Light-emitting device and lighting device

Abstract

The embodiment of the utility model provides a light-emitting device which comprises a light-emitting chip, a wavelength conversion layer, a light-transmitting layer and a light-emitting fence, the light-emitting chip comprises a light-emitting surface and emits exciting light, the exciting light comprises first exciting light and second exciting light, the wavelength conversion layer is arranged in a partial area of the light-emitting surface, the light-transmitting layer is arranged in a remaining partial area of the light-emitting surface, and the light-emitting fence is arranged between the wavelength conversion layer and the light-transmitting layer. The light-transmitting layer is used for transmitting the second exciting light, and the light-emitting fence at least surrounds the edge of the light-emitting chip and guides at least part of the second exciting light to be emitted in the preset direction. The wavelength conversion piece is provided with a plurality of wavelength conversion layers with different configurations and a light transmitting layer so as to form a plurality of emergent lights with different color temperatures. The light emitting fence is arranged outside the wavelength conversion piece, it can be guaranteed that the second exciting light can penetrate through the light transmitting layer to be mixed with the excited light, and the second exciting light can be prevented from leaking from the side face of the light transmitting layer. The light-emitting fence can also prevent external water vapor or oxygen and the like from entering the light-emitting device. The embodiment of the utility model further provides lighting equipment.

Description

Technical Field

[0001] The present application relates to the technical field of lighting equipment, and in particular to a light-emitting device and a lighting device. Background Art

[0002] The light-emitting device is powered by the light-emitting chip, which will emit light after being powered on. The light can be converted into white light by fluorescence and other methods. However, due to the manufacturing process of the light-emitting device or other factors, part of the light beam will be emitted from the side of the light-emitting device. The light beam leaking from the side will affect the use effect of the light-emitting device and reduce the energy utilization rate of the light-emitting device. In addition, water vapor or oxygen from the outside can enter the light-emitting chip and affect the service life of the light-emitting device. Utility Model Content

[0003] The embodiments of the present application provide a light emitting device and an illumination device to at least partially improve the above technical problems.

[0004] In a first aspect, an embodiment of the present application provides a light-emitting device, comprising a light-emitting chip, a wavelength conversion layer, a light-transmitting layer and a light-emitting enclosure, the light-emitting chip comprising a light-emitting surface and emitting excitation light, the excitation light comprising a first excitation light and a second excitation light, the wavelength conversion layer being arranged in a partial area of ​​the light-emitting surface, the wavelength conversion layer being used to receive the first excitation light, and converting at least a portion of the first excitation light into an excited light, the unconverted first excitation light being the remaining excitation light, the light-transmitting layer being arranged in a remaining area of ​​the light-emitting surface, the light-transmitting layer being used to transmit the second excitation light, the light-emitting enclosure being arranged at least around the edge of the light-emitting chip, and guiding at least a portion of the second excitation light to be emitted in a predetermined direction.

[0005] In one embodiment, the projection surface of the wavelength conversion layer on the light emitting surface is the first projection surface, the projection surface of the light-transmitting layer on the light emitting surface is the second projection surface, and the area ratio of the first projection surface to the second projection surface is 1-10.

[0006] In one embodiment, the light-transmitting layer is disposed around the wavelength conversion layer.

[0007] In one embodiment, the light-transmitting layer has a first inclined surface, the wavelength conversion layer has a second inclined surface, the first inclined surface is attached to the second inclined surface, and the thickness of the light-transmitting layer gradually increases from the edge toward the center of the light-emitting chip.

[0008] In one embodiment, the maximum thickness of the light-transmitting layer is greater than the average thickness of the wavelength conversion layer, and the area obtained by subtracting the second inclined surface from the first inclined surface is greater than the area of ​​the second projection surface.

[0009] In one implementation, the area obtained by subtracting the second inclined surface from the first inclined surface is 1 / 6-1 of the area of ​​the first projection surface.

[0010] In one embodiment, the light-emitting enclosure includes a first enclosure and a second enclosure that are connected, the first enclosure is arranged around the edge of the light-emitting chip, and the second enclosure is arranged around the edge of the light-transmitting layer.

[0011] In one embodiment, the thickness of the second enclosure is less than the thickness of the wavelength conversion layer, or the thickness of the second enclosure is equal to the thickness of the wavelength conversion layer, or the thickness of the second enclosure is greater than the thickness of the wavelength conversion layer.

[0012] In one embodiment, the light-transmitting layer includes one or more through holes.

[0013] In a second aspect, an embodiment of the present application provides a lighting device, comprising the light-emitting device of the first aspect described above.

