Electroplating feeding buffer device
By designing an electroplating loading buffer device including lifting plate, slide chute, screw and rotating motor, the problem of clamping force in the prior art is solved, and the protection of electroplating items and the efficiency of electroplating is improved.
Patent Information
- Application Number
- CN202421471377.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-26
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-06-26
AI Technical Summary
The existing electroplating and feeding devices mostly use clamping methods during use, and cannot buffer the clamping force, which may cause damage to the electroplating items and require manual assistance, which increases the labor intensity of the operator and reduces the efficiency of electroplating.
An electroplating and feeding buffer device is designed, including components such as lifting plate, sliding groove, screw rod, transmission gear and rotating motor. The rotating motor drives the screw rod and slide in the sliding groove, drive the moving plate, spring, clamp plate and clamp slide, realize buffering of clamping force, and drive the lifting plate to automatically lift and lower through the lifting motor to reduce manual operation.
The device reduces damage to electroplating items by buffering clamping force, and through the design of automated lifting plates, the labor intensity of operators is reduced and the efficiency of electroplating is improved.