Efficient heat dissipation LED display module
By designing the heat sink, heat sink and fan components in the LED display module, the problems of low heat dissipation efficiency and complex maintenance in the prior art are solved, and efficient heat dissipation, low cost and easy maintenance are achieved.
Patent Information
- Application Number
- CN202421492230.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-27
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2034-06-27
AI Technical Summary
The existing LED display module has low heat dissipation efficiency during long working hours, resulting in reduced LED work efficiency and shortened service life. The existing heat dissipation technology has problems such as high cost and complex maintenance.
An LED display module including a heat sink, a heat sink and a fan assembly is designed. A heat sink channel is set in the heat sink, and a special-shaped heat sink fin set is set on the surface of the heat sink. The fan assembly is used to quickly discharge heat in the channel.
It significantly improves the heat dissipation efficiency of LED display modules, extends the service life of the module, reduces maintenance costs, and is suitable for large-scale production and applications.
Smart Images

Figure CN222774956U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LED display, in particular to an LED display module with high efficiency in heat dissipation. Background Art
[0002] LED (Light Emitting Diode) is an optoelectronic product widely used in electronic equipment, outdoor billboards, automotive lighting and other fields. With the continuous development of LED technology, LED display modules have achieved significant improvements in brightness, color reproduction, energy saving and other aspects, and are therefore widely used in various scenarios.
[0003] However, LED display modules generate a lot of heat when working for a long time, and high temperature will affect the working efficiency and life of LED, and may even cause LED failure. Therefore, heat dissipation is one of the important issues that must be solved. At present, there are some heat dissipation technologies on the market, but they have some shortcomings, which limit the application and performance of LED display modules in high temperature environments.
[0004] One of the common heat dissipation technologies currently is to use aluminum heat sinks or radiators, which usually accelerate the dissipation of heat through a large contact area. However, aluminum radiators have the problem of low heat dissipation efficiency because their heat dissipation surface is relatively flat and cannot effectively increase the heat dissipation area, thus limiting the heat dissipation effect. In addition, some high-level LED display modules use liquid heat dissipation technology to remove heat through circulating liquid. Although this technology has a good heat dissipation effect, it requires regular maintenance and regular inspection of the liquid cooling pipes to prevent coolant leakage, resulting in a sharp increase in maintenance costs, and is not suitable for large-scale applications.
[0005] Therefore, in view of the current status of LED display module heat dissipation technology, it is particularly important to develop a new type of heat dissipation system. Utility Model Content
[0006] The main purpose of the utility model is to provide an LED display module with high heat dissipation efficiency, aiming to solve the technical problem that the existing LED display module heat dissipation structure is difficult to improve the heat dissipation effect at a low cost.
[0007] To achieve the above object, the utility model provides an LED display module with high efficiency heat dissipation, comprising:
[0008] A heat dissipation frame, wherein a heat dissipation channel is arranged inside the heat dissipation frame;
[0009] A heat sink, the heat sink is arranged on two opposite sides of the heat sink and is connected to the heat dissipation channel, wherein a first heat dissipation fin group and a second heat dissipation fin group are arranged on the surface of the heat sink;
[0010] A fan assembly, wherein the fan assembly is arranged at the first end of the heat dissipation frame, and the air outlet direction of the fan assembly is directly facing the heat dissipation channel, and is used to discharge the heat in the heat dissipation channel through the fan assembly, wherein the first end of the heat dissipation frame is an end adjacent to the heat sink;
[0011] The first heat dissipation fin group and the second heat dissipation fin group both include connecting ribs extending in a semicircular arc shape; protruding columns are protruded on the inner wall and the outer wall of the connecting ribs;
[0012] Wherein, the protruding columns on the inner wall and the protruding columns on the outer wall are arranged alternately along the extending direction of the connecting ribs.
[0013] Furthermore, the protrusions on the outer wall include first protrusions and second protrusions, the second protrusions are arranged at intervals of several first protrusions, the first protrusions extend from the connecting rib in a straight line, the second protrusions extend from the connecting rib in a semi-arc shape, and the opening direction of the semi-arc is arranged toward the outside of the connecting rib.
