Film stripping device for thick copper substrate

Abstract

The utility model belongs to the field of film stripping devices, particularly relates to a film stripping device for a thick copper substrate, and aims to solve the problems that the contact area between the bottom of a moving plate and the bottom of the thick copper substrate is large, the film stripping quality is influenced, and the position of the moving plate needs to be adjusted in advance to meet the requirement for bearing the thick copper substrate in the prior art. The device comprises a water storage tank, stand columns are fixedly connected to the two sides of the water storage tank correspondingly, a limiting frame is arranged between the two stand columns, two clamping plates are slidably connected into the limiting frame, a thick copper substrate can be clamped through the two clamping plates, and two bearing frames are arranged in the limiting frame; one connecting frame is fixedly connected between every two adjacent bearing frames, the bearing frames can bear the thick copper substrates, and two transverse rods are fixedly connected in the limiting frame. The device is easy to operate, actions such as clamping, overturning and spraying can be controlled through the control panel, and the operation difficulty is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of film stripping devices, in particular to a film stripping device for a thick copper substrate. Background Art

[0002] Metal substrates are also called circuit boards. Copper substrates, as an important metal substrate material, are widely used in high-frequency circuits, precision communication equipment and architectural decoration industries. During the processing of thick copper substrates, especially after drilling, film stripping is required to remove the protective film on the surface and expose the metal layer of the copper substrate for subsequent circuit production and welding processes.

[0003] After searching, a circuit board stripping device with announcement number CN214708186U is found, which includes a processing box, and two fixed plates are symmetrically arranged inside the processing box, a limiting mechanism is provided between one of the fixed plates, and a spraying mechanism is provided on the top of the two fixed plates. The beneficial effects are: it can facilitate the limited clamping of the circuit board, the operation is convenient and does not require a lot of operating time, and at the same time it has the effect of mobile spraying of stripping liquid, and with the rotating circuit board, the contact between the circuit board and the stripping liquid is more complete, thereby improving the stripping effect.

[0004] The film stripping device still has some shortcomings in actual use:

[0005] When the device is in use, the circuit board is limited and fixed by the movable plate. Although the movable plate can receive and clamp the thick copper substrate, the contact area between the bottom of the movable plate and the bottom of the thick copper substrate is large, which will affect the quality of film stripping. At the same time, in order to meet the need to receive the thick copper substrate, the position of the movable plate needs to be adjusted in advance, and the operation is relatively cumbersome. Utility Model Content

[0006] The purpose of the utility model is to solve the shortcomings in the prior art that the contact area between the bottom of the movable plate and the bottom of the thick copper substrate is large, which affects the quality of film stripping, and in order to meet the need to adjust the position of the movable plate in advance to receive the thick copper substrate, a film stripping device for a thick copper substrate is proposed.

[0007] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0008] A film stripping device for a thick copper substrate, comprising a reservoir. Both sides of the reservoir are fixedly connected with columns. A limiting frame is arranged between the two columns. Two clamping plates are slidably connected in the limiting frame. The thick copper substrate can be clamped by the two clamping plates. Two receiving frames are arranged in the limiting frame. The same connecting frame is fixedly connected between two adjacent receiving frames. The receiving frames can receive the thick copper substrate. Two cross bars are fixedly connected in the limiting frame. A plurality of support columns are fixedly connected to the tops of the two cross bars, and the plurality of support columns are correspondingly distributed below the receiving frames.

[0009] In a possible design, two bidirectional lead screws are rotatably connected in the limiting frame. The two clamping plates are respectively threadedly sleeved on the positive and negative threaded sections of the two bidirectional lead screws. By rotating the two bidirectional lead screws, the two clamping plates can be driven to approach each other to clamp the thick copper substrate. Synchronous wheels are fixedly sleeved at one ends of the two bidirectional lead screws. A second driving motor is fixedly installed in the limiting frame. Double-groove synchronous wheels are fixedly sleeved on the outer walls of the output shafts of the second driving motor, and the double-groove synchronous wheels and the two synchronous wheels are respectively connected by synchronous belts.

[0010] In a possible design, two U-shaped frames are fixedly connected to the bottom of the receiving frame. Chamfers are arranged on one sides of the two U-shaped frames. Two trapezoidal pressing blocks are arranged on one sides of the two clamping plates close to each other, and the inclined surfaces of the trapezoidal pressing blocks press the U-shaped frames through cooperation with the chamfers.