[0014] The embodiments of the present application provide a light-emitting device and an illumination device, wherein the wavelength conversion layer absorbs the first excitation light and emits the stimulated light, the second excitation light can be transmitted through the light-transmitting layer, and the second excitation light and the stimulated light are mixed and emitted outside the light-emitting device. The second excitation light and the stimulated light have different color temperatures, and the area ratio of the wavelength conversion layer and the light-transmitting layer to the corresponding area of ​​the light-emitting chip is positively correlated with the ratio of the second excitation light to the stimulated light. The wavelength conversion component has a plurality of wavelength conversion layers and light-transmitting layers with different configurations to form a plurality of different color temperature emitted lights, so that the light-emitting device can be adapted to a variety of different application scenarios, such as automobile driving lighting. The light-emitting enclosure is arranged outside the wavelength conversion component, which can ensure that the second excitation light can pass through the light-transmitting layer and mix with the stimulated light, and can prevent the second excitation light from leaking from the side of the light-transmitting layer, thereby reducing energy waste. The light-emitting enclosure can prevent external water vapor or oxygen from entering the light-emitting device, thereby effectively improving the service life of the light-emitting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the implementation modes of the present application, the drawings required for use in the description of the implementation modes will be briefly introduced below. Obviously, the drawings described below are only some implementation modes of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0016] Figure 1 A schematic diagram of the structure of a car proposed in an embodiment of the present application;

[0017] Figure 2 A schematic diagram of the structure of a light emitting device proposed in an embodiment of the present application;

[0018] Figure 3 A schematic diagram of the structure of another light emitting device proposed in an embodiment of the present application;

[0019] Figure 4 A schematic structural diagram of a light-emitting device from another perspective proposed in an embodiment of the present application;

[0020] Figure 5 A schematic diagram of the structure of another light emitting device proposed in an embodiment of the present application;

[0021] Figure 6 for Figure 5 A magnified image of point a;

[0022] Figure 7 A schematic diagram of the structure of a light-emitting enclosure and a light-transmitting layer proposed in an embodiment of the present application;

[0023] Figure 8 A schematic diagram of the structure of another light-emitting enclosure and a light-transmitting layer proposed in an embodiment of the present application;

[0024] Fig. 9 This is a schematic structural diagram of another light-emitting enclosure and a light-transmitting layer proposed in an embodiment of the present application.

[0025] Figure numerals: automobile 1, vehicle body 10, light-emitting device 20, light-emitting chip 21, light-emitting surface 211, first projection surface 211a, second projection surface 211b, wavelength conversion component 22, wavelength conversion layer 221, light-transmitting layer 222, through hole 223, first inclined surface 224, second inclined surface 225, light-emitting enclosure 23, first enclosure 231, second enclosure 232. DETAILED DESCRIPTION

[0026] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the implementation mode of the present application will be clearly and completely described below in conjunction with the drawings in the implementation mode of the present application. Obviously, the described implementation mode is only a part of the implementation mode of the present application, not all the implementation modes. Based on the implementation mode in the present application, all other implementation modes obtained by those skilled in the art without making creative work are within the scope of protection of the present application.

[0027] In this application, unless otherwise clearly specified or limited, the terms "installation", "connection", "fixation" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be internal communication between two elements, or it can be only surface contact, or surface contact connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0028] In addition, the terms "first", "second", etc. are only used to distinguish descriptions and cannot be understood as specific or special structures. The descriptions of the terms "some embodiments", "other embodiments", etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In the present application, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of the different embodiments or examples without contradiction.

[0029] Example

[0030] The present application embodiment provides a lighting device 10, see Figure 1 The lighting device 10 can be used for automobile lighting, medical equipment lighting, building lighting, projectors, etc., and this embodiment does not limit this. In order to describe the lighting device 10 more specifically, the following content describes the lighting device 10 as being used for automobile lighting.

[0031] Please continue reading Figure 1 The lighting device 10 can be set as a driving light of the automobile 1, which is suitable for driving lighting of the automobile 1. The lighting device 10 can be installed in the body of the automobile 1, and the body can be a collection of a frame and a cover. More specifically, the lighting device 10 can include a light source device 20 and optical elements such as a lens. The light source device 20 emits illumination light, and the lens adjusts the illumination light and emits it to the outside. In a dark environment, the light source device 20 can illuminate the surrounding driving environment and improve the driving safety of the driver and passengers.

[0032] In another embodiment, the automobile 1 may further include a head-up display device (not shown in the figure), and the light source device 20 of the lighting device 10 may also be arranged in the head-up display device, and the light emitting device 20 emits illumination light. The head-up display device modulates the illumination light to form image light. The image light includes but is not limited to driving conditions, navigation prompts, etc. The driver obtains the driving conditions of the automobile 1 through the image light, thereby improving the driving safety of the driver and passengers.

[0033] See also Figure 2 The light emitting device 20 may include a light emitting chip 21 , a wavelength conversion component 22 and a light emitting enclosure 23 , wherein the wavelength conversion component 22 is disposed in the light path of the light emitting chip 21 , and the light emitting enclosure 23 is disposed around the edges of the light emitting chip 21 and the wavelength conversion component 22 .

