Conductive film, pole piece, battery and electric equipment

Abstract

The utility model discloses a conductive film, a pole piece, a battery and electric equipment. The conductive film comprises a base film layer, a first metal layer, a second metal layer and an isolation removal layer. In the first direction, the base film layer comprises a first surface and a second surface; the first metal layer is arranged on the first surface; the second metal layer is arranged on the second surface; the isolation removal layer is arranged on at least one of the surface, deviating from the base film layer, of the first metal layer and the surface, deviating from the base film layer, of the second metal layer, and is removed before the conducting film executes the next preparation process. The utility model at least solves the problem that the conductive film is easy to delaminate due to the fact that the metal layers are easy to adhere in the production process of the conductive film.

Description

Technical Field

[0001] The utility model relates to the technical field of conductive films, and in particular to a conductive film, a pole piece, a battery and electrical equipment. Background Art

[0002] At present, the composite current collector mainly includes a base film layer and a metal layer disposed on two opposite sides of the base film layer. In actual preparation, the preparation process of the composite current collector generally includes the following methods:

[0003] 1) One-step forming by vacuum magnetron sputtering or thermal evaporation;

[0004] 2) Two-step forming by vacuum magnetron sputtering or evaporation or thermal evaporation coating + water electroplating coating;

[0005] 3) The three-step forming process is magnetron sputtering coating + thermal evaporation coating + water electroplating coating.

[0006] When the current collector is prepared by two-step or three-step molding, the current collector with a thinner metal layer needs to be wound on a winding roller and then transferred from the previous process to the next process. Since the metal layers on both sides of the base film after the roll-to-roll coating are prone to sticking to each other, the adhesion between the metal layer and the base film layer fails during the unwinding process, resulting in a delamination defect of the current collector. Utility Model Content

[0007] The main purpose of the utility model is to provide a conductive film, an electrode, a battery and an electrical device, which at least solves the problem that metal layers are easily adhered to each other during the production process of the conductive film, thereby easily causing delamination of the conductive film.

[0008] According to one aspect of the utility model, there is provided a conductive film, comprising:

[0009] A base film layer, along a first direction, the base film layer comprises a first surface and a second surface;

[0010] a first metal layer, the first metal layer being disposed on the first surface;

[0011] a second metal layer, the second metal layer being disposed on the second surface;

[0012] An isolation removal layer is disposed on at least one of a surface of the first metal layer facing away from the base film layer and a surface of the second metal layer facing away from the base film layer, and is removed before the conductive film is subjected to a next preparation process.

[0013] Furthermore, the isolation removal layer includes a metal layer or a compound layer whose material is different from that of the first metal layer and the second metal layer.

[0014] Furthermore, the isolation removal layer includes a structural layer having a melting point lower than a melting point of the first metal layer and / or the second metal layer.

[0015] Furthermore, the isolation removal layer includes at least one of a magnesium layer, an aluminum layer, a zinc layer, a tin layer, a calcium layer, a silver layer, a lead layer, a cadmium layer, a bismuth layer, a tellurium layer and their corresponding alloy layers and a boron trioxide layer.

[0016] Further, along the first direction, the thickness D1 of the isolation removal layer, the thickness D2 of the first metal layer, the thickness D3 of the base film layer, and the thickness D4 of the second metal layer satisfy the relationship:

[0017] D1:D2=1 / 500~3 / 2; and / or,

[0018] D2:D3=1 / 800-1 / 20; and / or,

[0019] D1:D3=1 / 40000~3 / 400.

[0020] Further, along the first direction, the thickness D1 of the isolation removal layer is 0.2 nm to 10 nm; and / or,

[0021] The thickness D2 of the first metal layer is 5 nm to 100 nm; and / or,

[0022] The thickness D3 of the base film layer is 2.0 μm to 8 μm; and / or,

[0023] The thickness D4 of the second metal layer is 5 nm to 100 nm.

[0024] Further, the first metal layer and the second metal layer both include a copper layer; and / or,

[0025] The base film layer includes at least one of a polypropylene layer, a polyethylene terephthalate layer, a polyethylene layer, a polyamide layer, a polyimide layer, a polyphenylene ether layer, a polyvinyl chloride layer, an ABS plastic layer, a poly(p-phenylene terephthalamide) layer, a polyoxymethylene layer, a polytetrafluoroethylene layer, a polyvinylidene fluoride layer, a polycarbonate layer, a polyvinyl alcohol layer, a polyethylene glycol layer and a cellulose layer.

[0026] Furthermore, a third metal layer is provided between the base film layer and the first metal layer, and a fourth metal layer is provided between the base film layer and the second metal layer.

[0027] Furthermore, the third metal layer or the fourth metal layer includes at least one of a chromium layer, a chromium alloy layer, a chromium alloy oxide layer, a nitride layer, a nitride oxide layer, a titanium layer, a titanium alloy oxide layer, a silicon oxide layer, a copper layer, and a copper alloy layer.

[0028] On the other hand, the utility model further provides a pole piece, which comprises the above-mentioned conductive film.

[0029] In a third aspect, the utility model further provides a battery, comprising the above-mentioned electrode piece.

[0030] In a fourth aspect, the utility model further provides an electrical device, wherein the electrical device comprises the above-mentioned battery.