[0011] In a possible design, two pressing plates are fixedly connected to the bottoms of the two receiving frames away from each other. Four sleeves are fixedly connected in the limiting frame. Springs are fixedly connected to the tops of the sleeves, and the tops of the springs are fixedly connected to the bottoms of the pressing plates. One ends of the pressing plates extend into the limiting frame and are slidably connected with the limiting frame. A through column is fixedly connected to the bottom of the pressing plate, and the spring is sleeved on the outer wall of the through column. The bottom end of the through column slidably extends into the sleeve.

[0012] In a possible design, a first driving motor is fixedly connected in one of the columns, and one end of the output shaft of the first driving motor is fixedly connected to one side of the limiting frame. The side of the limiting frame away from the first driving motor is rotatably connected to the adjacent column through a rotating shaft. The first driving motor can drive the limiting frame to flip, so as to realize spraying at an angle.

[0013] In a possible design, the tops of the two columns are fixedly connected with the same top plate. A plurality of spray heads are arranged below the top plate. A water tank is fixedly installed on the top of the top plate. A water pump is fixedly installed on the top of the top plate. The water pump can pump the liquid medicine in the water tank into the plurality of spray heads for spraying.

[0014] In this application, the receiving frame is used to place the thick copper substrate. The receiving frame is supported by springs. Through the control panel on one side of the column, the second driving motor is started. Through the transmission connection of two synchronous belts, the bidirectional lead screw rotates, driving two clamping plates to approach each other. At the same time, when the trapezoidal pressing block moves, the inclined surface of the trapezoidal pressing block presses the U-shaped frame, and the springs are pressed and displaced by the pressing plates at both ends. At the same time, as the receiving frame moves downward, the thick copper substrate is placed on multiple support columns, and the two clamping plates can clamp the thick copper substrate as they approach each other. According to the need of film removal, the first driving motor is started, and the output shaft of the first driving motor drives the limiting frame to rotate to achieve multi-angle spraying. The liquid medicine in the water tank is pumped into multiple nozzles by a water pump for spraying.

[0015] Beneficial effects:

[0016] In the present utility model, for the film removal device of the thick copper substrate, through the automated clamping and flipping mechanism, the copper substrate can be quickly clamped and multi-angle spraying can be carried out, significantly improving the film removal efficiency;

[0017] In the present utility model, for the film removal device of the thick copper substrate, the cooperation of the clamping mechanism and the receiving structure ensures the stability of the copper substrate during the film removal process. At the same time, it is not necessary to adjust the clamping mechanism in advance, and the thick copper substrate can be directly placed;

[0018] In the present utility model, the device is easy to operate. The clamping, flipping, spraying and other actions can be controlled through the control panel, reducing the operation difficulty. Description of the drawings

[0019] Figure 1 It is a three-dimensional structure diagram of a film removal device for a thick copper substrate proposed by the present utility model;

[0020] Figure 2 It is a three-dimensional structure diagram of the limiting frame of a film removal device for a thick copper substrate proposed by the present utility model;

[0021] Figure 3 It is a structural diagram of two clamping plates of a film removal device for a thick copper substrate proposed by the present utility model;

[0022] Figure 4 It is a three-dimensional structure diagram of the receiving frame of a film removal device for a thick copper substrate proposed by the present utility model;

[0023] Figure 5 It is a sectional structural diagram of the limiting frame of a film removal device for a thick copper substrate proposed by the present utility model.

[0024] In the figure: 1. water reservoir; 2. column; 3. top plate; 4. water tank; 5. limiting frame; 6. first drive motor; 7. bidirectional screw rod; 8. receiving frame; 9. pressing plate; 10. trapezoidal pressing block; 11. connecting frame; 12. clamping plate; 13. second drive motor; 14. synchronous belt; 15. synchronous wheel; 16. sleeve; 17. U-shaped frame; 18. chamfer; 19. spring; 20. through column; 21. cross bar; 22. support column. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0026] Example 1

