Chip heat dissipation device

By using automatic compression components, including elastic parts and adjusting parts in the chip heat dissipation device, the problem of reducing heat dissipation efficiency caused by the gap between the chip and the patch plate is solved, and the chip and the radiator are closely connected to continuously and efficiently heat dissipation.

CN222673030UActive Publication Date: 2025-03-25CHENGDU DIYUE ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202421392236.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-18
Publication Date
2025-03-25
Estimated Expiration
2034-06-18

AI Technical Summary

Technical Problem

In the prior art, the chip is connected to the heat dissipation fins through the patch plate. After a long time, a gap is easily generated between the chip and the patch plate, resulting in the inability to fully transmit the heat of the chip to the heat dissipation fins, and the heat dissipation efficiency of the chip is reduced.

Method used

Automatic compression components are adopted, including elastic members and adjusting members. The elastic members drive the lower pressing part to press the chip on the radiator downward through elastic deformation, and the adjusting members drive the fixing rod to press the chip through threaded connection to ensure that the chip and the radiator are closely connected.

Benefits of technology

Even after a long period of use, the automatic compression assembly can continuously tightly connect the radiator by releasing elastic force to maintain efficient heat dissipation efficiency.

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Abstract

The utility model discloses a chip heat dissipation device, which relates to the technical field of chip heat dissipation, and comprises a radiator and an automatic pressing assembly, the automatic pressing assembly comprises an elastic piece and an adjusting piece, the elastic piece comprises an elastic part and a pressing part which are connected with each other, one end part of the adjusting piece is connected with the elastic part, and the other end part of the adjusting piece is movably connected with the radiator. The adjusting part can move towards the radiator to abut against the elastic part, and the elastic part can drive the downward pressing part to downwards press a chip on the radiator through elastic deformation. In the assembling process, the adjusting piece can be controlled to move close to the radiator so that the adjusting piece can abut against the elastic part, the elastic part can drive the pressing part to press the chip on the radiator downwards when elastic deformation occurs, the chip and the radiator can be tightly connected, and the heat dissipation efficiency of the chip is improved. And after a long time, the elastic part can release the elastic force to drive the chip to be continuously and tightly connected with the radiator, so that the chip and the radiator are continuously and tightly connected, and the radiating efficiency of the chip is always kept in a high-efficiency state.
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