White light Mini LED backlight module

Abstract

The utility model relates to the technical field of LED display, in particular to a white light Mini LED backlight module. The packaging structure specifically comprises a substrate, a plurality of chips and a packaging layer, the section of the packaging layer comprises a first line segment, a second line segment, a first curve segment and a second curve segment which are connected end to end; a first line segment is formed at the joint of the packaging layer and the substrate, and the length of the first line segment is L1; the maximum distance between the first line segment and the second line segment is the height H1, and the ratio of the height H1 to the widest part of the whole section is 0.4-0.55; the first curve section and the second curve section are symmetrical, the radius of the first curve section and the radius of the second curve section are R, and the ratio of the radius R to the height H1 is 0.7-0.8; the midpoint of the first line segment is a point A, the connecting point of the first curve or the second curve and the second line segment is a point B, and the included angle between the connecting line L2 of the point A and the point B and the first line segment L1 is 50-70 degrees. The backlight module has the advantages that the light-emitting angle is increased through the structure of the primary lens, the uniform effect of a backlight source is achieved, and meanwhile the cost of the backlight module is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of LED displays, and in particular to a white light Mini LED backlight module. Background Art

[0002] Mini LED display products feature dynamic dimming technology, offering high contrast and excellent display quality, and their market share is gradually increasing. Color gamut is a key indicator of display quality, and includes standards such as NTSC and DCI-P3. Mini LED display products often use a blue light chip combined with a quantum dot film to achieve an ultra-high color gamut. However, the high cost of Mini LED display products, especially when the number of zones is large, significantly increases costs, further hindering their penetration into the display market. One approach to reducing costs is to replace the more expensive quantum dot films with white Mini LEDs with a high color gamut.

[0003] However, white Mini LEDs have a narrow beam angle, and even without the quantum dot film, the backlight module's uniformity falls short of requirements. While it's possible to increase the beam angle of white Mini LEDs using a secondary lens, this requires a secondary lens and its mounting, which increases costs. Given this demand, how to achieve a uniform backlight using a primary lens while increasing the angle is a pressing issue.

[0004] Therefore, to address the deficiencies in the prior art, a white light Mini LED backlight module is provided. Utility Model Content

[0005] In order to overcome the shortcomings of the existing technology, the utility model provides a white light Mini LED backlight module, which increases the light-emitting angle through the structure of a primary lens, thereby meeting the uniformity of the backlight source effect and reducing the cost of the backlight module.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A white light Mini LED backlight module, comprising: a substrate, a plurality of chips and a packaging layer;

[0008] A plurality of the chips are connected to the substrate, and the packaging layer covers the chips;

[0009] The cross section of the encapsulation layer includes a first line segment, a second line segment, a first curved segment, and a second curved segment connected end to end;

[0010] The first line segment is formed at the connection between the encapsulation layer and the substrate, and the length of the first line segment is L1;

[0011] The maximum distance between the first line segment and the second line segment is a height H1, and the ratio of the height H1 to the widest point of the entire cross section is 0.4-0.55;

[0012] The first curved segment is symmetrical to the second curved segment, the radius of the first curved segment and the second curved segment is R, and the ratio of the radius R to the height H1 is 0.7-0.8;

[0013] The midpoint of the first line segment is point A, the connection point between the first curve or the second curve and the second line segment is point B, and the angle between the line L2 connecting point A and point B and the first line segment L1 is 50°-70°.

[0014] As a further improvement of the technical solution of the present invention, it further includes a fluorescence conversion layer, the fluorescence conversion layer covers the chip, and the packaging layer covers the fluorescence conversion layer.

[0015] As a further improvement of the technical solution of the present invention, the packaging layer is further provided with a recessed portion, and the recessed portion is recessed toward the chip.

[0016] As a further improvement of the technical solution of the present utility model, the cross-section of the recessed portion includes a third line segment and a fourth line segment, the connection point between the third line segment or the fourth line segment and the second line segment is point C, the connection point between the third line segment and the fourth line segment is point D, the line connecting point A and point C is L3, the line connecting point A and point D is L4, and the angle between line L3 and line L4 is ±5°.

[0017] As a further improvement of the technical solution of the present invention, the recessed portion has a depth of H2, and a ratio of the depth H2 to the height H1 is 0.1-0.33.

