Structure of flexible circuit board used during steel sheet reinforcement

By using a combined structure of heat-curing glue and steel sheet on the flexible circuit board and combined with conventional FPC processing technology, the shortcomings of traditional flexible circuit boards in terms of flexural performance, dimensional stability and tensile strength are solved, the adhesion accuracy and product qualification rate are improved, and the overall performance of the flexible circuit board is significantly improved.

CN222674566UActive Publication Date: 2025-03-25DALIAN JIXING ELECTRONICS
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Patent Information

Application Number
CN202421212588.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-30
Publication Date
2025-03-25
Estimated Expiration
2034-05-30

AI Technical Summary

Technical Problem

Traditional flexible circuit boards have shortcomings in terms of flexural performance, dimensional stability and tensile strength, and steel sheet reinforcement technology has changed the conventional FPC processing method, making it cumbersome and poor adhesion accuracy, and low product pass rate.

Method used

The heat-curing glue is used to set up multiple reinforcement positions of the whole plate FPC product. The whole reinforcement steel sheet is laid through the heat-curing glue, and some steel sheets are retained after the etching operation. The top dry film and the bottom dry film are exposed, developed and etched respectively, and finally compressed by a film-removing and dry film pressing machine.

Benefits of technology

The conventional FPC processing technology is not changed, the adhesion accuracy of steel sheet reinforcement is improved, the risk of deviating, the product pass rate is improved, and the mechanical strength and overall performance of the flexible circuit board are significantly improved.

✦ Generated by Eureka AI based on patent content.
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Abstract

The utility model discloses a structure of a flexible circuit board used during steel sheet reinforcement, and relates to the technical field of flexible circuit board manufacturing. Comprising thermocuring glue which is arranged at a plurality of reinforcing positions of the whole FPC product; the reinforcing steel sheet is laid on the whole FPC product through a thermocuring adhesive; before the etching operation, the reinforcing steel sheet is of a whole sheet structure; after the etching operation is carried out, the reinforcing steel sheet is positioned on the corresponding thermocuring adhesive; the top layer dry film is laid on the reinforcing steel sheet; before exposure and development, the top-layer dry film is of a whole-piece structure; after exposure and development, the top layer dry film is located on the corresponding reinforcing steel sheet; and the bottom layer dry film is laid below the whole FPC product. According to the structure provided by the utility model, the conventional FPC processing technology is not changed, the attaching precision is high, the deviation risk is reduced through whole board attaching, and the product percent of pass is improved.
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