Light source module

Abstract

The utility model relates to a light source module which comprises a substrate and a plurality of LED chips, and the LED chips are arranged on the substrate. The plurality of LED chips comprise a first LED chip, a second LED chip and a third LED chip, the dominant wavelength of light emitted by the first LED chip ranges from 585 nm to 595 nm, and the dominant wavelength of light emitted by the second LED chip ranges from 560 nm to 575 nm; the first LED chip comprises a first wafer, a first fluorescent layer and a first light filtering layer, the first fluorescent layer is arranged on the light emitting face of the first wafer, and the first light filtering layer is arranged on a light path of light emitted by the first fluorescent layer. The number of the third LED chips is multiple, and the third LED chips at least emit red light, green light and blue light. The color purity of light emitted by the light source module is relatively high, and the overall color gamut area is relatively wide.

Description

Technical Field

[0001] This application relates to the field of light source technology, and in particular to a light source module. Background Art

[0002] As the demand for high color gamut and high color purity LED light source modules in the stage lighting market continues to rise, existing methods of improving the color gamut of light source modules using four, five, six, or even more color combinations have certain limitations. Currently, mainstream light source module solutions include LED chips such as R (Red), G (Green), B (Blue), C (Cool White), A (Amber), and L (Lime), or a combination of R, G, B, C, and W (Warm White). Among these, A and L chips primarily rely on LED chips to excite phosphors, resulting in color gamut values ​​that do not meet ideal targets and low color purity, making it difficult to satisfy higher requirements for stage lighting effects. Utility Model Content

[0003] This application provides a light source module.

[0004] This application provides a light source module including a substrate and multiple LED chips disposed on the substrate. The multiple LED chips include a first LED chip, a second LED chip, and a third LED chip. The dominant wavelength of the light emitted by the first LED chip is between 585-595nm, and the dominant wavelength of the light emitted by the second LED chip is between 560-575nm. The first LED chip includes a first wafer, a first phosphor layer, and a first filter layer. The first phosphor layer is disposed on the light-emitting surface of the first wafer, and the first filter layer is disposed in the optical path of the light emitted through the first phosphor layer. The second LED chip includes a second wafer, a second phosphor layer, and a second filter layer. The second phosphor layer is disposed on the light-emitting surface of the second wafer, and the second filter layer is disposed in the optical path of the light emitted through the second phosphor layer. The third LED chip emits at least red, green, and blue light.

[0005] In some alternative embodiments, the light emitted by the first LED chip has a color purity greater than 94%, and the light emitted by the second LED chip has a color purity greater than 91%.

[0006] In some alternative embodiments, the first filter layer and the second filter layer are used to filter blue light in the light emitted from the first LED chip and the second LED chip.

[0007] In some alternative embodiments, the light source module further includes a first light-shielding part and a second light-shielding part, the first light-shielding part surrounding the first LED chip and the second light-shielding part surrounding the second LED chip.

[0008] In some alternative embodiments, the first light-shielding portion covers the gap between the first wafer and the first filter layer; the second light-shielding portion covers the gap between the second wafer and the second filter layer.

[0009] In some alternative embodiments, the light-shielding part includes at least one of the following structures: white wall adhesive and fluorescent adhesive, and the second light-shielding part includes at least one of the following structures: white wall adhesive and fluorescent adhesive.

[0010] In some alternative embodiments, the first filter layer is closely attached to the first fluorescent layer, or the first filter layer and the first fluorescent layer are spaced apart.

[0011] In some optional embodiments, the first fluorescent layer includes any one of the following structures: a fluorescent adhesive layer, a phosphor layer, a silicone fluorescent film, a glass fluorescent sheet, or a ceramic fluorescent sheet; the second fluorescent layer includes any one of the following structures: a fluorescent adhesive layer, a phosphor layer, a silicone fluorescent film, a glass fluorescent sheet, or a ceramic fluorescent sheet.

[0012] In some alternative embodiments, multiple LED chips are divided into multiple groups of LED chips, each group of LED chips includes multiple LED chips, the multiple LED chips in each group emit light of the same wavelength, the multiple groups of LED chips emit light of different wavelengths, and the multiple groups of LED chips are staggered on the substrate to make the light of multiple wavelengths evenly distributed.

