LED lamp bead packaging structure, LED display module and LED display screen
By designing specific pixel unit arrangement and packaging methods in the LED lamp bead packaging structure of the LED display screen, the mixed light complementarity between red, green and blue light is achieved, solving the problem of inconsistent color temperature when viewed at different viewing angles of existing LED display screens, and improving the color consistency of the display.
Patent Information
- Application Number
- CN202420659566.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-01
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-04-01
AI Technical Summary
When viewed at different viewing angles, the color temperature inconsistent due to the difference in solid crystal position, resulting in color casting, which affects the display effect.
The package structure of LED lamp beads is adopted, including a bracket, a bowl and a packaging glue layer. The two pixel units are arranged in the first direction. The LED chip covers the bracket through the packaging glue layer to ensure that the LED chips of each pixel unit are aligned at a specific position on the center line, and achieve mixed light complementarity between red, green and blue light.
Through the complementary light of the red, green and blue light between pixel units in the package structure of the LED lamp beads, the color cast is reduced, the color temperature consistency is improved when viewed at different viewing angles, and the color consistency of the display is improved.
Smart Images

Figure CN222916541U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of display screens, in particular to a packaging structure of an LED lamp bead, an LED display module and an LED display screen. Background Art
[0002] An LED display module is composed of many LED lamp beads spliced according to a certain pitch. The LED lamp beads used in the LED display module are usually full-color LED lamp beads. Usually, red, green, and blue LED chips of three light colors are integrated in the full-color LED lamp beads. The three light-color LED chips are arranged in a straight line. The three light-color LED chips can obtain white light through mixing, so as to form a pixel point.
[0003] At present, an LED display screen is composed of several LED display modules. Since the three light-color LED chips in each full-color LED lamp bead of the LED display module are arranged in a straight line, when the LED display screen is viewed from certain viewing angles (deviated from the front of the LED display screen), the color temperature after mixing the light colors will deviate because the respective die bonding positions are at different distances from the light-emitting surface of the encapsulation glue layer (epoxy resin or silica gel / silicone resin) of the LED lamp bead. As a result, the color temperature is inconsistent (color cast) when viewing the LED display screen from different angles, and the display effect becomes poor. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a packaging structure of an LED lamp bead, an LED display module and an LED display screen to solve the problem of color cast of the existing LED display screen.
[0005] To achieve the above purpose, the utility model provides a packaging structure of an LED lamp bead, including a bracket, a bowl cup and an encapsulation glue layer. Two pixel units arranged along a first direction are provided on the bracket. The bowl cup is located on the bracket and surrounds the corresponding pixel unit. Each pixel unit includes LED chips of a first light color, a second light color and a third light color arranged in sequence along the first direction. The encapsulation glue layer is located in the bowl cup and covers the LED chips and the bracket; and,
[0006] The packaging structure of the LED lamp bead has a center line extending along the first direction. The LED chips of the first light color and the third light color of the first pixel unit are located on a first side of the center line, and the LED chip of the second light color is located on a second side of the center line; the LED chips of the first light color and the third light color of the second pixel unit are located on the second side of the center line, and the LED chip of the second light color is located on the first side of the center line.
[0007] Optionally, the three LED chips located on the first side of the center line are aligned in the first direction, and the three LED chips located on the second side of the center line are aligned in the first direction.
[0008] Optionally, the first light color, the second light color, and the third light color are respectively one of red light, green light, and blue light.
[0009] The present invention also provides a packaging structure for an LED lamp bead, including a bracket, a bowl cup, and a packaging glue layer. The bracket has four pixel units arranged in two rows and two columns. The bowl cup is located on the bracket and surrounds the corresponding pixel units. The direction of each column is the first direction, the direction of each row is the second direction, and the first direction is perpendicular to the second direction; and,
[0010] Each pixel unit includes LED chips of a first light color, a second light color, and a third light color arranged in sequence along the first direction. The packaging glue layer is located in the bowl cup and covers the LED chips and the bracket; and,
[0011] The two pixel units in each column have a center line extending along the first direction. The LED chips of the first light color and the third light color of the first pixel unit in the same column are located on the first side of the center line, and the LED chip of the second light color is located on the second side of the center line; the LED chips of the first light color and the third light color of the second pixel unit in the same column are located on the second side of the center line, and the LED chip of the second light color is located on the first side of the center line.
[0012] Optionally, the three LED chips located on the first side of each center line are aligned in the first direction, and the three LED chips located on the second side of each center line are aligned in the first direction.
[0013] Optionally, the first light color, the second light color, and the third light color are respectively one of red light, green light, and blue light.
