LED filament and LED filament lamp

Abstract

The utility model discloses an LED filament lamp, which comprises a lamp shell, the lamp holder is connected to the lamp shell, the core column and the conductive support are arranged in the lamp shell, the flexible LED lamp filament is connected with the conductive support, and the drive circuit is arranged in the lamp holder and electrically connected with the conductive support. The flexible LED lamp filament comprises an LED section which comprises a plurality of LED chips and a light conversion layer wrapping the LED chips; the first conductive electrode is electrically connected with the plurality of LED chips and one of the two conductive brackets; the second conductive electrode is electrically connected with the plurality of LED chips and the other one of the two conductive brackets; the conductive parts are electrically connected among the plurality of LED chips; one LED chip in the plurality of LED chips is provided with an electric connecting part, one end part of the conductive part is connected to the electric connecting part, the conductive part is provided with a first bending part and a second bending part, the conductive part extends from the electric connecting part along a first direction, a second direction and a third direction of the LED chip, and the first direction, the second direction and the third direction are different directions.

Description

Technical Field

[0001] This invention relates to the technical field of LED lighting devices, and more specifically to an LED filament and an LED filament lamp. Background Technology

[0002] LED lighting has many advantages such as long lifespan, small size, and energy saving, so it is widely used in the market and is gradually replacing existing incandescent and fluorescent lamps.

[0003] As one of the earliest electric lighting devices, the tungsten filament lamp, a type of incandescent bulb, has become one of the most widely accepted forms of lighting due to its long-term and extensive use. However, due to its manufacturing process and materials, the tungsten filament lamp has low luminous efficiency, generates significant heat, and consumes a lot of energy, with an average lifespan of only 1000-3000 hours. Currently, LED lighting fixtures, also known as LED filament lamps, have emerged on the market. These lamps use LED filaments as the light-emitting element and have a shape similar to tungsten filament lamps. With their superior luminous performance, low energy consumption, long lifespan, and similar shape to tungsten filament lamps, they have been rapidly accepted by consumers and are quickly replacing tungsten filament lamps in the original lighting market.

[0004] An LED filament is a light-emitting element consisting of multiple LED chips arranged and conducting in a certain direction, and encapsulated. Common LED filaments are strip-shaped. However, in order to make the LED filament resemble a tungsten filament, it needs to be made into a thin filament with an extremely small cross-section. This shape inevitably presents challenges in terms of structural strength, especially when the LED filament is flexible and needs to be bent. The LED filament itself or its internal conductive structure is prone to breakage, resulting in the inability to conduct electricity and light up.

[0005] In summary, given the shortcomings and defects of existing LED filament lamps, how to design LED filament lamps to prevent breakage is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0006] This abstract describes many embodiments of the invention. However, the term "invention" is used only to describe certain embodiments disclosed herein (whether or not they are mentioned in the claims), and not a complete description of all possible embodiments. Certain embodiments of the various features or aspects of the invention described above may be combined in different ways to form an LED luminaire or a portion thereof.

[0007] The purpose of this invention is to provide an LED filament lamp, characterized in that it comprises:

[0008] A lamp housing with a central axis;

[0009] The lamp holder is connected to the lamp housing;

[0010] A core column is disposed inside the lamp housing along the central axis of the lamp housing;

[0011] Two conductive supports are disposed inside the lamp housing, and the two conductive supports have opposite polarities;

[0012] A drive circuit disposed within the lamp holder and electrically connected to the two conductive supports; and

[0013] The flexible LED filament is disposed inside the lamp housing and electrically connected to the two conductive supports. The flexible LED filament includes an LED segment, which includes multiple LED chips connected in series and a light conversion layer that wraps the multiple LED chips.

[0014] A first conductive electrode is disposed at one of the two ends of the LED segment and electrically connected to the plurality of LED chips and one of the two conductive supports, wherein a portion of the first conductive electrode is wrapped by the light conversion layer;

[0015] A second conductive electrode is disposed at the other end of both ends of the LED segment and electrically connected to the plurality of LED chips and another of the two conductive supports, wherein a portion of the second conductive electrode is wrapped by the light conversion layer; and a conductive portion is electrically connected between the plurality of LED chips;

[0016] Among the plurality of LED chips, one LED chip has an electrical connection portion, one end of the conductive portion is connected to the electrical connection portion, the conductive portion has a first bending portion and a second bending portion, the conductive portion extends from the electrical connection portion along a first direction of the LED chip, extends through the first bending portion to a second direction of the LED chip, and extends through the second bending portion to a third direction of the LED chip, wherein the first direction, the second direction and the third direction are different directions.

[0017] In one embodiment of the present invention, the first direction is the height direction of the LED chip, the second direction is the width direction of the LED chip, and the third direction is the length direction of the LED chip.

[0018] In one embodiment of the present invention, the distance between the first bent portion and the surface of the LED chip is between 80 μm and 120 μm, and the distance between the first bent portion and the second bent portion is between 100 μm and 120 μm.

[0019] In one embodiment of the present invention, the LED filament further includes a first solder layer, the first solder layer being made of a welding material, and the end of the conductive portion being located between the electrical connection portion of the LED chip and the first solder layer.

[0020] In one embodiment of the present invention, the projected area of ​​the first solder layer on the electrical connection portion of the LED chip is greater than the projected area of ​​the bonding region between the conductive portion and the electrical connection portion of the LED chip.

[0021] In one embodiment of the present invention, the end of the conductive part, the electrical connection part of the LED chip and the first solder layer together form a connection part, the connection part having a mesh surface, and multiple protrusions and multiple indentations are alternately arranged on the mesh surface.