[0013] In some optional embodiments, the light source module further includes a controller and multiple connecting lines, all of which are connected to the controller. Each connecting line is configured to correspond one-to-one with a set of LED chips, with each connecting line connected to a corresponding set of LED chips.

[0014] Compared to existing technologies, in the light-emitting process of the light source module provided in this application embodiment, the first chip and the first phosphor layer are first excited to generate light of the desired color. Since the first LED chip is provided with a first filter layer, the first filter layer can improve the purity of the light emitted by the first LED chip. The main wavelength of the light emitted by the first LED chip is between 585-595nm. The light emitted by the first LED chip can be amber light, so the first filter layer filters out stray light that affects the color purity, thereby improving the color purity of the amber light. The second chip and the second phosphor layer are first excited to generate light of the desired color. Since the second LED chip is provided with a second filter layer, the second filter layer can improve the purity of the light emitted by the second LED chip. The wavelength range of the light emitted by the second LED chip is 560-575nm. The light emitted by the second LED chip can be lemon yellow light, so the second filter layer filters out stray light that affects the color purity, thereby improving the color purity of the lemon yellow light, and thus improving the color gamut of the light source module. Attached Figure Description

[0015] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a simplified structural diagram of a light source module provided in one embodiment of this application.

[0017] Figure 2 yes Figure 1 A simplified cross-sectional view of the first LED chip in the light source module shown.

[0018] Figure 3 yes Figure 1 A simplified cross-sectional view of the second LED chip in the light source module shown.

[0019] Figure 4 yes Figure 2 The diagram shows a planar structure of the first wafer and the first phosphor layer of the first LED chip.

[0020] Figure 5 yes Figure 1 The color gamut calculation diagrams for the light source module and the conventional light source module are shown.

[0021] Figure 6 yes Figure 1 A simplified structural diagram of the LED module of the light source module shown.

[0022] Labeling Explanation: 100, Light Source Module; 10, Substrate; 30, LED Module; 32, First LED Chip; 321, First Wafer; 3212, Light-Emitting Surface; 323, First Phosphor Layer; 325, First Filter Layer; 327, First Light-Shielding Part; 34, First LED Chip; 341, First Wafer; 343, First Phosphor Layer; 345, First Filter Layer; 347, Second Light-Shielding Part; 36, Third LED Chip; 50, Controller; 70, Connecting Cable. DETAILED DESCRIPTION

[0023] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of the present application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative effort are within the scope of protection of the present application.

[0024] If certain terms are used in the specification and claims to refer to specific components, those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. The specification and claims do not distinguish components based on differences in name, but rather on differences in function. For example, the term "comprising" used throughout the specification and claims is an open-ended term and should be interpreted as "including but not limited to"; "generally" means that those skilled in the art can solve the technical problem and basically achieve the technical effect within a certain margin of error.

[0025] Please see Figure 1 This application provides a light source module 100, which can be applied to the stage lighting market. This specification does not limit the specific application type of the light source module 100; for example, it can be applied to lighting equipment such as stage imaging lights, spotlights, and photographic lights.

[0026] Please also refer to Figure 1 , Figure 2 and Figure 3In this embodiment, the light source module 100 may include a substrate 10 and an LED module 30. The LED module 30 is disposed on the substrate 10 and may include multiple LED chips, including a first LED chip 32, a second LED chip 34, and a third LED chip 36. The dominant wavelength of the light emitted by the first LED chip is between 585-595nm, and the dominant wavelength of the light emitted by the second LED chip is between 560-575nm. The first LED chip 32 may include a first wafer 321, a first phosphor layer 323, and a first filter layer 325. The first phosphor layer 323 is disposed on the light-emitting surface of the first wafer 321, and the first filter layer 325 is located in the optical path of the light emitted through the first phosphor layer 323. The second LED chip 34 may include a second wafer 341, a second phosphor layer 343, and a second filter layer 345. The second phosphor layer 343 is disposed on the light-emitting surface of the second wafer 341, and the second filter layer 345 is located in the optical path of the light emitted through the second phosphor layer 343. The third LED chip 36 emits at least red, green and blue light.