[0018] As a further improvement of the technical solution of the present invention, a reflective layer is further included, and the reflective layer covers the recessed portion.

[0019] As a further improvement to the technical solution of the present utility model, the cross section of the recessed portion is in the shape of an inverted triangle.

[0020] As a further improvement of the technical solution of the present utility model, the material of the encapsulation layer is one or more of silicone rubber, silicone resin, and epoxy resin, and the refractive index of the encapsulation layer is 4.6-5.2.

[0021] As a further improvement of the technical solution of the present invention, the chip includes a face-up chip, a flip-chip and a vertical chip.

[0022] As a further improvement to the technical solution of the present invention, the ratio of the distance between adjacent chips to the light mixing distance is 1-3.

[0023] Compared with the prior art, the beneficial effects of the present invention are:

[0024] In this white Mini LED backlight module, several chips are connected to a substrate, and an encapsulation layer covers the chips. This encapsulation layer increases the luminous angle of the white Mini LEDs, achieving a uniform light color within the backlight module with a ratio of the spacing between adjacent chips to the light mixing distance within 1-3, while reducing the number of white Mini LEDs used. This white Mini LED backlight module features a primary lens structure that increases the luminous angle, achieving a uniform backlight source while reducing backlight module costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The technology of the utility model is further described in detail below with reference to the accompanying drawings and specific embodiments:

[0026] Figure 1 This is a cross-sectional schematic diagram of the packaging layer in the white light Mini LED backlight module of the present invention;

[0027] Figure 2 This is a cross-sectional schematic diagram of the packaging layer in the white light Mini LED backlight module of the present invention;

[0028] Figure 3 This is a schematic diagram of the cross-sectional structure of the white light Mini LED backlight module of the present invention;

[0029] Figure 4 Schematic diagram of the cross-sectional structure of embodiments 2 and 3 of the white light Mini LED backlight module of the present invention;

[0030] Figure 5 This is a schematic cross-sectional structure diagram of Example 4 of the white light Mini LED backlight module of the present invention.

[0031] In the picture:

[0032] 1. Substrate;

[0033] 2. Chip;

[0034] 3. Encapsulation layer; 31. First line segment; 32. Second line segment; 33. First curved segment; 34. Second curved segment; 35. Recess;

[0035] 4. Fluorescent conversion layer;

[0036] 5. Reflective layer. DETAILED DESCRIPTION

[0037] The following will be combined with the embodiments and drawings to clearly and completely describe the concept, specific structure and technical effects of the present invention so as to fully understand the purpose, scheme and effect of the present invention. It should be noted that the embodiments and features in the embodiments of this application can be combined with each other unless there is a conflict. The same reference numerals used throughout the drawings indicate the same or similar parts.

[0038] It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature or indirectly fixed or connected to the other feature. In addition, the terms "upper," "lower," "left," and "right" used in this utility model are only used with respect to the relative positions of the components of the utility model in the accompanying drawings.

[0039] Reference Figures 1 to 5 , a white light Mini LED backlight module, including a substrate 1, a plurality of chips 2 and a packaging layer 3;

[0040] In Example 1, the chip 2 is a flip-chip blue light chip 2, several chips 2 are connected to the substrate 1, and the encapsulation layer 3 covers the chip 2; the cross-section of the encapsulation layer 3 includes a first line segment 31, a second line segment 32, a first curved segment 33, and a second curved segment 34 connected end to end; the first line segment 31 is formed at the connection between the encapsulation layer 3 and the substrate 1, and the length of the first line segment 31 is L1; the second line segment 32 is approximately parallel to the first line segment 31, the distance between the first line segment 31 and the second line segment 32 is height H1, and the ratio of height H1 to the widest point of the entire cross-section is 0.55; the first curved segment 33 is symmetrical to the second curved segment 34, the radius of the first curved segment 33 and the second curved segment 34 is R, and the ratio of radius R to height H1 is 0.8; the midpoint of the first line segment 31 is point A, the connection point between the first curve or the second curve and the second line segment 32 is point B, and the angle between the line L2 connecting points A and B and the first line segment 31L1 is 70°. Preferably, the ratio of the distance between adjacent chips 2 to the light mixing distance is 1-3.