[0022] In one embodiment of the present invention, the LED filament includes a second solder layer, the second solder layer being made of solder material, and the end of the conductive part being located between the first solder layer and the second solder layer.

[0023] In one embodiment of the present invention, each of the projected area of ​​the first solder layer on the electrical connection portion of the LED chip and the projected area of ​​the second solder layer on the electrical connection portion of the LED chip is greater than the projected area of ​​the bonding region between the conductive portion and the first solder layer and the second solder layer on the electrical connection portion of the LED chip.

[0024] In one embodiment of the present invention, the projected area of ​​the bonding region between the conductive part and the electrical connection part of the LED chip is smaller than the projected area of ​​the first solder layer, and the projected area of ​​the first solder layer is smaller than the projected area of ​​the second solder layer.

[0025] In one embodiment of the present invention, the plurality of LED chips further includes a first row of LED chips and a second row of LED chips. The first row of LED chips and the second row of LED chips are connected in parallel. The LED chips in the first row of LED chips are connected in series. The LED chips in the second row of LED chips are connected in series. The first row of LED chips and the second row of LED chips are arranged alternately along the width direction of the LED filament.

[0026] In one embodiment of the present invention, the LED filament further includes a first conductive portion and a second conductive portion electrically connected between the LED chip and the first conductive electrode; wherein one end of the first conductive portion is connected to the LED chip, and the other end of the first conductive portion is connected to the first conductive electrode; one end of the second conductive portion is connected to the first conductive electrode, and the other end of the second conductive portion is connected to the LED chip; wherein the first conductive portion first extends downward and then upward with a first bending point as a first turning point, and then extends upward and then downward with a second bending point as a second turning point; the second conductive portion first extends upward and then downward with a first bending point as a first turning point, and then extends downward and then upward with a second bending point as a second turning point.

[0027] Other aspects and advantages of the invention will be readily apparent to those skilled in the art from the following detailed description. Only exemplary embodiments of the invention are shown and described in the following detailed description. As will be appreciated by those skilled in the art, the content of this invention enables them to make modifications to the disclosed specific embodiments without departing from the spirit and scope of the invention. Accordingly, the descriptions in the accompanying drawings and specification are merely exemplary and not restrictive. Attached Figure Description

[0028] The specific features of the invention are shown in the appended claims. The characteristics and advantages of the invention can be better understood by referring to the exemplary embodiments and accompanying drawings described in detail below. A brief description of the drawings is as follows:

[0029] Figure 1 The diagram shown is a three-dimensional partial perspective view of an LED filament in one embodiment of the present invention.

[0030] Figure 2 Displayed as Figure 1 A cross-sectional view at position 2-2 in the middle;

[0031] Figures 3 to 7 The diagrams shown are schematic representations of the LED chip and electrode configurations in different embodiments of the present invention.

[0032] Figure 8 The diagram shown is a structural schematic of the conductive portion of the present invention in one embodiment.

[0033] Figure 9 The diagram shows a structural schematic of the second joint in the related technology of the present invention;

[0034] Figure 10AThe diagram shown is a schematic representation of the structure of a ceramic nozzle in the related art of this invention;

[0035] Figure 10B This is shown as an example of the present invention. Figure 10A A schematic diagram of the cross-sectional structure of the ceramic nozzle in the relevant technology;

[0036] Figure 11A The diagram shown is a structural schematic of a ceramic nozzle according to an embodiment of the present invention;

[0037] Figure 11B This is shown as an example of the present invention. Figure 11A A schematic diagram of the cross-sectional structure of the ceramic nozzle in the relevant technology;

[0038] Figure 12 The diagram shown is a structural schematic of the second joint portion in one embodiment of the present invention;

[0039] Figure 13 The diagram shown is a structural schematic of the ceramic nozzle in one embodiment of the present invention;

[0040] Figure 14 The diagram shown is a structural schematic of the second joint portion in one embodiment of the present invention;

[0041] Figures 15A to 15D The diagrams shown are schematic diagrams of ceramic nozzles with two different surface roughnesses in different embodiments of the present invention.

[0042] Figure 16 The diagram shown is a structural schematic of the second joint portion in one embodiment of the present invention;

[0043] Figure 17A The diagram shown is a structural schematic of the second joint portion in one embodiment of the present invention;

[0044] Figure 17B This is shown as an embodiment of the present invention. Figure 17A Schematic diagram of the cross-sectional structure of the second joint;

[0045] Figure 18A The diagram shown is a structural schematic of the second joint portion in one embodiment of the present invention;

[0046] Figure 18B This is shown as an embodiment of the present invention. Figure 18A Schematic diagram of the cross-sectional structure of the second joint;

[0047] Figure 19A and Figure 19B Schematic diagrams showing the shearing position of the second end of the conductive part in the prior art;

[0048] Figure 20 The diagram shown is a structural schematic of the first joint in the prior art of this invention.

[0049] Figure 21 The diagram shown is a structural schematic of the first joint portion in one embodiment of the present invention;

[0050] Figure 22A and Figure 22B Partial schematic diagrams of the first end of the corresponding conductive part from different perspectives are shown in the prior art of the invention.

[0051] Figure 23A and Figure 23B These are partial schematic diagrams of the first end of the corresponding conductive portion in one embodiment of the present invention;

[0052] Figure 24A and Figure 24B The images shown are schematic diagrams of a portion of the LED filament structure from different perspectives in one embodiment of the present invention.

[0053] Figure 25 The diagram shows an embodiment of the present invention in which the LED chip is tilted.