[0027] In the light emission process of the light source module 100 provided in this embodiment, the first chip 321 and the first phosphor layer 323 are first excited to generate light of the desired color. The dominant wavelength of the light emitted by the first LED chip is between 585-595nm, and the light emitted by the first LED chip can be amber light. The first filter layer 325 is used to filter the light emitted through the first phosphor layer 323, which can filter out the spectrum that affects color saturation, making the amber light emitted by the first LED chip 32 purer and helping to improve the color saturation of the amber light. The second chip 341 and the second phosphor layer 343 are first excited to generate light of the desired color, and the second filter layer 345 can improve the purity of the light emitted by the second LED chip 34. The dominant wavelength of the light emitted by the second LED chip 34 is between 560-575nm, and the light emitted by the second LED chip 34 can be lemon yellow light. The second filter layer 345 filters out stray light that affects color purity, which can improve the color purity of lemon yellow light, thereby improving the color gamut of the entire light source module 100.

[0028] Compared to the traditional approach that uses only wafers and phosphors for direct excitation, the first filter layer 325 of the light source module 100 provided in this application results in relatively high color purity of the light emitted by the first LED chip 32 (amber light) and relatively high color purity of the light emitted by the second LED chip 34 (lemon yellow light), thus making the overall color gamut area of ​​the light source module 100 relatively wide.

[0029] In this embodiment, the substrate 10 is used to support the LED module 30, and it can dissipate heat and conduct heat to protect the LED module 30. This specification does not limit the specific type of the substrate 10. For example, the substrate 10 can be a metal substrate with good thermal conductivity, such as a copper substrate or an aluminum substrate. Alternatively, the substrate 10 can also be a ceramic substrate or a composite substrate of a ceramic substrate and a metal substrate. As an example, the substrate 10 may include a thermally conductive layer, an insulating layer, and a circuit layer. The thermally conductive layer can be made of an aluminum plate or a copper plate with good thermal conductivity. The insulating layer can be made of a polymer filled with special ceramics, responsible for heat conduction and insulation. The circuit layer can be a copper foil layer, where the copper foil is etched to form a printed circuit, connecting the various components of each element.

[0030] Multiple LED chips of the LED module 30 are disposed on the substrate 10 and are used to emit multiple beams of light. Among them, the dominant wavelength of the light emitted by the first LED chip 32 is between 585-595nm. As an example, the light emitted by the first LED chip 32 can be A (amber) light.

[0031] The first chip 321 is a solid-state semiconductor device, and the first LED chip 32 mainly relies on the first chip 321 to emit light. This specification does not limit the chip structure of the first chip 321, which may include any of the following: vertical chip structure, flip-chip structure, or upright chip structure. The first chip 321 is fixed on the substrate 10, and the side of the first chip 321 facing away from the substrate 10 is the light-emitting surface 3212. This specification also does not limit the specific connection structure between the first chip 321 and the substrate 10, which may include any of the following: solder paste bonding structure, insulating adhesive bonding structure, or eutectic bonding structure.

[0032] Please also refer to Figure 2 and Figure 4 A first phosphor layer 323 is disposed on the light-emitting surface 3212 of the first wafer 321, and is used to convert the light emitted by the first wafer 321. This specification does not limit the specific structure of the first phosphor layer 323. The first phosphor layer 323 includes any of the following structures: a phosphor adhesive layer, a phosphor layer, a silicone phosphor film, a glass phosphor sheet, or a ceramic phosphor sheet. The phosphor adhesive layer can be coated on the light-emitting surface 3212, the silicone phosphor film can be adhered to the light-emitting surface 3212, the phosphor layer can be coated on the light-emitting surface 3212 by powder spraying, and the glass phosphor sheet or ceramic phosphor sheet can be connected to the light-emitting surface 3212 by bonding or encapsulation.

