Overpass bridge, quantum device, superconducting quantum chip and quantum computer

Abstract

The utility model discloses an overpass bridge, a quantum device, a superconducting quantum chip and a quantum computer, and belongs to the technical field of superconducting quantum chip manufacturing. An overpass bridge includes: a metal layer having two separated end portions and a middle portion for communicating the two end portions; the two separated supporting layers are used for being connected with the two end parts in a one-to-one correspondence and complete contact mode, and the two supporting layers and the two contact faces of the two end parts are located on the same plane; the two supporting layers are arranged on the first side of the plane, the two end portions are arranged on the second side of the plane, the middle portion is arranged on the second side of the plane, and gaps are formed between the middle portion and the plane. Through the above mode, one signal transmission line can cross another signal transmission line through the flyover bridge structure, and the signal transmission line can be adjusted to impedance matching at one time, and the signal transmission line can be directly realized on a chip through subsequent process manufacturing, the speed is fast, and the impedance matching cannot be damaged.

Description

Technical Field

[0001] The present application belongs to the technical field of superconducting quantum chip manufacturing, and in particular, relates to a flyback bridge, a quantum device, a superconducting quantum chip and a quantum computer. Background Art

[0002] In superconducting quantum chips, there are a large number of signal transmission lines such as buses and control lines. However, due to factors such as the size and process of superconducting quantum chips, all signal transmission lines will inevitably cross when they are routed on the surface of the substrate, which is often manifested as some control lines being unable to bypass the bus and connect to the pad.

[0003] In the past, where wires intersect, the cross-line solution is generally to disconnect one of the signal transmission lines, create two signal ports connected to the disconnected end on both sides of the other line, and then connect the two signal ports above the undisconnected signal transmission line by bonding. However, this method requires subsequent manual bonding, and it is difficult to achieve impedance matching at both the source and end of the bonding wire, which is undoubtedly time-consuming and labor-intensive, and also brings considerable trouble to design and testing. Utility Model Content

[0004] The purpose of the present application is to provide a wire jumper to solve the problem in the prior art that impedance matching is difficult, time-consuming and labor-intensive due to the use of bonding wires to bond two model ports. The invention can be adjusted to impedance matching at one time, and then directly implemented on the chip through process manufacturing, which is fast and will not destroy the impedance matching.

[0005] In order to solve the above technical problems, the utility model provides a flyover, comprising:

[0006] A metal layer having two separated end portions and a middle portion for connecting the two end portions;

[0007] Two separate supporting layers are used to correspond to the two end portions one by one and be completely contact-connected, and the two contact surfaces of the two supporting layers and the two end portions are located in the same plane;

[0008] The two supporting layers are on a first side of the plane, the two end portions are on a second side of the plane, and the middle portion is on the second side of the plane and has a gap with the plane.

[0009] Preferably, the middle portion and the two end portions are integrally formed;

[0010] And / or, the material of the metal layer is aluminum.

[0011] Preferably, the surface shape of the supporting layer in contact with the two end portions is rectangular.

[0012] The present application also provides a quantum device, comprising:

[0013] A substrate, with at least two intersecting first signal transmission lines and second signal transmission lines arranged on the surface;

[0014] At least one overpass of any of the foregoing items is disposed on the surface of the substrate coplanarly with the first signal transmission line and the second signal transmission line;

[0015] The first signal transmission line has two sub-lines which are disconnected from each other and distributed on both sides of the second signal transmission line. Two ends of the two sub-lines adjacent to each other are electrically connected to the two supporting layers of the flyback bridge respectively.

[0016] Preferably, two air bridges are provided on both sides of each of the flyovers;

[0017] Two ends of the air bridge are electrically connected to the ground surfaces at both sides of the second signal transmission line respectively, and the air bridge is not in contact with the second signal transmission line.

[0018] Preferably, two ends of the two sub-lines adjacent to each other are respectively provided with a signal port and are electrically connected;

[0019] The two signal ports electrically connected to the two sub-lines are distributed on both sides of the second signal transmission line and are not in contact with the second signal transmission line;

[0020] The signal port is electrically connected to the two supporting layers.

[0021] Preferably, the two signal ports on both sides of the second signal transmission line are electrically connected via two flyovers, and the two supporting layers of each flyover are electrically connected to different signal ports, respectively.

[0022] Preferably, the size of the support layer is smaller than the size of the signal port, and a vertical projection of the support layer on the signal port is within the periphery of the signal port.

[0023] The present application also provides a superconducting quantum chip, comprising:

[0024] A quantum device according to any of the preceding items; and

[0025] quantum bits and signal transmission lines located on the surface of the substrate;

[0026] The signal transmission line is coupled to the quantum bit.

[0027] The present application also provides a quantum computer, comprising:

[0028] The aforementioned superconducting quantum chip.

