Liquid cooling heat dissipation device coupled with vapor chamber and vapor chamber substrate thereof

By designing a coupled heat-smoothing plate in the liquid-cooled heat-sinking device, using a heat-smoothing cavity structure with a large condensation end surface area and a small evaporation end surface area, the problem of insufficient heat dissipation ability of electronic devices with high heat flow density is solved, and efficient heat dissipation effect is achieved.

CN222674767UActive Publication Date: 2025-03-25SHENZHEN ENVICOOL TECH
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Patent Information

Application Number
CN202420750052.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-11
Publication Date
2025-03-25
Estimated Expiration
2034-04-11

AI Technical Summary

Technical Problem

The existing cold plate single-phase liquid-cooled heat dissipation technology is insufficient in the local heat dissipation capacity when facing electronic devices with high heat flow density, making it difficult to ensure temperature requirements, especially under specific conditions, which may cause temperatures to exceed the range.

Method used

A liquid-cooled heat dissipation device coupled with a heat-cooling plate is designed. The heat-cooling plate substrate is equipped with a heat-cooling chamber filled with refrigerant. The evaporation end is in contact with the heat source. The end surface area of ​​the condensing end is greater than the evaporation end. The liquid-cooling radiator comes into contact with the condensing end for heat exchange, realizing rapid condensation of the refrigerant.

Benefits of technology

By converting large heat flow density into small heat flow density, the heat dissipation ability is effectively improved, the overall performance of high heat flow density electronic devices is ensured, and efficient heat dissipation is achieved.

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Abstract

The utility model discloses a liquid cooling heat dissipation device coupled with a vapor chamber and a vapor chamber substrate of the liquid cooling heat dissipation device. The liquid cooling heat dissipation device comprises the vapor chamber substrate and a liquid cooling heat dissipation device connected with the vapor chamber substrate. A soaking cavity filled with refrigerants is formed in the soaking plate base plate and comprises an evaporation end used for making contact with a heat source and a condensation end opposite to the evaporation end, and the end face area of the condensation end is larger than that of the evaporation end. And the liquid cooling radiator is in contact with the condensation end of the soaking plate substrate and exchanges heat with the condensation end so as to condense the refrigerant which is heated and evaporated into a gas state in the soaking cavity into a liquid state. Through the arrangement of the vapor chamber substrate, large heat flux of a heating surface of an electronic device is converted into small heat flux through the large-area condensation end, and a gaseous refrigerant filled in the vapor chamber can be cooled and condensed back to a liquid state more quickly through the liquid cooling radiator at the condensation end, so that the heat dissipation capability is effectively improved; and the overall performance of an electronic device with high heat flux density can be ensured.
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