[0033] The color of the light (amber light) emitted by the first LED chip 32 is obtained by exciting the first phosphor layer 323 with the excitation light emitted from the first chip 321. The first chip 321 can be a blue LED chip, and the first phosphor layer 323 can be a cerium-doped yttrium aluminum garnet phosphor layer. By covering the blue LED chip with a cerium-doped yttrium aluminum garnet phosphor layer to emit amber light, the cerium-doped yttrium aluminum garnet phosphor layer can absorb the lower wavelength blue light and convert it into the higher wavelength amber light (A light). In other embodiments, the first phosphor layer 323 can also be an erbium-doped nitride phosphor layer.

[0034] In this embodiment, the first filter layer 325 covers the side of the first phosphor layer 323 opposite to the light-emitting surface 3212, and is used to filter the light emitted through the first phosphor layer 323. This ensures that the dominant wavelength of the light emitted by the first LED chip 32 is greater than or equal to 585nm and less than or equal to 595nm. In this embodiment, the first filter layer 325 is used to filter stray light in the first LED chip, that is, the first filter layer 325 can filter out blue light that affects color saturation, making the color of the A light emitted by the first LED chip 32 purer, which helps to improve the color saturation of the A light, thereby improving the color gamut of the entire light source module 100.

[0035] This specification does not limit the specific relative positions between the first filter layer 325 and the first fluorescent layer 323. The first filter layer 325 can be closely attached to the light-emitting side of the first fluorescent layer 323. For example, the first filter layer 325 can be directly stacked on the first fluorescent layer 323 and in direct contact with the first fluorescent layer 323. Alternatively, the first filter layer 325 can be spaced apart from the first fluorescent layer 323 and located in the optical path of the light emitted from the light-emitting surface of the first fluorescent layer 323. For example, the first filter layer 325 and the first fluorescent layer 323 can be separated by structures such as the light source module 100 packaging bracket, or they can be separated by air, light-transmitting optical adhesive, etc.

[0036] In this embodiment, the structure of the second LED chip 34 is substantially the same as that of the first LED chip 32. The second wafer 341 can also be a blue LED wafer. The second phosphor layer 343 includes any of the following structures: a phosphor layer, a phosphor powder layer, a silicone phosphor film, a glass phosphor sheet, or a ceramic phosphor sheet. The second filter layer 345 covers the side of the second phosphor layer 343 facing away from the light-emitting surface of the second wafer 341. This specification does not limit the specific relative position between the second filter layer 345 and the second phosphor layer 343. The second filter layer 345 can be closely attached to the light-emitting side of the second phosphor layer 343; for example, the second filter layer 345 can be directly stacked on the second phosphor layer 343 and in direct contact with the second phosphor layer 343. Alternatively, the second filter layer 345 can be spaced apart from the second phosphor layer 343 and located in the optical path of the light emitted from the light-emitting surface of the second phosphor layer 343. For example, the second filter layer 345 and the second fluorescent layer 343 can be separated by a structure such as the light source module 100 encapsulation bracket, or the second filter layer 345 and the second fluorescent layer 343 can also be separated by air, light-transmitting optical adhesive, etc.

[0037] The second filter layer 345 is used to filter the light emitted through the second phosphor layer 343. This ensures that the dominant wavelength of the light emitted by the second LED chip 34 is greater than or equal to 560nm and less than or equal to 575nm. The light emitted by the second LED chip 34 is lemon yellow light (L light). In this embodiment, the second filter layer 345 also filters stray light from the second LED chip. The second filter layer 345 can filter out blue light that affects color saturation, making the L light emitted by the second LED chip 34 purer, which helps to improve the color saturation of the L light and thus enhances the color gamut of the entire light source module 100.

