Magnetron
By designing a hoist-shaped magnetron, the plasma density on both sides of the target material is enhanced, and the problem of poor film deposition uniformity in multi-target magnetron sputtering equipment is solved, and the uniformity of the film deposition rate is achieved.
Patent Information
- Application Number
- CN202421198983.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-29
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-05-29
AI Technical Summary
During the thin film deposition process of existing multi-target magnetron sputtering equipment, the rotation of the substrate table leads to the fixed target material and the thin film deposition uniformity is poor. The existing improved methods such as delta target material, magnetron and baffle methods have not effectively solved this problem.
A hoist-shaped magnetron is designed, and two closed magnetic rings are formed by an outer magnetic pole magnet with opposite polarity and an inner magnetic pole magnet, and the magnetron is swung relative to the center of the target by rotating and swinging means to form a hoist-shaped magnetic ring to enhance the plasma density on both sides of the target.
By enhancing the plasma density on both sides of the target material, improving the film deposition rate at both ends of the target material, achieving uniformity of the overall film deposition rate, avoiding the problem of insufficient film uniformity in the prior art.