[0034] It is understandable that, in addition to automobile lighting, the light emitting device 20 can also be applied to a variety of different scenarios, such as indoor lighting, stage lighting, projection display, etc., and this embodiment does not limit this.

[0035] For more details, please refer to Figure 2 The light emitting chip 21 may include a light emitting surface 211, and the light emitting chip 21 may emit excitation light, and the excitation light may be emitted along a first direction (such as Figure 2 The light emitting chip 21 may be a light emitting diode (LED) chip or a laser chip, etc., and an LED chip is used as an example for the description. The LED chip can generate fluorescence when powered on. Based on the difference in the emitted light, the light emitting chip 21 may be a blue LED chip, a red LED chip, etc., which are not enumerated in this embodiment. Exemplarily, the light emitting chip 21 may be a blue LED chip, and the wavelength range of the excitation light is 440nm-455nm, and the emitted light is the corresponding blue excitation light, and the color temperature of the excitation light may be 5000K-6500K.

[0036] More specifically, the excitation light may include a first excitation light and a second excitation light. The wavelength band or color temperature of the first excitation light and the second excitation light may be the same. The difference is that the first excitation light and the second excitation light may be emitted from different areas of the light emitting surface 211 of the light emitting chip 21, thereby forming relatively opposite first excitation light and second excitation light.

[0037] In other embodiments, based on subsequent use requirements, the wavelength band or color temperature and other parameters of the first excitation light and the second excitation light may be different. Exemplarily, the wavelength bands of the first excitation light and the second excitation light may be different, and the first excitation light and the second excitation light of different wavelength bands may be combined for subsequent optical path use.

[0038] In one embodiment, the number of the light emitting chips 21 may be one or more, and the type or number of the light emitting chips 21 may be selected according to the actual needs of the light emitting device 20, etc., and this embodiment does not limit this. In addition, multiple light emitting chips 21 may be simultaneously arranged on one light emitting device 20, and emit light in the same direction, which can ensure the brightness of the light and determine the direction of the light path.

[0039] Exemplarily, the surface of the light-emitting chip 21 away from the wavelength conversion element 22 may be provided with a substrate (not shown in the figure), and the substrate may be a copper plate, an aluminum plate, sapphire, aluminum nitride ceramic, etc., which has an efficient heat dissipation effect. A metal heat sink may be provided in the light-emitting chip 21, and the metal heat sink and the substrate may be mutually heat-conducted to reduce the heat in the light-emitting chip 21 and ensure the safety of the light-emitting chip 21. At the same time, a circuit may also be arranged on the substrate, and the circuit is used to supply power and / or transmit signals to the light-emitting chip 21, which is not limited in this embodiment.

[0040] Please continue reading Figure 2 The wavelength conversion element 22 may include a wavelength conversion layer 221 and a light-transmitting layer 222 , and the wavelength conversion layer 221 and the light-transmitting layer 222 are arranged corresponding to the light-emitting chip 21 , so that the excitation light can be emitted to the wavelength conversion layer 221 and the light-transmitting layer 222 .

[0041] The wavelength conversion layer 221 is used to receive the first excitation light and convert at least part of the first excitation light into the converted light. Further, the wavelength conversion layer 221 can be YAG:Ce fluorescent ceramic or YGAG:Ce fluorescent ceramic, etc., and the wavelength conversion layer 221 can be configured with phosphor, which can be at least one of lithium calcium phosphor, fluoride phosphor, organic phosphor, oxide phosphor, etc. The phosphor can absorb the first excitation light and convert at least part of the first excitation light into the converted light, and the first excitation light that is not converted is the remaining excitation light. In other words, the phosphor can also be configured as one of red phosphor, yellow phosphor, green phosphor, etc., or a combination of at least two. Exemplarily, the excitation light is blue light, and the wavelength conversion layer 221 can include red phosphor. The wavelength conversion layer 221 can absorb part of the blue excitation light and emit red converted light, the color temperature of the converted light can be lower than 3000K, and the color temperature of the converted light can be different from the color temperature of the excitation light. Alternatively, the wavelength conversion layer 221 can include both red phosphor and green phosphor. The wavelength conversion layer 221 can absorb the blue excitation light and emit red and green converted light at the same time. The unconverted blue excitation light is the residual excitation light, which can be mixed with the red and green converted light to form white output light.

[0042] Please continue reading Figure 2 , the light-transmitting layer 222 is used to transmit the second excitation light. The light-transmitting layer 222 can be one of an Al2O3 layer, a YAG layer, a Y2O3 layer, a Lu2O3 layer, or a stacked combination of at least two of them. Exemplarily, the light-transmitting layer 222 can be a combination of an Al2O3 layer and a YAG layer. The Al2O3 layer can be disposed on the surface of the light-emitting chip 21, and the YAG layer is disposed on the surface of the Al2O3 layer away from the light-emitting chip 21. Both the Al2O3 layer and the YAG layer have characteristics such as high thermal conductivity. The second excitation light can be transmitted through the light-transmitting layer 222, and the light-transmitting layer 222 can quickly extract the heat of the excitation light.

