Liquid crystal screen capable of directly checking blasting effect of conductive particles

By designing transparent bound PAD and coatless metal air evacuation on the lower substrate of the LCD screen, the problem of difficult detection of the blasting effect of conductive particles is solved, achieving more efficient analysis and improving product competitiveness.

CN222672092UActive Publication Date: 2025-03-25XINLI OPTICAL RENSHOU CO LTD
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Patent Information

Application Number
CN202421378801.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-17
Publication Date
2025-03-25
Estimated Expiration
2034-06-17

AI Technical Summary

Technical Problem

In the existing LCD screen structure, the blasting effect of conductive particles after ACF hot pressing is difficult to directly check, which affects the inspection efficiency and product competitiveness.

Method used

A liquid crystal screen is designed, with a transparent binding PAD at the steps of the lower substrate, and there are multiple binding positions on the binding PAD. Each binding position is equipped with an air-evacuation portion without coated metal in the middle, allowing the blasting effect of conductive particles to be observed from the back of the lower substrate.

Benefits of technology

Through the design of transparent lower substrate and uncoated metal air-evacuation, the blasting effect of conductive particles on the ACF can be directly observed, which improves the analysis efficiency and enhances the competitiveness of the product.

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Abstract

The utility model discloses a liquid crystal screen capable of directly checking the blasting effect of conductive particles, which comprises a lower polaroid, a lower substrate, an upper substrate and an upper polaroid which are sequentially overlapped from bottom to top, and the lower substrate is longer than the upper substrate and extends outwards to form a step. The upper surface of the lower substrate is provided with a step, the upper surface of the lower substrate located at the step is provided with a binding PAD, the binding PAD comprises a plurality of binding positions which are arranged in sequence, the middle of each binding position is provided with a clearance part without coating metal, and the binding PAD is bound with an FPC. Due to the fact that the middle of each binding position is provided with the receding part without coating metal, after the lower substrate and the FPC are bound in a hot-pressing mode, the blasting effect of conductive particles on the ACF can be observed from the back face of the lower substrate through the receding parts in the middles of the binding positions, and therefore analysis efficiency is improved, and product competitiveness is improved.
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