Camera module and electronic equipment

Abstract

The utility model provides a camera module and electronic equipment, and the camera module comprises a substrate, the substrate is provided with a first through hole, and the first through hole penetrates through the front surface and the back surface, which are away from each other, of the substrate; the conductive part is attached to the back surface of the substrate and is used for blocking the first through hole; and the chip is embedded in the first through hole and is fixed in the first through hole through the bonding part, so that the chip can sink into the substrate, the thickness size of the camera module is reduced, and thinning of the camera module is realized.

Description

Technical Field

[0001] The utility model belongs to the field of imaging technology, and specifically relates to a camera module and electronic equipment. Background Art

[0002] Portable electronic devices such as laptops are becoming thinner and more portable to meet users' urgent needs for efficient mobile office and entertainment experience.

[0003] However, in the process of achieving thinner electronic device dimensions, the height of the camera module in the electronic device restricts the thinning of the screen bezel. Since the size of the screen bezel structure is difficult to effectively reduce, this not only affects the overall aesthetics of the device, but also limits the design of thin screen bezels. Utility Model Content

[0004] One purpose of the present invention is to provide a new technical solution for a camera module and an electronic device, which can solve the problem of thick frames of electronic devices.

[0005] According to a first aspect of the present invention, there is provided a camera module, comprising:

[0006] A substrate having a first through hole thereon, the first through hole penetrating a front surface and a back surface of the substrate that are opposite to each other;

[0007] a conductive portion, the conductive portion being attached to the back surface of the substrate and used to seal the first through hole;

[0008] A chip is embedded in the first through hole and fixed in the first through hole through an adhesive portion.

[0009] Optionally, the first through hole forms a glue overflow hole, the chip is embedded in the first through hole and at least a portion of the adhesive portion is formed between the peripheral side of the chip and the inner wall of the first through hole.

[0010] Optionally, part of the bonding portion is formed on an edge region of the front side of the chip.

[0011] Optionally, the back surface of the chip is flush with the back surface of the substrate.

[0012] Optionally, a front height of the chip is lower than a front height of the substrate.

[0013] Optionally, the ratio of the height of the chip to the height of the substrate is in the range of 0.5-0.8.

[0014] Optionally, the conductive part includes a conductive cloth and a release layer, the conductive cloth is attached to the back side of the substrate, and the release layer is attached to a side of the conductive cloth away from the substrate.

[0015] Optionally, the release layer includes a first release layer and a second release layer, and the first release layer and the second release layer are sequentially attached to a side of the conductive cloth away from the substrate;

[0016] The first release layer is used to form an isolation layer on the camera module, and the second release layer can be peeled off from the first release layer.

[0017] Optionally, the camera module further includes a lens, which is fixed to the front side of the substrate and opposite to the imaging area of ​​the chip.

[0018] According to a second aspect of the present invention, an electronic device is provided, which includes the camera module described in the first aspect.

[0019] One of the technical effects of the present invention is:

[0020] An embodiment of the present application provides a camera module, which includes a substrate having a first through hole, the first through hole penetrating the front and back sides of the substrate that are opposite to each other; a conductive portion, the conductive portion is attached to the back side of the substrate and is used to seal the first through hole; and a chip, the chip is embedded in the first through hole and fixed in the first through hole by an adhesive portion, so that the chip can sink into the interior of the substrate, thereby reducing the thickness of the camera module and achieving a thin camera module.

[0021] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0023] Figure 1 An overall diagram of a camera module provided in one embodiment of the present utility model;

[0024] Figure 2 for Figure 1 A partial enlarged view of the

[0025] Figure 3 A partial exploded view of a camera module provided by one embodiment of the present utility model;

[0026] Figure 4 A partial cross-section of a camera module provided in one embodiment of the present invention Figure 1 ;

[0027] Figure 5A partial cross-section of a camera module provided in one embodiment of the present invention Figure 2 ;

[0028] Figure 6 for Figure 5 A partial enlarged view of the .

[0029] Among them: 1. substrate; 11. first through hole; 2. conductive part; 21. conductive cloth; 22. release layer; 221. first release layer; 222. second release layer; 3. chip; 31. imaging area; 4. bonding part; 5. lens. DETAILED DESCRIPTION

[0030] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0031] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0032] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0033] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0034] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0035] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0036] An embodiment of the present application provides a camera module, which can be used in electronic devices such as smart watches, mobile phones, tablet computers, e-book readers, audio players, video players, computers, set-top boxes, smart TVs and wearable devices. The camera module sets a through hole in the substrate, adheres the conductive cloth to one side surface of the substrate and blocks one side opening of the through hole. While facilitating the arrangement of the chip in the through hole, the overall thickness of the camera module can be reduced, thereby achieving a thin camera module.