[0054] Figure 26 The diagram shown is a schematic representation of the connection between the electrode and the LED chip in one embodiment of the present invention.

[0055] Figures 27A to 27C The images shown are schematic diagrams of the LED chip and its corresponding electrode connected by two conductive parts from different perspectives in one embodiment of the present invention.

[0056] Figure 28 This is shown as an embodiment of the present invention. Figures 1 to 27A A schematic diagram of the LED filament bulb. Detailed Implementation

[0057] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0058] In the following description, reference is made to the accompanying drawings, which illustrate several embodiments of the invention. It should be understood that other embodiments may also be used, and changes in module or unit composition, electrical and operational aspects may be made without departing from the spirit and scope of this disclosure. The following detailed description should not be considered limiting, and the scope of the embodiments of the invention is defined only by the claims of the published patents. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention.

[0059] It will be understood that although the terms first, second, etc., may be used herein to describe various elements or parameters in some instances, these elements or parameters should not be limited by these terms. These terms are used only to distinguish one element or parameter from another. For example, a first electrical connection may be referred to as a second electrical connection, and similarly, a second electrical connection may be referred to as a first electrical connection, without departing from the scope of the various described embodiments. Both the first electrical connection and the second electrical connection describe an electrical connection, but they are not the same electrical connection unless the context otherwise clearly indicates otherwise. Similarly, first and second joints, first bends and second bends, and first and second bends are also included.

[0060] The terms “or” and “and / or” as used herein are interpreted as inclusive, or mean any one or any combination thereof. Therefore, “A, B, or C” or “A, B, and / or C” means any of the following: A; B; C; A and B; A and C; B and C; A, B, and C. Exceptions to this definition occur only when combinations of elements, functions, steps, or operations are inherently mutually exclusive in some way.

[0061] It will be understood that when an element, such as a layer, region, or substrate, is referred to as being "on" another element or extending "on" another element, the element may be directly on or directly extending onto the other element, or intermediate elements may exist. Conversely, when an element is referred to as being "directly on" another element or "directly extending onto" another element, no intermediate elements exist. It will also be understood that when an element is referred to as being "connected" or "attached" to another element, it may be directly connected or attached to the other element, or intermediate elements may exist. Conversely, when an element is referred to as being "directly connected" or "directly attached" to another element, no intermediate elements exist.

[0062] Relative terms such as “below,” “above,” “upper,” “lower,” “horizontal,” or “vertical” may be used herein to describe the relationship between one element, layer, or region and another element, layer, or region illustrated in the figures. It will be understood that these terms are intended to cover different device orientations other than those depicted in the figures. In this invention, “vertical,” “horizontal,” and “parallel” are defined as including cases within ±10% of their standard definitions. For example, vertical typically refers to an angle of 90 degrees relative to a reference line, but in this invention, vertical refers to cases including those within 80 to 100 degrees.

[0063] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. When used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that, when used herein, the terms “comprising,” “including,” “containing,” and / or “comprising” designate the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof.

[0064] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will also be understood that terms used herein shall be interpreted as having the meaning consistent with their meaning in the context of this specification and the relevant field, and shall not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0065] Unless otherwise explicitly stated, comparative quantitative terms (such as "above" and "below") are intended to encompass the concept of equality. As an example, "above" can mean not only "greater than" in a mathematical sense, but also "equal to".

[0066] In some embodiments, this invention discloses an LED filament that, as a light-emitting element, has a certain degree of flexibility, allowing it to be bent into a desired shape and configured in a lighting fixture. For example, the LED filament disclosed in this invention can be applied to LED bulbs or other LED filament lamps.

[0067] Please see Figure 1 and Figure 2 , Figure 1 The diagram shown is a partial perspective view of an LED filament in one embodiment of the present invention. Figure 2 Displayed as Figure 1 A cross-sectional view at position 2-2. (See diagram below.) Figure 1 and Figure 2 As shown, the LED filament 10 includes at least one LED chip (at least two LED chips 101, 102 are shown in the figure), at least one electrode (at least two electrodes 103, 104 are shown in the figure), a light conversion layer 105 (in a specific embodiment, the light conversion layer may be referred to as an adhesive layer or a silicone layer), and a conductive portion 106. Adjacent LED chips are interconnected via the conductive portion 106 to achieve electrical conduction, and the LED chips and electrodes (103, 104) are interconnected via the conductive portion 106 to achieve electrical conduction. The light conversion layer 105 covers at least a portion of the LED chips (101, 102), the conductive portion 106, and the electrodes (103, 104).

[0068] In this LED filament 10, light is emitted after its electrodes (103, 104) are connected to a power source (voltage source or current source), such as... Figure 1 and Figure 2 As shown, the cross-section of the LED filament 10 is set to a rectangle, but the cross-sectional shape of the LED filament 10 is not limited to this. It can also be a triangle, a circle, an ellipse, a polygon, or a rhombus, or even an irregular shape such as a square with chamfered or rounded corners.

[0069] In one embodiment, the light conversion layer 105 comprises silicone and phosphor, and may further comprise heat-dissipating particles. The heat-dissipating particles are, for example, oxide nanoparticles, including but not limited to nanoparticles formed from materials such as aluminum oxide (Al₂O₃), silicon oxide (SiO₂), zirconium oxide (ZrO₂), titanium oxide (TiO₂), calcium oxide (CaO), strontium oxide (SrO), and barium oxide (BaO).