[0031] In the present invention, since an isolation removal layer is provided on the surface of the first metal layer away from the base film layer or the surface of the second metal layer away from the base film layer, when the conductive film is rolled up, the first metal layer and the second metal layer can be isolated by the isolation removal layer, and the first metal layer and the second metal layer will not stick to each other. When the wound conductive film is unwound, the first metal layer or the second metal layer will not detach from the base film layer, which can solve the problem of delamination of the conductive film during the preparation process. At the same time, the isolation removal layer in the present invention can be removed before the next preparation process of the conductive film, for example, before the first metal layer and the second metal layer are thickened, which will not affect the preparation of the conductive film, and can not only improve the yield and production efficiency in the preparation process of the conductive film, but also ensure the performance of the finished conductive film. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0033] Figure 1 A cross-sectional view of a conductive film disclosed in an embodiment of the utility model;

[0034] Figure 2 A cross-sectional view of a conductive film disclosed in another embodiment of the utility model;

[0035] Figure 3 A cross-sectional view of a conductive film disclosed in a third embodiment of the utility model;

[0036] Figure 4 The present invention is a flow chart of a method for preparing a conductive film disclosed in an embodiment of the present invention.

[0037] The above drawings include the following reference numerals:

[0038] 10. Base film layer; 20. First metal layer; 30. Second metal layer; 40. Isolation removal layer; 50. Third metal layer; 60. Fourth metal layer. DETAILED DESCRIPTION

[0039] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0040] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the utility model. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0041] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps described in these embodiments do not limit the scope of the utility model. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0042] As described in the background technology, during the preparation process of the conductive film, after the metal layer is evaporated or magnetron sputtered on both sides of the base film layer, it is sometimes necessary to enter the water electroplating equipment to thicken the metal layer. Before the conductive film enters the water electroplating equipment, the conductive film needs to be rolled up and then unrolled into the water electroplating equipment. However, during the process of winding and unwinding the conductive film, the metal layers on both sides of the base film layer will stick together, making it easy for the metal layer to fall off the base film layer. For this reason, the embodiment of the utility model provides a new type of conductive film, which will not cause the metal layer to stick to the metal layer during the preparation process, can prevent the metal layer from falling off the base film layer, and thus can improve the yield rate in the production process of the conductive film. The conductive film of the utility model will be described in detail below in conjunction with the accompanying drawings.

[0043] See also Figure 1 to Figure 2 As shown, according to an embodiment of the present utility model, a conductive film is provided, which includes a base film layer 10, a first metal layer 20, a second metal layer 30 and an isolation removal layer 40.

[0044] Among them, along the first direction ( Figure 1and Figure 2 The base film layer 10 includes a first surface 11 and a second surface 12; a first metal layer 20 is disposed on the first surface 11; a second metal layer 30 is disposed on the second surface 12; an isolation removal layer 40 is disposed on at least one of a surface of the first metal layer 20 away from the base film layer 10 and a surface of the second metal layer 30 away from the base film layer 10, Figure 1 FIG. 4 shows a case where the isolation removal layer 40 is disposed on the surface of the first metal layer 20 away from the base film layer 10. Figure 2 FIG. 4 shows a case where the isolation removal layer 40 is disposed on the surface of the second metal layer 30 away from the base film layer 10. Figure 3 , it is shown that the isolation removal layer 40 is simultaneously arranged on the surface of the first metal layer 20 away from the base film layer 10 and on the surface of the second metal layer 30 away from the base film layer 10. In this embodiment, the isolation removal layer 40 is configured to isolate the first metal layer 20 and the second metal layer 30, and is removed before the conductive film performs the next preparation process, for example, before the thickening process of the first metal layer 20 and the second metal layer 30. That is to say, the isolation removal layer 40 in this embodiment will not exist on the final product of the conductive film, but only plays an isolation role in the preparation process of the conductive film, and will not cause adverse effects on the performance of the conductive film. Combined with the structure of the conductive film in this embodiment, it can be known that since the isolation removal layer 40 is arranged on the surface of the first metal layer 20 away from the base film layer 10 or the surface of the second metal layer 30 away from the base film layer 10 in this embodiment, when the conductive film is rolled up, the first metal layer 20 and the second metal layer 30 can be isolated by the isolation removal layer 40, and the first metal layer 20 and the second metal layer 30 will not stick to each other. When the wound conductive film is unwound, the first metal layer 20 or the second metal layer 30 will not be separated from the base film layer 10, which can solve the problem of delamination of the conductive film during the preparation process. At the same time, the isolation removal layer 40 in this embodiment can be removed before the next preparation process of the conductive film, for example, before the first metal layer 20 and the second metal layer 30 are thickened, which will not affect the preparation of the conductive film, and can not only improve the yield and production efficiency in the preparation process of the conductive film, but also ensure the performance of the finished conductive film.

[0045] Furthermore, the isolation removal layer 40 in the present embodiment includes a metal layer or a compound layer whose material is different from the first metal layer 20 and the second metal layer 30. In the present embodiment, the isolation removal layer 40 is a metal layer or a compound layer whose material is different from the first metal layer 20 and the second metal layer 30. It can be understood that the metal layer described here can be a metal element or a corresponding alloy, and the compound includes but is not limited to boron trioxide. In other words, the material of the isolation removal layer 40 is different from that of the first metal layer 20 and the second metal layer 30. In this way, the adhesion between the isolation removal layer 40 and the first metal layer 20 and between the isolation removal layer 40 and the second metal layer 30 can be reduced, which not only facilitates the removal of the isolation removal layer 40 from the first metal layer 20 and the second metal layer 30, but also prevents the first metal layer 20 and the second metal layer 30 from sticking to each other and causing the first metal layer 20 or the second metal layer 30 to fall off from the base film layer 10.

