Floating floor heat preservation, sound insulation and vibration reduction structure
By designing the meshing connection structure between the upper motherboard and the lower motherboard of the floating floor slab, the meshing effect of bumps and grooves is used to adjust during vibration, the existing floating floor structure is easily exposed to gaps and deformation when facing external factors, and better shock absorption and thermal insulation and sound insulation are achieved.
Patent Information
- Application Number
- CN202421354920.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-13
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-06-13
AI Technical Summary
When facing external factors such as thermal expansion, contraction and vibration, existing floating floor insulation structures are prone to gaps and cannot effectively absorb vibration, resulting in deformation and use effects.
A floating floor insulation and vibration-absorbing structure including the upper motherboard and the lower motherboard is designed. By setting up bumps and grooves that engage in engagement between the two plates, slight adjustment and movement are allowed during vibration, thereby achieving shock absorption effect, and avoiding gaps caused by thermal expansion and contraction through the design of mutually engaging and connecting.
It effectively reduces the impact of vibration on the structure, avoids deformation caused by vibration, and ensures a tight fit under thermal expansion and contraction, ensuring the effectiveness of the structure.