[0027] Reference Figures 1 to 3 A film stripping device comprises a water reservoir 1, both sides of the water reservoir 1 are fixedly connected with columns 2, a limiting frame 5 is provided between the two columns 2, two clamping plates 12 are slidably connected in the limiting frame 5, and the thick copper substrate can be clamped by the two clamping plates 12, two receiving frames 8 are provided in the limiting frame 5, the same connecting frame 11 is fixedly connected between two adjacent receiving frames 8, and the receiving frame 8 can receive the thick copper substrate, two cross bars 21 are fixedly connected in the limiting frame 5, the tops of the two cross bars 21 are fixedly connected with a plurality of supporting columns 22, and the plurality of supporting columns 22 are correspondingly distributed below the receiving frame 8, the water reservoir 1 is located between the two columns 2 for collecting waste water, the limiting frame 5 can clamp the thick copper substrate through the two clamping plates 12, the receiving frame 8 is used to place the thick copper substrate, and the plurality of supporting columns 22 can receive the thick copper substrate.

[0028] Reference Figure 3 Two bidirectional screw rods 7 are rotatably connected in the limiting frame 5, and two clamping plates 12 are respectively threadedly sleeved on the positive and negative thread segments of the two bidirectional screw rods 7. The two bidirectional screw rods 7 are rotated to drive the two clamping plates 12 to approach each other to clamp the thick copper substrate. One end of the two bidirectional screw rods 7 is fixedly sleeved with a synchronous wheel 15. A second drive motor 13 is fixedly installed in the limiting frame 5. The outer wall of the output shaft of the second drive motor 13 is fixedly sleeved with a double-groove synchronous wheel, and the double-groove synchronous wheel and the two synchronous wheels 15 are respectively connected by a synchronous belt 14. Start the second drive motor 13, and the bidirectional screw rod 7 is rotated through the transmission connection of the two synchronous belts 14, driving the two clamping plates 12 to approach each other.

[0029] Reference Figure 4, the bottom of the receiving frame 8 is fixedly connected with two U-shaped frames 17. Chamfers 18 are provided on one side of each of the two U-shaped frames 17. Two trapezoidal pressing blocks 10 are provided on the side of each of the two clamping plates 12 close to each other. The inclined surface of the trapezoidal pressing block 10 presses the U-shaped frame 17 through cooperation with the chamfer 18. The two clamping plates 12 approach each other. When the trapezoidal pressing block 10 moves, the inclined surface of the trapezoidal pressing block 10 can press the U-shaped frame 17.

[0030] Refer to Figure 4 and Figure 5 , on the bottom of the two sides of the receiving frame 8 away from each other, two pressing plates 9 are fixedly connected. Four sleeves 16 are fixedly connected in the limiting frame 5. A spring 19 is fixedly connected to the top of the sleeve 16. The top of the spring 19 is fixedly connected to the bottom of the pressing plate 9. One end of the pressing plate 9 extends into the limiting frame 5 and is slidably connected to the limiting frame 5. A through column 20 is fixedly connected to the bottom of the pressing plate 9. The spring 19 is sleeved on the outer wall of the through column 20. The bottom end of the through column 20 slidably extends into the sleeve 16. When the two receiving frames 8 are forced to move downward, the pressing plate 9 can move the spring 19 and the through column 20 downward synchronously. The spring 19 contracts, and the through column 20 extends into the sleeve 16.

[0031] Refer to Figures 1 to 2 , a first driving motor 6 is fixedly connected inside one of the columns 2. One end of the output shaft of the first driving motor 6 is fixedly connected to one side of the limiting frame 5. The side of the limiting frame 5 away from the first driving motor 6 is rotatably connected to the adjacent column 2 through a rotating shaft. The first driving motor 6 can drive the limiting frame 5 to flip, realizing spraying at an angle. The output shaft of the first driving motor 6 can drive the limiting frame 5 to flip, spraying the thick copper substrate at multiple angles.

[0032] This application can be used in the field of thick copper substrates and also in other fields applicable to this application.

[0033] Embodiment 2

[0034] Refer to Figure 1 , on the basis of Embodiment 1, an improvement is made: A film stripping device for a thick copper substrate, which is applied to the field of thick copper substrates. The tops of the two columns 2 are fixedly connected with the same top plate 3. A plurality of spray heads are provided below the top plate 3. A water tank 4 is fixedly installed on the top of the top plate 3. A water pump is fixedly installed on the top of the top plate 3. The water pump can pump the medicine water in the water tank 4 into the plurality of spray heads for spraying.