[0014] The present invention also provides an LED display module, including m rows and n columns of display units, where m and n are greater than or equal to 1, and m * n is not equal to 1. Each display unit includes two pixel units arranged along the first direction, and each pixel unit includes LED chips of a first light color, a second light color, and a third light color arranged in sequence along the first direction; and,
[0015] Each of the display units has a center line extending in the first direction. For the first pixel unit in the display unit, the LED chips of the first light color and the third light color are located on the first side of the center line, and the LED chip of the second light color is located on the second side of the center line; for the second pixel unit in the display unit, the LED chips of the first light color and the third light color are located on the second side of the center line, and the LED chip of the second light color is located on the first side of the center line.
[0016] Optionally, each of the display units is composed of a packaging structure of 1 LED lamp bead. The packaging structure of the LED lamp bead includes a bracket, a bowl cup and a packaging glue layer. There are two pixel units arranged along the first direction on the bracket. The bowl cup is located on the bracket and surrounds the corresponding pixel unit. Each pixel unit includes LED chips of the first light color, the second light color and the third light color arranged in sequence along the first direction. The packaging glue layer is located in the bowl cup and covers the LED chips and the bracket; and,
[0017] For the first pixel unit of the packaging structure of the LED lamp bead, the LED chips of the first light color and the third light color are located on the first side of the corresponding center line, and the LED chip of the second light color is located on the second side of the corresponding center line; for the second pixel unit, the LED chips of the first light color and the third light color are located on the second side of the corresponding center line, and the LED chip of the second light color is located on the first side of the corresponding center line.
[0018] Optionally, two adjacent display units are composed of a packaging structure of 1 LED lamp bead. The packaging structure of the LED lamp bead includes a bracket, a bowl cup and a packaging glue layer. There are four pixel units arranged in two rows and two columns on the bracket. The bowl cup is located on the bracket and surrounds the corresponding pixel unit; and,
[0019] Each pixel unit includes LED chips of the first light color, the second light color and the third light color arranged in sequence along the first direction. The packaging glue layer is located in the bowl cup and covers the LED chips and the bracket; and,
[0020] For the first pixel unit in the same column of the packaging structure of the LED lamp bead, the LED chips of the first light color and the third light color are located on the first side of the corresponding center line, and the LED chip of the second light color is located on the second side of the corresponding center line; for the second pixel unit in the same column, the LED chips of the first light color and the third light color are located on the second side of the corresponding center line, and the LED chip of the second light color is located on the first side of the corresponding center line.
[0021] Optionally, each of the display units is formed by combining the packaging structures of two LED lamp beads. The packaging structure of the LED lamp bead includes a bracket, a bowl cup, and a packaging glue layer. There is one pixel unit on the bracket. The bowl cup is located on the bracket and surrounds the pixel unit. The pixel unit includes LED chips of a first light color, a second light color, and a third light color arranged in sequence along the first direction. The packaging glue layer is located in the bowl cup and covers the LED chips and the bracket; and,
[0022] In the packaging structures of two adjacent LED lamp beads in the same column, the LED chips of the first light color and the third light color of the pixel unit of the first LED lamp bead packaging structure are located on the first side of the corresponding center line, and the LED chip of the second light color is located on the second side of the corresponding center line; the LED chips of the first light color and the third light color of the pixel unit of the second LED lamp bead packaging structure are located on the second side of the corresponding center line, and the LED chip of the second light color is located on the first side of the corresponding center line.
[0023] Optionally, the three LED chips of the display unit located on the first side of the corresponding center line are aligned in the first direction, and the three LED chips of the display unit located on the second side of the corresponding center line are aligned in the first direction.
[0024] Optionally, all the LED chips are directly formed on a substrate, and the packaging glue layer covers the substrate and the LED chips.
[0025] Optionally, the first light color, the second light color, and the third light color are respectively one of red light, green light, and blue light.
[0026] The present utility model also provides an LED display screen, including at least one of the LED display modules.