[0029] Compared with the prior art, the present application designs a flyover, which includes a metal layer and two supporting layers for supporting the metal layer, wherein the metal layer includes a raised portion in the middle and two flat end portions, the two end portions are in covering contact with the two supporting layers, and the two supporting layers are on the other side of the metal layer where the raised portion is provided. The flyover can be set on the signal transmission line that needs to be crossed, and the two supporting layers are respectively on both sides of the signal transmission line and do not contact each other, so as to connect other crossed signal transmission lines. This structure is manufactured through a process, which is faster than manual manufacturing and easier to achieve impedance matching. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic side view of a flyover provided in an embodiment of the present application;

[0031] Figure 2 A schematic top view of a flyover provided in an embodiment of the present application;

[0032] Figure 3 A schematic diagram of cross-connection through a flyover bridge provided in an embodiment of the present application;

[0033] Figure 4 A schematic diagram of a structure in which air bridges are provided on both sides of the overpass provided in an embodiment of the present application;

[0034] Figure 5 A schematic diagram of cross-connection through two flyovers provided in an embodiment of the present application.

[0035] Description of the reference numerals: 1 - metal layer, 2 - support layer, 3 - first signal transmission line, 4 - second signal transmission line, 5 - air bridge, 6 - signal port. DETAILED DESCRIPTION

[0036] The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limiting the present application.

[0037] In the description of the present application, it should be understood that the terms "center", "up", "down", "left", "right", etc., indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present application.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0039] With the development of superconducting quantum chips, the number of quantum bits therein is increasing. Obviously, the number of signal transmission lines for controlling quantum bits and signal input / output is also increasing. At present, in order to solve the problem of arranging signal transmission lines on the surface of the substrate, a variety of arrangement methods have emerged, in order to arrange as many signal transmission lines as possible on the smallest possible substrate. However, due to the large number of signal transmission lines, the size of the substrate used to carry the signal transmission lines is limited by industrial machines. Therefore, it is difficult to arrange such a large number of signal transmission lines in a regular manner without crossing the lines on a substrate of limited size. Moreover, how to arrange is only part of the problem that needs to be considered. In addition, how to prevent crosstalk between adjacent signal transmission lines after the arrangement is also one of the problems that need to be solved.

[0040] At present, with the increase in the number of bits, the number of buses and control lines will also increase exponentially, resulting in the inevitable situation of wire crossing, in which some control lines cannot bypass the bus to reach the signal port; therefore, one of the two lines is selected at the intersection to be disconnected, and two signal ports are set at both ends of the disconnection, and then the two signal ports are connected by wire bonding and cross over the top of the undisconnected line, so that the disconnected signal transmission line is connected again; however, this method still has some problems that cannot be ignored or difficult to achieve, such as: the bonding wire has a size, and a bonding point requires several bonding wires, and there is a non-negligible spacing between the wires, so the corresponding bonding point diameter is at least 80μm, and such a size is difficult to achieve for the layout design of superconducting quantum chips; that is, it is difficult to leave such a large area in the layout design, which will make the layout that is already difficult to route more crowded; in addition, the wire bonding here can only be done manually, which can easily cause signal mismatch, and impedance matching needs to be considered at both the source and the end, which is also a considerable difficulty for design and testing.

[0041] Based on the above problems, the inventors of the present application have proposed a flyback bridge, a quantum device, a superconducting quantum chip and a quantum computer after many experiments, which have better solved the above problems.

[0042] Please refer to Figure 1The embodiment of the utility model provides a flyover, including a metal layer 1 and two separate supporting layers 2; wherein the metal layer 1 has two separate end portions and a middle portion for connecting the two end portions, and the material of the entire metal layer 1 satisfies the requirements for realizing electrical signal transmission; in addition, the two supporting layers 2 are separated and arranged corresponding to the positions of the two end portions of the metal layer 1, so that the two supporting layers 2 correspond to the two end portions one by one and are fully contact-connected (the two end portions completely cover the two supporting layers 2, and there is no gap between the contact surfaces of the two end portions and the supporting layers 2). And the two supporting layers 2 are in contact with the two end portions of the metal layer 1 respectively, and there are two contact surfaces in total, and the two contact surfaces are arranged to be located in the same plane; or it can also be understood that: the two surfaces used for contact at the two end portions are located in the first plane, and the two surfaces used for contact of the two supporting layers 2 are located in the second plane, and the first plane coincides with the second plane. In addition, the above-mentioned plane where the two end portions overlap with the two supporting layers 2 has two sides (respectively a first side and a second side), so that the two supporting layers 2 are on the first side of the plane and the two end portions are on the second side of the plane. In addition, the middle portion is in an arch bridge shape relative to the two end portions, so the middle portion is on the second side of the plane and has a certain gap with the plane. The gap (arch bridge shape) is used to pass some devices between the two end portions and between the middle portion and the plane, such as: signal transmission lines.

