Developing equipment suitable for semiconductor photoetching process

Abstract

The utility model discloses developing equipment suitable for a semiconductor photoetching process, which relates to the technical field of semiconductor processing equipment and comprises a case, a processing cover is fixedly arranged at one end of the upper surface of the case, a fixing seat is fixedly arranged on the inner wall of the bottom end of the processing cover, and the fixing seat is of a conical structure. And a discharging table is movably arranged at the top end of the fixed seat through a bearing. The processing cover is arranged in the case, the fixed seat is arranged in the processing cover, the top end of the fixed seat is provided with the material placing table for placing the semiconductor substrate, and the material placing table can drive the semiconductor substrate to rotate; and redundant developing agents can be discharged through the discharging groove in the bottom end of the processing cover and the discharging cover under the guide of the conical structure fixing seat, so that the collecting processing of the developing agents can be realized, and the smooth proceeding of subsequent operation is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing equipment, in particular to a developing device suitable for semiconductor photolithography technology. Background Art

[0002] A semiconductor device that can achieve a certain function by etching and wiring on a semiconductor sheet is called a semiconductor chip. In order to coat the photoresist on the semiconductor chip, a coating and developing equipment is required.

[0003] For example, a semiconductor chip processing glue developing machine with publication number CN215769351U includes a base and a second bracket, one side of the top of the first bracket is connected to the first electric telescopic column through an electric telescopic rod, the second bracket is fixed on the base, the top of the second bracket is rotatably connected to a rotating frame, and the other side of the upper end surface of the base is provided with a second conveyor belt device. The semiconductor chip processing glue developing machine, after using the first suction cup to suck up a semiconductor chip in the limit frame and transfer it to the first conveyor belt device, the semiconductor chip can move to the right under the operation of the first conveyor belt device and enter the inner side of the glue developing machine body, which is convenient for automatic loading. The glue developing machine body can develop, rinse, glue and dry the semiconductor chip. After the semiconductor chip reaches the bottom of the second suction cup, the second suction cup sucks up the semiconductor chip and transfers it to the second conveyor belt device, which is convenient for automatic unloading.

[0004] The above technical solution has some problems in practical application. When developing the semiconductor chip, it is not convenient to handle the excess developer. Moreover, it is difficult to ensure the uniformity of the developer spraying when the developer is sprayed.

[0005] Therefore, it is necessary to invent a developing device suitable for semiconductor photolithography process to solve the above problems. Utility Model Content

[0006] The purpose of the utility model is to provide a developing device suitable for semiconductor photolithography process to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a developing device suitable for semiconductor lithography process, comprising a chassis, a processing cover is fixedly arranged at one end of the upper surface of the chassis, a fixing seat is fixedly arranged on the inner wall of the bottom end of the processing cover, and the fixing seat is arranged in a conical structure, a discharge table is movably arranged on the top of the fixing seat through a bearing, a driving motor is fixedly arranged on the bottom end of the processing cover, and the output shaft of the driving motor is fixedly connected to the bottom end of the discharge table, a plurality of discharge grooves are penetrated on the inner wall of the bottom end of the processing cover, a discharge cover is fixedly arranged at the bottom notch of the discharge groove, a movable seat is penetrated at the other end of the upper surface of the chassis, a swing arm is fixedly arranged on the top of the movable seat, a nozzle seat is fixedly arranged on one end of the swing arm, a swing motor is fixedly arranged on the bottom end of the movable seat, a transmission seat is fixedly arranged on the bottom end of the swing motor, an electric push rod is fixedly arranged on the bottom end of the transmission seat, and the electric push rod is fixedly arranged inside the chassis.

[0008] Preferably, a plurality of liquid storage tanks are fixedly provided on the outer side wall of the chassis, and a plurality of feeding pumps are fixedly provided inside the chassis.

[0009] Preferably, the plurality of feeding pumps correspond one-to-one to the plurality of liquid storage tanks, and the input end of the feeding pump is fixedly connected to the liquid storage tank via a conduit.

[0010] Preferably, a plurality of nozzles are fixedly arranged in the middle of the nozzle seat, and the plurality of nozzles are respectively connected to the output end of the feeding pump through a conduit, and the conduit is set as a PU hose.