[0027] In the packaging structure of the LED lamp beads, the LED display module and the LED display screen provided by the present utility model, it includes a bracket, a bowl cup and a packaging glue layer. There are two pixel units arranged along a first direction on the bracket. The bowl cup is located on the bracket and surrounds the corresponding pixel unit. Each pixel unit includes LED chips of a first light color, a second light color and a third light color arranged in sequence along the first direction. The packaging glue layer is located in the bowl cup and covers the LED chips and the bracket. The packaging structure of the LED lamp beads has a center line extending along the first direction. The LED chips of the first light color and the third light color of the first pixel unit are located on the first side of the center line, and the LED chip of the second light color is located on the second side of the center line. The LED chips of the first light color and the third light color of the second pixel unit are located on the second side of the center line, and the LED chip of the second light color is located on the first side of the center line. In this way, between the pixel units within the same packaging structure of the LED lamp beads, intermixing and complementary light of red, green and blue light colors can be carried out. When the packaging structures of the LED lamp beads are used in combination, between two adjacent packaging structures of the LED lamp beads, intermixing and complementary light of red, green and blue light colors can also be carried out, reducing color deviation and improving the problem of inconsistent color temperature when viewed from different perspectives, and improving the color consistency of the display. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1 FIG. 6 is a schematic structural diagram of the packaging structure of the LED lamp beads provided in the first embodiment of the present utility model;
[0029] Figure 2 FIG. 10 is a wire bonding schematic diagram of a pixel unit of the packaging structure of the LED lamp beads provided in the first embodiment of the present utility model;
[0030] Figure 3 is Figure 2 a schematic cross-sectional view of a pixel unit of the packaging structure of the LED lamp beads in FIG. 6 along the A-A direction;
[0031] Figure 4 FIG. 20 is a schematic structural diagram of the LED display module provided in the first embodiment of the present utility model;
[0032] Figure 5 FIG. 24 is a schematic structural diagram of the packaging structure of the LED lamp beads provided in the second embodiment of the present utility model;
[0033] Figure 6 FIG. 28 is a schematic structural diagram of the LED display module provided in the second embodiment of the present utility model;
[0034] Wherein, the reference numerals are:
[0035] 11, 12, 21, 22, 23, 24 - pixel units; a, b, c, d - pads; B - blue LED chip; G - green LED chip; R - red LED chip; x - first direction; y - second direction; 101 - bracket; 102 - cup; 103 - encapsulation glue layer; 30 - substrate. Detailed implementation manners
[0036] The following will describe the detailed implementation manners of the present utility model in more detail with reference to the schematic diagrams. According to the following description, the advantages and features of the present utility model will be clearer. It should be noted that the drawings are all in a very simplified form and use non-precise scales, only for conveniently and clearly assisting in explaining the purpose of the embodiments of the present utility model.
[0037] Embodiment 1
[0038] Figure 1 is a schematic structural diagram of the encapsulation structure of the LED lamp bead provided in this embodiment. As Figure 1 shown, the encapsulation structure of the LED lamp bead includes two pixel units arranged in sequence along the first direction x. In this embodiment, the two pixel units are pixel unit 11 and pixel unit 12 respectively, and the pixel unit 11 and the pixel unit 12 are arranged in sequence along the first direction x.
[0039] Furthermore, both the pixel unit 11 and the pixel unit 12 include LED chips of the first light color, the second light color, and the third light color arranged in sequence along the first direction x, and the three light colors are respectively one of the red light R, the green light G, and the blue light B, that is, each pixel unit includes a red LED chip, a green LED chip, and a blue LED chip. In this embodiment, the first light color, the second light color, and the third light color are the blue light B, the green light G, and the red light R respectively. At this time, the arrangement order of the LED chips of the three light colors of the pixel unit 11 and the pixel unit 12 along the first direction x is the blue LED chip B, the green LED chip G, and the red LED chip R, but it should not be limited thereto.
[0040] Furthermore, the encapsulation structure of the LED lamp bead has a center line extending along the first direction x ( Figure 1 the dotted line in the figure), the LED chips of the first light color and the third light color of the first pixel unit are located on the first side of the center line, and the LED chip of the second light color is located on the second side of the center line; the LED chips of the first light color and the third light color of the second pixel unit are located on the second side of the center line, and the LED chip of the second light color is located on the first side of the center line.
[0041] In this embodiment, the blue LED chip and the red LED chip of the pixel unit 11 are located on the right side of the center line, and the green LED chip is located on the left side of the center line; the blue LED chip and the red LED chip of the pixel unit 12 are located on the left side of the center line, and the green LED chip is located on the right side of the center line. In this way, color mixing and complementary between red, green, and blue lights can be performed between the two pixel units of the same LED lamp bead packaging structure. When the LED lamp bead packaging structures are used in combination, color mixing and complementary between red, green, and blue lights can also be performed between two adjacent LED lamp bead packaging structures, reducing color deviation and improving the problem of inconsistent color temperature when viewed from different perspectives, and improving the color consistency of the display.
[0042] Of course, the three-color LED chips in the two pixel units of the present invention are not limited to being arranged according to the Figure 1 arrangement method. For example, the arrangement order of the three-color LED chips of the pixel unit 11 and the pixel unit 12 along the first direction x can also be the green LED chip G, the blue LED chip B, and the red LED chip R; or, the arrangement order of the three-color LED chips of the pixel unit 11 and the pixel unit 12 can also be the red LED chip R, the green LED chip G, and the blue LED chip B.