[0014] Furthermore, a gap is provided between the first heat dissipation fin group and the second heat dissipation fin group, so that an air circulation channel is formed between the two groups of heat dissipation fins, and a plurality of first heat dissipation holes are provided at the center position and the port position of the air circulation channel.
[0015] Furthermore, the heat dissipation frame is provided with a plurality of second heat dissipation holes at both ends of the heat dissipation fin, and the second heat dissipation holes are vertically connected to the heat dissipation channel.
[0016] Furthermore, it also includes a light-emitting component, which is arranged at the center of the heat dissipation frame and fixedly connected to the heat dissipation frame.
[0017] Furthermore, it also includes a timer, wherein the timer is electrically connected to the fan assembly;
[0018] When the timer is triggered, the fan assembly is started to discharge the heat in the heat dissipation channel through the rotation of the fan assembly.
[0019] Furthermore, the fan assembly includes a fan body and a fan driving circuit, wherein the fan driving circuit is electrically connected to the timer, and when the timer is triggered, the fan driving circuit drives the fan body to rotate.
[0020] Furthermore, the light-emitting component includes LED lamp beads and a circuit board, and a plurality of the LED lamp beads are equidistantly arranged on the circuit board.
[0021] Furthermore, a fixing piece is included, and the heat sink and the heat sink frame are fixedly connected via the fixing piece.
[0022] Furthermore, the circuit board is also provided with a power interface and a signal interface for providing the LED lamp beads with power and signal input required for operation.
[0023] Beneficial effects:
[0024] The utility model discloses an LED display module with high efficiency heat dissipation. By setting a heat dissipation channel on the heat sink, and designing a first heat dissipation fin group and a second heat dissipation fin group with special shapes on the surface of the heat sink, the heat dissipation efficiency of the LED display module can be significantly improved. The design of the heat dissipation channel allows heat to flow effectively inside the heat sink, while the first heat dissipation fin group and the second heat dissipation fin group on the heat sink increase the heat dissipation area and improve the heat dissipation speed. At the same time, the protruding columns on the inner wall and the protruding columns on the outer wall are staggered along the extension direction of the connecting ribs, further increasing the heat dissipation area, making the heat dissipation more uniform and efficient. In addition, the setting of the fan assembly can quickly discharge the heat in the heat dissipation channel, further improving the heat dissipation effect. Compared with traditional aluminum heat sinks or liquid heat dissipation technology, the LED display of the present application achieves high efficiency heat dissipation and improves the stability and life of the LED display module in a high temperature environment. Secondly, the heat dissipation system of the present application does not need to use a liquid cooling medium, avoids high maintenance costs and potential leakage risks, and reduces the use and maintenance costs. Thirdly, the design of the heat sink and the heat sink can be easily integrated with other LED display modules, which is suitable for large-scale production and application.
[0025] In summary, the LED display module of the present application has the advantages of efficient heat dissipation, low cost, and easy maintenance. It is particularly suitable for application scenarios in long-term working and high-temperature environments, and provides a new solution for the development of LED display technology. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 This is a schematic diagram of the overall structure of an LED display module with high efficiency heat dissipation according to an embodiment of the utility model;
[0027] Figure 2 The utility model is a schematic structural diagram of a heat sink of an LED display module with high heat dissipation efficiency according to an embodiment of the utility model.
[0028] Among them: 1. heat sink; 2. heat dissipation channel; 3. heat sink; 41. first heat dissipation fin group; 42. second heat dissipation fin group; 431. first protrusion; 432. second protrusion; 433. connecting rib; 5. fan assembly; 6. timer; 7. light-emitting assembly; 81. first heat dissipation hole; 82. second heat dissipation hole; 9. air circulation channel.
[0029] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0030] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.
[0031] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.