[0046] In the actual process of preparing the conductive film, the first metal layer 20 and the second metal layer 30 can be coated on the first surface 11 and the second surface 12 of the base film layer 10 by vacuum magnetron sputtering or thermal evaporation. In addition, before depositing the first metal layer 20 and the second metal layer 30, a third metal layer 50 is deposited between the base film layer 10 and the first metal layer 20 by magnetron sputtering, and a fourth metal layer 60 is deposited between the base film layer 10 and the second metal layer 30 to enhance the adhesion between the first metal layer 50 and the second metal layer and the base film layer. In addition, the so-called third metal layer 50 and the fourth metal layer 60 can also be replaced by the oxide or nitride or nitrogen oxide of the selectable single metal / alloy metal layer. The isolation removal layer 40 can also be coated on the surface of the first metal layer 20 away from the base film layer 10 or the surface of the second metal layer 30 away from the base film layer 10 by vacuum magnetron sputtering or thermal evaporation. The isolation removal layer of the present invention is preferably deposited by thermal evaporation, and no limitation is imposed on the adhesion between the film layer and the first or second metal layer, because the removal of the isolation removal layer is actually accomplished by chemical corrosion.

[0047] Furthermore, the isolation removal layer 40 in this embodiment is a structural layer with a melting point lower than the melting points of the first metal layer 20 and the second metal layer 30. In this way, when the isolation removal layer 40 is plated on the first metal layer 20 or the second metal layer 30, the target material of the isolation removal layer 40 can be quickly melted and evaporated or sputtered on the first metal layer 20 or the second metal layer 30, and the isolation removal layer 40 is also convenient for rapid condensation and fixation on the surface of the first metal layer 20 or the second metal layer 30, which can reduce the preparation time of the isolation removal layer 40 in this embodiment to a certain extent and improve the production effect of the conductive film in this embodiment. At the same time, using a material with a lower melting point than the first metal layer 20 and the second metal layer 30 to prepare the isolation removal layer 40 can also reduce the energy consumption of the magnetron sputtering coating equipment or the thermal evaporation coating equipment.

[0048] Furthermore, the isolation removal layer 40 in this embodiment includes at least one of a magnesium layer (Mg), an aluminum layer (Al), a zinc (Zn) layer, a tin (Sn) layer, a calcium (Ca) layer, a silver (Ag) layer, a lead (Pb) layer, a cadmium (Cd) layer, a bismuth (Bi) layer, a tellurium (Te) layer and their corresponding alloy layers, and a boron trioxide (B2O3) layer.

[0049] Among them, magnesium (Mg) can show advantages such as high sputtering rate, good substrate compatibility, excellent uniformity over a large area, and strong flexibility in multilayer structure and doping during magnetron sputtering; while in the thermal evaporation process, it shows high purity, good chemical stability, simple process and high cost-effectiveness, as well as easy control of film growth mode. In actual processing, you can choose according to actual needs.

[0050] Aluminum (Al) exhibits advantages such as high-efficiency sputtering, precise control, large-area uniformity, and preparation of multilayer structures and alloy films in the magnetron sputtering process; while in the thermal evaporation process, it exhibits the characteristics of high purity, low cost, low-temperature deposition and substrate compatibility, and easy alloying and multilayer structures. In actual processing, you can choose according to actual needs.

[0051] B2O3 has strong thermal stability, and the vapor pressure of B2O3 can increase significantly with increasing temperature, which is conducive to forming a stable vapor flow during vacuum evaporation or magnetron sputtering. During evaporation or magnetron sputtering, B2O3 can maintain a high purity, and the vacuum environment reduces the chance of B2O3 reacting with impurities in the air, which helps to generate a pure and uniform borate film. In addition, the melting point of B2O3 is relatively low (about 450°C), and it is easy to evaporate under appropriate heating conditions. Its high volatility means that a higher vapor pressure can be obtained at a lower evaporation temperature, which is conducive to reducing the energy consumption of the evaporation process and reducing the thermal stress effect on the substrate and equipment. In the actual preparation of the isolation removal layer 40, the thickness and composition distribution of the B2O3 layer can be precisely controlled by controlling the temperature of the evaporation source, the evaporation rate, and the distance between the substrate and the evaporation source, so as to facilitate the isolation of the first metal layer 20 and the second metal layer 30 during the winding of the conductive film and prevent the delamination of the conductive film.

[0052] Zinc (Zn) can be efficiently sputtered and deposited in magnetron sputtering because it responds well to the sputtering of argon ions and has a high sputtering rate, so that a thin film can be formed on the first metal layer 20 or the second metal layer 30 more quickly. The zinc film prepared by magnetron sputtering usually has excellent density and purity, and good film uniformity, which is beneficial to improve the conductivity, mechanical properties and chemical stability of the film. Zinc has a relatively low melting point (419.5°C) and has good evaporation properties under suitable evaporation conditions. It can be quickly converted into steam and deposited as a thin film after condensation. It can be seen that whether it is magnetron sputtering or evaporation process, zinc shows good deposition performance and application prospects, especially in new energy batteries, thin film electronic devices, optical coatings and anti-corrosion coatings. It has significant advantages.