[0043] In another embodiment, see Figure 3The light-transmitting layer 222 may include one or more through holes 223. The number of through holes 223 may be 1, 2, 3, etc., which is not limited in this embodiment. The second excitation light may be emitted along the through hole 223 and mixed with the stimulated light. The through hole 223 also has the effect of transmitting the second excitation light. At the same time, the through hole 223 may extend to the surface of the light-emitting chip 21. The light-emitting chip 21 may dissipate heat through the through hole 223 to prevent heat from accumulating on the surface of the light-emitting chip 21.

[0044] Please continue reading Figure 2 , the wavelength conversion layer 221 is arranged corresponding to a partial area of ​​the light-emitting chip 21, and the first excitation light emitted from the partial area will be absorbed by the wavelength conversion layer 221, and the wavelength conversion layer 221 emits the converted light. The light-transmitting layer 222 is arranged corresponding to the remaining area of ​​the light-emitting chip 21, and the second excitation light emitted from the remaining area can be transmitted through the light-transmitting layer 222. The amount of excitation light absorbed by the wavelength conversion layer 221 or the light-transmitting layer 222 is positively correlated with the size of the area corresponding to the light-emitting chip 21, that is, the larger the proportion of the area corresponding to the wavelength conversion layer 221 or the light-transmitting layer 222 in the light-emitting chip 21, the greater the amount of excitation light absorbed by the wavelength conversion layer 221 or the light-transmitting layer 222. Excitation light and converted light of different color temperatures are mixed in different proportions to form light beams of multiple color temperatures, and then the light-emitting device 20 has emitted light of different color temperatures to adapt to multiple scenes.

[0045] Exemplarily, the color temperature of the second excitation light is higher than the color temperature of the converted light, and the light-emitting device 20 is suitable for indoor places. Indoor lighting requires warm white light with a low color temperature. In this embodiment, the volume ratio of the wavelength conversion layer 221 in the wavelength conversion element 22 is increased, thereby increasing the area of ​​the partial region corresponding to the wavelength conversion layer 221 and the light-emitting chip 21. Compared with the light-transmitting layer 222, the wavelength conversion layer 221 can absorb more first excitation light to generate more converted light, and relatively more converted light is mixed with the second excitation light to reduce the color temperature of the output light of the light-emitting device 20. Alternatively, the light-emitting device 20 is suitable for automotive lighting or outdoor lighting, and automotive lighting or outdoor lighting requires cold white light with a high color temperature. In this embodiment, the volume ratio of the light-transmitting layer 222 in the wavelength conversion element 11 is increased, thereby increasing the area of ​​the partial region corresponding to the light-transmitting layer 222 and the light-emitting chip 21. Compared with the wavelength conversion layer 221, the light-transmitting layer 222 can transmit more second excitation light, and relatively more second excitation light is mixed with the converted light to increase the color temperature of the output light of the light-emitting device 20.

[0046] It is understandable that the uniform light output of each unit area of ​​the light output surface 211 of the light emitting chip 21 is what we expect, but under the influence of the structure and process of the light emitting chip 21, the light output of each unit area of ​​the light output surface 211 of the light emitting chip 21 is not uniform. For example, the energy of the light output of the area near the center of the light output surface 211 is more concentrated, and the energy of the light output of the area near the edge of the light output surface 211 is more dispersed. In this embodiment, the color temperature of the light output of the light emitting device 20 can also be changed by adjusting the relative positions of the light-transmitting layer 222 and the wavelength conversion layer 221 to adapt it to more scenes.

[0047] For more details, please refer to Figure 2 , the wavelength conversion layer 221 is arranged in a partial area of ​​the light emitting surface 211, that is, the wavelength conversion layer 221 is attached to a partial area of ​​the light emitting surface 211. The light-transmitting layer 222 is arranged in the remaining area of ​​the light emitting surface 211, that is, the light-transmitting layer 222 is attached to the remaining area of ​​the light emitting surface 211, and the remaining area is the area of ​​the light emitting surface 211 except for the area where the wavelength conversion layer 221 is arranged. The excitation light is directly emitted from the light emitting surface 211 to the wavelength conversion layer 221 and the light-transmitting layer 222, so as to avoid the phenomenon of refraction or scattering of the excitation light during the propagation process, reduce the loss of the excitation light during the propagation process, and improve the energy utilization rate of the excitation light.

[0048] In another embodiment, the light-emitting chip 21 generates a large amount of heat during operation. In order to reduce the impact of high temperature on the conversion efficiency of the wavelength conversion layer 221, the light-emitting chip 21 and the wavelength conversion component 22 in this embodiment are spaced apart. The gap between the light-emitting chip 21 and the wavelength conversion component 22 can reduce the heat transfer efficiency and reduce the heat transferred from the light-emitting chip 21 to the wavelength conversion component 22, so as to ensure the conversion efficiency of the wavelength conversion layer 221.

