Precise electroplating thickness control device

By designing a precision electroplating thickness control device, the coordination of the motor, reciprocating screw, transmission mechanism and stirring mechanism is used to solve the problem of uneven electroplating, achieving uniform electroplating of the workpiece and uniformity of the electroplating layer thickness, and improving the electroplating effect.

CN222684829UActive Publication Date: 2025-03-28DONGGUAN XUNSHENG PRECISION TECH CO LTD
1 Cites 0 Cited by

Patent Information

Application Number
CN202421022033.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-13
Publication Date
2025-03-28
Estimated Expiration
2034-05-13

AI Technical Summary

Technical Problem

Existing electroplating equipment is prone to inhomogeneous electroplating during the electroplating process, resulting in uneven thickness of the electroplating layer, affecting the electroplating effect.

Method used

A precision electroplating thickness control device is designed, including an electroplating cell, an electroplating tank, a support plate, a top box, a transmission box, a motor, a reciprocating mechanism, a stirring mechanism, etc. Through the cooperation of the motor, a reciprocating screw, a transmission mechanism and a stirring mechanism, the workpiece is electroplating at different locations in the electroplating solution, and the stirring mechanism is used to ensure that the metal ions in the electroplating solution are evenly distributed.

Benefits of technology

The uniform electroplating of the workpiece is achieved, avoiding the problem of uneven thickness of the electroplating layer and improving the electroplating effect.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The utility model belongs to the technical field of electroplating equipment, and particularly relates to a precise electroplating thickness control device which comprises an electroplating pool, an electroplating bath is formed in the top of the electroplating pool, two supporting plates are fixedly mounted at the top of the electroplating pool, the electroplating bath is located between the two supporting plates, and the same top box is fixedly mounted at the tops of the two supporting plates; the right side of the top box and the right side of the electroplating pool are fixedly provided with the same transmission box. The electroplating device is reasonable in design, by arranging the electric telescopic rod and the placing mechanism, the purposes of controlling the electroplating duration of a workpiece and controlling the electroplating thickness of the workpiece can be achieved, by arranging the reciprocating mechanism, electroplating machining of the workpiece in different positions in electroplating liquid can be achieved, and the electroplating efficiency is improved. And by arranging the stirring mechanism, the purpose that the electroplating effect is affected due to the fact that the thickness of an electroplated layer of the workpiece is not uniform can be achieved.
Need to check novelty before this filing date? Find Prior Art