[0053] The sputtering rate of tin (Sn) is relatively fast compared to some high melting point metals, and a uniform thin film layer can be formed within a reasonable sputtering time. Due to the low melting point of tin (about 232°C), the heat generated during the magnetron sputtering process will not cause excessive heat load on many sensitive substrates, allowing thin film deposition to be completed at a lower temperature, reducing potential damage to the substrate material. Magnetron sputtering can finely control the chemical composition of the tin film. Tin (Sn) has a strong evaporation performance at an appropriate temperature, and can form a continuous and uniform vapor flow to deposit a continuous and thickness-controlled thin film. In short, whether it is magnetron sputtering or evaporation, tin, as a soft metal, is easy to be plated on the first metal layer 20 and the second metal layer 30 when preparing thin film materials due to its good deposition performance, film quality and process controllability.

[0054] Of course, in other embodiments of the present invention, the isolation removal layer 40 can also be aluminum, aluminum alloy or nickel-chromium alloy, or an iron-based alloy containing aluminum, chromium or titanium, or a cobalt-based alloy layer containing aluminum, chromium or titanium. As long as it is other deformation methods based on the concept of the present invention, it is within the protection scope of the present invention.

[0055] Further, along the first direction, the thickness D1 of the isolation removal layer 40, the thickness D2 of the first metal layer 20, the thickness D3 of the base film layer 10, and the thickness D4 of the second metal layer 30 satisfy the relationship: D1:D2=1 / 500~3 / 2, for example, 1 / 500, 1 / 400, 1 / 300, 1 / 200, 1 / 100, 1 / 50, 1, 3 / 2, etc.; D2:D3=1 / 800~1 / 20, for example, 1 / 800, 1 / 700, 1 / 600, 1 / 700, 1 / 400, 1 / 300, 1 / 200, 1 / 100, 1 / 20, etc.; D1:D3=1 / 40000~3 / 400, for example, 1 / 40000, 1 / 10000, 1 / 5000, 1 / 400, or 3 / 400, etc.

[0056] Further, along the first direction, the thickness D1 of the isolation removal layer 40 is 0.2nm to 15nm, for example, 0.2nm, 1nm, 3nm, 5nm, 7nm, 9nm, 10nm, 11nm, 12nm, 13nm, 14nm, 15nm, etc., and the thickness D2 of the first metal layer 20 is 5nm to 100nm, for example, 5nm, 10nm, 20nm, 30nm, 40nm, 50nm, 60nm, 70nm, etc. The thickness D3 of the base film layer 10 is 2.0μm to 8μm, for example, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, or 8μm, and the thickness D4 of the second metal layer 30 is 5nm to 100nm, for example, 5nm, 10nm, 20nm, 30nm, 40nm, 50nm, 60nm, 70nm, 80nm, 90nm or 100nm, etc.

[0057] Furthermore, the first metal layer 20 and the second metal layer 30 in the present embodiment both include a copper (Cu) layer, and the electrical conductivity of copper is extremely high, second only to silver. In the conductive film, copper can effectively transmit and collect the current generated by the electrode material, reduce the resistance, and improve the battery charging and discharging efficiency and overall performance. Copper has sufficient ductility and flexibility, and is easy to be processed into foil-like materials, which can adapt to the requirements of different battery manufacturing processes such as winding and lamination, and ensure good contact and firm bonding between the conductive film and the electrode active material. In addition, compared with other precious metals with similar conductive properties, the price of copper is more reasonable, and the use of copper as a conductive film in large-scale production of batteries can greatly reduce costs. Of course, in other embodiments of the utility model, the first metal layer 20 and the second metal layer 30 can also be aluminum, etc., as long as it is other deformation methods under the conception of the utility model, they are all within the protection scope of the utility model.

[0058] Further, the base film layer 10 in this embodiment includes at least one of a polypropylene layer, a polyethylene terephthalate layer, a polyethylene layer, a polyamide layer, a polyimide layer, a polyphenylene ether layer, a polyvinyl chloride layer, an ABS plastic layer, a poly(p-phenylene terephthalamide) layer, a polyoxymethylene layer, a polytetrafluoroethylene layer, a polyvinylidene fluoride layer, a polycarbonate layer, a polyvinyl alcohol layer, a polyethylene glycol layer, and a cellulose layer. That is, in this embodiment, different material combinations can be selected as the base material of the support layer 10. Among them, the polypropylene layer has chemical resistance, heat resistance, electrical insulation, high-strength mechanical properties and good high wear resistance processing performance; the polyethylene terephthalate layer has excellent physical and mechanical properties in a wide temperature range and excellent electrical insulation; the polyethylene layer has excellent low temperature resistance and chemical stability; the polyamide layer has good wear resistance and strong structural strength; the polyimide layer can withstand extremely low temperatures and has excellent mechanical properties and high radiation resistance; the polyphenylene ether layer has the advantages of high heat resistance, good flame retardancy and high strength; the polyvinyl chloride layer has good mechanical properties and excellent dielectric properties The ABS plastic layer has good chemical corrosion resistance and heat resistance; the poly(p-phenylene terephthalamide) layer has high heat resistance, high heat resistance and chemical corrosion resistance; the polyoxymethylene layer has high mechanical properties and excellent electrical insulation; the polytetrafluoroethylene layer has the characteristics of acid and alkali resistance, resistance to various organic solvents and high temperature resistance; the polyvinylidene fluoride layer has good chemical resistance, weather resistance, ultraviolet radiation resistance and other properties; the polycarbonate layer has good mechanical properties and good impact resistance; the polyvinyl alcohol layer has high strength; the polyethylene glycol layer has good acid and alkali resistance; the cellulose layer has strong polarity. Furthermore, the support layer 10 of this embodiment uses a polypropylene layer as the support layer 10 because the polypropylene layer has strong corrosion resistance and only carbon-carbon bonds exist in its molecular chain. In addition to being corroded by concentrated sulfuric acid and concentrated nitric acid, the polypropylene layer can adapt to various other chemical reagents and has relatively stable chemical properties. In particular, when the conductive film in the utility model is applied to a battery, the polypropylene layer is not easily corroded by the electrolyte, thereby extending the battery life.

