Computer case with fan-shaped heat dissipation air ducts

By designing fan-shaped cooling air duct components in the computer chassis, the problem of insufficient heat dissipation design of traditional chassis is solved, and the board is stable to avoid the problem of excessive temperature. It is simple to design and low cost.

CN222636581UActive Publication Date: 2025-03-18SHANGHAI ZHEFEI ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202421358229.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-14
Publication Date
2025-03-18
Estimated Expiration
2034-06-14

AI Technical Summary

Technical Problem

The heat dissipation design of traditional computer chassis is insufficient and cannot effectively deal with the concentrated area of ​​high heat generation, resulting in the continuous increase in the board temperature, affecting performance stability and possibly causing hardware failures.

Method used

A computer case with a fan-shaped cooling air duct is designed. By fixing the installation of the fan-shaped air duct assembly in the side panel, the bottom is connected to the lower ventilation groove, the top is connected to the upper ventilation groove, and the fan is connected to the upper ventilation groove through the top cover, achieving rapid discharge of hot air.

Benefits of technology

It effectively improves the heat dissipation performance of the chassis, ensures the stable operation of the board, and avoids the problem of excessive board operating temperature caused by insufficient heat dissipation. It has a simple design and low production cost.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The utility model relates to a computer case with a fan-shaped heat dissipation air duct, which comprises a case body, the case body comprises a top cover, a front panel, a rear panel, a base and a side plate, a fan is arranged on the outer side of the top cover, and a lower ventilation slot and an upper ventilation slot are arranged on the outer side of the side plate; the bottom of the fan-shaped air duct assembly is communicated with the lower ventilation groove, the top of the fan-shaped air duct assembly is communicated with the upper ventilation groove, and the fan penetrates through the top cover to be communicated with the upper ventilation groove. According to the utility model, the vertically dispersed heat dissipation air channels are changed into the fan-shaped heat dissipation air channels which are concentrated at the fan of the case to enhance heat dissipation, so that hot air can be quickly blown out, the heat dissipation of the board card can be stably performed, and the problem that the operation temperature of the board card is too high due to insufficient heat dissipation of the case body can be solved.
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