[0043] Furthermore, the three LED chips located on the first side of the center line are aligned in the first direction x (the three LED chips on the right side of the center line are aligned in the first direction x), and the three LED chips located on the second side of the center line are aligned in the first direction x (the three LED chips on the left side of the center line are aligned in the first direction x).
[0044] Figure 2 It is a wire bonding schematic diagram of the pixel unit 11 of the LED lamp bead packaging structure provided in this embodiment. As Figure 2As shown, in this embodiment, each pixel unit of the packaging structure of the LED lamp beads has 4 mutually insulated pads, namely pads a, b, c, and d. The die bonding positions of the three LED chips of the pixel unit are respectively on one of the pads. Among them, the die bonding position of the green LED chip is on pad a, the die bonding position of the blue LED chip is on pad b, and the die bonding position of the red LED chip is on pad c. The red LED chip is a vertical structure, the green LED chip and the blue LED chip are in a flip-chip structure. One electrode of the red LED chip is electrically connected to pad c through bottom conductive adhesive, and the other electrode is connected to pad d through a bonding wire. The two electrodes of the green LED chip are respectively connected to pad a and pad c through a bonding wire. The two electrodes of the blue LED chip are respectively connected to pad b and pad c through a bonding wire. At this time, pad c is shared by the three LED chips.
[0045] Of course, in some embodiments, the three LED chips in the pixel unit are not limited to being led out according to the Figure 2 wire bonding method, and each LED chip is not limited to being the Figure 2 structure. The LED chip can be any one of a flip-chip structure, a flip-chip structure, or a vertical structure, and no further examples will be given here.
[0046] Figure 3 For Figure 2 the cross-sectional schematic diagram of the pixel unit along the A-A direction. As Figure 3 shown, in this embodiment, the packaging structure of the LED lamp bead is a top-type lamp bead. The packaging structure of the LED lamp bead further includes a bracket 101. The LED chip is installed on the bracket 101. A bowl cup 102 is provided on the bracket 101. The bowl cup 102 is located on the bracket 101 and surrounds the corresponding pixel unit. The bracket 101 also has a packaging glue layer 103. The packaging glue layer 103 is located in the bowl cup 102 and covers the bracket 101 and the LED chip.
[0047] When fabricating the encapsulation structure of the LED lamp bead, the LED chip can be first fixed on the front surface of the bracket 101 in a predetermined order and direction, and then the LED chip is electrically connected to the bracket 101. Among them, the LED chip in the face-up structure is electrically connected to the bracket 101 through two bonding wires, the LED chip in the vertical structure is electrically connected to the bracket 101 through one bonding wire and bottom conductive adhesive, and the LED chip in the flip-chip structure is electrically connected to the bracket 101 through bottom conductive adhesive. Then, the encapsulation glue layer 103 is formed in the cup 102 on the bracket 101. After that, cutting is performed according to actual needs to separate the encapsulation structure of a single LED lamp bead.
[0048] Based on this, this embodiment further provides an LED display module composed of Figure 1 the encapsulation structure of the LED lamp bead shown. Figure 4 The structural schematic diagram of the LED display module provided by this embodiment is shown in Figure 4 As shown, the LED display module includes m rows and n columns of display units, where m and n are greater than or equal to 1, and m * n is not equal to 1. In this embodiment, m is equal to 2 and n is equal to 3, but it is not limited thereto.
[0049] Furthermore, each of the display units is composed of 1 Figure 1 the encapsulation structure of the LED lamp bead shown, and the LED display module is arranged by 6 Figure 1 the encapsulation structure of the LED lamp bead shown, and 6 Figure 1 the encapsulation structure of the LED lamp bead shown is installed on the substrate 30.
[0050] It can also be seen from Figure 4 that each of the encapsulation structures of the LED lamp beads includes two pixel units (the pixel unit 11 and the pixel unit 12) arranged in sequence along the first direction x. Each pixel unit includes LED chips of a first light color (blue light B), a second light color (green light G), and a third light color (red light R) arranged in sequence along the first direction x. Each display unit has a center line extending along the first direction x (which is also the center line of the encapsulation structure of the LED lamp bead extending along the first direction x). The LED chips of the first light color and the third light color of the first pixel unit (the pixel unit 11) in the display unit are located on the first side of the corresponding center line, and the LED chip of the second light color is located on the second side of the corresponding center line; the LED chips of the first light color and the third light color of the second pixel unit (the pixel unit 12) in the display unit are located on the second side of the corresponding center line, and the LED chip of the second light color is located on the first side of the corresponding center line.
[0051] Further, the three LED chips of the display unit located on the first side of the corresponding center line are aligned in the first direction x, and the three LED chips of the display unit located on the second side of the corresponding center line are aligned in the first direction x.