[0032] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0033] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0034] Reference Figure 1-Figure 2, an LED display module with high efficiency heat dissipation in one embodiment of the utility model comprises: a heat sink 1, wherein a heat dissipation channel 2 is arranged inside the heat sink 1; a heat sink 3, wherein the heat sink 3 is arranged on opposite sides of the heat sink 1 and is connected to the heat dissipation channel 2, wherein a first heat dissipation fin group 41 and a second heat dissipation fin group 42 are arranged on the surface of the heat sink 3; a fan assembly 5, wherein the fan assembly 5 is arranged at a first end of the heat sink 1, and the air outlet direction of the fan assembly 5 is directly facing the heat dissipation channel 2, and is used to discharge the heat in the heat dissipation channel 2 through the fan assembly 5, wherein the first end of the heat sink 1 is an end adjacent to the heat sink 3; the first heat dissipation fin group 41 and the second heat dissipation fin group 42 both include a connecting rib 433 extending in a semicircular arc shape; protruding columns are protruded on the inner wall and the outer wall of the connecting rib 433; wherein the protruding columns on the inner wall and the protruding columns on the outer wall are staggered along the extension direction of the connecting rib 433.
[0035] In this embodiment, the heat sink 1 can be selected as a rectangular structure, so that the heat sink 1 can stably support the LED display module, and the heat dissipation channel 2 arranged inside can effectively guide the heat generated by the module to improve the heat dissipation efficiency. The heat sink 3 is arranged on opposite sides of the heat sink 1 and is connected to the heat dissipation channel 2, which can effectively disperse the heat to various parts of the heat sink 3, and further dissipate the heat through the first heat dissipation fin group 41 and the second heat dissipation fin group 42 on the surface of the heat sink 3, which not only increases the heat dissipation area, but also can take away more heat through air flow, thereby further improving the heat dissipation effect; the first end of the heat sink 1 is provided with a fan assembly 5. The air outlet direction of the fan assembly 5 is directly facing the heat dissipation channel 2, and the heat in the heat dissipation channel 2 can be discharged through the fan assembly 5, thereby achieving rapid heat dissipation. This design not only improves the heat dissipation efficiency, but also prolongs the service life of the LED display module; the connecting rib 433 is a supporting structure for the first heat dissipation fin group 41 and the second heat dissipation fin group 42, extending in a semicircular arc shape, which can not only enhance the overall stability of the heat dissipation fin group, but also reduce the use of materials and reduce costs while maintaining a certain strength. At the same time, protruding columns are provided on the inner wall and the outer wall of the connecting rib 433, which can increase the heat dissipation area and improve the heat dissipation efficiency. Moreover, the protruding columns on the inner wall and the protruding columns on the outer wall are staggered along the extension direction of the connecting rib 433, which can effectively break the flow resistance of the hot air, improve the fluidity of the hot air, and further improve the heat dissipation effect.
[0036] In this embodiment, the airflow generated by the operation of the fan assembly 5 enters the heat dissipation channel 2 from the first end of the heat sink 1, flows along the heat dissipation channel 2, and exchanges heat with the first heat dissipation fin group 41 and the second heat dissipation fin group 42 on the heat sink 3. The first heat dissipation fin group and the second heat dissipation fin group both include connecting ribs extending in a semicircular arc shape, and the protrusions on the inner wall and the protrusions on the outer wall are staggered along the extension direction of the connecting ribs. This design not only increases the heat dissipation area, but also allows the airflow to flow more evenly between the heat dissipation fins, thereby improving the heat dissipation efficiency. At the same time, the heat sink 3 is connected to the heat dissipation channel 2, so that the heat can be quickly transferred from the LED display module to the heat sink 3, and further dissipated into the air through the heat dissipation fins, ensuring that the heat can be quickly and effectively extracted, thereby preventing the LED display module from being affected by overheating and affecting its performance and life.