[0070] In one embodiment, such as Figure 1 and Figure 2 As shown, the light conversion layer 105 includes a top layer 1051 and a carrier layer 1052 (in certain embodiments, the carrier layer may be referred to as a base layer). The top layer 1051 encapsulates the LED chip (101, 102), the conductive portion 106, and the electrodes (103, 104), and exposes at least a portion of two electrodes (103, 104), or in other words, exposes at least a portion of two electrodes (103, 104). The carrier layer 1052 includes an upper surface and a lower surface opposite to the upper surface. The upper surface of the carrier layer 1052 is closer to the top layer 1051 than the lower surface of the carrier layer. In some examples, the top layer 1051 and the carrier layer 1052 may each be at least one layered structure, preferably one of a phosphor adhesive with high plasticity (relative to a phosphor film), a phosphor film with low plasticity, or a transparent layer, or any combination of the aforementioned at least two layered structures. The phosphor adhesive or phosphor film comprises the following components: silicone-modified polyimide and / or adhesive. The phosphor adhesive / phosphor film may also include phosphor, inorganic oxide nanoparticles (or heat dissipation particles). The transparent layer may be composed of a light-transmitting resin (e.g., silicone, polyimide) or a combination thereof. The adhesive may be, but is not limited to, silicone. It should be understood that the above-described structure and composition of the top layer 1051 and the carrier layer 1052 are merely examples. In other examples, the top layer 1051 and the carrier layer 1052 may have the same or different structures and / or compositions to create a variety of LED filaments with different properties.

[0071] In one embodiment, in the height direction of the LED filament 10 ( Figure 1 and Figure 2(In the Z-axis direction), the height of the top layer 1051 is greater than the height of the carrier layer 1052. The top layer 1051 includes opposing upper and lower surfaces, and the upper surface of the carrier layer 1052 is in contact with at least a portion of the lower surface of the top layer 1051. The LED chips (101, 102) include opposing upper and lower surfaces. The upper surface of the LED chips (101, 102) is closer to the upper surface of the top layer 1051 than the lower surface of the LED chips (101, 102). The distance from the lower surface of the LED chips (101, 102) to the lower surface of the carrier layer 1052 is less than the distance from the lower surface of the LED chips (101, 102) to the upper surface of the top layer 1051. That is, the path of heat conduction from the LED chips (101, 102) to the outer surface of the carrier layer 1052 is relatively short, so heat is not easy to accumulate, and the LED filament 10 can obtain a better heat dissipation effect.

[0072] To increase the bonding strength between the top layer 1051 and the support layer 1052, in some embodiments, the contact area between the top layer 1051 and the support layer 1052, or their shapes, or their interfaces can be adjusted so that the bonding surface between them is not a single plane. In one example, at least a portion of the contact surfaces of the top layer 1051 and the support layer 1052 are formed as mutually bonding surfaces, and the bonding can be interlocking, for example, the interlocking surfaces can be wavy, serrated, etc. In another example, the upper surface of the support layer 1052 can also be set with a larger roughness to enhance the bonding strength with the top layer 1051. In yet another example, multiple through holes can be provided on the support layer 1052 so that the top layer 1051 can penetrate into the support layer 1052 to increase the contact area between them, and further, after penetrating the through holes, the top layer 1051 can extend to the other side of the support layer 1052, in which case the top layer 1051 can sandwich the support layer 1052 from the top and bottom, so that the two present a riveted relationship.

[0073] It should be noted that, as Figure 1 and Figure 2 The top layer 1051 shown is configured on the upper surface of the carrier layer 1052, which is only one structural example of the light conversion layer 105. The top layer 1051 and the carrier layer 1052 can also be configured in other ways. For example, the carrier layer 1052 can be formed in the direction of the LED filament length (i.e., Figure 1 and Figure 2 In one embodiment, an accommodating channel (in the Y direction) is formed, with the LED chip disposed at the bottom of the accommodating channel, and a top layer 1051 filling the accommodating channel. Alternatively, a carrier layer 1052 can be configured to enclose the six surfaces of the LED chip (i.e., the LED chip is enclosed in the central portion of the carrier layer 1052), with the top layer 1051 enclosing the carrier layer 1052. This invention does not limit the structure of the light conversion layer.

[0074] The LED chip is encapsulated in a light conversion layer. The LED filament can include a single LED chip, two LED chips, or multiple LED chips, i.e., three or more LED chips. The shape of the LED chip can be, but is not limited to, elongated. Elongated chips have fewer electrodes, reducing the chance of blocking the light emitted by the LED. Furthermore, a layer of conductive transparent indium tin oxide (ITO) can be deposited on the surface of the LED chip. This ITO layer helps to evenly distribute the current and improve the luminous efficiency of the LED chip. Specifically, the aspect ratio of the LED chip can be set from 2:1 to 10:1, for example, but not limited to 14×28 or 10×20. Alternatively, a high-power LED chip can be used, operating at a low current. This way, the LED chip maintains sufficient brightness while keeping the current density low, and the LED chip does not generate a large amount of heat, resulting in good overall luminous efficiency.

[0075] The LED chip itself can be made of sapphire substrate or transparent substrate that allows light to pass through. In this way, the substrate of the LED chip itself will not block the light emitted by the LED chip, meaning that the LED chip itself can emit light from its periphery.

[0076] The electrical relationships between the individual LED chips, such as Figure 1 and Figure 2 As shown, adjacent LED chips (101, 102) are electrically connected to each other through conductive parts 106, so as to... Figure 1 and Figure 2 For example, the LED chips (101, 102) can be electrically connected in series, but the method of electrical connection is not limited to this. They can also be electrically connected in parallel first and then in series, for example, but not limited to, connecting every two LED chips (101, 102) in parallel first, and then connecting every two parallel chips (101, 102) in series. They can also be electrically connected in series first and then in parallel, etc.