[0037] In some embodiments, reference Figures 1 to 4 , the camera module includes:

[0038] A substrate 1 having a first through hole 11 thereon, the first through hole 11 penetrating the front and back surfaces of the substrate 1 that are opposite to each other;

[0039] The conductive portion 2 is attached to the back surface of the substrate 1 and is used to block the first through hole 11;

[0040] The chip 3 is embedded in the first through hole 11 and fixed in the first through hole 11 through the adhesive portion 4 .

[0041] In this embodiment, substrate 1 can serve as a support plate for electronic components such as chips, capacitors and resistors in the camera module. At the same time, electronic components such as chips, capacitors and resistors on substrate 1 can be connected through circuits in substrate 1 to ensure circuit conductivity and signal transmission of each electronic component on substrate 1.

[0042] A first through hole 11 can be formed in a predetermined area on the substrate 1 by digging, and the first through hole 11 passes through the front and back surfaces of the substrate 1 that are away from each other, for example Figure 4 The upper surface of the middle substrate 1 is its front side. Figure 4 The lower surface of the middle substrate 1 is its back surface. The first through hole 11 passes through the upper and lower surfaces of the substrate 1 from top to bottom, so that electronic components can be arranged in the first through hole 11 .

[0043] See also Figure 3 and Figure 4 Since the first through hole 11 passes through the front and back sides of the substrate 1, in order to facilitate the support of the electronic component in the first through hole 11 and prevent the electronic component from detaching from the first through hole 11, the conductive part 2 can be attached to the back side of the substrate 1 to block the first through hole 11 through the conductive part 2. In addition, the conductive part 2 can provide support for the electronic component in the first through hole 11, thereby ensuring the accuracy of the position of the electronic component in the first through hole 11.

[0044] For example, when the chip 3 is placed in the first through hole 11 , gaps will exist between the chip 3 and the conductive portion 2 and between the chip 3 and the sidewall of the first through hole 11 . The adhesive portion 4 can fill the gaps and fix the chip 3 in the first through hole 11 .

[0045] In an embodiment, the opening position at the bottom of the first through hole 11 is covered with a production auxiliary material formed by combining release paper and conductive cloth, so that the liquid or gel-like uncured adhesive portion 4 can be applied to the surface of the conductive portion 2 opposite to the first through hole 11, and then the chip 3 is pressed down into the first through hole 11 to overflow at least part of the uncured adhesive portion 4 to between the side surface of the chip 3 and the inner wall of the first through hole 11, and then the adhesive portion 4 is cured to fix the chip 3 in the first through hole 11 through the adhesive portion 4.

[0046] Specifically, when the chip 3 is specified, the camera module is attached to the frame through the conductive part 2, and the camera module is fixed by the frame; the DB (Die bond) process equipment is used to apply glue to the adhesive part 4 on the surface of the conductive part 2, and then the chip 3 is pressed down into the first through hole 11 and the uncured adhesive part 4 is caused to overflow, so that the chip 3 and the frame around the first through hole 11 and the bottom of the chip 3 retain the uncured adhesive part 4. In this process, the amount of glue needs to be controlled so that when the chip 3 is fixed, the glue needs to wrap around the chip 3 and cannot overflow to the imaging area 31 on the surface of the chip 3; the adhesive part 4 is then cured by high-temperature baking to achieve the purpose of fixing the chip 3; and the WB (Wire Bonding) equipment is used to set welding wires between the chip 3 and the solder points on the substrate 1, thereby completing the production of the camera module.

[0047] The camera module provided by the embodiment of the present application includes a substrate 1, which has a first through hole 11, and the first through hole 11 passes through the front and back sides of the substrate 1 that are opposite to each other; a conductive part 2, which is attached to the back side of the substrate 1 and is used to seal the first through hole 11; a chip 3, which is embedded in the first through hole 11 and fixed in the first through hole 11 by an adhesive part 4, so that the chip 3 can sink into the interior of the substrate 1, thereby reducing the thickness of the camera module and realizing the thinning of the camera module.

[0048] In addition, while supporting the chip 3, the conductive part 2 can also serve as a shielding layer to effectively shield the electromagnetic radiation of the camera module after molding, preventing external electromagnetic interference from affecting the performance of the camera module. By reusing the conductive part 2, the molding efficiency of the camera module is improved.