[0037] In summary, the utility model provides an efficient heat dissipation LED display module, which can effectively improve the heat dissipation efficiency and ensure the normal operating temperature of the LED display module through reasonable design of the heat dissipation frame 1, heat sink 3 and fan assembly 5, as well as optimized heat dissipation fin structure, thereby extending its service life and improving user experience.
[0038] It should be noted that Figure 1 and Figure 2 The heat sink 3 in the embodiment is set as a reference setting, and the heat sink 3 in this embodiment can be flexibly adjusted according to the specific application scenario and heat dissipation requirements. For example, in a specific embodiment, a denser arrangement of fins is adopted to increase the heat dissipation area, so as to more effectively dissipate the generated heat; or a plurality of heat sinks 3 are provided on opposite sides of the heat sink 1 to meet higher heat dissipation requirements; or the heat sink 3 is provided at the opposite end of the fan assembly 5 to further guide the wind flow and improve the heat dissipation effect. At the same time, customized heat dissipation design can also be performed according to different environments and usage conditions. For example, in a high temperature environment, the number of heat sink fins can be increased or their shape can be adjusted to improve the heat dissipation efficiency.
[0039] In one embodiment, the protrusion includes a first protrusion 431 and a second protrusion 432, the second protrusion 432 is arranged at intervals of a plurality of first protrusions 431, the first protrusion 431 extends from the connecting rib 433 in a straight line, and the second protrusion 432 extends from the connecting rib 433 in a semi-arc shape, and the opening direction of the semi-arc is arranged toward the outside of the connecting rib 433.
[0040] In this embodiment, the first protrusion 431 extends from the connecting rib 433 in a straight line, and the second protrusion 432 extends from the connecting rib 433 in a semi-arc shape. This mixed protrusion design can further optimize the heat dissipation effect. The straight extension of the first protrusion 431 maximizes the heat dissipation surface area in a certain direction, while the semi-arc extension of the second protrusion 432 can guide the wind flow, so that the airflow flows more smoothly between the heat dissipation fins to avoid the formation of dead zones. At the same time, the semi-arc opening direction of the second protrusion 432 is set toward the outside of the connecting rib 433, which can further enhance the heat dissipation effect of the heat dissipation fins in a specific direction and improve the overall heat dissipation efficiency. In addition, the arrangement of the second protrusion 432 with a plurality of first protrusions 431 at intervals ensures that the heat dissipation fin group maintains a sufficient heat dissipation area while also ensuring the smooth flow of airflow, avoiding the airflow blockage caused by the excessive density of the heat dissipation fins, thereby ensuring that the heat can be quickly and effectively discharged. At the same time, the semi-arc design of the second protrusion 432 also brings better structural stability to the heat sink fins, making the heat sink fins less likely to deform or be damaged during long-term use. In an optional embodiment, according to the actual situation, the spacing and number of the first protrusion 431 and the second protrusion 432 can further adjust the heat sink surface area and the airflow path to meet different heat dissipation requirements, which not only improves the heat dissipation efficiency, but also makes the heat sink fin group have a more unique and beautiful appearance.
[0041] In one embodiment, a gap is provided between the first heat dissipation fin group 41 and the second heat dissipation fin group 42 so that an air circulation channel 9 is formed between the two groups of heat dissipation fins, and a plurality of first heat dissipation holes 81 are provided at the center position and the port position of the air circulation channel 9 .
[0042] In this embodiment, the interval set between the first heat dissipation fin group 41 and the second heat dissipation fin group 42 forms an air circulation channel 9 between the two groups of heat dissipation fins, which not only optimizes the heat dissipation structure, but also enhances the heat dissipation effect. The air circulation channel 9 allows the airflow to pass through the heat dissipation fin group more smoothly and take away more heat. At the same time, a number of first heat dissipation holes 81 are set at the center position and the port position of the air circulation channel 9. These heat dissipation holes not only further increase the heat dissipation area, but also make the wind flow more concentrated, thereby improving the heat dissipation efficiency. In addition, the setting of the heat dissipation holes also makes the heat dissipation fin group more layered visually, improving the aesthetics of the product.