[0077] The electrodes correspond to the LED chip configuration and are electrically connected to the LED chip. For example... Figure 1 and Figure 2 In the illustrated embodiment, the LED chips (101, 102) are arranged in a straight line, and adjacent LED chips (101, 102) are electrically connected in series. Two electrodes (103, 104) are disposed at both ends of the LED filament to connect to the two ends of the LED chips (101, 102) respectively. A portion of each electrode (103, 104) is exposed outside the light conversion layer 105. The arrangement of the electrodes (103, 104) and the LED chips (101, 102) is not limited to this.

[0078] Of course, in this invention, the number of chip columns along the width direction of the LED filament can also be multiple, that is, at least two columns of chips can be arranged side by side or staggered on the LED filament.

[0079] Please see Figures 3 to 7 The figures shown are schematic diagrams illustrating the LED chip and electrode configurations in different embodiments of the present invention.

[0080] like Figure 3 In the embodiment shown, adjacent LED chips (101, 102) are still electrically connected in series, but the multiple LED chips (101, 102) are arranged in two columns on the LED filament 10 (i.e., adjacent LED chips (101, 102) are arranged in the width direction of the LED filament 10). Figure 3 The LED chips (101, 102) are staggered along the X-axis direction. Alternatively, they can be described as two rows of LED chips (101, 102) spaced apart, or as two rows of LED chips (101, 102) located in different columns. The corresponding LED chips (101, 102) do not completely overlap when viewed from the filament side, or the overlapping area is less than or equal to 100%. Furthermore, these two rows of LED chips (101, 102) are arranged along the length of the LED filament 10. Figure 3 The LED chips are arranged along the Y-axis. Adjacent LED chips (101, 102) are connected by conductive parts 106. Figure 3 In this design, two electrodes (103, 104) are positioned at both ends of the LED filament to be connected to both ends of the LED chip (101, 102) via conductive portions 106, with portions of each electrode (103, 104) exposed outside the light conversion layer 105. For example... Figure 3 In the illustrated embodiment, the LED chips (101, 102) have a length dimension wc along the length direction of the LED filament 10. The ratio of the sum of the lengths wc of all LED chips (101, 102) (i.e., Σwc) to the length of the LED filament 10 is greater than 0.5, 0.6, 0.65, or 0.7 to ensure the arrangement density of LED chips (101, 102) along the length direction of the LED filament 10, thereby increasing the total luminous flux and effectively reducing the graininess of the emitted light. Furthermore, since adjacent LED chips (101, 102) are staggered along the width direction of the LED filament 10, they can have better flexibility while maintaining the same spacing between them. Conversely, if the ratio of the sum of the lengths of all LED chips (101, 102) to the length of the LED filament 10 is greater than 0.5, 0.6, 0.65 or 0.7, and the LED chips (101, 102) are arranged in a single row, the LED filament 10 may have poor bendability and cannot be bent normally, thus limiting the shape of the LED filament 10.

[0081] like Figure 4In the illustrated embodiment, multiple LED chips (101, 102) are configured in an inverted "U" or "n" shape, and adjacent LED chips (101, 102) are electrically connected in series. Electrodes (103, 104) are disposed at the open end of the inverted "U" or "n" shape and are electrically connected to the corresponding LED chip (101, 102). From the appearance, both electrodes (103, 104) are disposed at one end of the LED filament (this end corresponds to the open end of the inverted "U" or "n" shape) and are partially exposed outside the light conversion layer 105.

[0082] In some embodiments, such as Figure 5 and Figure 6 As shown, multiple LED chips (101, 102) can also be arranged in at least two roughly parallel columns. Figure 5 and Figure 6 (Taking two columns as an example), each column of LED chips is electrically connected in series. The two electrodes (103, 104) are configured at the two ends of at least two columns of LED chips and are connected to each column of LED chips respectively, forming an electrical connection method of first series and then parallel. Figure 5 and Figure 6 This example uses two electrodes, but it is not limited to this; three or four electrodes can also be used, for example... Figure 5 or Figure 6 One of the electrodes (103, 104) is replaced by two separate secondary electrodes, each a positive terminal of the power supply, while the remaining electrode serves as a common ground terminal; or... Figure 5 or Figure 6 Both electrodes are replaced with two secondary electrodes to suit different applications.

[0083] In such Figure 6 In the illustrated embodiment, the LED chip closest to the LED filament end in one column is denoted as LED chip a1. Then, the LED chips in one column from one end of the LED filament to the other are sequentially denoted as a1, a2, a3, ..., a1. m (m is an integer); Let LED chip b1 be the one closest to the LED filament in the other column. Then, let the LED chips in the other column from one end of the LED filament to the other end be labeled as b1, b2, b3, ..., b n (n is an integer); along the length direction of the LED filament 10 (e.g.) Figure 6 LED chip b in the Y-axis direction n Located in LED chip a n With LED chip a n+1Between (for example, in the length direction, LED chip b1 is located between LED chip a1 and LED chip a2, and LED chip b2 is located between LED chip a2 and LED chip a3), and LED chip b n The projection of the LED filament along its width direction and the LED chip a n In the width direction of LED filament 10 ( Figure 6 The projections of the LED chips in one column and those in another column (in the X-axis direction) do not overlap. That is, the projections of the LED chips in one column and those in another column do not overlap in the width direction of the LED filament 10. Figure 6 The LED chips are staggered along the X-axis. Of course, in some embodiments, the LED chips b... n The projection of the LED filament along its width direction and the LED chip a n In the width direction of LED filament 10 ( Figure 6 The projections along the X-axis have some overlap, but the overlap is less than 100%. It should be understood that... Figure 6 The example uses two columns with the same number of LED chips. In actual applications, the number of LED chips in the two columns is not necessarily the same or different. That is, the maximum value of n can be greater than, less than, or equal to the maximum value of m. It is only necessary to make the LED chips in the column with fewer chips interleaved with the corresponding number of LED chips in the other column, or at least partially interleaved. The remaining LED chips in the column with more chips continue to be arranged along the length of the LED filament.