[0041] Several chips 2 are connected to the substrate 1, and the encapsulation layer 3 covers the chips 2. The structure of the encapsulation layer 3 increases the luminous angle of the white light Mini LEDs, achieving a uniform light color in the backlight module with a ratio of the spacing between adjacent chips 2 to the light mixing distance within 1-3, thereby reducing the number of white light Mini LEDs used. This white light Mini LED backlight module features a primary lens structure that increases the luminous angle, achieving a uniform backlight source while reducing backlight module costs.

[0042] In one embodiment, the backlight module further includes a fluorescence conversion layer 4, which covers the chip 2. The encapsulation layer 3 covers the fluorescence conversion layer 4. Preferably, the fluorescence conversion layer 4 comprises a red fluorescence conversion material, a green fluorescence conversion material, and silica gel. The chip 2 excites the red fluorescence conversion material, which in turn emits red and green light, which together with the blue light emitted by the chip 2 constitute white light. The red fluorescence conversion material comprises K2SiF6:Mn, and the green fluorescence conversion comprises SiAlON:Eu.

[0043] In one embodiment, the material of the encapsulation layer 3 is silicone resin, and the refractive index of the encapsulation layer 3 is 4.6.

[0044] In one embodiment, the backlight module further includes a driver IC, components and plug-ins, and the driver IC, components and plug-ins are all connected to the substrate 1 .

[0045] In Example 2, referring to Figure 4 As shown, the difference from Example 1 is that the chip 2 is upright, the second line segment 32 is parallel to the first line segment 31, the distance between the first and second line segments 31 is height H1, and the ratio of height H1 to the widest point of the entire cross-section is 0.4; the first curved segment 33 is symmetrical to the second curved segment 34, the radius of the first and second curved segments 33 and 34 is R, and the ratio of radius R to height H1 is 0.7; the midpoint of the first line segment 31 is point A, the connection point between the first or second curve and the second line segment 32 is point B, and the angle between the line L2 connecting points A and B and the first line segment 31L1 is 50°. The phosphor conversion layer 4 is formed as a convex shape within the lead frame or separately, and comprises silicone rubber and a phosphor conversion material. The encapsulation layer 3 is made of silicone rubber and has a refractive index of 4.9. The encapsulation layer 3 also has a recessed portion 35, which is recessed toward the chip 2. The cross section of the recessed portion 35 includes a third line segment and a fourth line segment. The connection point between the third or fourth line segment and the second line segment 32 is point C. The connection point between the third and fourth line segments is point D. The line connecting points A and C is L3, and the line connecting points A and D is L4. The angle between lines L3 and L4 is ±5°. The recessed portion 35 has a depth of H2, and the ratio of depth H2 to height H1 is 0.33.

[0046] In Example 3, referring to Figure 4As shown, the difference from Example 1 is that: chip 2 is upright; second line segment 32 is parallel to first line segment 31; the distance between first and second line segments 31 is height H1; the ratio of height H1 to the widest point of the entire cross-section is 0.45; first curved segment 33 is symmetrical to second curved segment 34; the radius of first and second curved segments 33 and 34 is R; the ratio of radius R to height H1 is 0.72; the midpoint of first line segment 31 is point A; the connection point between the first or second curve and second line segment 32 is point B; the angle between line L2 connecting points A and B and first line segment 31L1 is 55°. The phosphor conversion layer comprises K2TiF6:Mn, SiAlON:Eu, and a second red phosphor, SrCaAlON:Eu. The encapsulation layer 3 is made of silicone rubber and has a refractive index of 5.2. Encapsulation layer 3 also has a recessed portion 35, which is recessed toward chip 2. The cross section of the recessed portion 35 includes a third line segment and a fourth line segment. The connection point between the third or fourth line segment and the second line segment 32 is point C. The connection point between the third and fourth line segments is point D. The line connecting points A and C is L3, and the line connecting points A and D is L4. The angle between lines L3 and L4 is ±5°. The recessed portion 35 has a depth of H2, and the ratio of depth H2 to height H1 is 0.33.

