Downward pressing type multi-element positioning clamp for wafer substrate plasma processing

By designing a downward-pressing multi-component positioning fixture for wafer substrates, the contamination problem caused by debris deposition during semiconductor wafer processing is solved, stable fixation and convenient disassembly of semiconductor wafers are achieved, and processing accuracy and efficiency are improved.

CN223378151UActive Publication Date: 2025-09-23INNER MONGOLIA METAL MATERIAL RES INST
0 Cites 0 Cited by

Patent Information

Application Number
CN202421705398.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-18
Publication Date
2025-09-23
Estimated Expiration
2034-07-18

AI Technical Summary

Technical Problem

During semiconductor wafer processing, debris deposition causes plasma wafer contamination, affecting processing accuracy, and existing fixtures are difficult to effectively fix and disassemble.

Method used

A downward-pressing multi-component positioning fixture for wafer substrates is designed, which includes a fixing gasket, a fixing chassis and a support rod. The semiconductor wafer is detachably fixed through a slot, a positioning hole, a pressing piece and a locking piece. The positioning ring and the connecting rod on the support rod ensure the detachable connection of the chassis.

Benefits of technology

The invention realizes the stable fixation and convenient disassembly of the semiconductor wafer, improves the processing efficiency, reduces the plasma processing error, enhances the locking force and simplifies the installation and disassembly process.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The utility model discloses a downward-pressing type multi-element positioning clamp for wafer substrate plasma processing. The downward-pressing type multi-element positioning clamp comprises a base, a fixing gasket connected to the base and a fixing base plate fixed to the fixing gasket in a matched mode. A plurality of clamping grooves for placing semiconductor wafers are formed in the fixed base plate, positioning holes correspondingly communicated with the clamping grooves are formed in the fixed gasket, and a plurality of pressing pieces abutting against the peripheral sides of the semiconductor wafers are arranged on the fixed gasket and located on the peripheral sides of the positioning holes; a supporting rod is arranged above the base, and a fixing hole fixedly connected with the supporting rod is formed in the lower portion of the fixing base plate. According to the utility model, detachable connection between the fixed chassis and the base is facilitated, so that a plasma light beam irradiates a wafer on the fixed chassis from bottom to top.
Need to check novelty before this filing date? Find Prior Art