[0038] In this embodiment, the color purity of the light emitted by the first LED chip (A light) is greater than 94%, and the color purity of the light emitted by the second LED chip (L light) is greater than 91%. The color purity of the light source module 100 provided in this application was measured, and the measurement data are shown in the table below:

[0039]

[0040]

[0041] As shown in the table above, in conventional technology, the A-light source only uses a wafer and a phosphor layer, and does not have a filter layer. The color purity range of the A-light emitted by the light source in conventional technology is 84.3 to 85.6 (inclusive). In this embodiment, because a first filter layer 325 is provided in the optical path of the light emitted through the phosphor, the color purity range of the A-light emitted by the first LED chip 32 is 94.4 to 94.5 (inclusive), which is significantly improved by approximately 12%. In conventional technology, the L-light source only uses a wafer and a phosphor layer, and does not have a filter layer. The color purity range of the L-light emitted by the light source in conventional technology is 72.1 to 72.9 (inclusive). Because a second filter layer 345 is provided in the optical path of the light emitted through the phosphor, the color purity range of the L-light emitted by the second LED chip 34 is 91.2 to 91.8 (inclusive), which is significantly improved by approximately 28%. By adding the first filter layer 325 and the second filter layer 345, the color purity of A light can be improved from 80-88% to greater than 94%, and the color purity of L light can be improved from 70-80% to greater than 91%. The setting of the filter layers (first filter layer 325 and second filter layer 345) can achieve a 5% to 20% improvement in the color purity of A light and L light, thus achieving the goal of improving color purity.

[0042] A color gamut analysis of the light source module 100 provided in this application shows that the setting of the filter layers (first filter layer 325 and second filter layer 345) increases the overall color gamut area of ​​the light source module 100 by 2% to 8% (see [link]). Figure 5 , Figure 5 P1 represents a conventional solution without a filter layer, while P2 represents the light source module 100 of this application, achieving the goal of improving the color gamut range.

[0043] This specification does not limit the specific structure of the first filter layer 325 and the second filter layer 345. For example, the first filter layer 325 and the second filter layer 345 can be filters or filter films. In this embodiment, the first filter layer 325 and the second filter layer 345 are filters, and the filters are stacked on the first fluorescent layer 323 and the second fluorescent layer 343.

[0044] In some embodiments, the first LED chip 32 may further include a first light-shielding portion 327, which surrounds the first LED chip 32 and is used to shield the first wafer 321 to prevent light emitted from the first wafer 321 from leaking out. This specification does not limit the specific structure of the first light-shielding portion 327. For example, the first light-shielding portion 327 may include at least one of the following structures: white wall adhesive, fluorescent adhesive. White wall adhesive is a high-reflectivity white adhesive that can improve the luminous efficacy and brightness of the LED chip. White wall adhesive is a phenyl silicone resin with high reflectivity, high hardness, good adhesion, and low moisture and oxygen permeability and anti-sulfurization properties based on phenyl silicone resin. White wall adhesive can be disposed on the side of the first wafer 321, blocking stray light emitted from the side, thereby reducing light leakage from the side of the first LED chip 32. Simultaneously, the high reflectivity of the white wall adhesive reflects the light from the side back to the light-emitting surface 3212 of the first wafer 321, thereby improving the overall luminous efficacy. The first light-shielding part 327 can also be a fluorescent adhesive of the same color as the first fluorescent layer 323. The fluorescent adhesive can be disposed around the outer peripheral wall of the first chip 321 to prevent light leakage from the first chip 321 and affect the color purity.

[0045] In some examples, the first wafer 321 and the first filter layer 325 are stacked on top of each other with a gap between them, and the first light-shielding part 327 can cover the gap, thereby further improving the light-shielding effect.

[0046] The second LED chip 34 may further include a second light-shielding portion 347, which surrounds the second LED chip 34 and is used to shield the second chip 341 to prevent light emitted from the second chip 341 from leaking out and affecting color purity. The second light-shielding portion 347 may cover the gap between the second LED chip 34 and the second filter layer 345. The second light-shielding portion 347 includes at least one of the following structures: white wall adhesive, fluorescent adhesive.

[0047] Please also refer to Figure 1 and Figure 6The number of third LED chips 36 is set to multiple, and the center wavelengths of the light emitted by the multiple third LED chips 36 are different. At least red, blue, and green chips are present among the multiple third LED chips 36. The specific type of light emitted by the multiple third LED chips 36 is not limited in this specification. For example, the light emitted by the third LED chips 36 may include at least one of the following: R (Red) light, G (Green) light, B (Blue) light, C (Cool White) light, DR (Dark Red) light, etc. In this embodiment, the light emitted by the third LED chips 36 includes at least R, G, and B light; and at least red, blue, and green chips are present among the multiple third LED chips 36.