[0043] In one embodiment of the present application, the metal layer 1 includes two separate end portions and a middle portion for connecting the two end portions, and the middle portion and the two end portions are manufactured as an integral part; so that the above-mentioned overpass can be completed through a one-time process during manufacturing, and when the overpass is subsequently used as a "bridge", the one-piece structure can appear to be more solid and not easy to collapse.

[0044] Furthermore, the material of the metal layer 1 is selected as aluminum.

[0045] Please refer to Figure 2 In one embodiment of the present application, in order to make the structure of the overpass more stable and the manufacturing simpler, the shape of the surface where the support layer 2 contacts the two end parts is set to be rectangular; due to the aforementioned: the two separated support layers 2 are used to correspond to the two end parts one by one and are fully contacted, it can be explained that at least the support layer 2 is rectangular, and in the direction perpendicular to the surface where the support layer 2 contacts the two end parts, the support layer 2 has a thickness within 4μm.

[0046] Please refer to Figure 3In an embodiment of the present application, a quantum device is also provided; the quantum device at least includes a substrate and a flyback bridge, wherein the substrate is a sapphire substrate or a silicon substrate or other materials, and the substrate, as a superconducting bottom material, mainly plays the role of physical support, heat conduction and electricity conduction; in the manufacturing process of the quantum device, a superconducting metal film layer is formed on the surface of the substrate by means of magnetron sputtering or other methods, and then a transmission line required for the quantum device is formed on the superconducting metal film layer by means of etching or other methods, including at least two intersecting first signal transmission lines 3 and second signal transmission lines 4, and the flyback bridge is arranged on the surface of the substrate coplanar with the first signal transmission line 3 and the second signal transmission line 4, specifically at the intersection of the first signal transmission line 3 and the second signal transmission line 4. At the intersection of the first signal transmission line 3 and the second signal transmission line 4, the first signal transmission line 3 is disconnected at a portion close to the second signal transmission line 4, and two sub-lines of the first signal transmission line 3 are formed on the substrate surface and on both sides of the second signal transmission line 4, that is, the first signal transmission line 3 has two sub-lines that are disconnected from each other and distributed on both sides of the second signal transmission line 4; and the two sub-lines have two ends adjacent to each other, and these two ends are electrically connected to the two supporting layers 2 of the flyover respectively. It is worth noting that the two end portions of the flyover are electrically connected to the adjacent two ends of the two sub-lines through the two supporting layers 2, and the middle portion of the flyover has an arch bridge shape. The second signal transmission line 4 is located in the arch bridge shape and does not contact the flyover to avoid causing cross-current between lines.

[0047] Please refer to Figure 4 In one embodiment of the present application, two air bridges 5 are respectively provided on both sides of each flyover; both ends of the air bridge 5 are respectively electrically connected to the ground surface on both sides of the second signal transmission line 4, and the air bridge 5 does not contact the second signal transmission line 4.

[0048] Here, the structure of the air bridge 5 is consistent with that of the flyover. Here, the flyover can be understood as a specific type of signal transmission line. If the flyovers are dense, there will be signal crosstalk between the lines. Therefore, two air bridges 5 are placed on both sides of each flyover and grounded, thereby reducing energy loss, improving the isolation between signal channels, and improving signal crosstalk between lines. It is worth noting that the two ends of the air bridge 5 are respectively connected to the ground planes on both sides of the second signal transmission line 4: the metal layer 1 on the surface of the substrate, and the arch bridge-shaped structure in the middle of the air bridge 5 is also used to cross the second signal transmission line 4, without contacting the second signal transmission line 4, to prevent the second signal transmission line 4 from short-circuiting to the ground. In addition, in the design of the layout, air bridges 5 will be placed on both the bus and the control line, so the design of the flyover and the air bridge 5 does not increase the process steps, does not require separate wiring, and does not increase the difficulty of the process.

[0049] In one embodiment of the present application, a signal port 6 is respectively provided at both ends of two sub-lines adjacent to each other, and each signal port 6 is electrically connected to the end of the corresponding sub-line; and the two signal ports 6 electrically connected to the two sub-lines are distributed on both sides of the second signal transmission line 4, and do not cross, overlap or contact the second signal transmission line 4; the above-mentioned signal ports 6 are only used to electrically connect to two supporting layers 2, and it is worth noting that one signal port 6 is only used to electrically connect to one supporting layer 2.

[0050] Please refer to Figure 5 In one embodiment of the present application, the two signal ports 6 located on both sides of the second signal transmission line 4 are electrically connected through the two above-mentioned flyovers, wherein the two ends of each flyover are respectively located on both sides of the second signal transmission line 4, and specifically, the two supporting layers 2 of each flyover are respectively located on both sides of the second signal transmission line 4 and electrically connected to the corresponding signal ports 6. Such a connection method can make the electrical connection between the two model ports more reliable and stronger.