[0011] Preferably, a controller is fixedly mounted on one end of the outer side wall of the chassis, and the controller is configured as a PLC control panel with a touch screen.

[0012] Preferably, the driving motor, the swing motor, the electric push rod and the feeding pump are all electrically connected to the controller via wires.

[0013] Technical effects and advantages of the utility model:

[0014] 1. The utility model arranges a processing cover inside the chassis, and a fixed seat is arranged inside the processing cover. A discharging table for placing semiconductor substrates is arranged on the top of the fixed seat, and the discharging table can drive the semiconductor substrates to rotate. When the developer is sprayed on the surface of the semiconductor substrate, the excess developer can be discharged through the discharging groove at the bottom of the processing cover and the discharging cover under the guidance of the conical structure fixed seat, so that the developer can be collected and processed to ensure the smooth progress of subsequent operations;

[0015] 2. The utility model sets a swing arm at the top of the chassis, and a nozzle seat is set at one end of the swing arm. A plurality of nozzles for spraying developer are set on the nozzle seat. When the developer is sprayed on the semiconductor substrate, the swing arm can drive the nozzle seat to move to switch different nozzles, so that different developers can be switched according to the operation process, thereby facilitating the development operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0017] Figure 2 It is a schematic cross-sectional view of the processing cover structure of the utility model.

[0018] Figure 3 It is a schematic cross-sectional view of the chassis structure of the utility model.

[0019] In the figure: 1. Chassis; 2. Processing cover; 3. Fixed seat; 4. Discharge table; 5. Driving motor; 6. Discharge chute; 7. Discharge cover; 8. Movable seat; 9. Swing arm; 10. Nozzle seat; 11. Swing motor; 12. Transmission seat; 13. Electric push rod; 14. Liquid storage tank; 15. Feeding pump; 16. Nozzle; 17. Controller. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] The utility model provides Figure 1-3 The developing device suitable for semiconductor photolithography process shown in the figure comprises a chassis 1, a processing cover 2 is fixedly arranged at one end of the upper surface of the chassis 1, a fixing seat 3 is fixedly arranged on the inner wall of the bottom end of the processing cover 2, and the fixing seat 3 is arranged in a conical structure, a material discharge table 4 is movably arranged at the top of the fixing seat 3 through a bearing, a driving motor 5 is fixedly arranged at the bottom end of the processing cover 2, and the output shaft of the driving motor 5 is fixedly connected to the bottom end of the material discharge table 4;

[0022] Specifically, a plurality of discharge grooves 6 are provided through the inner wall of the bottom end of the processing cover 2, and a discharge cover 7 is fixedly provided at the bottom notch of the discharge groove 6. The excess developer and water are discharged through the discharge groove 6 and the discharge cover 7 at the bottom end of the processing cover 2 under the guidance of the fixed seat 3.

[0023] More specifically, a movable seat 8 is provided through the other end of the upper surface of the chassis 1, a swing arm 9 is fixedly provided at the top of the movable seat 8, a nozzle seat 10 is fixedly provided at one end of the swing arm 9, a swing motor 11 is fixedly provided at the bottom end of the movable seat 8, a transmission seat 12 is fixedly provided at the bottom end of the swing motor 11, an electric push rod 13 is fixedly provided at the bottom end of the transmission seat 12, and the electric push rod 13 is fixedly provided inside the chassis 1, and the electric push rod 13 is used to adjust the height of the swing arm 9 to adjust the distance between the nozzle 16 and the semiconductor substrate;

[0024] In addition, a plurality of liquid storage tanks 14 are fixedly arranged on the outer wall of the chassis 1, and a plurality of feeding pumps 15 are fixedly arranged inside the chassis 1. The plurality of feeding pumps 15 correspond to the plurality of liquid storage tanks 14 one by one, and the input end of the feeding pump 15 is fixedly connected to the liquid storage tank 14 through a conduit. A plurality of nozzles 16 are fixedly arranged in the middle of the nozzle holder 10. The plurality of nozzles 16 are respectively connected to the output end of the feeding pump 15 through a conduit, and the conduit is set as a PU hose. The plurality of nozzles 16 respectively include two developer nozzles 16, a pure water nozzle 16 and a nitrogen nozzle 16. The plurality of nozzles 16 spray the surface of the semiconductor substrate respectively to facilitate the development process of the semiconductor substrate.