[0043] In another embodiment, in order to further improve the heat dissipation effect, a fan assembly 5 can also be provided on both sides of the heat sink 3. The fan assembly 5 quickly takes away the heat on the heat sink fins by generating wind flow, thereby ensuring that the LED display module can work continuously and stably. At the same time, the speed of the fan assembly 5 can be adjusted according to the actual heat dissipation requirements to achieve more accurate heat dissipation control. In addition, the noise control of the fan assembly 5 is also an important factor to be considered in the design process to ensure that while providing efficient heat dissipation, it will not cause excessive noise interference to the user.
[0044] In one embodiment, the heat dissipation frame 1 is provided with a plurality of second heat dissipation holes 82 at both ends of the heat dissipation fin 3 , respectively. The second heat dissipation holes 82 are vertically connected to the heat dissipation channel 2 .
[0045] In this embodiment, the heat sink 1 is provided with a plurality of second heat dissipation holes 82 at both ends of the heat sink 3, and these second heat dissipation holes 82 are vertically connected with the heat dissipation channel 2, further enhancing the heat dissipation effect. The provision of the second heat dissipation holes 82 enables the heat in the heat dissipation channel 2 to be more quickly discharged through the heat dissipation holes, thereby avoiding the accumulation of heat in the channel. At the same time, the vertical connection relationship between the second heat dissipation holes 82 and the heat dissipation channel 2 ensures the continuity and efficiency of the airflow flowing between the heat dissipation fins, thereby further improving the heat dissipation effect. In addition, the number and distribution of the second heat dissipation holes 82 can also be flexibly adjusted according to the actual heat dissipation requirements to adapt to the heat dissipation requirements under different environments and use conditions, which not only improves the heat dissipation efficiency, but also makes the heat sink 1 more reasonable and beautiful in structure.
[0046] In one embodiment, a light emitting component 7 is further included. The light emitting component 7 is disposed at the center of the heat dissipation frame 1 and is fixedly connected to the heat dissipation frame 1 .
[0047] In the present embodiment, the light-emitting component 7 is arranged at the center of the heat sink 1 and is fixedly connected to the heat sink 1. Such a layout enables the light-emitting component 7 to be stably fixed on the heat sink 1, avoiding the risk of the light-emitting component 7 being displaced or damaged due to vibration or movement during use. At the same time, placing the light-emitting component 7 at the center of the heat sink 1 is also conducive to the uniform distribution of heat in the heat dissipation channel 2, thereby improving the heat dissipation efficiency. In addition, the fixed connection method between the light-emitting component 7 and the heat sink 1 can be screwed, welded or other connection methods to ensure that the connection between the light-emitting component 7 and the heat sink 1 is stable and reliable, and can withstand certain external force impacts. This connection method can also simplify the assembly process and improve production efficiency. In summary, in the present embodiment, the light-emitting component 7 can be stably fixed on the heat sink 1, and a tight heat dissipation structure is formed between the light-emitting component 7 and the heat sink 1, further improving the heat dissipation performance and stability of the LED display module.
[0048] In one embodiment, a timer 6 is further included, and the timer 6 is electrically connected to the fan assembly; wherein, when the timer 6 is triggered, the fan assembly is driven to start and discharge the heat in the heat dissipation channel through the rotation of the fan assembly.
[0049] In the present embodiment, by setting the electrical connection between the timer 6 and the fan assembly, the automatic control of the fan assembly is realized. The timer 6 can be triggered according to a preset time interval or condition. When the timer 6 is triggered, the fan assembly will be driven to start. The rotation of the fan assembly can generate wind flow, and the heat in the heat dissipation channel is discharged through the rotation of the fan assembly, thereby improving the heat dissipation efficiency, which not only simplifies the operation of the heat dissipation process, but also can adjust the working state of the fan assembly according to actual needs, avoiding unnecessary energy consumption and noise. At the same time, the setting of the timer 6 also makes the heat dissipation process more intelligent and automated, and improves the convenience and comfort of the LED display module. In addition, the timer 6 can also be linked with other control systems or sensors to achieve more accurate heat dissipation control to adapt to the heat dissipation requirements under different environments and usage conditions.
