Electrocaloric refrigeration element, electrocaloric refrigeration device and refrigeration equipment

Abstract

The utility model relates to the technical field of refrigeration, and discloses an electrocaloric refrigeration element which comprises a first electrocaloric material and a second electrocaloric material. The first electrocaloric material is provided with a first electrode, the first electrode is used for being connected with a first potential, the second electrocaloric material is provided with a second electrode, the second electrode is used for being connected with a second potential, and the first potential is larger than the second potential, so that the first electrocaloric material and the second electrocaloric material release heat and are bent and deformed under the action of an applied electric field. The electrocaloric refrigeration element disclosed by the utility model can be alternatively deformed or recovered in shape according to the change of heat and cold, so that cold and hot separation is realized, and the complexity of equipment for cold and hot separation of the electrocaloric refrigeration element is simplified. The utility model further provides an electrocaloric refrigeration device and refrigeration equipment.

Description

Technical Field

[0001] The present application relates to the field of refrigeration technology, for example, to an electric card refrigeration element, an electric card refrigeration device and a refrigeration device. Background Art

[0002] At present, compressor refrigeration equipment such as refrigerators or air conditioners are filled with fluorine-containing refrigerants. During the production and use process, they will produce a greenhouse effect and there is a risk of leakage and pollution of the environment. With the development of modern society, the huge demand for refrigeration equipment has aggravated the frequent occurrence of global energy crises, extreme high temperature weather and natural disasters. Therefore, it is necessary to develop a new refrigeration technology to replace the existing compressor refrigeration technology.

[0003] Among the many compressor-free refrigeration technologies, the new solid-state refrigeration technology based on the electrocaloric effect is one of the technologies most likely to replace compressor refrigeration. However, ferroelectric materials do not have the natural hot-cold separation characteristics of thermoelectric materials, so it is necessary to separate the heat and cold generated by the electrocaloric material to achieve refrigeration applications.

[0004] In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art:

[0005] Generally speaking, an electric card refrigeration system includes an electric card refrigeration element, a first heat exchange component and a second heat exchange component, wherein the first heat exchange component and the second heat exchange component operate alternately to respectively extract heat or cold from the electric card refrigeration element. It can be seen that the existing electric card refrigeration system has a relatively complex separation method in the process of realizing the separation of heat and cold of electric card materials.

[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0007] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0008] An embodiment of the present disclosure provides an electric card refrigeration element.

[0009] In some embodiments, the electric card cooling element includes: a first electric card material, provided with a first electrode, and the first electrode is used to connect to a first electric potential; and, a second electric card material, provided with a second electrode, and the second electrode is used to connect to a second electric potential. When an electric field is applied, the first electric card material and the second electric card material release heat and bend and deform, wherein the first electric potential is greater than the second electric potential, or the first electric card material is different from the second electric card material.

[0010] By applying different electric potentials to the first electrocaloric material and the second electrocaloric material, or the first electrocaloric material and the second electrocaloric material are of different types, the electrocaloric refrigeration element undergoes a bending phase change while releasing heat when an electric field is applied, and recovers its shape after the electric field is removed. In this way, the electrocaloric refrigeration element itself is deformed or recovered alternately when an electric field is applied and removed, and heat and cold are alternately extracted, which simplifies the complexity of hot and cold separation of the electrocaloric refrigeration element and is conducive to the miniaturization and integration of refrigeration equipment.

[0011] In some optional embodiments, the potential difference between the first potential and the second potential is a first potential difference, wherein the first potential difference is positively correlated with the degree of bending deformation of the first electrocaloric material and the second electrocaloric material.

[0012] In some optional embodiments, the thickness of the first electrocaloric material is a first thickness m1, and the thickness of the second electrocaloric material is a second thickness m2, wherein a ratio of the first thickness m1 to the second thickness m2 is M, and 0.8≤M≤1.2.

[0013] In some optional embodiments, the electric card refrigeration element further includes: a third electrode, disposed between the first electric card material and the second electric card material, wherein the third electrode is used for grounding.

[0014] In some optional embodiments, the first electrocaloric material and the second electrocaloric material include a multilayer ceramic electrocaloric material, wherein under the action of an electric field, one end of the multilayer ceramic electrocaloric material warps in a thickness direction.

[0015] In some optional embodiments, the first electric card material includes at least two layers of electric card material, and the first electrode is arranged between the two layers of electric card material; and / or the second electric card material includes at least two layers of electric card material, and the second electrode is arranged between the two layers of electric card material.