[0052] Please continue to refer to Figure 4 , in the LED display module, between the two pixel units of the same LED lamp bead's packaging structure, inter-color mixing and complementary of red, green, and blue light can be performed ( Figure 4 the solid coil in), and between the packaging structures of two adjacent LED lamp beads, inter-color mixing and complementary of red, green, and blue light can also be performed ( Figure 4 the dashed coil in), reducing color deviation, improving the problem of inconsistent color temperature when viewed from different perspectives, and improving the color consistency of the display.
[0053] Further, in some embodiments, each display unit of the LED display module can also be composed of a combination of the packaging structures of two LED lamp beads. Figure 4 The LED display module in can be arranged by the packaging structures of 12 LED lamp beads, and the 12 packaging structures of LED lamp beads are mounted on the substrate 30. Each packaging structure of the LED lamp bead includes a pixel unit, and each pixel unit includes LED chips of a first light color, a second light color, and a third light color arranged in sequence along the first direction x.
[0054] In two adjacent packaging structures of LED lamp beads in the same column, the LED chips of the first light color and the third light color of the pixel unit of the first LED lamp bead's packaging structure are located on the first side of the corresponding center line, and the LED chip of the second light color is located on the second side of the corresponding center line; the LED chips of the first light color and the third light color of the pixel unit of the second LED lamp bead's packaging structure are located on the second side of the corresponding center line, and the LED chip of the second light color is located on the first side of the corresponding center line.
[0055] The packaging structure of the LED lamp bead is a top-type lamp bead, that is, the packaging structure of the LED lamp bead can also include a bracket 101, the LED chip is mounted on the bracket 101, a bowl cup 102 is provided on the bracket 101, the bowl cup 102 is located on the bracket 101 and surrounds the pixel unit, and there is also a packaging glue layer 103 on the bracket 101, and the packaging glue layer 103 is located in the bowl cup 102 and covers the bracket 101 and the LED chip.
[0056] As an alternative embodiment, the LED display module may also be a COB module, that is, all the LED chips may also be directly formed on the substrate 30, and the encapsulation glue layer covers the surfaces of the substrate 30 and the LED chips to form the LED display module.
[0057] This embodiment also provides an LED display screen, including at least one of the above-mentioned LED display modules.
[0058] Embodiment Two
[0059] Figure 5 is a schematic structural diagram of the encapsulation structure of the LED lamp beads provided in this embodiment. As Figure 5 shown, the encapsulation structure of the LED lamp beads includes four pixel units arranged in two rows and two columns. The direction of each column is the first direction x, the direction of each row is the second direction y, and the first direction x is perpendicular to the second direction y. In this embodiment, the four pixel units are respectively pixel unit 21, pixel unit 22, pixel unit 23, and pixel unit 24.
[0060] Furthermore, the pixel units 21, 22, 23, and 24 each include LED chips of a first light color, a second light color, and a third light color arranged in sequence along the first direction x. The three light colors are respectively one of red light R, green light G, and blue light B. That is, each pixel unit includes a red light LED chip, a green light LED chip, and a blue light LED chip. In this embodiment, the first light color, the second light color, and the third light color are respectively red light R, green light G, and blue light B. At this time, the arrangement order of the LED chips of the three light colors of the pixel units 21, 22, 23, and 24 along the first direction x is all red light LED chip R, green light LED chip G, and blue light LED chip B, but it should not be limited thereto.
[0061] Furthermore, the two pixel units in each column have a center line extending along the first direction ( Figure 5 the dotted line in the figure). For the first pixel unit in the same column, the LED chips of the first light color and the third light color are located on the first side of the corresponding center line, and the LED chip of the second light color is located on the second side of the corresponding center line; for the second pixel unit in the same column, the LED chips of the first light color and the third light color are located on the second side of the corresponding center line, and the LED chip of the second light color is located on the first side of the corresponding center line.
[0062] In this embodiment, the blue LED chip and the red LED chip of the pixel unit 21 are located on the right side of the corresponding center line, and the green LED chip is located on the left side of the corresponding center line; the blue LED chip and the red LED chip of the pixel unit 23 are located on the left side of the corresponding center line, and the green LED chip is located on the right side of the corresponding center line. Similarly, the blue LED chip and the red LED chip of the pixel unit 22 are located on the right side of the corresponding center line, and the green LED chip is located on the left side of the corresponding center line; the blue LED chip and the red LED chip of the pixel unit 24 are located on the left side of the corresponding center line, and the green LED chip is located on the right side of the corresponding center line. In this way, between the four pixel units of the same LED lamp bead packaging structure, complementary mixing of red, green, and blue light colors can be performed. When the LED lamp bead packaging structures are used in combination, between the adjacent two LED lamp bead packaging structures, complementary mixing of red, green, and blue light colors can also be performed, reducing color cast and improving the problem of inconsistent color temperature when viewed from different perspectives, and improving the color consistency of the display.