[0035] However, as well known to those skilled in the art, the working principles and wiring methods of the first driving motor 6 and the second driving motor 13 are common knowledge. They both belong to conventional means or well-known common knowledge and will not be elaborated here. Those skilled in the art can make arbitrary selections according to their needs or convenience.

[0036] The above are only the preferred specific embodiments of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its inventive concept, making equivalent substitutions or changes should be covered within the protection scope of the present utility model.

Claims

1. A film stripping device for a thick copper substrate, characterized in that: The invention comprises a water reservoir (1), wherein both sides of the water reservoir (1) are fixedly connected with upright posts (2), a limiting frame (5) is provided between the two upright posts (2), two clamping plates (12) are slidably connected in the limiting frame (5), and a thick copper substrate can be clamped by the two clamping plates (12), two receiving frames (8) are provided in the limiting frame (5), a same connecting frame (11) is fixedly connected between two adjacent receiving frames (8), and the receiving frame (8) can receive the thick copper substrate, two cross bars (21) are fixedly connected in the limiting frame (5), and a plurality of supporting columns (22) are fixedly connected to the tops of the two cross bars (21), and the plurality of supporting columns (22) are correspondingly distributed below the receiving frames (8).

2. The film stripping device for thick copper substrate according to claim 1, characterized in that: Two bidirectional screw rods (7) are rotatably connected in the limiting frame (5), and the two clamping plates (12) are respectively threadedly sleeved on the positive and negative threaded sections of the two bidirectional screw rods (7). The two clamping plates (12) can be driven to approach each other to clamp the thick copper substrate by the rotation of the two bidirectional screw rods (7). One end of the two bidirectional screw rods (7) is fixedly sleeved with a synchronous wheel (15). A second driving motor (13) is fixedly installed in the limiting frame (5), and the outer wall of the output shaft of the second driving motor (13) is fixedly sleeved with a double-groove synchronous wheel, and the double-groove synchronous wheel and the two synchronous wheels (15) are respectively connected by a synchronous belt (14).

3. The film stripping device for thick copper substrate according to claim 1, characterized in that: Two U-shaped frames (17) are fixedly connected to the bottom of the receiving frame (8), and one side of the two U-shaped frames (17) is provided with a chamfer (18). Two trapezoidal pressing blocks (10) are provided on the sides of the two clamping plates (12) close to each other, and the inclined surfaces of the trapezoidal pressing blocks (10) cooperate with the chamfer (18) to press the U-shaped frames (17).

4. The film stripping device for thick copper substrate according to claim 1, characterized in that: Two pressing plates (9) are fixedly connected to the bottom of the two receiving frames (8) on the side away from each other, and four sleeves (16) are fixedly connected inside the limiting frame (5). The top of the sleeve (16) is fixedly connected to a spring (19), and the top of the spring (19) is fixedly connected to the bottom of the pressing plate (9). One end of the pressing plate (9) extends into the limiting frame (5) and is slidably connected to the limiting frame (5). The bottom of the pressing plate (9) is fixedly connected to a through column (20), and the spring (19) is sleeved on the outer wall of the through column (20), and the bottom end of the through column (20) slidably extends into the sleeve (16).

5. The film stripping device for thick copper substrate according to claim 1, characterized in that: A first drive motor (6) is fixedly connected inside one of the columns (2), and one end of the output shaft of the first drive motor (6) is fixedly connected to one side of a limiting frame (5). The side of the limiting frame (5) away from the first drive motor (6) is rotatably connected to an adjacent column (2) via a rotating shaft. The first drive motor (6) can drive the limiting frame (5) to flip, thereby achieving spraying at an angle.

6. The film stripping device for thick copper substrate according to claim 1, characterized in that: The tops of the two uprights (2) are fixedly connected to a top plate (3), a plurality of nozzles are arranged below the top plate (3), a water tank (4) is fixedly installed on the top of the top plate (3), and a water pump is fixedly installed on the top of the top plate (3), and the medicine in the water tank (4) can be pumped into the plurality of nozzles for spraying by the water pump.

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