[0084] In some embodiments, LED chip b n The projection of the LED filament along its width direction and the LED chip a n Along the length of the LED filament 10 ( Figure 6 The projections along the Y-axis do not have overlapping regions.

[0085] In some embodiments, LED chip b n The projection of the LED filament along its width direction and the LED chip a n Along the length of the LED filament 10 ( Figure 6 The projections (in the Y-axis direction) overlap at least partially.

[0086] With the same number of LED chips, the longer the LED filament, the larger the spacing between adjacent LED chips. When the LED filament is lit, the more noticeable the light spots (or graininess) are to the naked eye, severely impacting the user's viewing comfort. Furthermore, with the same filament length, the more LED chips there are, the smaller the spacing between adjacent LED chips, causing the heat generated by adjacent LED chips to interfere with each other. To ensure excellent light output and heat dissipation performance of the LED filament, such as... Figure 6 In the illustrated embodiment, two rows of LED chips are connected in parallel, and the LED chips in one row and the LED chips in the other row are staggered in the width direction of the LED filament. In this way, the light emitted by one row of LED chips can supplement the light spot produced by the other row of LED chips, thereby improving the luminous effect of the LED filament. In addition, compared with LED filaments of the same length and the same number of LED chips, the spacing between adjacent LED chips in each row is larger, so the heat generated by adjacent LED chips is less likely to affect each other, and the junction temperature of the LED filament is reduced.

[0087] Furthermore, such as Figure 7 As shown, in Figure 6 Based on the LED chip arrangement shown, the LED chips in one column are aligned with the LED chips in another column along the length of the LED filament 10 (e.g., ...). Figure 7 The projection of the LED chip (in the Y-axis direction) has an overlapping area, which allows for a reduction in the width of the LED filament, making it closer to that of a traditional tungsten filament lamp. This also results in a more aesthetically pleasing appearance when the LED filament is bent or wound. Specifically, LED chip a m LED chip b n Each has multiple sides, and along the length of the LED filament 10, the LED chip b n One side is located on LED chip a n With LED chip a n+1 Between the same side (e.g., Figure 7 One side of the LED chip b1 11 Located on one side of LED chip a1 11 Side a of LED chip a2 21 Between). In some embodiments, side a 11 With side a 21 relatively.

[0088] In some embodiments, along the length direction of the LED filament 10 (e.g.) Figure 7 In the Y-axis direction, LED chip a m LED chip b n The widths of the LED filaments are wa and wb, respectively. The length ww of the LED filament 10 is not less than the sum of waa and wbb, i.e., ww ≥ waa + wbb. Furthermore, the length ww of the LED filament 10 is not less than the sum of the sum of waa and wbb, i.e., ww ≥ Σwaa + Σwbb.

[0089] In some embodiments, in the width direction of the LED filament 10 (e.g.) Figure 7 In the X-axis direction, LED chip a m LED chip b nThe widths of the LED filament 10 are wa and wb, respectively. The width w of the LED filament 10 is not less than the sum of wa and wb, that is, w≥wa+wb. Furthermore, the width w of the LED filament 10 is not less than the sum of the sum of wa and wb, that is, w≥Σwa+Σwb.

[0090] like Figures 1 to 7 As shown in any embodiment, adjacent LED chips (101, 102) are interconnected via conductive parts 106 to achieve electrical conduction. Similarly, LED chips (101, 102) and electrodes (103, 104) are interconnected via conductive parts 106 to achieve electrical conduction. The conductive part 106 can be a conductive metal wire, a conductive film, or a conductive metal sheet. In subsequent embodiments, the conductive part 106 is described as a conductive metal wire, but this should not be construed as a limitation of the invention. Taking the conductive part 106 as a conductive metal wire as an example, the diameter of the conductive metal wire can be configured to be 0.5 mil to 1.5 mil. It can be a single metal wire, such as gold, silver, aluminum, or copper wire, or it can be an alloy wire. The alloy wire is made from at least two metals in a certain proportion, such as a gold-silver alloy wire.

[0091] The connection between the conductive part 106 and the LED chip (101, 102) and the connection between the conductive part 106 and the electrode (103, 104) are fixed connections. Specifically, the LED chips (101, 102) are provided with a first electrical connection portion and a second electrical connection portion (the electrical connection portion may be, for example, a solder joint or a pad). The first end of the conductive portion 106 is fixed to the second electrical connection portion of the LED chip 101, and the second end is fixed to the first electrical connection portion of another LED chip 102 adjacent to the LED chip 101. In this way, electrical or signal communication can be realized between adjacent LED chips (101, 102). The electrodes (103, 104) are also provided with electrical connection portions (the electrical connection portion may be, for example, a solder joint or a pad). The first end and the second end of the conductive portion 106 are respectively fixed to the electrodes (103, 104) and the electrical connection portions of the LED chips (101, 102) adjacent to the electrodes (103, 104). In this way, electrical or signal communication can be realized between the electrodes (103, 104) and the LED chips (101, 102).