[0016] An embodiment of the present disclosure provides an electric card cooling device.

[0017] In some embodiments, the electric card cooling device includes: a heat-conductive shell, which encloses a closed electric card accommodating space, the heat-conductive shell includes a heat receiving side plate and a cold receiving side plate; and, an electric card cooling element, which is arranged in the electric card accommodating space and attached to the cold receiving side plate, and the first electric card material and the second electric card material of the electric card cooling element release heat and bend and deform under the action of an electric field, and the deformed electric card cooling element can be attached to the heat receiving side plate, wherein the electric card cooling element is the aforementioned electric card cooling element.

[0018] In some optional embodiments, the heat receiving side plate of the heat conductive shell is an arc-shaped plate with one end being warped; and / or, the cold receiving side plate of the heat conductive shell is a flat plate.

[0019] An embodiment of the present disclosure provides a refrigeration device.

[0020] In some embodiments, the refrigeration equipment includes: a refrigerated box body, which encloses a storage cavity; and an electric card refrigeration device, which is arranged in the refrigerated box body, and the cold receiving side plate of the electric card refrigeration device faces the inside of the storage cavity, and the heat receiving side plate of the electric card refrigeration device is exposed to the outside of the refrigerated box body, wherein the electric card refrigeration device is the electric card refrigeration device as described above.

[0021] In some optional embodiments, the refrigeration device further includes: a first fan, disposed in the storage cavity; and / or a second fan, disposed on one side of the heat receiving side plate of the electric card refrigeration device.

[0022] The electric card refrigeration element, electric card refrigeration device and refrigeration equipment provided by the embodiments of the present disclosure can achieve the following technical effects:

[0023] The electric card cooling element provided by the embodiment of the present disclosure includes a first electric card material and a second electric card material, and the first electric card material is applied with a first potential through a first electrode, and the second electric card material is applied with a second potential through a second electrode, and the first potential is higher than the second potential. That is, the first electric card material is connected to a high potential, and the second electric card material is connected to a low potential. In this way, after an electric field is applied to the first electric card material and the second electric card material, the temperature rises due to the electric caloric effect. In addition, the electric card material also has a reverse piezoelectric effect, and can be deformed under the action of an electric field. Because the first electric card material is subjected to a high electric field, the positive strain generated in the thickness direction of the first electric card material is greater than that of the second electric card material, and the negative strain generated in the length direction or the width direction is greater. In this way, the electric card cooling element provided by the embodiment of the present disclosure not only releases heat under the action of an electric field, but also produces bending deformation.

[0024] It can be seen that in the electric card cooling element provided by the embodiment of the present disclosure, based on the deformation of the first electric card material and the second electric card material themselves, bending deformation can occur when the electric field is applied, and the deformation can be restored when the electric field is removed. In this way, the heat and cold generated by the electric card cooling element can be separated by utilizing the alternating deformation or recovery of the electric card cooling element when the electric field is applied and removed, which greatly simplifies the hot and cold separation process of the electric card cooling element.

[0025] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Devices with the same reference numerals in the drawings are shown as similar devices, and the drawings do not constitute a scale limitation, and wherein:

[0027] Figure 1 is a schematic diagram of an electric card refrigeration element provided by an embodiment of the present disclosure;

[0028] Figure 2 is a schematic diagram of another electric card cooling element provided by an embodiment of the present disclosure;

[0029] Figure 3 is a schematic diagram of another electric card cooling element provided by an embodiment of the present disclosure;

[0030] Figure 4 is a schematic diagram of another electric card cooling element provided by an embodiment of the present disclosure;

[0031] Figure 5 It is a schematic diagram of hot and cold separation of an electric card refrigeration device provided by an embodiment of the present disclosure;

[0032] Figure 6 It is a schematic diagram of a refrigeration device provided in an embodiment of the present disclosure.

[0033] Reference numerals:

[0034] 001: horizontal baseline;

[0035] 1: Electric card cooling element; 101: Warped end;

[0036] 11: first electric card material; 12: second electric card material; 111: first external high potential electric card material; 112: second external high potential electric card material; 121: first external low potential electric card material; 122: second external low potential electric card material;

[0037] 13: first electrode; 14: second electrode; 15: third electrode;

[0038] 21: heat receiving side plate; 22: cold receiving side plate;

[0039] 3: Refrigerated box. DETAILED DESCRIPTION

[0040] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0041] The terms "first", "second", etc. in the specification and claims of the disclosed embodiments and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate to describe the disclosed embodiments here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0042] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, components or components to have a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0043] In addition, the terms "disposed", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to the specific circumstances.