[0049] In another embodiment, the number of wavelength conversion layers 221 and / or light-transmitting layers 222 can be configured as multiple, and the number of wavelength conversion layers 221 or light-transmitting layers 222 can be 1, 2, 3, etc., which is not limited in this embodiment. Multiple wavelength conversion layers 221 and / or multiple light-transmitting layers 222 are all arranged corresponding to the light-emitting chip 21. Exemplarily, when the number of wavelength conversion layers 221 and light-transmitting layers 222 is multiple, multiple wavelength conversion layers 221 and multiple light-transmitting layers 222 are alternately arranged to ensure that the second excitation light and the stimulated light are evenly mixed, thereby improving the lighting effect of the output light of the light-emitting device 20.

[0050] It is understandable that the multiple wavelength conversion layers 221 and the multiple light-transmitting layers 222 may also be configured in other arrangements, which is not limited in this embodiment.

[0051] In some embodiments of this application, please refer to Figure 4The light-transmitting layer 222 is disposed around the wavelength conversion layer 221. The wavelength conversion layer 221 emits the converted light, which is scattered in all directions. The second excitation light transmitted through the light-transmitting layer 222 intersects with the light path of the scattered converted light, and the second excitation light can be mixed with the converted light more evenly, thereby improving the lighting effect of the emitted light of the light-emitting device 20.

[0052] In one embodiment, see Figure 5 , the light-transmitting layer 222 has a first inclined surface 224, the wavelength conversion layer 221 has a second inclined surface 225, and the first inclined surface 224 is in contact with the second inclined surface 225. The wavelength conversion layer 221 can be configured as a trapezoid or a triangle, etc., which is not limited in this embodiment. The first inclined surface 224 can change the direction of the second excitation light, and the optical axis of the second excitation light intersects with the optical axis close to the converted light, so that more second excitation light can be evenly mixed with more converted light, further improving the lighting effect of the output light of the light-emitting device 20. At the same time, the second excitation light will be emitted from the first inclined surface 224, such as Figure 5 As shown, the length of the first inclined surface 224 is greater than the width of the bottom surface of the light-transmitting layer 222. Under the premise that the area occupied by the light-emitting surface 211 remains unchanged, the first inclined surface 224 can increase the light-emitting area of ​​the light-transmitting layer 222, avoid the second excitation light energy concentration due to too small a light-emitting area, and make more second excitation light energy evenly mixed with the stimulated light.

[0053] More specifically, the light-transmitting layer 222 is arranged outside the wavelength conversion layer 221, and the thickness of the light-transmitting layer 222 gradually increases from the edge toward the center of the light-emitting chip 21. The first inclined surface 224 is arranged toward the direction close to the wavelength conversion layer 221, and the second excitation light emitted by the light-transmitting layer 222 is arranged toward the path of the converted light, so that more second excitation light can be evenly mixed with the converted light. At the same time, the light-transmitting layer 222 changes the emission path of the second excitation light through the first inclined surface 224. Furthermore, the smaller volume of the light-transmitting layer 222 can also change the emission range of the second excitation light through the first inclined surface 224, so that the second excitation light can be evenly mixed with the converted light emitted from multiple different regions. When the corresponding area range of the light-transmitting layer 222 is reduced, the corresponding area of ​​the wavelength conversion layer 221 is increased, and the lumen efficiency of the light-emitting device 20 can also be improved.

[0054] In some embodiments of the present application, the maximum thickness of the light-transmitting layer 222 is greater than the average thickness of the wavelength conversion layer 221. At least a portion of the light-transmitting layer 222 having the first inclined surface 224 protrudes from the wavelength conversion layer 221. This arrangement can prevent the second excitation light from being completely absorbed and converted by the wavelength conversion layer 221, that is, it can ensure that a sufficient amount of the second excitation light is mixed with the converted light, and ensure that the light-emitting device 20 has a color temperature adjustment function.

[0055] In some embodiments of this application, please refer to Figure 2 , the projection surface of the wavelength conversion layer 221 on the light exit surface 211 is the first projection surface 211a, and the projection surface of the light-transmitting layer 222 on the light exit surface 211 is the second projection surface 211b. The area ratio of the first projection surface 211a to the second projection surface 211b is 1-10. In another embodiment of the present application, the projection surface of the light-transmitting layer 222 on the light exit surface 211 is the second projection surface 211b. The area ratio of the first projection surface 211a to the second projection surface 211b is 1, 2, 3, 4, 5, 6, 7, 8, 9, 10. The area ratio of the first projection surface 211a to the second projection surface 211b should not be set too small or too large. Setting it too large or too small will lead to an imbalance in the ratio of the converted light and the excitation light, thereby affecting the lighting effect of the lighting device 10. A suitable area ratio can balance the ratio of the converted light and the excitation light, and can also facilitate the mixing of the converted light and the excitation light, thereby improving the lighting effect of the lighting device 10.

