Ejector pin type power module, heat dissipation structure thereof and electronic equipment
Through the heat dissipation structure combined with the heat dissipation plate, the problem of low heat dissipation efficiency of power modules in the prior art is solved, and more efficient heat management and device reliability are achieved.
CN223308986UActive Publication Date: 2025-09-05SHENZHEN SANRISE TECH CO LTD
0 Cites 0 Cited by
Patent Information
- Application Number
- CN202422704141.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-06
- Publication Date
- 2025-09-05
- Estimated Expiration
- 2034-11-06
AI Technical Summary
Technical Problem
The heat dissipation method of power modules in the prior art cannot effectively control the chip junction temperature, affecting the reliability and safety of the device.
Method used
The heat dissipation structure is adopted that combines the heat conduction plate and the heat dissipation plate. The heat conduction plate is welded with the non-pin surface of the thimble power module. The heat dissipation plate is connected through the thermally conductive material to increase the heat dissipation area and improve the heat transfer efficiency.
Benefits of technology
Effectively control the chip junction temperature, improve heat dissipation efficiency, ensure device reliability and safety, extend service life, and enhance mechanical strength and stability.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model relates to the technical field of power semiconductors, in particular to an ejector pin type power module, a heat dissipation structure thereof and electronic equipment. The heat dissipation structure of the ejector pin type power module comprises a heat conduction plate and a heat dissipation plate, one face of the heat conduction plate is used for being connected with the non-pin face of the ejector pin type power module in a welded mode, and the other face of the heat conduction plate is connected with the heat dissipation plate through a heat conduction material. According to the heat dissipation structure of the ejector pin type power module, the heat conduction plate is arranged on the heat dissipation plate and the non-pin surface of the ejector pin type module, so that heat of the ejector pin type power module is transmitted to the radiator through the heat conduction plate, the heat dissipation area of the ejector pin type power module is increased, the heat dissipation efficiency of the ejector pin type power module is improved, and the service life of the ejector pin type power module is prolonged. Therefore, the chip junction temperature in the power module can be more effectively controlled, the reliability and safety of the power device are guaranteed, the service life of the power device is prolonged, and the performance of the system is improved.
Need to check novelty before this filing date? Find Prior Art