[0063] Of course, the LED chips of the three light colors in the four pixel units of the present invention are not limited to being arranged according to the Figure 5 arrangement method. For example, the arrangement order of the LED chips of the three light colors of the pixel unit 21, the pixel unit 22, the pixel unit 23, and the pixel unit 24 along the first direction x can also be the green LED chip G, the blue LED chip B, and the red LED chip R; or, the arrangement order of the LED chips of the three light colors of the pixel unit 21, the pixel unit 22, the pixel unit 23, and the pixel unit 24 can also be the blue LED chip B, the green LED chip G, and the red LED chip R.
[0064] Furthermore, the three LED chips located on the first side of the corresponding center line are aligned in the first direction x (the three LED chips on the right side of each center line are aligned in the first direction x), and the three LED chips located on the second side of the corresponding center line are aligned in the first direction x (the three LED chips on the left side of each center line are aligned in the first direction x).
[0065] The LED chip can be any one of a flip-chip structure, a front-mounted structure, or a vertical structure, and no further examples will be given here.
[0066] Further, the encapsulation structure of the LED lamp beads is also a top-type lamp bead. The encapsulation structure of the LED lamp beads further includes a bracket 101, the LED chip is installed on the bracket 101, a bowl cup 102 is arranged on the bracket 101, the bowl cup 102 is located on the bracket 101 and surrounds the corresponding pixel unit, and an encapsulation glue layer 103 is further provided on the bracket 101. The encapsulation glue layer 103 is located in the bowl cup 102 and covers the bracket 101 and the LED chip.
[0067] When preparing the encapsulation structure of the LED lamp beads, the LED chip can be fixed on the front surface of the bracket 101 in a predetermined order and direction first, and then the LED chip is electrically connected to the bracket 101. Among them, the LED chip with a front-mounted structure is electrically connected to the bracket 101 through two bonding wires, the LED chip with a vertical structure is electrically connected to the bracket 101 through a bonding wire and a bottom conductive adhesive, and the LED chip with a flip-chip structure is electrically connected to the bracket 101 through a bottom conductive adhesive. Then, an encapsulation glue layer 103 is formed in the bowl cup 102 on the bracket 101. After that, cutting is performed according to actual needs to separate the encapsulation structure of a single LED lamp bead.
[0068] Based on this, this embodiment further provides an Figure 5 LED display module composed of the encapsulation structure of the LED lamp beads shown. Figure 6 The structural schematic diagram of the LED display module provided by this embodiment is as Figure 6 shown. The LED display module includes m rows and n columns of display units, where m and n are greater than or equal to 1, and m * n is not equal to 1. In this embodiment, m is equal to 3 and n is equal to 6, but it is not limited thereto.
[0069] Further, two adjacent display units are both composed of 1 Figure 5 shown encapsulation structure of the LED lamp beads. The LED display module is arranged by 9 Figure 5 shown encapsulation structures of the LED lamp beads. The 9 Figure 5 shown encapsulation structures of the LED lamp beads are installed on a substrate 30.
[0070] From Figure 6It can also be seen that the packaging structure of each of the LED lamp beads includes four pixel units (the pixel unit 21, pixel unit 22, pixel unit 23, and pixel unit 24) arranged in two rows and two columns. Each pixel unit includes LED chips of a first light color (red R), a second light color (green G), and a third light color (blue B) arranged in sequence along the first direction x. Each display unit has a center line extending along the first direction x (which is also the center line of the packaging structure of the LED lamp bead extending along the first direction x). The LED chips of the first light color and the third light color of the first pixel unit (the pixel unit 21 or the pixel unit 22) in the same column are located on the first side of the corresponding center line, and the LED chip of the second light color is located on the second side of the corresponding center line; the LED chips of the first light color and the third light color of the second pixel unit (the pixel unit 23 or the pixel unit 24) in the same column are located on the second side of the corresponding center line, and the LED chip of the second light color is located on the first side of the corresponding center line.
[0071] Further, the three LED chips of the display unit located on the first side of the corresponding center line are aligned in the first direction x, and the three LED chips of the display unit located on the second side of the corresponding center line are aligned in the first direction x.
[0072] Please continue to refer to Figure 6 , in the LED display module, color mixing and complementary of red, green, and blue light can be performed between the four pixel units of the packaging structure of the same LED lamp bead (the solid circles in Figure 6 ), and color mixing and complementary of red, green, and blue light can also be performed between the packaging structures of two adjacent LED lamp beads (the dashed circles in Figure 6 ), reducing color deviation, improving the problem of inconsistent color temperature when viewed from different angles, and improving the color consistency of the display.
[0073] This embodiment also provides an LED display screen, including at least one of the LED display modules.