[0050] In an optional embodiment, the surface of the heat sink 3 is coated with a thermally conductive material.
[0051] In this embodiment, the surface of the heat sink 3 is coated with a thermally conductive material, which has excellent thermal conductivity and can quickly transfer the heat on the heat sink 3 to a wider area, thereby improving the heat dissipation efficiency. The coating of the thermally conductive material makes the heat exchange between the heat sink 3 and the air more efficient, and the heat can be dissipated to the surrounding environment more quickly. In addition, the coating of the thermally conductive material can also enhance the surface hardness of the heat sink 3, improve its wear resistance and corrosion resistance, and extend the service life of the heat sink 3. At the same time, the selection of the thermally conductive material needs to take into account factors such as its thermal conductivity, stability and cost, so as to ensure that while meeting the heat dissipation requirements, the production cost can also be controlled. In a specific embodiment, the thermally conductive material can be a metal oxide thermally conductive coating or a carbon nanotube thermally conductive coating. The metal oxide thermally conductive coating has good thermal conductivity and stability, and the cost is moderate. Therefore, it has been widely used in the coating of the heat sink 3. Its unique thermal conductivity mechanism enables heat to be quickly transferred between the heat sinks 3, effectively improving the overall heat dissipation effect. At the same time, the metal oxide thermally conductive coating also has certain wear resistance and corrosion resistance, and can maintain stable heat dissipation performance in harsh environments. The carbon nanotube thermal conductive coating has higher thermal conductivity, and its unique nanostructure enables heat to spread quickly inside the coating. This thermal conductive coating is suitable for occasions that require higher heat dissipation performance, such as high-performance computers, servers and other equipment. However, the cost of carbon nanotube thermal conductive coating is relatively high, so it is necessary to weigh it according to the actual application scenario when choosing. In summary, the design of coating the surface of the heat sink 3 with a thermal conductive material in this embodiment can further improve the heat dissipation performance and service life of the LED display module, and provide a strong guarantee for the efficient and stable operation of the module.
[0052] In one embodiment, the fan assembly 5 includes a fan body and a fan driving circuit, and the fan driving circuit is electrically connected to the timer 6. When the timer 6 is triggered, the fan driving circuit drives the fan body to rotate.
[0053] In this embodiment, the fan assembly 5 is responsible for generating wind flow to take away the heat in the heat dissipation channel 2. When the timer 6 is triggered, the fan drive circuit receives a signal, and then drives the fan body to start rotating, ensuring that the fan assembly 5 can automatically start and stop according to the preset time interval, avoiding energy waste and equipment loss caused by long-term continuous operation. The electrical connection between the fan drive circuit and the timer 6 ensures that the signal transmission between the two is stable and reliable. The timer 6 can be set according to actual needs to meet the heat dissipation requirements in different working scenarios. For example, when the LED display module has a long working time or a high ambient temperature, a shorter timer 6 trigger interval can be set to ensure that the heat dissipation system can remove heat in a timely and effective manner. When the module has a short working time or a low ambient temperature, the trigger interval can be appropriately extended to save energy and extend the service life of the equipment. In summary, the design of the fan assembly 5 in this embodiment fully considers factors such as heat dissipation efficiency, energy utilization and equipment life, and provides a stable and reliable heat dissipation guarantee for the LED display module through intelligent control and adjustment methods. This design not only improves the service life and stability of the module, but also reduces the operating cost and maintenance cost, providing strong support for the widespread application of LED display technology.
[0054] In an optional embodiment, the fan body of the fan assembly 5 is a silent fan, which generates extremely low noise during operation and can operate stably for a long time.
[0055] In this embodiment, the fan assembly 5 has a silent design for its fan body, which effectively reduces the noise generated by the fan during operation.