[0049] In one embodiment, see Figure 4 The first through hole 11 forms a glue overflow hole, the chip 3 is embedded in the first through hole 11 and at least a portion of the adhesive portion 4 is formed between the peripheral side of the chip 3 and the inner wall of the first through hole 11.

[0050] In this embodiment, by embedding the chip 3 in the first through hole 11 and using the adhesive portion 4 to tightly connect the chip 3 to the substrate 1, the position of the chip 3 on the substrate 1 can be ensured to be stable, making it difficult for the chip 3 to shift or fall off; and the adhesive portion 4 not only plays a fixing role, but also can absorb and disperse external force impact to a certain extent, thereby improving the seismic performance of the camera module.

[0051] In addition, using the first through hole 11 as a glue overflow hole can simplify the manufacturing process and reduce the monitoring and adjustment steps during the glue injection process, thereby improving the production efficiency of the camera module and reducing the manufacturing cost.

[0052] In one embodiment, see Figure 4 , part of the bonding portion 4 is formed in the edge area of ​​the front side of the chip 3 .

[0053] In this embodiment, when the chip 3 is fixed, the uncured adhesive portion 4 can overflow to the edge of the front side of the chip 3. After the adhesive portion 4 is cured, the adhesive portion 4 on the front side of the chip 3 and the adhesive portion 4 on the side of the chip 3 can be combined to improve the stability of the chip 3 in the substrate 1.

[0054] Furthermore, when the adhesive portion 4 is formed at the edge of the front surface of the chip 3, it forms a sealed barrier between the chip 3 and the inner wall of the first through-hole 11, effectively preventing contaminants such as moisture and dust from entering the chip 3. This protects the stable operation of the chip 3, extends its service life, and improves the reliability and stability of the entire camera module.

[0055] In one embodiment, see Figure 4 , the back surface of the chip 3 is flush with the back surface of the substrate 1 .

[0056] In this embodiment, the bottom of the chip 3 and the bottom of the substrate 1 are on the same horizontal line. On the one hand, it can facilitate the heat dissipation of the back of the chip 3 and reduce the operating temperature of the chip 3; on the other hand, it makes the layout of the entire camera module more compact, reduces space occupancy, and improves the integration and functional density of the entire camera module.

[0057] In one embodiment, see Figure 4 , the front height of the chip 3 is lower than the front height of the substrate 1.

[0058] In this embodiment, when the height of the chip 3 is lower than the height of the substrate 1, a gap can be left on the front of the chip 3, so that part of the bonding portion 4 can be formed in the edge area of ​​the front of the chip 3, thereby ensuring the stability of the chip 3. Moreover, the substrate 1 can provide certain protection for the chip 3, reducing damage to the chip 3 caused by external physical impact.

[0059] In addition, the chip 3 does not protrude from the front of the substrate 1, which can provide more space for wiring on the substrate 1, help to achieve a more complex circuit layout on the substrate 1, and reduce interference and conflict during the wiring process.

[0060] In one embodiment, see Figure 4 The ratio of the height of the chip 3 to the height of the substrate 1 is in the range of 0.5-0.8.

[0061] In this embodiment, the height of the chip 3 is greater than or equal to half the height of the substrate 1, and less than the height of the substrate 1. For example, the ratio of the height of the chip 3 to the height of the substrate 1 is 0.60, 0.65, 0.70 or 0.75, which enables the chip 3 to effectively utilize the internal space of the first through hole 11. The chip 3 will not occupy too much space or affect the arrangement of other components due to being too high, nor will the chip 3 be limited in its structural function due to being too low.

[0062] In one embodiment, see Figure 5 and Figure 6 The conductive part 2 includes a conductive cloth 21 and a release layer 22 . The conductive cloth 21 is attached to the back of the substrate 1 , and the release layer 22 is attached to the side of the conductive cloth 21 away from the substrate 1 .

[0063] In this embodiment, the conductive cloth 21 is attached to the back side of the substrate 1 as an electromagnetic shielding layer, which can effectively block the interference of the external electromagnetic field on the chip 3, protect the chip 3 from the influence of electromagnetic noise, and ensure the normal operation of the chip 3; and the conductive cloth 21 can also play the role of electrostatic protection, preventing electrostatic discharge from damaging the chip 3, and improving the reliability and service life of the chip 3.

[0064] The presence of the release layer 22 makes it easier to peel and position the conductive cloth 21 and the substrate 1 during subsequent processing, ensuring the integrity of the conductive cloth 21 and improving the efficiency and accuracy of camera module processing.

