Half-piece sucking and splicing device
By designing a half-piece suction and splicing device including two rows of adsorbent sheets and a driving mechanism, the problem of the inability to absorb and splice half-piece silicon wafers in the prior art is solved, and the smooth suction and splicing of half-piece silicon wafers is achieved, and the efficiency of the silicon wafer transfer process is improved.
Patent Information
- Application Number
- CN202421237351.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-03
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-06-03
AI Technical Summary
The existing technology cannot effectively absorb and assemble half-piece silicon wafers, and cannot meet customers' different needs for silicon wafers.
A half-piece suction and assembly device is designed, including an adsorption seat body and an adsorption mechanism connecting the robot. The adsorption mechanism consists of two rows of adsorption sheets on the left and right rows of adsorption sheets. The same side of the same row of adsorption sheets is provided with an adsorption port. The two rows of adsorption sheets are opposite in the direction of the adsorption sheets. The two rows of adsorption sheets are respectively connected to the horizontal and longitudinal driving mechanisms, and the staggered and corresponding bonding of the adsorption sheets is achieved through the driving mechanism.
The smooth absorption and assembly of half a silicon wafer has been achieved, the problem that the existing technology cannot meet the different needs of customers is solved, and the efficiency of the silicon wafer transfer process has been improved.
Smart Images
Figure CN222637266U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafer transfer, in particular to a half-wafer suction and splicing device. Background Art
[0002] Silicon wafers are the most important raw materials in the semiconductor industry. During the production process, silicon wafers need to be transferred from one jig to another. The common silicon wafers are large whole wafers. During the transfer, the robot controls a row of adsorption sheets to directly insert into the jig, and then the silicon wafer can be taken away for transfer. However, some customers have different requirements for silicon wafers, which are in the form of two half wafers. The structure in the jig is as follows: Figure 1 As shown, the existing suction device cannot meet the film taking requirements. Summary of the invention
[0003] In order to solve the problem that the existing half-sheet cannot be sucked smoothly, the utility model provides a half-sheet sucking and splicing device, which can smoothly realize the sucking of the half-sheet.
[0004] The technical solution is as follows: a half-piece suction and splicing device, which includes an adsorption base connected to a robot, and an adsorption mechanism is arranged on the adsorption base. The feature is that the adsorption mechanism includes two left and right rows of adsorption sheets, and adsorption ports are provided on the same surface of the adsorption sheets in the same row, and the adsorption ports of the two rows of adsorption sheets are in opposite directions. The two rows of adsorption sheets are respectively connected to a horizontal driving mechanism, and one row of the adsorption sheets is connected to a longitudinal driving mechanism.
[0005] Its further feature is that two groups of adsorption mechanisms are arranged side by side.
[0006] After adopting the utility model, the left and right rows of adsorption sheets respectively adsorb the adsorption surfaces of the two groups of half sheets, and make the bonding surfaces of the two groups of half sheets face each other, use the longitudinal driving mechanism to stagger the two groups of half sheets, and then use the transverse driving mechanism to make the two groups of half sheets correspond to each other and bond one by one, so as to successfully complete the absorption of the half sheets and prepare for the subsequent transfer operation. BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Figure 1 This is a schematic diagram of a half-piece fixture;
[0008] Figure 2 It is a schematic diagram of the structure of the utility model;
[0009] Figure 3 It is a schematic diagram of the back side of the adsorption seat. DETAILED DESCRIPTION
[0010] See Figure 1 , Figure 2 , Figure 3As shown, a half-wafer suction and splicing device includes an adsorption base body 2 connected to a robot 1, and an adsorption mechanism 3 is arranged on the adsorption base body 2. The adsorption mechanism 3 can be arranged in two groups side by side as needed. The adsorption mechanism 3 includes two left and right rows of adsorption sheets 3-1 and 3-2. Adsorption ports are opened on the same side of the same row of adsorption sheets, and the adsorption ports of the two rows of adsorption sheets are in opposite directions. Since the two rows of half sheets in the same fixture have different directions, the two rows of adsorption sheets can adsorb the adsorption surfaces of the silicon wafers, and the bonding surfaces of the two sheets in the two rows of half sheets corresponding to each other are opposite to each other, so that they can be smoothly bonded.
[0011] The two rows of adsorption sheets 3-1 and 3-2 are connected to the transverse driving mechanism respectively, and one row of adsorption sheets is connected to the longitudinal driving mechanism. The longitudinal driving mechanism can make one row of half sheets staggered with the other row of half sheets by a certain distance, and then the transverse driving mechanism drives the two rows of half sheets to approach and overlap, and then the longitudinal driving mechanism works again to make the two half sheets fit together smoothly. The transverse driving mechanism is realized by the synchronous belt 4 and the first motor 5. The two adsorption sheets 3-1 and 3-2 are respectively fixed to two sliders, and the two sliders are respectively connected to the upper and lower layers of the synchronous belt 4. When the belt rotates, the two sliders can be synchronously approached or synchronously moved away; the longitudinal driving mechanism relies on the screw mechanism 6 to realize longitudinal movement, which can make one row of adsorption sheets staggered with the other row of adsorption sheets.
[0012] Since two groups of adsorption mechanisms 3 are arranged side by side, two transverse driving mechanisms and two longitudinal driving mechanisms are arranged.
Claims
1. A half-sheet suction and splicing device, comprising a suction seat connected to a robot, wherein a suction mechanism is provided on the suction seat, characterized in that: The adsorption mechanism includes two rows of adsorption sheets on the left and right. Adsorption ports are opened on the same side of the adsorption sheets in the same row and the adsorption ports of the two rows are in opposite directions. The two rows of adsorption sheets are respectively connected to the horizontal driving mechanism, and one row of the adsorption sheets is connected to the vertical driving mechanism.
2. A half-sheet suction and splicing device according to claim 1, characterized in that: The adsorption mechanisms are arranged in two groups side by side.