[0056] In one embodiment, the light emitting assembly 7 includes an LED lamp bead and a circuit board, and a plurality of the LED lamp beads are equidistantly arranged on the circuit board.
[0057] In the present embodiment, the light-emitting component 7 is mainly composed of LED lamp beads and circuit boards, achieving efficient and stable lighting effects. As light-emitting elements, LED lamp beads have the advantages of high brightness, low power consumption, and long life, and are suitable for various display scenarios. In the present embodiment, a number of LED lamp beads are equidistantly arranged on the circuit board. This layout method not only ensures the uniformity of light emission, but also improves the display effect of the module. At the same time, the equidistantly arranged LED lamp beads can also reduce the heat dissipation problem caused by uneven heat distribution, further improving the stability of the module. Secondly, as a carrier of LED lamp beads, the circuit board not only provides a stable electrical connection, but also ensures that the signal transmission between each lamp bead is accurate and reliable.
[0058] In one embodiment, a fixing member is further included, and the heat sink 3 and the heat sink frame 1 are fixedly connected via the fixing member.
[0059] In this embodiment, a fixing is added to ensure a stable connection between the heat sink 3 and the heat sink 1. The fixing enables the heat sink 3 to be firmly fixed on the heat sink 1 to prevent loosening or falling off during use. In addition, a buckle can be selected as a fixing. The buckle has the advantages of simple structure, easy installation, and low cost, and is suitable for the connection between the heat sink 3 and the heat sink 1. The design of the buckle can ensure that the heat sink 3 fits tightly on the heat sink 1 to form a good heat dissipation channel 2, thereby improving the heat dissipation efficiency. At the same time, the buckle can also withstand a certain external force impact to ensure the stability and reliability of the connection. In practical applications, the appropriate type and quantity of fixings can be selected according to the specific heat dissipation requirements and module structure to achieve the best heat dissipation effect.
[0060] In an optional embodiment, the fixing member includes a screw and a nut, one end of the screw passes through the heat sink 3 and matches with the threaded hole on the heat sink 1, and the nut is tightened with the other end of the screw.
[0061] In this embodiment, by using a combination of screws and nuts, a tight fit between the heat sink 3 and the heat sink 1 can be achieved, effectively preventing loosening or falling off during use. One end of the screw passes through the heat sink 3 and matches the threaded hole on the heat sink 1, ensuring the accuracy and stability of the connection. At the same time, the nut is tightened with the other end of the screw, and the connection between the heat sink 3 and the heat sink 1 is more firm and reliable through appropriate tightening force. This fixing method is not only simple in structure, but also easy to install, and can quickly and effectively complete the fixing of the heat sink 3. In summary, in this embodiment, by using screws and nuts as fixings, a reliable guarantee is provided for the connection between the heat sink 3 and the heat sink 1, thereby ensuring the efficient and stable operation of the entire LED display module heat dissipation system.
[0062] In one embodiment, the circuit board is also provided with a power interface and a signal interface for providing the LED lamp beads with power and signal input required for operation.
[0063] In this embodiment, a power interface and a signal interface are provided on the circuit board, which are mainly responsible for the power supply and signal transmission of the LED lamp beads. The power interface is responsible for receiving external power supply, providing a stable working voltage for the LED lamp beads, and ensuring that the module can emit light normally. The signal interface is responsible for receiving the signal input from the controller, controlling the display effects such as the on and off and color change of the LED lamp beads. The control chip can preferably be set on the circuit board, so that the module can be flexibly configured and controlled according to different application scenarios and requirements, thereby improving the flexibility and expansibility of the module. In summary, the power interface and signal interface added to the circuit board in this embodiment provide a convenient power supply and signal transmission method for the LED display module, and at the same time, combined with the design of the protection circuit, ensure the efficient and stable operation of the module.
[0064] In an optional embodiment, a buffer pad is further included, and the buffer pad is arranged between the light emitting component 7 and the heat dissipation frame 1.