[0059] Furthermore, in this embodiment, a third metal layer 50 is provided between the base film layer 10 and the first metal layer 20, and a fourth metal layer 60 is provided between the base film layer 10 and the second metal layer 30. The third metal layer 50 and the fourth metal layer 60 are an adhesion enhancing layer, and the third metal layer 50 and the fourth metal layer 60 can improve the adhesion of the first metal layer 20 and the second metal layer 30 to the base film layer 10, that is, enhance the interface bonding force between the metal layer and the base film layer 10.

[0060] Optionally, the third metal layer 50 or the fourth metal layer 60 in this embodiment includes at least one of a chromium layer, a chromium alloy oxide layer, a nitride layer, a nitride oxide layer, a titanium layer, a titanium alloy oxide layer, a silicon oxide layer, a copper layer, a copper alloy layer and a chromium alloy.

[0061] Optionally, the thickness of the third metal layer 50 and the fourth metal layer 60 in this embodiment is between 2 nm and 10 nm, for example, 2 nm, 4 nm, 6 nm, 8 nm, 10 nm, etc.

[0062] The performance of the conductive film of the present application will be introduced below in combination with specific embodiments and comparative examples.

[0063] Example 1

[0064] The first metal layer 20 and the second metal layer 30 are respectively arranged on both sides of the base film layer 10 of the conductive film, and the isolation removal layer 40 is arranged on the side of the first metal layer 20 away from the base film layer 19. Among them, the base film layer 10 is a polypropylene layer with a thickness of 6μm, the first metal layer 20 and the second metal layer 30 are both copper layers with thicknesses of 100nm and 99nm respectively, and the isolation removal layer 40 is a magnesium layer with a thickness of 15nm. The third metal layer 50 and the fourth metal layer 60 are chromium alloy layers with a thickness of 2nm.

[0065] Example 2

[0066] The structure of the conductive film of Example 2 is basically the same as that of Example 1, except that the base film layer 10 in this embodiment is a polyethylene terephthalate layer with a thickness of 8 μm, the first metal layer 20 and the second metal layer 30 are 80 nm and 80 nm thick respectively, and the isolation removal layer 40 is 5 nm thick.

[0067] Example 3

[0068] The structure of the conductive film of Example 3 is basically the same as that of Example 1, except that the base film layer 10 in this embodiment is a polyethylene layer with a thickness of 2 μm, the first metal layer 20 and the second metal layer 30 are 50 nm and 48.5 nm thick respectively, and the thickness of the isolation removal layer 40 is 0.2 nm.

[0069] Example 4

[0070] The structure of the conductive film of Example 4 is basically the same as that of Example 1, except that the base film layer 10 in this embodiment has a thickness of 4.5 μm, the first metal layer 20 and the second metal layer 30 have a thickness of 90 nm, and the isolation removal layer 40 is an aluminum layer with a thickness of 10 nm.

[0071] Example 5

[0072] The structure of the conductive film of Example 5 is basically the same as that of Example 1, except that the base film layer 10 in this embodiment is a polyethylene terephthalate layer with a thickness of 3 μm, the first metal layer 20 and the second metal layer 30 are both 70 nm thick, and the isolation removal layer 40 is an aluminum layer with a thickness of 4 nm.

[0073] Example 6

[0074] The structure of the conductive film of Example 6 is basically the same as that of Example 1, except that the base film layer 10 in this embodiment is a polyethylene layer with a thickness of 6 μm, the first metal layer 20 and the second metal layer 30 are both 20 nm thick, and the isolation removal layer 40 is an aluminum layer with a thickness of 2 nm.

[0075] Example 7

[0076] The structure of the conductive film of Example 6 is basically the same as that of Example 1, except that the base film layer 10 in this embodiment is polypropylene with a thickness of 3.2 μm, the first metal layer 20 and the second metal layer 30 are both 20 nm thick, and the isolation removal layer 40 is a boron trioxide layer with a thickness of 10 nm.

[0077] Example 8

[0078] The structure of the conductive film of Example 8 is basically the same as that of Example 1, except that the base film layer 10 in this embodiment is a polyethylene terephthalate layer with a thickness of 6 μm, the first metal layer 20 and the second metal layer 30 are both 30 nm thick, and the isolation removal layer 40 is a boron trioxide layer with a thickness of 5 nm.

[0079] Example 9

[0080] The structure of the conductive film of Example 9 is basically the same as that of Example 1, except that the base film layer 10 in this embodiment is a polyethylene layer with a thickness of 4.5 μm, the first metal layer 20 and the second metal layer 30 are both 10 nm thick, and the isolation removal layer 40 is a boron trioxide layer with a thickness of 1 nm.

[0081] Example 10

[0082] The structure of the conductive film of Example 10 is basically the same as that of Example 1, except that the base film layer 10 in this embodiment has a thickness of 3.8 μm, the first metal layer 20 and the second metal layer 30 have a thickness of 70 nm, and the isolation removal layer 40 is a zinc layer with a thickness of 12 nm.