[0048] The third LED chip 36 emitting R light has a red wafer, the third LED chip 36 emitting G light has a green wafer, and the third LED chip 36 emitting B light has a blue wafer. Specifically, in this embodiment, the light emitted by the third LED chip 36 may also include C light and DR light, and the third LED chip 36 emitting DR light has a dark red wafer. The third LED chip 36 emitting C light may include a blue wafer and a phosphor layer, and the blue wafer and phosphor layer excite to generate C light.

[0049] The connection method between the third LED chip 36 and the substrate 10 is the same as that between the first LED chip 32 and the substrate 10. The third LED chip 36 can also be fixed to the substrate 10 by the aforementioned die bonding methods, such as solder paste die bonding, eutectic die bonding, and insulating adhesive die bonding. After all the LED chips of the LED module 30 are fixed to the substrate 10, encapsulation is required to ensure the sealing and stability of the product. The encapsulation material can be waterproof, dustproof, and has good heat dissipation performance. For example, epoxy resin and silicone can be used for external potting of the LED chips. In this embodiment, multiple LED chips of the LED module 30 are encapsulated on the substrate 10. The peripheral walls of the LED chips with phosphor layers are provided with the aforementioned first light-shielding portion 327 to shield the light emitted by the chip that has not been converted by the phosphor layer, thereby improving the color purity of the light emitted by the LED chip.

[0050] Multiple LED chips can be divided into multiple groups, each group containing multiple LED chips. The LED chips in each group emit light of the same wavelength, while the LED chips in the multiple groups emit light of different wavelengths. These multiple groups of LED chips are evenly distributed on the substrate 10 to ensure uniform distribution of light across multiple wavelengths. As an example, the LED module 30 can have seven groups of LED chips. The LED chips in each group emit light of the same wavelength, while the seven groups emit light of different wavelengths. These seven groups of LED chips are staggered on the substrate 10 to ensure uniform distribution of the seven wavelengths of light. However, "uniform distribution of the seven wavelengths of light" does not strictly require that the multiple chips in the seven groups of LED chips be evenly arranged on the substrate; the distance between the chips in the seven groups of LED chips can be unequal. The staggered distribution of the individual LED chips in the seven groups ensures uniform color distribution of the light emitted by the entire LED module 30.

[0051] In this embodiment, the seven groups of LED chips may include group R, group G, group B, group C, group A, group L, and group DR LED chips. Specifically, group R includes multiple LED chips emitting red light (dominant wavelength between 615 and 635 nm), group G includes multiple LED chips emitting green light (dominant wavelength between 515 and 535 nm), group B includes multiple LED chips emitting blue light (dominant wavelength between 440 and 470 nm), group C includes multiple LED chips emitting cool white light (dominant wavelength between 480 and 495 nm), group A includes multiple LED chips emitting amber light (dominant wavelength between 585 and 595 nm), group L includes multiple LED chips emitting lemon yellow light (dominant wavelength between 560 and 575 nm), and group DR includes multiple LED chips emitting dark red light (dominant wavelength between 650 and 670 nm). Seven groups of LED chips together form a seven-color light source module 100.

[0052] As an example, the seven groups of LED chips can each have the same number of chips, and the chips of the seven groups of LED chips are staggered on the substrate 10 to ensure that the seven colors of light are evenly distributed on the substrate 10. In this embodiment, the light source module 100 may also include a controller 50 and multiple connecting lines 70. The multiple connecting lines 70 are all connected to the controller 50, and each connecting line 70 is connected to a corresponding group of LED chips. The multiple LED chips in each group of LED chips can be connected in series or in parallel. LED chips that emit light of the same color can be connected in series or in parallel, and multiple groups of LED chips can also be connected in series or in parallel. The controller 50 realizes independent control and adjustment of multiple groups of LED chips through multiple connecting lines 70, achieving more precise color adjustment to meet the needs of different stage lighting effects.