[0044] Unless otherwise stated, the term "plurality" means two or more.

[0045] The term "and / or" is a description of the association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.

[0046] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

[0047] The electrocaloric effect is a hot and cold effect of ferroelectric materials under an electric field. It releases heat when an electric field is applied and absorbs heat when the electric field is removed. Ferroelectric thin films apply high electric fields through electrodes on both sides to stimulate the periodic electrocaloric effect. Electrocaloric cooling elements are based on the electrocaloric effect. They release heat to generate heat when an electric field is applied and absorb heat to generate cold when the electric field is removed.

[0048] The embodiment of the present disclosure provides an electric card cooling element 1, such as Figures 1 to 4 shown.

[0049] The electric card refrigeration element 1 provided in the embodiment of the present disclosure includes a first electric card material 11 and a second electric card material 12. The first electric card material 11 is provided with a first electrode 13, and the first electrode 13 is used to connect to a first potential, and the second electric card material 12 is provided with a second electrode 14, and the second electrode 14 is used to connect to a second potential. Under the action of an electric field, the first electric card material 11 and the second electric card material 12 release heat and bend and deform. Wherein, the first potential is greater than the second potential, or the first electric card material 11 is different from the second electric card material 12.

[0050] The first electric potential is greater than the second electric potential, so that the first electric card material 11 and the second electric card material 12 release heat and bend under the action of the electric field.

[0051] The disclosed embodiment provides a self-driven electric card refrigeration element 1 , which greatly simplifies the hot and cold separation method of the electric card refrigeration element 1 .

[0052] Optionally, the first electrocard material 11 can be an inorganic ferroelectric multilayer thick film, and similarly, the second electrocard material 12 can also be an inorganic ferroelectric multilayer thick film. Among them, the inorganic ferroelectric multilayer thick film can also be called a multilayer ceramic capacitor film layer (Multi-Layer Ceramic Capacitor, MLCC). The inorganic ferroelectric multilayer thick film has a large adiabatic temperature change and breakdown field strength, a wide ferroelectric phase change temperature range, a low driving voltage, and can generate a larger amount of cold, so it can achieve refrigeration applications with a wide temperature range and a large temperature difference.

[0053] Optionally, the first electrocaloric material 11 and / or the second electrocaloric material 12 can be selected as a multilayer ceramic capacitor film layer whose composition is lead scandium tantalate PST. Optionally, the composition can also be selected from other high electrocaloric effect ferroelectric materials such as lead lanthanum zirconate titanate PLZT and lead zirconate titanate PZT.

[0054] Optionally, the first electrocard material 11 and the second electrocard material 12 may also be made of different electrocard materials. Since the two different electrocard materials have different inverse piezoelectric effects, the MLCC can be deformed by applying the same electric field or potential, which simplifies the complexity of the power supply equipment, that is, a single-channel power supply is sufficient.

[0055] The electric card cooling element 1 provided in the embodiment of the present disclosure includes a first electric card material 11 and a second electric card material 12, and the first electric card material 11 is connected to a first potential through a first electrode 13, and the second electric card material 12 is connected to a second potential through a second electrode 14, and the first potential is higher than the second potential. It can be understood that the first potential and the second potential are both positive potentials. That is, in the embodiment of the present disclosure, the first electric card material 11 is connected to a high potential, and the second electric card material 12 is connected to a low potential. In this way, after an electric field is applied to the first electric card material 11 and the second electric card material 12, the temperature rises due to the electrocaloric effect. In addition, the electric card material also has a reverse piezoelectric effect, and can be deformed under the action of an electric field. Because the first electric card material 11 is subjected to a high electric field, the positive strain generated in the thickness direction of the first electric card material 11 is greater than that of the second electric card material 12, and the negative strain generated in the length direction or the width direction is greater. In this way, the electric card cooling element 1 provided in the embodiment of the present disclosure not only releases heat under the action of an electric field, but also produces bending deformation.

[0056] Optionally, the thickness direction can be Figure 3 The z direction in the figure, the length direction can be Figure 3 The x direction in the width direction can be Figure 3 In the y direction. Optionally, the positive strain is an expansion strain, and the negative strain is a contraction strain. Optionally, the bending deformation can be a warping deformation at one end.

[0057] It can be seen that in the electric card cooling element 1 provided in the embodiment of the present disclosure, the heat generated by the electric card cooling element can be separated based on the deformation of the first electric card material 11 and the second electric card material 12 themselves, which greatly simplifies the hot and cold separation process of the electric card cooling element 1.