[0047] In Example 4, referring to Figure 5 As shown, the difference from Example 1 is that: chip 2 is perpendicular to chip 2; second line segment 32 is parallel to first line segment 31; the distance between first and second line segments 31 is height H1; the ratio of height H1 to the widest point of the entire cross-section is 0.48; first curved segment 33 is symmetrical to second curved segment 34; the radius of first and second curved segments 33 and 34 is R; the ratio of radius R to height H1 is 0.75; the midpoint of first line segment 31 is point A; the connection point between the first or second curve and second line segment 32 is point B; the angle between line L2 connecting points A and B and first line segment 31L1 is 60°. The fluorescence conversion layer comprises K2SiF6:Mn, and the green fluorescence conversion comprises a silicate system. The encapsulation layer 3 is made of silicone resin and diffused SiO2 particles; the refractive index of encapsulation layer 3 is 5.0. Encapsulation layer 3 also has a recessed portion 35, which is recessed toward chip 2. The cross-section of the recessed portion 35 includes a third line segment and a fourth line segment. The connection point between the third line segment or the fourth line segment and the second line segment 32 is point C, and the connection point between the third line segment and the fourth line segment is point D. The line connecting points A and C is L3, and the line connecting points A and D is L4. The angle between line L3 and line L4 is ±3°. The recessed portion 35 has a depth of H2, and the ratio of depth H2 to height H1 is 0.1. The backlight module also includes a reflective layer 5 with a reflective effect, which covers the recessed portion 35. The cross-section of the recessed portion 35 is an inverted triangle. It is composed of a mixture of silicone rubber or silicone resin and TiO2 and ZrO2.

[0048] For other details of the white light Mini LED backlight module described in the present invention, please refer to the prior art and will not be repeated here.

[0049] The above are only preferred embodiments of the present invention and do not constitute any form of limitation to the present invention. Therefore, any modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

[0050] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0051] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

Claims

1. A white light Mini LED backlight module, characterized in that: include: a substrate, several chips, and packaging layers; A plurality of the chips are connected to the substrate, and the packaging layer covers the chips; The cross section of the encapsulation layer includes a first line segment, a second line segment, a first curved segment, and a second curved segment connected end to end; The first line segment is formed at the connection between the encapsulation layer and the substrate, and the length of the first line segment is L1; The maximum distance between the first line segment and the second line segment is a height H1, and the ratio of the height H1 to the widest point of the entire cross section is 0.4-0.55; The first curved segment is symmetrical to the second curved segment, the radius of the first curved segment and the second curved segment is R, and the ratio of the radius R to the height H1 is 0.7-0.8; The midpoint of the first line segment is point A, the connection point between the first curve or the second curve and the second line segment is point B, and the angle between the line L2 connecting point A and point B and the first line segment L1 is 50°-70°.

2. The white light Mini LED backlight module according to claim 1, characterized in that: It also includes a fluorescence conversion layer, which covers the chip, and the packaging layer covers the fluorescence conversion layer.

3. The white light Mini LED backlight module according to claim 1, characterized in that: The packaging layer is further provided with a recessed portion, which is recessed toward the chip.

4. The white light Mini LED backlight module according to claim 3, characterized in that: The cross-section of the recessed portion includes a third line segment and a fourth line segment. The connection point between the third line segment or the fourth line segment and the second line segment is point C, the connection point between the third line segment and the fourth line segment is point D, the line connecting point A and point C is L3, the line connecting point A and point D is L4, and the angle between line L3 and line L4 is ±5°.

5. The white light Mini LED backlight module according to claim 3, characterized in that: The recessed portion has a depth of H2, and a ratio of the depth H2 to the height H1 is 0.1-0.

33.

6. The white light Mini LED backlight module according to claim 5, characterized in that: The invention also includes a light reflecting layer, wherein the light reflecting layer covers the recessed portion.

7. The white light Mini LED backlight module according to claim 5, characterized in that: The cross section of the recessed portion is in an inverted triangle shape.

8. The white light Mini LED backlight module according to claim 1, characterized in that: The material of the encapsulation layer is one or more of silicone rubber, silicone resin, and epoxy resin, and the refractive index of the encapsulation layer is 4.6-5.

2.

9. The white light Mini LED backlight module according to claim 1, characterized in that: The chips include face-up chips, flip chips and vertical chips.

10. The white light Mini LED backlight module according to claim 1, characterized in that: The ratio of the distance between adjacent chips to the light mixing distance is 1-3.

Images