[0065] In this embodiment, the buffer pad is arranged between the light emitting component 7 and the heat sink 1 to improve the stability and durability of the LED display module. The buffer pad can effectively alleviate the direct contact between the light emitting component 7 and the heat sink 1, avoiding friction and collision caused by vibration or impact. This can not only reduce the noise generated by the module during operation, but also extend the service life of the module and reduce maintenance costs. In a preferred embodiment, the main material of the buffer pad is a silicone material with excellent properties such as high elasticity, high temperature resistance, and corrosion resistance. It can not only effectively absorb and disperse impact force, but also withstand high temperature environment, ensuring that the buffer pad maintains good performance during long-term use.
[0066] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.
Claims
1. An LED display module with high heat dissipation efficiency, characterized in that: include: A heat dissipation frame, wherein a heat dissipation channel is arranged inside the heat dissipation frame; A heat sink, the heat sink is arranged on two opposite sides of the heat sink and is connected to the heat dissipation channel, wherein a first heat dissipation fin group and a second heat dissipation fin group are arranged on the surface of the heat sink; A fan assembly, wherein the fan assembly is arranged at the first end of the heat dissipation frame, and the air outlet direction of the fan assembly is directly facing the heat dissipation channel, and is used to discharge the heat in the heat dissipation channel through the fan assembly, wherein the first end of the heat dissipation frame is an end adjacent to the heat sink; The first heat dissipation fin group and the second heat dissipation fin group both include connecting ribs extending in a semicircular arc shape; protruding columns are protruded on the inner wall and the outer wall of the connecting ribs; Wherein, the protruding columns on the inner wall and the protruding columns on the outer wall are arranged alternately along the extending direction of the connecting ribs.
2. The LED display module with high heat dissipation efficiency according to claim 1, characterized in that: The protrusions on the outer wall include first protrusions and second protrusions, the second protrusions are arranged at intervals of a plurality of first protrusions, the first protrusions extend from the connecting rib in a straight line, the second protrusions extend from the connecting rib in a semi-arc shape, and the opening direction of the semi-arc is arranged toward the outside of the connecting rib.
3. The LED display module with high heat dissipation efficiency according to claim 1, characterized in that: A gap is arranged between the first heat dissipation fin group and the second heat dissipation fin group, so that an air circulation channel is formed between the two groups of heat dissipation fins, and a plurality of first heat dissipation holes are arranged at the center position and the port position of the air circulation channel.
4. The LED display module with high heat dissipation efficiency according to claim 1, characterized in that: The heat dissipation frame is provided with a plurality of second heat dissipation holes at both ends of the heat dissipation fins, and the second heat dissipation holes are vertically connected with the heat dissipation channel.
5. The LED display module with high heat dissipation efficiency according to claim 1, characterized in that: It also includes a light-emitting component, which is arranged at the center of the heat dissipation frame and is fixedly connected to the heat dissipation frame.
6. The LED display module with high heat dissipation efficiency according to claim 1, characterized in that: Also included is a timer, the timer being electrically connected to the fan assembly; When the timer is triggered, the fan assembly is started to discharge the heat in the heat dissipation channel through the rotation of the fan assembly.
7. The LED display module with high heat dissipation efficiency according to claim 6, characterized in that: The fan assembly includes a fan body and a fan driving circuit. The fan driving circuit is electrically connected to the timer. When the timer is triggered, the fan driving circuit drives the fan body to rotate.
8. The LED display module with high heat dissipation efficiency according to claim 5, characterized in that: The light emitting component comprises an LED lamp bead and a circuit board, and a plurality of the LED lamp beads are arranged on the circuit board at equal intervals.
9. The LED display module with high heat dissipation efficiency according to claim 1, characterized in that: It also includes a fixing piece, through which the heat sink and the heat sink are fixedly connected.
10. The LED display module with high heat dissipation efficiency according to claim 8, characterized in that: The circuit board is also provided with a power interface and a signal interface for providing the LED lamp beads with the power and signal input required for operation.