[0058] Optionally, the electrode slurry can be printed onto the ceramic diaphragm by screen printing. Optionally, a wire can be connected to the electrode so that the power supply energizes the electric card cooling element 1 to apply a high potential to the first electric card material 11 and a low potential to the second electric card material 12.

[0059] Optionally, the electric card refrigeration element 1 is a rectangular parallelepiped, such as Figure 3 It can be understood that the shape of the electric card cooling element 1 is obtained by cutting a large blank during the manufacturing process, and the embodiment of the present disclosure does not impose too many restrictions on the shape of the electric card cooling element 1.

[0060] Optionally, the potential difference between the first potential and the second potential is a first potential difference, wherein the first potential difference is positively correlated with the bending deformation degree of the first electrocaloric material 11 and the second electrocaloric material 12 .

[0061] The greater the first potential difference between the electric potentials applied by the first electric card material 11 and the second electric card material 12, the greater the warping degree of the first electric card material 11 and the second electric card material 12. Optionally, the warping degree of the first electric card material 11 and the second electric card material 12 can be increased by increasing the first potential difference, thereby improving the close fit between the electric card refrigeration element 1 and the heat receiving side plate 21, thereby improving the heat extraction effect generated when the electric field is applied to the electric card refrigeration element 1.

[0062] Optionally, the thickness of the first electric card material 11 is the first thickness m1, and the thickness of the second electric card material 12 is the second thickness m2, wherein the ratio of the first thickness m1 to the second thickness m2 is M, and 0.8≤M≤1.2. The warping degree of the first electric card material 11 and the second electric card material 12 is related to the thickness of the first electric card material 11 and the second electric card material 12. Further, when M approaches 1, the warping degree of the first electric card material 11 and the second electric card material 12 is large.

[0063] Optionally, the electric card cooling element 1 further includes a third electrode 15. The third electrode 15 is disposed between the first electric card material 11 and the second electric card material 12, and the third electrode 15 is used for grounding. Optionally, a horizontal wire is connected to the third electrode 15 to ground the third electrode 15, and the upper and lower wires are respectively connected to positive potentials of different magnitudes.

[0064] Optionally, as mentioned above, the first electrocaloric material 11 and the second electrocaloric material 12 include a multilayer ceramic electrocaloric material, wherein one end of the multilayer ceramic electrocaloric material warps in the thickness direction under the action of an electric field. Under the action of an electric field, the multilayer ceramic electrocaloric material includes a warped end 101 that is warped, that is, one end is warped, and the warped electrocaloric cooling element 1 is roughly in the shape of an arc with one end bent. Figure 3 and Figure 4 shown.

[0065] Optionally, the first electric card material 11 includes at least two electric card material layers, and the first electrode 13 is arranged between the two electric card material layers; and / or the second electric card material 12 includes at least two electric card material layers, and the second electrode 14 is arranged between the two electric card material layers.

[0066] In order to increase the cooling capacity of the electric card refrigeration element 1, the number of layers of the first electric card material 11 and the second electric card material 12 can be increased. For example, the first electric card material 11 includes two layers, namely, the first external high-potential electric card material 111 and the second external high-potential electric card material 112, and the second electric card material 12 also includes two layers, namely, the first external low-potential electric card material 121 and the second external low-potential electric card material 122. In this way, a high electric field can be applied to the external high-potential electric card material located in the upper two layers, and a low electric field can be applied to the external low-potential electric card material located in the lower two layers, which generates bending deformation while releasing heat. Optionally, the material type and thickness of the first external high-potential electric card material 111 and the second external high-potential electric card material 112 are the same. Similarly, the material type and thickness of the first external low-potential electric card material 121 and the second external low-potential electric card material 122 are the same.

[0067] The disclosed embodiment also provides an electric card cooling device.

[0068] Optionally, the electric card cooling device provided in the embodiment of the present disclosure includes a heat-conducting shell and an electric card cooling element 1. The heat-conducting shell encloses a closed electric card accommodation space, and the heat-conducting shell includes a heat receiving side plate 21 and a cold receiving side plate 22. The electric card cooling element 1 is arranged in the electric card accommodation space and attached to the cold receiving side plate 22. Moreover, the first electric card material 11 and the second electric card material 12 of the electric card cooling element 1 release heat and bend under the action of an electric field, and the deformed electric card cooling element 1 can be attached to the heat receiving side plate 21, wherein the electric card cooling element 1 is the electric card cooling element 1 as described above.