[0074] In summary, in the packaging structure of the LED lamp bead, the LED display module, and the LED display screen provided by the present utility model, it includes a bracket, a bowl cup, and a packaging glue layer. There are two pixel units arranged along a first direction on the bracket. The bowl cup is located on the bracket and surrounds the corresponding pixel unit. Each pixel unit includes LED chips of a first light color, a second light color, and a third light color arranged in sequence along the first direction. The packaging glue layer is located in the bowl cup and covers the LED chips and the bracket. The packaging structure of the LED lamp bead has a center line extending along the first direction. The LED chips of the first light color and the third light color of the first pixel unit are located on a first side of the center line, and the LED chip of the second light color is located on a second side of the center line. The LED chips of the first light color and the third light color of the second pixel unit are located on the second side of the center line, and the LED chip of the second light color is located on the first side of the center line. In this way, between the pixel units within the same packaging structure of the LED lamp bead, RGB color mixing and complementary can be performed. When the packaging structures of the LED lamp beads are used in combination, between two adjacent packaging structures of the LED lamp beads, RGB color mixing and complementary can also be performed, reducing color deviation and improving the problem of inconsistent color temperature when viewed from different perspectives, and improving the color consistency of the display.
[0075] It should be noted that the various embodiments in this specification are described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. For the same or similar parts among the various embodiments, reference can be made to each other. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and for the relevant parts, reference can be made to the description in the method part.
[0076] It also should be noted that although the present utility model has been disclosed above with preferred embodiments, the above embodiments are not intended to limit the present utility model. For any person skilled in the art, without departing from the scope of the technical solution of the present utility model, many possible changes and modifications can be made to the technical solution of the present utility model by using the disclosed technical content above, or modified into equivalent embodiments with equivalent changes. Therefore, any simple modification, equivalent change, and modification made to the above embodiments based on the technical essence of the present utility model without departing from the content of the technical solution of the present utility model still belong to the scope of protection of the technical solution of the present utility model.
[0077] It should also be understood that unless otherwise specifically stated or indicated, the terms "first", "second", "third", etc. in the specification are only used to distinguish each component, element, step, etc. in the specification, rather than to represent the logical relationship or sequential relationship, etc. between each component, element, step.
[0078] It should also be recognized that the terms described herein are only used to describe specific embodiments and are not intended to limit the scope of the present utility model. It must be noted that the singular forms "a" and "an" used herein and in the appended claims include plural referents unless the context clearly dictates otherwise. For example, reference to "a step" or "a device" means reference to one or more steps or devices and may include sub-steps and sub-devices. All conjunctions used should be understood in their broadest sense. Also, the word "or" should be understood to have the definition of logical "or" rather than the definition of logical "exclusive or" unless the context clearly dictates otherwise. In addition, the implementation of the methods and / or devices in the embodiments of the present utility model may include performing the selected tasks manually, automatically, or in combination.
Claims
1. A packaging structure of an LED lamp bead, characterized in that: It comprises a bracket, a bowl and a packaging glue layer, wherein the bracket has two pixel units arranged along a first direction, the bowl is located on the bracket and surrounds the corresponding pixel unit, each of the pixel units comprises LED chips of a first light color, a second light color and a third light color arranged in sequence along the first direction, the packaging glue layer is located in the bowl and covers the LED chip and the bracket; and, The packaging structure of the LED lamp bead has a center line extending along the first direction, the LED chips of the first light color and the third light color of the first pixel unit are located on the first side of the center line, and the LED chip of the second light color is located on the second side of the center line; the LED chips of the first light color and the third light color of the second pixel unit are located on the second side of the center line, and the LED chip of the second light color is located on the first side of the center line.
2. The packaging structure of the LED lamp bead according to claim 1, characterized in that: The three LED chips located on a first side of the center line are aligned in the first direction, and the three LED chips located on a second side of the center line are aligned in the first direction.
3. The packaging structure of the LED lamp bead according to claim 1 or 2, characterized in that: The first light color, the second light color, and the third light color are respectively one of red light, green light, and blue light.
4. A packaging structure of an LED lamp bead, characterized in that: It comprises a support, a bowl and a packaging glue layer, wherein the support has four pixel units arranged in two rows and two columns, the bowl is located on the support and surrounds the corresponding pixel units, wherein the direction of each column is a first direction, the direction of each row is a second direction, and the first direction is perpendicular to the second direction; and, Each of the pixel units includes LED chips of a first light color, a second light color, and a third light color sequentially arranged along the first direction, the encapsulation glue layer is located in the bowl and covers the LED chips and the bracket; and, The two pixel units in each column have a center line extending along the first direction, the LED chips of the first light color and the third light color of the first pixel unit in the same column are located on the first side of the center line, and the LED chip of the second light color is located on the second side of the center line; the LED chips of the first light color and the third light color of the second pixel unit in the same column are located on the second side of the center line, and the LED chip of the second light color is located on the first side of the center line.