[0065] In one embodiment, see Figure 6 The release layer 22 includes a first release layer 221 and a second release layer 222 , and the first release layer 221 and the second release layer 222 are sequentially attached to the side of the conductive cloth 21 away from the substrate 1 ;

[0066] The first release layer 221 is used to form an isolation layer on the camera module, and the second release layer 222 can be peeled off from the first release layer 221 .

[0067] In this embodiment, the first release layer 221 is adhered to the side of the conductive cloth 21 away from the substrate 1, and can form a protective layer between the conductive cloth 21 and other parts of the camera module to prevent electrical short circuits and signal interference in the camera module, and help ensure the stability and reliability of the internal circuit of the camera module; the second release layer 222 is designed to enable it to be easily peeled off from the first release layer 221; when the camera module needs to be separated from external components, the complete structure of the camera module can be easily obtained by peeling off the second release layer 222.

[0068] In one embodiment, see Figure 3 and Figure 4 The camera module also includes a lens 5, which is fixed on the front side of the substrate 1 and opposite to the imaging area 31 of the chip 3.

[0069] In this embodiment, the chip 3 is embedded in the substrate 1 through the first through hole 11, and the lens 5 is fixed on the front side of the substrate 1 and opposite to the imaging area 31 of the chip 3, ensuring that light can be accurately projected onto the photosensitive element in the imaging area 31 of the chip 3, thereby reducing light loss and image distortion, thereby improving imaging quality; and after the chip 3 is embedded in the substrate 1, the lens 5 can be brought closer to the substrate 1, making the structure of the camera module more compact and improving the integration of the camera module.

[0070] An embodiment of the present application also provides an electronic device, which includes the camera module described in the first aspect.

[0071] In this embodiment, the electronic device includes but is not limited to one of a smart watch, a mobile phone, a tablet computer, an e-book reader, an audio player, a video player, a computer, a set-top box, a smart TV, and a wearable device.

[0072] The camera module of the electronic device includes a substrate 1, which has a first through hole 11, and the first through hole 11 passes through the front and back sides of the substrate 1 that are opposite to each other; a conductive part 2, which is attached to the back side of the substrate 1 and is used to seal the first through hole 11; a chip 3, which is embedded in the first through hole 11 and fixed in the first through hole 11 by an adhesive part 4, so that the chip 3 can sink into the interior of the substrate 1, reducing the thickness of the camera module, making the screen frame of the electronic device thinner, and realizing the thinness of the electronic device.

[0073] Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art will appreciate that the above examples are for illustration only and are not intended to limit the scope of the present invention. Those skilled in the art will appreciate that modifications may be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A camera module, characterized in that: include: A substrate (1), the substrate (1) having a first through hole (11), the first through hole (11) penetrating a front side and a back side of the substrate (1) that are opposite to each other; A conductive portion (2), the conductive portion (2) being attached to the back surface of the substrate (1) and used to seal the first through hole (11); A chip (3) is embedded in the first through hole (11) and fixed in the first through hole (11) via an adhesive portion (4).

2. The camera module according to claim 1, wherein: The first through hole (11) forms a glue overflow hole, the chip (3) is embedded in the first through hole (11) and at least a portion of the bonding portion (4) is formed between the peripheral side of the chip (3) and the inner wall of the first through hole (11).

3. The camera module according to claim 2, wherein: Part of the bonding portion (4) is formed on the edge area of ​​the front side of the chip (3).

4. The camera module according to claim 1, wherein: The back surface of the chip (3) is flush with the back surface of the substrate (1).

5. The camera module according to claim 1, wherein: The front height of the chip (3) is lower than the front height of the substrate (1).

6. The camera module according to claim 1, wherein: The ratio of the height dimension of the chip (3) to the height dimension of the substrate (1) is in the range of 0.5-0.

8.

7. The camera module according to claim 1, wherein: The conductive portion (2) comprises a conductive cloth (21) and a release layer (22), wherein the conductive cloth (21) is attached to the back surface of the substrate (1), and the release layer (22) is attached to the side of the conductive cloth (21) away from the substrate (1).

8. The camera module according to claim 7, wherein: The release layer (22) comprises a first release layer (221) and a second release layer (222), wherein the first release layer (221) and the second release layer (222) are sequentially attached to a side of the conductive cloth (21) away from the substrate (1); The first release layer (221) is used to form an isolation layer on the camera module, and the second release layer (222) can be peeled off from the first release layer (221).

9. The camera module according to claim 1, wherein: It also includes a lens (5), which is fixed on the front side of the substrate (1) and faces the imaging area (31) of the chip (3).

10. An electronic device, characterized in that: A camera module comprising any one of claims 1-9.

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