[0083] Embodiment 11

[0084] The structure of the conductive film of Example 11 is basically the same as that of Example 1, except that the base film layer 10 in this embodiment is a polyethylene terephthalate layer with a thickness of 4.5 μm, the first metal layer 20 and the second metal layer 30 are both 50 nm thick, and the isolation removal layer 40 is a zinc layer with a thickness of 7 nm.

[0085] Example 12

[0086] The structure of the conductive film of Example 12 is basically the same as that of Example 1, except that the base film layer 10 in this embodiment is polyethylene with a thickness of 2 μm, the first metal layer 20 and the second metal layer 30 are both 15 nm thick, and the isolation removal layer 40 is a zinc layer with a thickness of 0.5 nm.

[0087] Embodiment 13

[0088] The structure of the conductive film of Example 13 is basically the same as that of Example 1, except that the base film layer 10 in this embodiment has a thickness of 2.8 μm, the first metal layer 20 and the second metal layer 30 have a thickness of 80 nm, and the isolation removal layer 40 is a tin layer with a thickness of 15 nm.

[0089] Embodiment 14

[0090] The structure of the conductive film of Example 14 is basically the same as that of Example 1, except that the base film layer 10 in this embodiment is a polyethylene terephthalate layer with a thickness of 4.5 μm, the first metal layer 20 and the second metal layer 30 are both 45 nm thick, and the isolation removal layer 40 is a tin layer with a thickness of 3 nm.

[0091] Embodiment 15

[0092] The structure of the conductive film of Example 15 is basically the same as that of Example 1, except that the base film layer 10 in this embodiment is polyethylene with a thickness of 6 μm, the first metal layer 20 and the second metal layer 30 are both 35 nm thick, and the isolation removal layer 40 is a tin layer with a thickness of 0.2 nm.

[0093] Comparative Example 1

[0094] The structure of Comparative Example 1 is substantially the same as that of Example 1, except that the conductive film in Comparative Example 2 is not provided with the isolation removal layer 40, wherein the thickness of the base film layer 10 is 4.5 μm, the thickness of the first metal layer 20 and the second metal layer 30 are both 100 nm, and the third metal layer 50 and the fourth metal layer 60 are chromium alloy layers with a thickness of 2 nm.

[0095] Comparative Example 2

[0096] The structure of Comparative Example 2 is basically the same as that of Example 1, except that the conductive film in Comparative Example 2 does not have an isolation removal layer 40, wherein the thickness of the base film layer 10 is 3 μm, and the thickness of the first metal layer 20 and the second metal layer 30 are both 50 nm.

[0097] Comparative Example 3

[0098] The structure of comparative example 3 is basically the same as that of embodiment 1, except that the conductive film of comparative example 2 does not have an isolation removal layer 40, wherein the thickness of the base film layer 10 is 3 μm, and the thickness of the first metal layer 20 and the second metal layer 30 are both 15 nm.

[0099] In the present application, the stickiness or adhesion condition of the two opposite sides of the conductive film is specifically manifested as whether there are light-transmitting spots on the conductive film and whether there are many or few light-transmitting spots when the surface of the conductive film is observed after the rolled conductive film is unwound.

[0100] The present application measures the sticking film tension of different conductive film rolls as follows: when the length of the film rolls of different conductive films is constant, for example, when a film roll of a conductive film with a width of 1600 mm is unwound, the film roll of the conductive film is placed on the unwinding shaft, and the film is pulled in the horizontal direction and the distribution of light-transmitting points on the conductive film is observed. The so-called light-transmitting points are caused by the light-transmitting phenomenon at the detachment position after the first metal layer 20 and / or the second metal layer 30 partially or sporadically falls off due to the adhesion of the film layer. That is, the fewer the light-transmitting points, the less likely the conductive film is to produce sticking film.

[0101] In order to verify the anti-sticking condition of the first metal layer 20 and the second metal layer 30 after the isolation removal layer 40 is set on the conductive film, this embodiment conducts a sticking test on the conductive films in Examples 1 to 15 and Comparative Examples 1 to 3, and the test results of the film pulling test on different conductive films are shown in Table 1, wherein the "number of light leakage points per unit area before thickening" mentioned in Table 1 refers to the number of light leakage points per unit area obtained by conducting a film pulling test and observing after the isolation removal layer 40 is removed, and the "number of light leakage points per unit area after thickening" refers to the number of light leakage points per unit area obtained by conducting a film pulling test and observing after the isolation removal layer 40 is removed and the metal layer is thickened on the first metal layer 20 and the second metal layer 30, and the data of the third metal layer 50 and the fourth metal layer 60 are not listed in Table 1.

[0102] Table 1:

[0103]

[0104]

[0105] According to Table 1, it can be known that the thicker the isolation removal layer 40 is, the more the number of light leakage points per unit area on the conductive film tends to decrease when the film tension is measured, and the better the anti-sticking effect is during the winding of the conductive film.

[0106] In addition, according to Table 1, it can be known that: in Examples 1 to 15, due to the provision of an isolation removal layer 40, after the film pulling test, the number of light leakage points per unit area before and after the thickening of the conductive film is much less than that of Comparative Examples 1 to 3, and the structure of the conductive film in the present application has a good anti-sticking effect. It should be noted that the reason for the small number of light leakage points after thickening is mainly that after the thickening process, the first metal layer 20 and the second metal layer 30 of the conductive film are well bonded to the base film layer 10. It can be seen that if the conductive film is not provided with an isolation removal layer 40, the first metal layer 20 and the second metal layer 30 on the opposite sides of the conductive film are prone to mutual adhesion during winding, resulting in adhesion failure of the film layer during the unwinding process, resulting in delamination defects, that is, the copper layer on the surface of the base film is partially or sporadically detached.