[0056] In one embodiment, Figure 6 As shown, the area obtained by subtracting the second inclined surface 225 from the first inclined surface 224 is greater than the area of ​​the second projection surface 211b. The area obtained by subtracting the second inclined surface 225 from the first inclined surface 224 is as shown in FIG. Figure 6 As shown in d1 in FIG. 1 , the area of ​​the second projection surface 211b is as follows: Figure 6 Most of the second excitation light emitted from the second projection surface 211b can be directly emitted to the outside through the first inclined surface 224, thereby preventing a large amount of second excitation light from being absorbed by the wavelength conversion layer 221, thereby causing an imbalance in the ratio of the second excitation light to the stimulated light, and improving the lighting effect of the lighting device 10.

[0057] In another embodiment, see Figure 5 as well as Figure 6 , the area obtained by subtracting the second inclined surface 225 from the first inclined surface 224 is 1 / 6-1 of the area of ​​the first projection surface 211a. It can be understood that the area obtained by subtracting the second inclined surface 225 from the first inclined surface 224 is as follows: Figure 6 As shown in d1, the area is the area of ​​the region where the second excitation light is directly emitted, which affects the proportion of the second excitation light. The ratio of the area difference obtained by subtracting the second inclined surface 225 from the first inclined surface 224 to the area of ​​the first projection surface 211a should not be too large or too small. Too large or too small will lead to an imbalance in the ratio of the second excitation light and the stimulated light. The area difference obtained by subtracting the second inclined surface 225 from the first inclined surface 224 and the area of ​​the first projection surface 211a have a suitable ratio, which can improve the lighting effect of the lighting device 10.

[0058] In some embodiments of the present application, the light-emitting enclosure 23 is at least arranged around the edge of the light-emitting chip 21, and guides at least part of the second excitation light to be emitted in a predetermined direction. The predetermined direction of the second excitation light may be a direction intersecting or parallel to the emission direction of the stimulated light. More specifically, the light-emitting enclosure 23 may be arranged around the edge of the light-emitting chip 21 to prevent the excitation light from being emitted from the side edge of the light-emitting chip 21, reduce stray light emission, and improve the energy utilization of the light-emitting chip 21. In addition, the light-emitting enclosure 23 may also be arranged around the edge of the wavelength conversion component 22 at the same time, that is, the light-emitting enclosure 23 may also be arranged around the side edge of the wavelength conversion layer 221 and / or the light-transmitting layer 222, and the light-emitting enclosure 23 may prevent the second excitation light from leaking from the side of the light-transmitting layer 222, reduce energy waste, and the light-emitting enclosure 23 may further improve the protection capability.

[0059] Please continue reading Figure 2 , the light-emitting enclosure 23 may include a first enclosure 231 and a second enclosure 232 that are connected. The first enclosure 231 is arranged around the edge of the light-emitting chip 21, and the second enclosure 232 is arranged around the edge of the wavelength conversion element 22. In other words, the second enclosure 232 may be arranged around the edge of the wavelength conversion layer 221 and / or the light-transmitting layer 222. The light-emitting enclosure 23 may be made of white glue or dam glue, etc., which is not limited in this embodiment. When the light-emitting chip 21 and the wavelength conversion element 22 are connected to each other, the first enclosure 231 and the second enclosure 232 may be connected as a whole, and the light beams emitted from the side of the light-emitting chip 21 and / or the side of the wavelength conversion element 22, the excitation light and the stimulated light will be reflected by the light-emitting enclosure 23 into the wavelength conversion element 22, and the excitation light and the stimulated light can be reused by the wavelength conversion element 22 and emitted from a preset direction. The light-emitting enclosure 23 can prevent the excitation light from being directly emitted outside the light-emitting device 20, thereby reducing energy waste.

[0060] For more details, please refer to Figure 2 In this embodiment, white glue can be applied to the periphery of the light-emitting chip 21 through a spot coating process to form a light-emitting enclosure 23, so as to form a semi-enclosed space with an opening. The wavelength conversion layer 221 and the light-transmitting layer 222 are arranged at the opening, and the light-emitting surface 211 of the light-emitting chip 21 is arranged relative to the opening, and most of the light emitted by the light-emitting chip 21 can be emitted from the opening. Among them, the axial direction of the opening can be preset. The remaining part of the light is emitted to the light-emitting enclosure 23, and is reflected by the light-emitting enclosure 23 to the wavelength conversion component 22. The light-emitting enclosure 23 not only ensures the conversion efficiency and utilization rate of the wavelength conversion layer 221, but also ensures that the light does not overflow from the surroundings, reduces the possibility of side light emission of the light-emitting device 20, and further improves the stability of the light-emitting device 20.