[0025] Moreover, a controller 17 is fixedly installed at one end of the outer wall of the chassis 1, and the controller 17, the drive motor 5, the swing motor 11, the electric push rod 13 and the feed pump 15 are all electrically connected to the controller 17 through wires. The controller 17 can control the swing motor 11, the electric push rod 13 and the feed pump 15 to facilitate the operation of the device.

[0026] Working principle of this utility model:

[0027] When the device is in use, the semiconductor substrate can be placed above the discharge table 4, the driving motor 5 can drive the discharge table 4 to rotate, and the swing motor 11 can drive the swing arm 9 to swing, and the swing arm 9 drives the nozzle seat 10 to move, so that the nozzle 16 on the nozzle seat 10 moves to the top of the semiconductor substrate, and the height of the swing arm 9 is adjusted by the electric push rod 13, so that the distance between the nozzle 16 on the nozzle seat 10 and the semiconductor substrate can be adjusted, and the developer, pure water and nitrogen in the liquid storage tank 14 are sprayed onto the surface of the semiconductor substrate in turn through the feeding pump 15 to realize the development treatment of the semiconductor substrate. During the treatment process, the excess developer and water are discharged through the discharge groove 6 and the discharge cover 7 at the bottom of the processing cover 2 under the guidance of the fixed seat 3.

[0028] Finally, it should be noted that the above is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A developing device suitable for semiconductor photolithography process, comprising a housing (1), characterized in that: A processing cover (2) is fixedly arranged at one end of the upper surface of the chassis (1); a fixing seat (3) is fixedly arranged on the inner wall of the bottom end of the processing cover (2); and the fixing seat (3) is arranged in a conical structure; a discharge platform (4) is movably arranged at the top of the fixing seat (3) through a bearing; a driving motor (5) is fixedly arranged at the bottom end of the processing cover (2); and the output shaft of the driving motor (5) is fixedly connected to the bottom end of the discharge platform (4); a plurality of discharge grooves (6) are penetrated through the inner wall of the bottom end of the processing cover (2); and the bottom notches of the discharge grooves (6) are A discharge cover (7) is fixedly arranged at the other end of the upper surface of the chassis (1), a movable seat (8) is penetrated and arranged, a swing arm (9) is fixedly arranged at the top of the movable seat (8), a nozzle seat (10) is fixedly arranged at one end of the swing arm (9), a swing motor (11) is fixedly arranged at the bottom end of the movable seat (8), a transmission seat (12) is fixedly arranged at the bottom end of the swing motor (11), an electric push rod (13) is fixedly arranged at the bottom end of the transmission seat (12), and the electric push rod (13) is fixedly arranged inside the chassis (1).

2. The developing device suitable for semiconductor photolithography process according to claim 1, characterized in that: A plurality of liquid storage tanks (14) are fixedly arranged on the outer side wall of the chassis (1), and a plurality of feed pumps (15) are fixedly arranged inside the chassis (1).

3. The developing device suitable for semiconductor photolithography process according to claim 2, characterized in that: The plurality of feeding pumps (15) correspond one to one to the plurality of liquid storage tanks (14), and the input end of the feeding pump (15) is fixedly connected to the liquid storage tank (14) via a conduit.

4. The developing device suitable for semiconductor photolithography process according to claim 3, characterized in that: A plurality of nozzles (16) are fixedly arranged in the middle of the nozzle seat (10), and the plurality of nozzles (16) are respectively connected to the output end of the feeding pump (15) through a conduit, and the conduit is configured as a PU hose.

5. The developing device suitable for semiconductor photolithography process according to claim 4, characterized in that: A controller (17) is fixedly arranged at one end of the outer side wall of the chassis (1), and the controller (17) is arranged as a PLC control panel with a touch screen.

6. The developing device suitable for semiconductor photolithography process according to claim 5, characterized in that: The driving motor (5), the swing motor (11), the electric push rod (13) and the feeding pump (15) are all electrically connected to the controller (17) via wires.

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