[0107] See also Figures 1 to 4 As shown, the utility model also provides a method for preparing a conductive film, and the method for preparing a conductive film is used to prepare the above conductive film. Specifically, the method for preparing a conductive film in this embodiment includes the following steps:

[0108] Step S1: Prepare the first metal layer 20 and the second metal layer 30 on the first surface 11 and the second surface 12 of the base film layer 10 by using a first preparation process.

[0109] In this step, the first preparation process can be a thermal evaporation coating process or a vacuum magnetron sputtering coating process. The equipment for performing the thermal evaporation coating process and the equipment for performing the vacuum magnetron sputtering coating process are the equipment for performing thermal evaporation coating or vacuum magnetron sputtering coating on the market, and are not specifically introduced in this embodiment. The base film layer 10 is selected from at least one of a polypropylene layer, a polyethylene terephthalate layer, a polyethylene layer, a polyamide layer, a polyimide layer, a polyphenylene ether layer, a polyvinyl chloride layer, an ABS plastic layer, a poly(p-phenylene terephthalamide) layer, a polyoxymethylene layer, a polytetrafluoroethylene layer, a polyvinylidene fluoride layer, a polycarbonate layer, a polyvinyl alcohol layer, a polyethylene glycol layer, and a cellulose layer.

[0110] When step S1 is actually performed, the base film layer 20 is firstly placed in a vacuum magnetron sputtering coating device or a thermal evaporation coating device, and then step S2 is performed after a first metal layer 20 and a second metal layer 30 of a certain thickness are plated on the base film layer 10. The first metal layer 20 and the second metal layer 30 in this embodiment can be a copper layer or a metal layer.

[0111] Step S2: Using a second preparation process, an isolation removal layer 40 is prepared on the surface of the first metal layer 20 away from the base film layer 10 or the second metal layer 30 or on the surfaces of the first metal layer and the second metal layer away from the base film layer 10, and an anti-adhesive conductive film is formed.

[0112] In this step, the second preparation process can be a thermal evaporation coating process or a vacuum magnetron sputtering coating process. The equipment for performing the thermal evaporation coating process and the equipment for performing the vacuum magnetron sputtering coating process are the equipment for performing thermal evaporation coating or vacuum magnetron sputtering coating on the market, and will not be specifically introduced in this embodiment.

[0113] When step S2 is actually performed, the conductive film coated with the first metal layer 10 and the second metal layer 20 is firstly put into a vacuum magnetron sputtering coating device or a thermal evaporation coating device, and then after the isolation removal layer 40 with a thickness of D1 is plated on the first metal layer 10 or the second metal layer 20, step S3 is performed. At this time, the conductive film is an anti-sticking conductive film.

[0114] Step S3: rolling up the anti-sticking conductive film, and then removing the isolation removal layer 40 before the next preparation process (eg, thickening process).

[0115] In this step, the removal equipment includes an etching liquid tank, in which the etching liquid tank contains an etching liquid for etching and removing the isolation removal layer 40. In actual operation, the isolation removal layer 40 is brought into contact with the etching liquid to etch away the isolation removal layer 40. The etching liquid includes an acidic solution or an alkaline solution. The acidic etching liquid may be, for example, nitric acid or sulfuric acid, and the alkaline etching liquid may be, for example, a sodium hydroxide solution.

[0116] For example, when the isolation removal layer 40 is an aluminum or aluminum alloy layer, an alkaline solution is used to remove the isolation removal layer 40. When the isolation removal layer 40 is a boron trioxide layer, a zinc layer, or a tin layer, an acidic solution is used to remove the boron trioxide layer, the zinc layer, or the tin layer. The specific solution can be selected according to the chemical properties of the isolation layer 40.

[0117] Step S4: cleaning the conductive film after removing the isolation removal layer 40 and air-drying the film.

[0118] In this step, after the isolation removal layer 40 is removed, the conductive film from which the isolation removal layer 40 is removed is sprayed with clean water to wash away the acidic solution or alkaline solution remaining on the conductive film, thereby avoiding the acidic solution or alkaline solution from affecting the first metal layer 20 or the second metal layer 30, and also preventing the acidic solution or alkaline solution from causing unnecessary influence on the subsequent preparation of the conductive film.

[0119] During the actual air drying, a hot air blower or the like may be provided to dry the surface of the conductive film for subsequent use. It is understandable that whether to dry and clean the conductive film may also be selected and designed according to the actual preparation process of the conductive film. Step S4 in this application is not a step that must be performed in the preparation process of the conductive film.

[0120] Step S5: The first metal layer 20 and the second metal layer 30 are thickened by the third preparation process until the thickness of the first metal layer 20 and the second metal layer 30 reaches the finished product thickness requirement. At this time, the total thickness of the coating on each side of the base film layer 10 is 700nm to 1600nm, that is, the total thickness of the coating on the first surface 11 or the second surface 12 of the base film layer 10 is 700nm to 1600nm, for example, 700nm, 800nm, 900nm, 1000nm, 1100nm, 1200nm, 1300nm, 1400nm, 1500nm and 1600nm. It can be understood that the total thickness of the coating on each side of the base film layer 10 mentioned here refers to the total thickness of the material on the first surface 11 or the second surface 12 of the base film layer 10 along the first direction.

[0121] Optionally, the third preparation process in this embodiment includes but is not limited to a water electroplating process.

