducting shell encloses a closed electric card accommodation space, and the heat-conducting shell includes a heat receiving side plate 61 and a cold receiving side plate 62, and a preset distance is set between the heat receiving side plate 61 and the cold receiving side plate 62. The electric card cooling element is arranged in the electric card accommodation space, and the negative thermal expansion support element 2 of the electric card cooling element is attached to the cold receiving side plate 62, the electric card chip 1 of the electric card cooling element releases heat when an electric field is applied, the negative thermal expansion support element 2 shrinks due to the heat, the electric card chip 1 is deformed, and the first heat dissipation surface of the electric card chip 1 is attached to the heat receiving side plate 61, wherein the electric card cooling element is the aforementioned electric card cooling element.

[0074] Optionally, the heat-conducting housing is rectangular and sealed. Optionally, the heat receiving side plate 61 and the cold receiving side plate 62 of the heat-conducting housing are made of highly thermally conductive insulating materials, such as aluminum nitride, etc., to enhance the heat transfer performance between the electric card chip 1 and the heat receiving side plate 61 and the cold receiving side plate 62.

[0075] The electric card refrigeration element uses a clamp, glue, etc. to fix the two ends of the electric card refrigeration element to the inner wall of the cold receiving side plate 62 of the heat conductive housing. Optionally, the first electric card end 101 and the first support end 201 of the electric card refrigeration element are fixed to one end of the inner wall of the cold receiving side plate 62, and the second electric card end 102 and the second support end 202 of the electric card refrigeration element are fixed to the other end of the inner wall of the cold receiving side plate 62. Optionally, the negative thermal expansion support element 2 of the electric card refrigeration element is attached to the inner wall of the cold receiving side plate 62.

[0076] The schematic diagram of the heat and cold separation process of the electric card refrigeration device provided in the embodiment of the present disclosure can be found in Figure 8 .

[0077] S1, the initial state of the electric card refrigeration device, the negative thermal expansion support element 2 of the electric card refrigeration element is attached to the inner wall of the cold receiving side plate 62.

[0078] S2, when an electric field is applied to the electric card chip 1, the temperature of the electric card chip 1 increases, and the negative thermal expansion support element 2 contracts, causing the electric card chip 1 to deform. The deformed electric card chip 1 is partially or completely attached to the heat receiving side plate 61 of the heat-conducting shell, thereby realizing the heat transfer of the electric card chip 1.

[0079] S3, after the heat dissipation of the electric card chip 1 is completed, the temperature decreases, the shape of the negative thermal expansion support element 2 is restored, and the shape of the electric card chip 1 is restored accordingly. At this time, the electric card refrigeration element is attached to the cold receiving side plate 62 of the heat conductive housing.

[0080] S4, when the electric field of the electric card chip 1 is removed, the electric card chip 1 generates cold energy and is attached to the cold energy receiving side plate 62, thereby realizing the cold energy transfer of the electric card chip 1.

[0081] It can be seen that the electric card refrigeration device provided in the embodiment of the present disclosure achieves the separation of heat and cold by only utilizing the deformation of the electric card refrigeration element itself.

[0082] Optionally, a preset distance is set between the heat receiving side plate 61 and the cold receiving side plate 62, and the maximum deformation distance of the electric card chip 1 is the deformation distance, wherein the preset distance is less than or equal to the deformation distance, so that the first heat dissipation surface of the deformed electric card chip 1 can be at least partially attached to the heat receiving side plate 61 of the heat conductive shell.

[0083] Optionally, the heat receiving side plate 61 of the heat conducting housing is an arc-shaped plate, and the concave side of the arc-shaped plate faces the cold receiving side plate 62, and / or the cold receiving side plate 62 of the heat conducting housing is a flat plate.

[0084] The arc-shaped heat receiving side plate 61 increases the contact area between the electric card chip 1 and the heat receiving side plate 61 when the electric field is applied, thereby improving the heat conduction effect between the electric card chip 1 and the heat receiving side plate 61. Similarly, the cold receiving side plate 62 is in the shape of a flat plate, which increases the contact area between the electric card chip 1 and the cold receiving side plate 62 when the electric field is removed, thereby improving the heat conduction effect between the electric card chip 1 and the cold receiving side plate 62.

[0085] The embodiment of the present disclosure also provides a refrigeration device.

[0086] The refrigeration device provided in the embodiment of the present disclosure includes a refrigeration box 5 and an electric card refrigeration device. The refrigeration box 5 encloses a storage cavity, and the electric card refrigeration device is arranged in the refrigeration box 5, and the cold receiving side plate 62 of the electric card refrigeration device faces the inside of the storage cavity, and the heat receiving side plate 61 of the electric card refrigeration device is exposed to the outside of the refrigeration box 5, wherein the electric card refrigeration device is the aforementioned electric card refrigeration device.

[0087] The refrigeration device provided in the embodiment of the present disclosure can directly mount the electric card refrigeration device on the cold storage body 5, and the cold receiving side plate 62 of the electric card refrigeration device faces the inner side of the storage cavity, which is used to cool the storage cavity, and the heat receiving side plate 61 of the electric card refrigeration device is exposed to the outer side of the cold storage body 5 to dissipate the heat generated by the electric card chip 1.