[0092] In some embodiments, conductive parts are formed by wire bonding, also known as wire bonding. The wire bonding process can be used to bond and fix the wire to the corresponding electrical connection part to form the conductive parts in the LED filament through methods such as thermo-press bonding, ultrasonic bonding, and thermo-acoustic bonding. These bonding methods all require applying pressure to the wire.

[0093] Specifically, the wire bonding process can be completed using a wire bonding machine (or wire bonding machine). The wire bonding machine is equipped with a ceramic nozzle, which has a through hole (or wire hole) through which the wire can pass. A torch is used to heat the wire to form a ball shape in front of the ceramic nozzle. The ceramic nozzle, carrying the ball shape, descends to the corresponding electrical connection part that needs to be connected (e.g., the second electrical connection part of an LED chip) and applies pressure to the wire to form a first bonding part (or first solder point), thus completing the fixation of the first end of the conductive part. Then, the ceramic nozzle moves towards another electrical connection part that needs to be connected (e.g., the first electrical connection part of another LED chip adjacent to an LED chip) with a certain movement trajectory. In this process, a wire arc of the conductive part is also formed, and by descending to the electrical connection part and applying pressure to the wire, a second bonding part (or second solder point) is formed, thus completing the fixation of the second end of the conductive part. Afterward, the ceramic nozzle slides laterally to cut the wire, forming a bonded conductive part. In other words, during the wire bonding process, the wire is located between the LED chip or electrode and the ceramic nozzle. Pressure is applied to the wire through the ceramic nozzle, which further bonds the wire to the LED chip (or electrode).

[0094] It should be noted that "wire" refers to the material used to form the conductive part, which can be, for example, a conductive metal wire, and the formed conductive part is also a conductive metal wire. Furthermore, in this invention, the area formed by joining the wire and the electrical connection part is called a joint. To distinguish between different joints, the area formed by the joining of the wire's starting point and the electrical connection part during the formation of a conductive part is called the first joint (or first solder joint), and the area formed by the joining of the wire's ending point and the electrical connection part is called the second joint (or second solder joint). The end of the conductive part connected to the first joint is defined as the first end of the conductive part, and the end of the conductive part connected to the second joint is defined as the second end of the conductive part.

[0095] Please see Figure 8 The diagram shows a schematic representation of the conductive portion in one embodiment of the present invention. Figure 8 The illustration shows an example where the conductive part 106 is connected to two adjacent LED chips 101 and 102; it can also be connected between the LED chip and the electrode. After the conductive part 106 is formed, its connection quality is mainly determined by... Figure 8 The three positions B, C, and D determine the connection. In other words, the reason for unreliable connection of conductive part 106 is generally due to a quality problem at any of these three positions. Specifically, position B is the connection between the first end of conductive part 106 and the first joint 1061, position D is the connection between the second end of conductive part 106 and the second joint 1062, and position C is the line segment of conductive part 106 (i.e., the area between positions B and D).

[0096] In conventional related technologies, the conductive part 106 is formed using a BSOB (Bond Stick on Ball) wire bonding process. Figure 8 For example, as shown, a spherical solder needs to be pre-placed on the first electrical connection portion of the LED chip 102. During bonding, the first bonding portion 1061 is formed first, followed by the second bonding portion 1062. The second bonding portion 1062 is formed by pressing the wire onto the pre-placed spherical solder, thereby forming a bonding portion 1062. Figure 9 (The diagram shown is a structural schematic of the second joint in the related art.) The second joint 1062 has a mesh surface, and both the second joint 1062 and the mesh surface are processed as follows... Figure 10A and Figure 10B (That Figure 10A This is a schematic diagram of the structure of a ceramic capillary in the prior art. Figure 10B The ceramic nozzle 20 (shown as a cross-sectional schematic diagram of a ceramic nozzle in the prior art) is formed after applying pressure to the wire, resulting in a surface with distinct height variations, specifically raised and recessed structures. The first height difference G1 between the highest point of the raised section and the lowest point of the recessed section is between 5 and 15 μm, i.e., 5 ≤ G1 ≤ 15 μm; the height difference between the raised and recessed structures in region D can also be referred to as G1, and 5 ≤ G1 ≤ 15 μm. The ceramic nozzle 20 includes a surface 201 and a wire hole 202 for the wire (which can be configured as a conductive metal wire) to pass through, wherein the surface 201 is the side in contact with the wire. Figure 10A and Figure 10B Surface 201 is configured with a mesh structure, which is further configured with an array of grooves. The grooves are quite deep, resulting in a high surface roughness for surface 201. During the wire bonding process, this leaves deep indentations on the wire surface, resembling... Figure 9 As shown, the surface of the second bonding portion 1062 has a raised structure and a recessed structure corresponding to the grid structure of the ceramic nozzle 20. The depth of the recessed structure is relatively large, so the overall thickness of the area where the recessed structure is located is relatively small. The thinner part is the weak area, which is more prone to breakage than other areas, that is, it is more prone to breakage at position D, causing problems such as open circuit or short circuit due to connection with other circuits, thereby causing abnormalities in the LED filament, such as some or all of the LED chips not lighting up or abnormal brightness. In this embodiment, the first electrical connection portion of the LED chip 102 is configured as the negative electrode (also called the cathode) of the LED chip 102, and the second electrical connection portion is configured as the positive electrode (also called the anode) of the LED chip 102. That is, the first bonding portion 1061 is formed on the positive electrode of the LED chip 101, and the second bonding portion 1062 is formed on the negative electrode of the LED chip 102.

