Handheld multifunctional fan

By setting a semiconductor refrigeration sheet in the case of the handheld multi-function fan, the shell is divided into a cold half area and a hot half area, and the separation of cold air and hot air is achieved, the problem of mixing cold air and hot air in the existing technology is solved, improving the use effect and reducing costs.

CN222688353UActive Publication Date: 2025-03-28CHONGQING HONGEN XINCHUANG TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202421496805.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-27
Publication Date
2025-03-28
Estimated Expiration
2034-06-27

AI Technical Summary

Technical Problem

The handheld small fan with existing semiconductor cooling functions does not design to separate the hot air after heat dissipation from the cold air after cooling, resulting in the air blown when the ambient temperature exceeds 30 degrees as hot air. After cooling, the cooling surface will quickly become hot and affect the cooling effect.

Method used

A handheld multifunctional fan is designed. By setting a semiconductor refrigeration plate in the case, the shell is divided into a cold half area and a hot half area, and air is blown into the cold half area and a hot half area through the first fan and the fan blade respectively to achieve the separation of cold air and hot air.

Benefits of technology

The separation of cold air and hot air is achieved. Cold air can be blown in summer and hot air can be blown in winter, which improves the use effect, meets different needs, and reduces costs and has high application value.

✦ Generated by Eureka AI based on patent content.
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Abstract

The utility model relates to the technical field of small household appliances for daily use, and particularly discloses a handheld multifunctional fan which comprises a shell, a first fan and a plurality of semiconductor chilling plates, the first fan and the semiconductor chilling plates are arranged in the shell, the first fan and the semiconductor chilling plates are located on the same axis, and the first fan is located at one ends of the semiconductor chilling plates; the semiconductor chilling plate divides the interior of the shell where the semiconductor chilling plate is located into a cold half area and a hot half area; a first air inlet is formed in one end, close to the first fan, of the shell; a cold air outlet and a hot air outlet are formed in the end, away from the first fan, of the shell, the cold air outlet is located in the cold half area, and the hot air outlet is located in the hot half area. According to the technical scheme, cold air and hot air can be separated, the using effect is improved, and different requirements are met.
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