[0088] Optionally, a plurality of electric card refrigeration devices are provided on the cold storage box 5, so as to increase the total amount of refrigeration in the storage cavity of the refrigeration equipment. Optionally, the plurality of electric card refrigeration devices are cross-electrically applied or de-electrically applied, for example, the plurality of electric card refrigeration devices include a first group of electric card refrigeration devices and a second group of electric card refrigeration devices, the first group of electric card refrigeration devices are electric-applied, and the second group of electric card refrigeration devices are de-electrically applied, so that the plurality of electric card refrigeration devices can continuously refrigerate the storage cavity.

[0089] Optionally, the refrigeration device further includes a first fan and / or a second fan. The first fan is arranged in the storage cavity, for example, the first fan is arranged on the inner side of the top plate of the refrigeration box 5, so that the low-temperature air inside the storage cavity can be convected, thereby improving the temperature uniformity between various positions inside the storage cavity. The second fan is arranged at the heat receiving end of the electric card refrigeration device, thereby improving the heat dissipation effect on the hot end of the electric card refrigeration device, thereby improving the refrigeration efficiency of the electric card refrigeration device.

[0090] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An electric card refrigeration element, characterized in that: include: The electric card chip can alternately generate heat and cold, and the electric card chip includes a first electric card end and a second electric card end opposite to each other; and, The negative thermal expansion support element comprises a first support end and a second support end opposite to each other, wherein the first electric card end is connected to the first support end, and the second electric card end is connected to the second support end. Among them, the electric card chip includes a first heat dissipation surface and a second heat dissipation surface, and the negative thermal expansion support element is arranged on the second heat dissipation surface of the electric card chip. When the electric field is applied, the electric card chip releases heat, the negative thermal expansion support element shrinks due to the heat, and the electric card chip deforms.

2. The electric card refrigeration element according to claim 1, characterized in that: The negative thermal expansion support element includes a plurality of interconnected reverse chiral units.

3. The electric card refrigeration element according to claim 2, characterized in that: The backhandedness unit includes: Central connecting nodes; and, A plurality of bi-material bending rods, each of which comprises a first connection end connected to a central connection node, and a second connection end opposite to the first connection end, Wherein, the second connection end is provided with an end connection node.

4. The electric card refrigeration element according to claim 3, characterized in that: The negative thermal expansion support element further includes a third support end and a fourth support end opposite to each other. Wherein, a plurality of end connection nodes of the third support end are connected to the first connection rod, and a plurality of end connection nodes of the fourth support end are connected to the second connection rod.

5. The electric card refrigeration element according to claim 3, characterized in that: The double-material curved rod comprises a first high-thermal-conductivity curved rod and a second high-thermal-conductivity curved rod connected to each other. The first high thermal conductivity material bent rod is arranged outside the second high thermal conductivity material bent rod, and the thermal expansion coefficient of the first high thermal conductivity material bent rod is greater than the thermal expansion coefficient of the second high thermal conductivity material bent rod.

6. The electric card refrigeration element according to any one of claims 1 to 5, characterized in that: Also includes: The heat-conducting adhesive layer is arranged between the second heat dissipation surface of the electric card chip and the negative thermal expansion supporting element.

7. An electric card refrigeration device, characterized in that: include: A heat-conducting shell encloses a sealed electric card accommodating space, wherein the heat-conducting shell includes a heat receiving side plate and a cold receiving side plate, and a preset distance is set between the heat receiving side plate and the cold receiving side plate; and, The electric card cooling element is arranged in the electric card accommodating space, and the negative thermal expansion support element of the electric card cooling element is attached to the cold receiving side plate. When the electric field is applied, the electric card chip of the electric card cooling element releases heat, the negative thermal expansion support element shrinks due to heat, and the electric card chip is deformed, so that the first heat dissipation surface of the electric card chip is attached to the heat receiving side plate. Wherein, the electric card refrigeration element is the electric card refrigeration element described in any one of claims 1 to 6.

8. The electric card refrigeration device according to claim 7, characterized in that: The heat receiving side plate of the heat conducting housing is an arc-shaped plate, and the concave side of the arc-shaped plate faces the cold receiving side plate; and / or, The cold receiving side plate of the heat-conducting shell is a flat plate.

9. A refrigeration device, characterized in that: include: A refrigerated box body encloses a storage cavity; and, The electric card refrigeration device is arranged in the refrigeration box, and the cold receiving side plate of the electric card refrigeration device faces the inner side of the storage cavity, and the heat receiving side plate of the electric card refrigeration device is exposed to the outer side of the refrigeration box. Wherein, the electric card refrigeration device is the electric card refrigeration device as described in claim 7 or 8.

10. The refrigeration device according to claim 9, characterized in that: Also includes: A first fan is disposed in the storage cavity; and / or, The second fan is arranged at the heat receiving end of the electric card refrigeration device.

Images