Warp-reducing heat dissipation chip packaging structure
Through the innovative design of the base and shell, combined with the ventilation holes and ventilation plates, the problems of inconvenient fixation and insufficient heat dissipation in the traditional chip packaging structure are solved, the effect of rapid fixation and stable heat dissipation is achieved, and the maintenance convenience and performance of the chip are improved.
CN223347767UActive Publication Date: 2025-09-16SUZHOU WEICHANGXIN SEMICONDUCTOR TECHNOLOGY CO LTD
0 Cites 0 Cited by
Patent Information
- Application Number
- CN202422654603.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-01
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-11-01
AI Technical Summary
Technical Problem
Traditional chip packaging structures are difficult to quickly fix, and are inconvenient to maintain when the chip body is displaced or misaligned. The heat dissipation performance is insufficient, affecting the chip performance and lifespan.
Method used
It adopts a base and shell structure, combined with the design of air vents and air permeable plates, and uses fixing components such as discs, screws and fixing blocks to achieve rapid fixation, and enhances heat dissipation performance through heat dissipation plates and air permeable plates.
Benefits of technology
It achieves fast fixation and stable heat dissipation of the chip, facilitates maintenance, and improves the operating stability and service life of the chip.
✦ Generated by Eureka AI based on patent content.
Abstract
A warp-reducing heat dissipation chip packaging structure comprises a base, the center of the base is provided with two grooves, the two grooves are arranged in parallel, the top of the base is provided with a plurality of positioning blocks, the bottoms of the plurality of positioning blocks are fixedly connected with the top of the base, a chip body is embedded in the plurality of positioning blocks, and the chip body is fixedly connected with the top of the base. A groove is formed in the base, chip bottom feet of the chip body can penetrate through the groove, a sealing shell is arranged above the base and can completely cover the chip body, a heat dissipation plate is arranged at the top of the sealing shell, a fixing assembly is arranged on the base and comprises a disc and a fixing block, and the disc is arranged on the base. The sealing shell can be turned over on the base through the rotating block on the left side of the sealing shell and the square block on the top of the left side of the base, meanwhile, the sealing shell and the base can be rapidly fixed through the fixing block on the right side of the sealing shell and the cylinder in the hollow cavity in the right side of the base, and maintenance can be conveniently carried out when the internal chip body is staggered.
Need to check novelty before this filing date? Find Prior Art