[0122] According to the above-mentioned method for preparing the conductive film, the conductive films of Examples 1 to 15 described in Table 1 above are prepared. According to Table 1, it can be known that the conductive film of the present application is provided with an isolation removal layer 40, and the isolation removal layer 40 is removed before the subsequent preparation process (such as the thickening process). In the final conductive film product, the number of light leakage points per unit area of ​​the conductive film is significantly less than that without the isolation removal layer 40. In addition, the measurement of the sticky film tension before and after the thickening process of the conductive film obtains that the number of light leakage points per unit area is much less than that without the isolation removal layer 40. The isolation removal layer 40 can play a role in different degrees of anti-sticking effect before and after the thickening process of the conductive film. In summary, the present application can play a good anti-sticking effect, can improve the yield of the conductive film, and can effectively improve the production and preparation efficiency of the conductive film.

[0123] On the other hand, the embodiment of the utility model further provides a pole piece, which includes the above-mentioned conductive film, and thus the pole piece includes all the technical effects of the above-mentioned conductive film. Since the technical effects of the conductive film have been described in detail above, they will not be repeated here.

[0124] On the other hand, the embodiment of the utility model further provides a battery, which includes the above-mentioned pole piece, and therefore, the battery includes all the technical effects of the above-mentioned battery. The battery includes all the technical effects of the above-mentioned conductive film, and since the technical effects of the conductive film have been described in detail above, they will not be repeated here.

[0125] Finally, the embodiment of the utility model also provides an electric device, which includes but is not limited to a computer, an electric vehicle, etc. The electric device includes the above-mentioned battery, and therefore, the electric device includes all the technical effects of the above-mentioned battery, conductive film, and pole piece. Since the technical effects of the battery, conductive film, and pole piece have been described in detail above, they will not be repeated here.

[0126] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0127] In addition, it should be noted that the use of words such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above words have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0128] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A conductive film, characterized in that: include: A base film layer (10), wherein along a first direction, the base film layer (10) comprises a first surface (11) and a second surface (12); A first metal layer (20), the first metal layer (20) being disposed on the first surface (11); A second metal layer (30), the second metal layer (30) being disposed on the second surface (12); An isolation removal layer (40) is provided on at least one of a surface of the first metal layer (20) facing away from the base film layer (10) and a surface of the second metal layer (30) facing away from the base film layer (10), and is removed before the conductive film is subjected to a next preparation process.

2. The conductive film according to claim 1, characterized in that The isolation removal layer (40) comprises a metal layer or a compound layer whose material is different from that of the first metal layer (20) and the second metal layer (30).

3. The conductive film according to claim 2, characterized in that: The isolation removal layer (40) includes a structural layer having a melting point lower than a melting point of the first metal layer (20) and / or the second metal layer (30).

4. The conductive film according to claim 3, characterized in that: The isolation removal layer (40) comprises at least one of a magnesium layer, an aluminum layer, a zinc layer, a tin layer, a calcium layer, a silver layer, a lead layer, a cadmium layer, a bismuth layer, a tellurium layer and corresponding alloy layers thereof, and a boron trioxide layer.

5. The conductive film according to any one of claims 1 to 4, characterized in that: Along the first direction, the thickness D1 of the isolation removal layer (40), the thickness D2 of the first metal layer (20), the thickness D3 of the base film layer (10), and the thickness D4 of the second metal layer (30) satisfy the relationship: D1:D2=1 / 500~3 / 2; and / or D2:D3=1 / 800-1 / 20; and / or, D1:D3=1 / 40000~3 / 400.

6. The conductive film according to claim 5, characterized in that Along the first direction, the thickness D1 of the isolation removal layer (40) is 0.2 nm to 15 nm; and / or, The thickness D2 of the first metal layer (20) is 10 nm to 100 nm; and / or, The thickness D3 of the base film layer (10) is 2.0 μm to 8 μm; and / or, The thickness D4 of the second metal layer (30) is 10 nm to 100 nm.

7. The conductive film according to any one of claims 1 to 4 and 6, characterized in that: The first metal layer (20) and the second metal layer (30) both include a copper layer or an aluminum layer; and / or, The base film layer (10) includes at least one of a polypropylene layer, a polyethylene terephthalate layer, a polyethylene layer, a polyamide layer, a polyimide layer, a polyphenylene ether layer, a polyvinyl chloride layer, an ABS plastic layer, a poly(p-phenylene terephthalamide) layer, a polyoxymethylene layer, a polytetrafluoroethylene layer, a polyvinylidene fluoride layer, a polycarbonate layer, a polyvinyl alcohol layer, a polyethylene glycol layer and a cellulose layer.

8. The conductive film according to any one of claims 1 to 4 and 6, characterized in that: A third metal layer (50) is provided between the base film layer (10) and the first metal layer (20), and a fourth metal layer (60) is provided between the base film layer (10) and the second metal layer (30).

9. The conductive film according to claim 8, characterized in that: The third metal layer (50) or the fourth metal layer (60) comprises at least one of a chromium layer, a chromium alloy layer, a chromium alloy oxide layer, a nitride layer, a nitride oxide layer, a titanium layer, a titanium alloy oxide layer, a silicon oxide layer, a copper layer, and a copper alloy layer.

10. A pole piece, characterized in that: The pole piece includes the conductive film according to any one of claims 1 to 9.

11. A battery, characterized in that: The battery comprises the electrode sheet as claimed in claim 10.

12. An electrical equipment, characterized in that: The electric device comprises the battery as claimed in claim 11.

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