[0069] Optionally, the heat-conducting housing is sealed. Optionally, the heat receiving side plate 21 and the cold receiving side plate 22 of the heat-conducting housing are made of highly thermally conductive insulating materials, such as aluminum nitride, etc., to enhance the heat transfer performance between the electric card refrigeration element 1 and the heat receiving side plate 21 and the cold receiving side plate 22.

[0070] The two ends of the electric card cooling element 1 can be fixed to the inner wall of the cold receiving side plate 22 of the heat conductive housing by using a clamp, glue, etc. Optionally, one side of the second electric card material of the electric card cooling element 1 is fixed to the inner wall of the cold receiving side plate 22.

[0071] The schematic diagram of the heat and cold separation process of the electric card refrigeration device provided in the embodiment of the present disclosure can be found in Figure 5 .

[0072] S1, the initial state of the electric card refrigeration device, one side of the second electric card material of the electric card refrigeration element 1 is attached to the inner wall of the cold receiving side plate 22.

[0073] S2, when an electric field is applied to the electric card cooling element 1, the temperature of the electric card cooling element 1 rises and releases heat. At the same time, one end of the electric card cooling element 1 generates a bending deformation toward the heat receiving side plate 21. The deformed electric card cooling element 1 is partially or completely attached to the heat receiving side plate 21 of the heat conductive shell, thereby realizing the heat transfer of the electric card cooling element 1.

[0074] S3, after the electric card refrigeration element 1 has finished dissipating heat, the temperature drops and the shape is restored, and the shape of the electric card refrigeration element 1 is restored accordingly. At this time, the electric card refrigeration element 1 removes the electric field, the electric card refrigeration element 1 generates cold energy, and is attached to the cold energy receiving side plate 22, so that the cold energy of the electric card refrigeration element 1 is transferred out.

[0075] It can be seen that the electric card refrigeration device provided in the embodiment of the present disclosure achieves the separation of heat and cold by only utilizing the deformation of the electric card refrigeration element 1 itself.

[0076] Optionally, a preset distance is provided between the heat receiving side plate 21 and the cold receiving side plate 22, so that the deformed electric card refrigeration element 1 can be attached to the heat receiving side plate 21. Optionally, the electric card refrigeration element 1 includes a warped end 101 and a starting end opposite to the warped end 101, wherein the preset distance between the heat receiving side plate 21 and the cold receiving side plate 22 gradually increases from the starting end to the warped end 101.

[0077] Optionally, the heat receiving side plate of the heat conductive housing is an arc-shaped plate with one end warped. The size, shape, warping curvature and other specific structures of the arc-shaped plate can be designed according to the warping degree of the electric card cooling element 1 when the electric field is applied, so as to improve the degree of fit between the electric card cooling element 1 and the heat receiving side plate when the electric field is applied. The contact area between the electric card cooling element 1 and the heat receiving side plate 21 is increased when the electric field is applied, and the heat conduction effect between the electric card cooling element 1 and the heat receiving side plate 21 is improved.

[0078] Optionally, the cold receiving side plate 22 of the heat conducting housing is a flat plate, which increases the contact area between the electric card refrigeration element 1 and the cold receiving side plate 22 when the electric field is removed, thereby improving the heat conduction effect between the electric card refrigeration element 1 and the cold receiving side plate 22.

[0079] The embodiment of the present disclosure also provides a refrigeration device.

[0080] The refrigeration device provided in the embodiment of the present disclosure includes a refrigeration box 3 and an electric card refrigeration device. The refrigeration box 3 encloses a storage cavity, and the electric card refrigeration device is arranged in the refrigeration box 3, and the cold receiving side plate 22 of the electric card refrigeration device faces the inside of the storage cavity, and the heat receiving side plate 21 of the electric card refrigeration device is exposed to the outside of the refrigeration box 3, wherein the electric card refrigeration device is the aforementioned electric card refrigeration device.

[0081] The refrigeration device provided in the embodiment of the present disclosure can directly mount the electric card refrigeration device on the cold storage box body 3, and the cold receiving side plate 22 of the electric card refrigeration device faces the inner side of the storage cavity, which is used to cool the storage cavity, and the heat receiving side plate 21 of the electric card refrigeration device is exposed to the outer side of the cold storage box body 3 to dissipate the heat generated by the electric card refrigeration element 1.