[0051] Furthermore, for the contact-connected support layer 2 and signal port 6, the size of the support layer 2 is smaller than that of the signal port 6. Since the signal port 6 is manufactured by etching the metal film layer on the surface of the substrate, the metal film layer around the signal port 6 is "hollowed out" to expose the substrate surface. Therefore, when the signal port 6 is contact-connected with the support layer 2, it is necessary to ensure that the support layer 2 is completely within the effective area of ​​the signal port 6, that is, the vertical projection of the support layer 2 on the signal port 6 is within the periphery of the signal port 6.

[0052] In one embodiment of the present application, a superconducting quantum chip is provided, comprising the above-mentioned quantum device, a quantum bit located on the surface of a substrate, and a signal transmission line, wherein the signal transmission line in the quantum device is coupled and connected to the quantum bit. The signal transmission line may include a control line, for example: a microwave control line, which can adjust the state of the quantum bit; a magnetic flux control line, which can control the frequency of the quantum bit; a signal reading line, which can be associated with the quantum bit through a resonator to realize the reading operation of the quantum bit; or a signal reading line, which reads the information of the quantum bit by connecting the quantum bit through a coupling resonator.

[0053] In one embodiment of the present application, a quantum computer is also provided, including the aforementioned superconducting quantum chip. With reference to the currently popular quantum computers and the flyover bridge, quantum device and superconducting quantum chip in the present application, no further details are given here.

[0054] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example" or "specific example" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0055] The above describes in detail the structure, features and effects of the present application based on the embodiments shown in the drawings. The above is only a preferred embodiment of the present application, but the present application does not limit the scope of implementation to what is shown in the drawings. Any changes made in accordance with the concept of the present application, or modifications to equivalent embodiments with equivalent changes, which still do not exceed the spirit covered by the description and drawings, should be within the protection scope of the present application.

Claims

1. A flyover, characterized in that: include: A metal layer (1) having two separated end portions and a middle portion for connecting the two end portions; Two separate supporting layers (2) are used to correspond to the two end portions one by one and to be completely contact-connected, and the two contact surfaces of the two supporting layers (2) and the two end portions are located in the same plane; The two supporting layers (2) are on a first side of the plane, the two end portions are on a second side of the plane, and the middle portion is on the second side of the plane and has a gap with the plane.

2. The flyover according to claim 1, characterized in that: The middle portion and the two end portions are integrally formed; And / or, the material of the metal layer (1) is aluminum.

3. The flyover according to claim 1, characterized in that: The surface shape of the support layer (2) in contact with the two end portions is rectangular.

4. A quantum device, characterized in that: include: A substrate, a surface of which is provided with at least two intersecting first signal transmission lines (3) and second signal transmission lines (4); At least one flyover according to any one of claims 1 to 3, arranged on the surface of the substrate in the same plane as the first signal transmission line (3) and the second signal transmission line (4); The first signal transmission line (3) has two sub-lines which are disconnected from each other and are distributed on both sides of the second signal transmission line (4), and the two ends of the two sub-lines which are adjacent to each other are respectively electrically connected to the two supporting layers (2) of the crossover.

5. The quantum device according to claim 4, characterized in that: Two air bridges (5) are respectively arranged on both sides of each of the flyovers; The two ends of the air bridge (5) are electrically connected to the ground surfaces at both sides of the second signal transmission line (4), respectively, and the air bridge (5) is not in contact with the second signal transmission line (4).

6. The quantum device according to claim 4, characterized in that Two ends of the two sub-lines adjacent to each other are respectively provided with a signal port (6) and are electrically connected; The two signal ports (6) electrically connected to the two sub-lines respectively are distributed on both sides of the second signal transmission line (4) and are not in contact with the second signal transmission line (4); The signal port (6) is electrically connected to the two supporting layers (2).

7. The quantum device according to claim 6, characterized in that The two signal ports (6) on both sides of the second signal transmission line (4) are electrically connected via two flyovers, and the two supporting layers (2) of each flyover are electrically connected to different signal ports (6) respectively.

8. The quantum device according to claim 6, characterized in that: The size of the support layer (2) is smaller than the size of the signal port (6), and the vertical projection of the support layer (2) on the signal port (6) is within the periphery of the signal port (6).

9. A superconducting quantum chip, characterized in that: include: The quantum device according to any one of claims 4 to 8; as well as quantum bits and signal transmission lines located on the surface of the substrate; The signal transmission line is coupled to the quantum bit.

10. A quantum computer, characterized in that: include: The superconducting quantum chip as claimed in claim 9.

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