5. The packaging structure of the LED lamp bead as claimed in claim 4, characterized in that: The three LED chips located on a first side of each of the center lines are aligned in the first direction, and the three LED chips located on a second side of each of the center lines are aligned in the first direction.
6. The packaging structure of the LED lamp bead according to claim 4 or 5, characterized in that: The first light color, the second light color, and the third light color are respectively one of red light, green light, and blue light.
7. An LED display module, characterized in that: It comprises m rows and n columns of display units, where m and n are greater than or equal to 1, and m*n is not equal to 1, each of the display units comprises two pixel units arranged along a first direction, and each of the pixel units comprises LED chips of a first light color, a second light color, and a third light color arranged in sequence along the first direction; and Each of the display units has a center line extending along the first direction, the LED chips of the first light color and the third light color of the first pixel unit in the display unit are located on the first side of the center line, and the LED chip of the second light color is located on the second side of the center line; the LED chips of the first light color and the third light color of the second pixel unit in the display unit are located on the second side of the center line, and the LED chip of the second light color is located on the first side of the center line.
8. The LED display module according to claim 7, characterized in that: Each of the display units is composed of a packaging structure of an LED lamp bead, and the packaging structure of the LED lamp bead includes a bracket, a bowl and a packaging glue layer, the bracket has two pixel units arranged along the first direction, the bowl is located on the bracket and surrounds the corresponding pixel unit, each of the pixel units includes LED chips of a first light color, a second light color and a third light color arranged in sequence along the first direction, the packaging glue layer is located in the bowl and covers the LED chip and the bracket; and, The LED chips of the first light color and the third light color of the first pixel unit of the packaging structure of the LED lamp bead are located on the first side of the corresponding center line, and the LED chip of the second light color is located on the second side of the corresponding center line; the LED chips of the first light color and the third light color of the second pixel unit are located on the second side of the corresponding center line, and the LED chip of the second light color is located on the first side of the corresponding center line.
9. The LED display module according to claim 7, characterized in that: Two adjacent display units are composed of a packaging structure of an LED lamp bead, and the packaging structure of the LED lamp bead includes a bracket, a bowl and a packaging glue layer, and the bracket has four pixel units arranged in two rows and two columns, and the bowl is located on the bracket and surrounds the corresponding pixel unit; as well as, Each of the pixel units includes LED chips of a first light color, a second light color, and a third light color sequentially arranged along the first direction, the encapsulation glue layer is located in the bowl and covers the LED chips and the bracket; and, The LED chips of the first light color and the third light color of the first pixel unit in the same column of the packaging structure of the LED lamp bead are located on the first side of the corresponding center line, and the LED chip of the second light color is located on the second side of the corresponding center line; the LED chips of the first light color and the third light color of the second pixel unit in the same column are located on the second side of the corresponding center line, and the LED chip of the second light color is located on the first side of the corresponding center line.
10. The LED display module according to claim 7, characterized in that: Each of the display units is composed of a packaging structure of two LED lamp beads, the packaging structure of the LED lamp beads includes a bracket, a bowl and a packaging glue layer, the bracket is provided with a pixel unit, the bowl is located on the bracket and surrounds the pixel unit, the pixel unit includes LED chips of a first light color, a second light color and a third light color arranged in sequence along the first direction, the packaging glue layer is located in the bowl and covers the LED chip and the bracket; and, In the packaging structures of two adjacent LED lamp beads in the same column, the LED chips of the first light color and the third light color of the pixel unit of the packaging structure of the first LED lamp bead are located on the first side of the corresponding center line, and the LED chip of the second light color is located on the second side of the corresponding center line; the LED chips of the first light color and the third light color of the pixel unit of the packaging structure of the second LED lamp bead are located on the second side of the corresponding center line, and the LED chip of the second light color is located on the first side of the corresponding center line.
11. The LED display module according to any one of claims 7 to 10, characterized in that: The three LED chips of the display unit located on a first side of the corresponding center line are aligned in the first direction, and the three LED chips of the display unit located on a second side of the corresponding center line are aligned in the first direction.
12. The LED display module according to claim 7, characterized in that: All the LED chips are directly formed on a substrate, and a packaging adhesive layer covers the substrate and the LED chips.
13. The LED display module according to any one of claims 7 to 10 and 12, characterized in that: The first light color, the second light color, and the third light color are respectively one of red light, green light, and blue light.
14. An LED display screen, characterized in that: It comprises at least one LED display module as claimed in any one of claims 7 to 13.