[0053] After the light source module 100 is assembled, quality inspection and performance testing can be performed to ensure that the product meets relevant standards and requirements. Testing items can include color purity, color gamut area, brightness, stability, and reliability. In practical applications, the light source module 100 can be configured with different parameter settings for the controller 50 according to different application scenarios. For example, personalized control schemes can be specified based on stage size, light intensity, color matching, and other requirements to improve the user experience.

[0054] In the light emission process of the light source module 100 provided in this application embodiment, the first chip 321 and the first phosphor layer 323 are first excited to generate light of the desired color, and then the first filter layer 325 is applied. The first filter layer 325 filters out a portion of the light of a predetermined wavelength to prevent it from leaking out. Thus, compared with the traditional solution that only uses the chip and phosphor to directly excite the light, the first filter layer 325 of the light source module 100 provided in this application makes the color purity of the light emitted by the first LED chip 32 relatively high and the overall color gamut area of ​​the light source module 100 relatively wide, thereby optimizing the light effect. For stage lighting, the higher the color purity, the higher the light utilization rate.

[0055] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0056] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A light source module, characterized in that, It includes a substrate and a plurality of LED chips, wherein the plurality of LED chips are disposed on the substrate; The plurality of LED chips include a first LED chip, a second LED chip, and a third LED chip. The dominant wavelength of the light emitted by the first LED chip is between 585-595nm, and the dominant wavelength of the light emitted by the second LED chip is between 560-575nm. The first LED chip includes a first wafer, a first phosphor layer, and a first filter layer. The first phosphor layer is disposed on the light-emitting surface of the first wafer, and the first filter layer is disposed on the light path of the light emitted through the first phosphor layer. The second LED chip includes a second wafer, a second phosphor layer, and a second filter layer. The second phosphor layer is disposed on the light-emitting surface of the second wafer, and the second filter layer is disposed on the light path of the light emitted through the second phosphor layer. The third LED chip emits at least red, green and blue light.

2. The light source module as described in claim 1, characterized in that, The first LED chip emits light with a color purity greater than 94%, and the second LED chip emits light with a color purity greater than 91%.

3. The light source module as described in claim 1, characterized in that, The first filter layer and the second filter layer are used to filter the blue light emitted from the first LED chip and the second LED chip.

4. The light source module as described in claim 1, characterized in that, The light source module further includes a first light-shielding part and a second light-shielding part, wherein the first light-shielding part surrounds the first LED chip and the second light-shielding part surrounds the second LED chip.

5. The light source module as described in claim 4, characterized in that, The first light-shielding portion covers the gap between the first wafer and the first filter layer; the second light-shielding portion covers the gap between the second wafer and the second filter layer.

6. The light source module as described in claim 4, characterized in that, The first light-shielding part includes at least one of the following structures: white wall adhesive and fluorescent adhesive; the second light-shielding part includes at least one of the following structures: white wall adhesive and fluorescent adhesive.

7. The light source module as described in claim 1, characterized in that, The first filter layer is tightly bonded to the first fluorescent layer, or The first filter layer and the first fluorescent layer are spaced apart.

8. The light source module as described in claim 1, characterized in that, The first fluorescent layer comprises any one of the following structures: a fluorescent adhesive layer, a phosphor layer, a silicone fluorescent film, a glass fluorescent sheet, or a ceramic fluorescent sheet; the second fluorescent layer comprises any one of the following structures: a fluorescent adhesive layer, a phosphor layer, a silicone fluorescent film, a glass fluorescent sheet, or a ceramic fluorescent sheet.

9. The light source module as described in claim 1, characterized in that, The LED chips are divided into multiple groups of LED chips, and each group of LED chips includes multiple LED chips. The LED chips in each group emit light of the same wavelength, while the LED chips in the multiple groups emit light of different wavelengths. The multiple groups of LED chips are staggered on the substrate to ensure uniform distribution of light of multiple wavelengths.

10. The light source module as described in claim 9, characterized in that, The light source module also includes a controller and multiple connecting lines. The multiple connecting lines are all connected to the controller, and each of the multiple connecting lines is configured to correspond one-to-one with a set of LED chips.

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