Substrate processing apparatus and substrate offset detection assembly
By using a distance measuring sensor and a controller in a substrate processing device to calculate the offset between the substrate and the edge ring, the problem of low substrate position adjustment efficiency is solved, accurate position detection and adjustment are achieved, and product yield is improved.
CN223376572UActive Publication Date: 2025-09-23HUBEI YANGTZE PILOT-LINE SERVICES CO LTD
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Patent Information
- Application Number
- CN202422545491.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-22
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-10-22
AI Technical Summary
Technical Problem
In the prior art, the efficiency of adjusting the position of the substrate in the reaction chamber is low, and it is difficult to accurately obtain the offset position, resulting in uneven thin film deposition and low product yield.
Method used
A distance measuring sensor is used to obtain multiple measurement points on the substrate and edge ring, and the offset is calculated by the controller. Combined with the display and alarm, precise position detection and adjustment are achieved.
Benefits of technology
The accuracy of substrate position adjustment is improved, human errors are reduced, the risk of position deviation is reduced, and product yield is significantly improved.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model relates to a substrate processing device and a substrate offset detection assembly. A measuring point acquisition mechanism comprises a distance measuring sensor, and the distance measuring sensor is used for acquiring at least three first measuring points on the edge of a substrate according to a first stroke difference; and at least three second measuring points on the inner edge or the outer edge of the edge ring are obtained according to the second stroke difference, so that the position of each first measuring point and the position of each second measuring point can be accurately obtained. Therefore, the first center position of the substrate and the second center position of the edge ring can be accurately obtained, whether the position of the substrate deviates or not can be accurately detected, human judgment errors are reduced, the substrate position deviation risk can be effectively reduced, and the product yield can be greatly improved.
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