[0082] Optionally, a plurality of electric card refrigeration devices are provided on the cold storage box 3, so as to increase the total amount of refrigeration in the storage cavity of the refrigeration equipment. Optionally, multiple electric card refrigeration devices are cross-electrically applied or de-electrically applied, for example, the multiple electric card refrigeration devices include a first group of electric card refrigeration devices and a second group of electric card refrigeration devices, and the first group of electric card refrigeration devices are electric-applied, while the second group of electric card refrigeration devices are de-electrically applied, so that the multiple electric card refrigeration devices can continuously refrigerate the storage cavity.

[0083] Optionally, the refrigeration device further includes a first fan and / or a second fan. The first fan is arranged in the storage cavity, for example, the first fan is arranged on the inner side of the top plate of the refrigeration box body 3, so that the low-temperature air inside the storage cavity can be convected, thereby improving the temperature uniformity between various positions inside the storage cavity. The second fan is arranged on one side of the heat receiving side plate of the electric card refrigeration device, thereby improving the heat dissipation effect on the hot end of the electric card refrigeration device, thereby improving the refrigeration efficiency of the electric card refrigeration device.

[0084] The electric card refrigeration element 1 provided in the embodiment of the present disclosure realizes hot and cold separation by applying different electric fields to different electric card material layers and utilizing the inverse piezoelectric effect generated by the MLCC itself when the power is turned on and off. There is no need to add other heat exchange systems, thus reducing energy consumption and facilitating miniaturization and integrated applications.

[0085] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An electric card refrigeration element, characterized in that: include: A first electrocaloric material is provided with a first electrode, and the first electrode is used to connect to a first potential; and, The second electrocaloric material is provided with a second electrode, and the second electrode is used to connect a second electric potential. When an electric field is applied, the first electrocaloric material and the second electrocaloric material release heat and bend and deform. The first electric potential is greater than the second electric potential, or the first electrocaloric material is different from the second electrocaloric material.

2. The electric card refrigeration element according to claim 1, characterized in that: The potential difference between the first potential and the second potential is a first potential difference, The first potential difference is positively correlated with the bending deformation degree of the first electrocaloric material and the second electrocaloric material.

3. The electric card refrigeration element according to claim 1, characterized in that: The thickness of the first electrical card material is a first thickness m1, the thickness of the second electrical card material is a second thickness m2, The ratio of the first thickness m1 to the second thickness m2 is M, and 0.8≤M≤1.

2.

4. The electric card refrigeration element according to any one of claims 1 to 3, characterized in that: Also includes: The third electrode is disposed between the first electrocaloric material and the second electrocaloric material, The third electrode is used for grounding.

5. The electric card refrigeration element according to claim 4, characterized in that: The first electrocard material and the second electrocard material include a multilayer ceramic electrocard material, Among them, under the action of the electric field, one end of the multilayer ceramic electric card material warps in the thickness direction.

6. The electric card refrigeration element according to claim 4, characterized in that: The first electrocardial material comprises at least two electrocardial material layers, and the first electrode is disposed between the two electrocardial material layers; and / or, The second electrocaloric material comprises at least two electrocaloric material layers, and the second electrode is arranged between the two electrocaloric material layers.

7. An electric card refrigeration device, characterized in that: include: The heat-conducting shell encloses a sealed electric card accommodating space, and the heat-conducting shell includes a heat receiving side plate and a cold receiving side plate; and, The electric card cooling element is arranged in the electric card accommodating space and attached to the cold receiving side plate. The first electric card material and the second electric card material of the electric card cooling element release heat and bend under the action of the electric field. The deformed electric card cooling element can be attached to the heat receiving side plate. Wherein, the electric card refrigeration element is the electric card refrigeration element described in any one of claims 1 to 6.

8. The electric card refrigeration device according to claim 7, characterized in that: The heat receiving side plate of the heat conducting housing is an arc-shaped plate with one end being warped; and / or, The cold receiving side plate of the heat-conducting shell is a flat plate.

9. A refrigeration device, characterized in that: include: A refrigerated box body encloses a storage cavity; and, The electric card refrigeration device is arranged in the refrigeration box, and the cold receiving side plate of the electric card refrigeration device faces the inner side of the storage cavity, and the heat receiving side plate of the electric card refrigeration device is exposed to the outer side of the refrigeration box. Wherein, the electric card refrigeration device is the electric card refrigeration device as described in claim 7 or 8.

10. The refrigeration device according to claim 9, characterized in that: Also includes: A first fan is disposed in the storage cavity; and / or, The second fan is arranged on one side of the heat receiving side plate of the electric card refrigeration device.

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