[0061] The second enclosure 232 and the wavelength conversion member 22 have a variety of different size relationships. For example, in one embodiment, Figure 2As shown, the thickness of the second enclosure 232 is less than the thickness of the wavelength conversion member 22, that is, the thickness of the second enclosure 232 is less than the thickness of the wavelength conversion layer 221. This arrangement is conducive to the excitation light emitted by the wavelength conversion layer 221 to be scattered in all directions and mixed with the surrounding second excitation light to form an emitted light with a certain color temperature.

[0062] In another embodiment, if Figure 7 As shown, the second excitation light is emitted from the light-transmitting layer 222 into the air. During this period, the second excitation light may be refracted on the surface of the light-transmitting layer 222. The refraction causes the second excitation light to propagate in all directions, wasting a large amount of excitation light energy. The second enclosure 232 in this embodiment may protrude from the surface of the light-transmitting layer 222 away from the light-emitting chip 21, that is, the thickness of the second enclosure 232 may be greater than the thickness of the light-transmitting layer 222. The second enclosure 232 is arranged around the edge of the light-transmitting layer 222, which can constrain the divergence effect of the second excitation light, reduce the scattered second excitation light, and improve the utilization rate of the excitation light.

[0063] It is understandable that, compared with the wavelength conversion component 22 , the height of the second enclosure 232 should not be set too high. A second enclosure 232 set too high will block the converted light of the wavelength conversion layer 221 , excessively limit the light emitting range of the light emitting device 20 , and affect the lighting effect of the lighting equipment 10 .

[0064] In another embodiment, if Figure 8 As shown, the thickness of the second enclosure can be equal to the thickness of the wavelength conversion layer 221, and the surface of the second enclosure 232 away from the first enclosure 231 is flush with the surface of the wavelength conversion member 22 away from the light emitting chip 21. This arrangement further improves the shielding effect of the light-emitting enclosure 23 on the excitation light emitted from the edge of the wavelength conversion member 22, and further improves the energy utilization rate.

[0065] In another embodiment, see Fig. 9 , the light-emitting enclosure 23 may only include a first enclosure 231, which is arranged around the edge of the light-emitting chip 21. The first enclosure 231 can reflect the excitation light emitted from the edge of the light-emitting chip 21. The first enclosure 231 can prevent the excitation light from being directly emitted outside the light-emitting device 20, thereby reducing energy waste. At the same time, the edge of the wavelength conversion element 22 is exposed to the air, which can directly dissipate heat into the environment, thereby preventing heat accumulation from affecting its own conversion efficiency.

[0066] In some other cases, the light-emitting chip 21 and the wavelength converter 22 are spaced apart, and the light-emitting enclosure 23 may further include a third enclosure (not shown in the figure), which is arranged between the first enclosure 231 and the second enclosure 232. The third enclosure can prevent the excitation light and the stimulated light from propagating out from the gap between the first enclosure 231 and the second enclosure 232, so as to reduce the energy waste of the excitation light and improve the energy utilization rate of the light-emitting device 20.

[0067] Example 1

[0068] See also Figure 2 , the wavelength conversion layer 221 is arranged in a partial area of ​​the light emitting surface 211, and the light-transmitting layer 222 is arranged in the remaining area of ​​the light emitting surface 211. The wavelength conversion layer 221 can be YAG:Ce fluorescent ceramic; the light-transmitting layer 222 is a combination of Al2O3 and YAG. The wavelength conversion layer 221 and the light-transmitting layer 222 are both 100±10 microns thick and are bonded to the LED light-emitting chip 21 using glass glue and a white glue wall to form a light-emitting device 20. The light-emitting enclosure 23 includes a first enclosure 231 and a second enclosure 232 connected together. The first enclosure 231 is equal to the thickness of the light-emitting chip 21, and the second enclosure 232 is lower than the thickness of the wavelength conversion layer 221. For this embodiment, four groups of comparison groups of different ratios of the projection surface area of ​​the wavelength conversion layer 221 to the light-transmitting layer 222 are set respectively. The specific ratios and experimental test results are shown in Table 1:

[0069] Table 1 Relationship between the ratio of the area of ​​different projection surfaces and the color temperature and blue light transmittance in Example 1

[0070]

[0071] Example 2

[0072] See also Figure 5 Different from Example 1, the light-transmitting layer 222 of Example 2 has a first inclined surface 224, and the wavelength conversion layer 221 has a second inclined surface 225, and the first inclined surface 224 is in contact with the second inclined surface 225. The wavelength conversion layer 221 can be configured as a trapezoid. The length of the first inclined surface 224 is greater than the width of the bottom surface of the light-transmitting layer 222. The thickness of the wavelength conversion layer 221 is lower than the height of the light-transmitting layer 222 and the second enclosure 232. For this embodiment, four groups of comparison groups of different ratios of the projection surface area of ​​the wavelength conversion layer 221 to the light-transmitting layer 222 are set respectively. The specific ratios and experimental test results are shown in Table 2:

[0073] Table 2 Relationship between the ratio of the area of ​​different projection surfaces and the color temperature and blue light transmittance in Example 2

[0074]

[0075] It can be seen from Table 1 and Table 2 that adjusting the area ratio between the first projection surface 211a and the second projection surface 211b can effectively change the blue light transmittance of the light emitting device 20, and then change the color temperature of the light emitted by the light emitting device 20, so that the light of different color temperatures can be adapted to a variety of different environments. Moreover, under the premise that the first projection surface 211a and the second projection surface 211b have the same area ratio, compared with Example 1, Example 2 provided with the first inclined surface 224 and the second inclined surface 225 can further improve the blue light transmittance and color temperature, which further expands the color temperature range of the light emitting device 20 to adapt to more scenes.

[0076] The embodiment of the present application provides a light-emitting device 20 and a lighting device 10, wherein the wavelength conversion layer 221 absorbs the first excitation light and emits the converted light, the second excitation light can be transmitted through the light-transmitting layer 222, and the second excitation light and the converted light are mixed and emitted outside the light-emitting device 20. The second excitation light and the converted light have different color temperatures, and the area ratio of the wavelength conversion layer 221 and the light-transmitting layer 222 to the corresponding area of ​​the light-emitting chip 21 is positively correlated with the ratio of the second excitation light to the converted light. The wavelength conversion element 22 has a plurality of wavelength conversion layers 221 and light-transmitting layers 222 with different configurations to form a plurality of different color temperature output lights, so that the light-emitting device 20 is adapted to a plurality of different application scenarios, such as the driving lighting of the automobile 1. The light-emitting enclosure 23 is arranged outside the wavelength conversion element 22, which can ensure that the second excitation light can pass through the light-transmitting layer 222 and mix with the converted light, and can also prevent the second excitation light from leaking from the side of the light-transmitting layer 222, thereby reducing energy waste. The light-emitting enclosure 23 can prevent external water vapor or oxygen from entering the light-emitting device 20 , thereby effectively increasing the service life of the light-emitting device 20 .

[0077] The above implementation modes are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned implementation modes, a person skilled in the art should understand that the technical solutions described in the aforementioned implementation modes can still be modified, or some of the technical features can be replaced by equivalents. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various implementation modes of the present application, and should all be included in the protection scope of the present application.

Claims

1. A light emitting device, characterized in that: include: A light-emitting chip, the light-emitting chip comprising a light-emitting surface and emitting excitation light, the excitation light comprising a first excitation light and a second excitation light; a wavelength conversion layer, the wavelength conversion layer being disposed in a partial area of ​​the light-emitting surface, the wavelength conversion layer being used to receive the first excitation light and convert at least a portion of the first excitation light into converted light, and the first excitation light that has not been converted being the remaining excitation light; a light-transmitting layer, the light-transmitting layer being disposed in the remaining area of ​​the light-emitting surface and being used for transmitting the second excitation light; A light-emitting enclosure is provided at least around an edge of the light-emitting chip, and guides at least a portion of the second excitation light to be emitted in a predetermined direction.

2. The light emitting device according to claim 1, characterized in that: The projection surface of the wavelength conversion layer on the light emitting surface is a first projection surface, the projection surface of the light-transmitting layer on the light emitting surface is a second projection surface, and the area ratio of the first projection surface to the second projection surface is 1-10.

3. The light emitting device according to claim 1, characterized in that: The light-transmitting layer is disposed around the wavelength conversion layer.

4. The light emitting device according to claim 2, characterized in that: The light-transmitting layer has a first inclined surface, the wavelength conversion layer has a second inclined surface, the first inclined surface is attached to the second inclined surface, and the thickness of the light-transmitting layer gradually increases from the edge toward the center of the light-emitting chip.

5. The light emitting device according to claim 4, characterized in that: The maximum thickness of the light-transmitting layer is greater than the average thickness of the wavelength conversion layer, and an area obtained by subtracting the second inclined surface from the first inclined surface is greater than an area of ​​the second projection surface.

6. The light emitting device according to claim 5, characterized in that: The area obtained by subtracting the second inclined surface from the first inclined surface is 1 / 6-1 of the area of ​​the first projection surface.

7. The light emitting device according to claim 1, characterized in that: The light-emitting enclosure includes a first enclosure and a second enclosure that are connected, wherein the first enclosure is arranged around the edge of the light-emitting chip, and the second enclosure is arranged around the edge of the light-transmitting layer.

8. The light emitting device according to claim 7, characterized in that: The thickness of the second enclosure is smaller than the thickness of the wavelength conversion layer, or the thickness of the second enclosure is equal to the thickness of the wavelength conversion layer, or the thickness of the second enclosure is larger than the thickness of the wavelength conversion layer.

9. The light emitting device according to claim 1, characterized in that: The light-transmitting layer includes one or more through holes.

10. A lighting device, characterized in that: Comprising a light emitting device as claimed in any one of claims 1 to 9.

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