[0097] To address the issue of breakage at position D, in some embodiments of the present invention, ceramic nozzles with different surface structures are provided so that the surface of the second joint has a corresponding structure. Please refer to... Figure 11A and Figure 11B , Figure 11A The diagram shown is a structural schematic of a ceramic nozzle according to an embodiment of the present invention. Figure 11B Its corresponding cross-sectional view, compared to Figure 10A and Figure 10B The ceramic nozzle structure shown. Figure 11A and Figure 11B The surface 201 of the ceramic nozzle 20 is also configured with a mesh structure, but Figure 11A and Figure 11B The grid structure is configured as an array of raised structures, and these raised structures are tiny protrusions; that is, the height difference between the raised and non-raised parts of the raised structure is small, at least less than [missing information]. Figure 10A and 10B The depth of the groove structure shown is further specified, and the edges of each protrusion in the raised structure are set as smooth arcs. The ceramic nozzle 20 passes through... Figure 11A or Figure 11B The surface 201 of the protruding structure in the middle applies pressure to the second end of the conductive part, thereby forming a corresponding structure on the surface of the second end, as shown in the figure. Figure 12 As shown, this is a schematic diagram of the structure of the second joint in one embodiment of the present invention, corresponding to... Figure 11A The surface 201 of the ceramic nozzle 20 has a tiny raised structure, and the surface of the second joint 1062 is a tiny concave surface. The height difference between the highest point of the raised structure and the lowest point of the concave structure is called the second height difference G2. The range of G2 is between 1 and 5 μm, that is, 1 ≤ G2 ≤ ​​5 μm. The highest point of the raised structure and the lowest point of the concave structure at position D can also be called the second height difference G2. The range of G2 is between 1 and 5 μm, that is, 1 ≤ G2 ≤ ​​5 μm. There is no particularly weak part at position D and the second joint 1062, which improves the problem of breakage at position D.

[0098] Please see Figure 13 The image shown is a schematic diagram of the ceramic nozzle structure in one embodiment of the present invention, compared to... Figure 10A The ceramic nozzle structure shown. Figure 13 The surface 201 of the ceramic tip 20 is configured with a frosted structure, which is a textured surface. This texture can be formed, for example, by fine raised and recessed structures. However, the height difference between these raised and recessed structures is small and insufficient to create a distinct mesh effect. The ceramic tip 20 applies pressure to the wire through the frosted surface 201, thereby forming a corresponding structure on the surface of the second joint 1062, as shown in the image. Figure 14As shown, this is a schematic diagram of the structure of the second joint in one embodiment of the present invention, corresponding to... Figure 13 The frosted structure of the surface 201 of the ceramic nozzle 20 and the frosted surface of the second joint 1062, with no obvious weak areas, greatly improves the problem of breakage at position D. Figure 14 As shown, through as Figure 13 The height difference between the second joint 1062 formed by the ceramic nozzle 20 and the highest point of the respective protruding structure and the lowest point of the concave structure formed at position D is called the third height difference G3. The range of G3 is 0 to 1 μm, that is, 0 ≤ G3 ≤ 1 μm.

[0099] Please see Figures 15A to 15D The diagram shows a ceramic nozzle with two different surface roughnesses in different embodiments of the present invention, compared to... Figure 10A The ceramic nozzle structure shown. Figures 15A to 15D The surface 201 of the ceramic nozzle is configured to include a first portion 2011 and a second portion 2012, wherein the second portion 2012 surrounds the first portion 2011 and together with the first portion 2011 constitutes the surface 201 of the ceramic nozzle. The first portion 2011 and the second portion 2012 have different roughnesses. Specifically, Figure 15A In the embodiment shown, the first part 2011 is configured as a grooved mesh structure, and the second part 2012 is configured as a frosted structure. There is a significant difference in surface roughness between the two parts (2011, 2012), with the surface roughness of the first part 2011 being much greater than that of the second part 2012. Figure 15B In the embodiment shown, the first part 2011 is configured as a raised mesh structure, and the second part 2012 is configured as a frosted structure. There is a significant difference in surface roughness between the two parts (2011, 2012), with the surface roughness of the first part 2011 being much greater than that of the second part 2012. Figure 15C In the embodiment shown, the first part 2011 is configured as a frosted structure, and the second part 2012 is configured as a grooved mesh structure. There is a significant difference in surface roughness between the two parts (2011, 2012), with the surface roughness of the first part 2011 being much smaller than that of the second part 2012. Figure 15D In the embodiment shown, the first part 2011 is configured as a frosted structure, and the second part 2012 is configured as a raised mesh structure. There is a significant difference in surface roughness between the two parts (2011, 2012), with the surface roughness of the first part 2011 being much smaller than that of the second part 2012.

[0100] In any embodiment of a ceramic nozzle that includes two surfaces with different roughness settings, for example... Figures 15A to 15DIn any embodiment, the ceramic nozzle, when applying pressure to the wire (conductive metal wire or conductive part) during wire bonding, can cause the surface of the corresponding wire to exhibit two different roughnesses. Of course, the surface roughness of the ceramic nozzle can also be set to one or more types, meaning the surface of the corresponding wire exhibits one or more roughnesses. Furthermore, setting a rough surface makes it easier to cut the wire and complete the wire bonding process compared to a smooth surface. Figure 16 As shown in the example, Figure 16 The diagram shown illustrates the structure of the second joint in one embodiment of the present invention, corresponding to, as follows: Figure 15B The surface 201 of the ceramic nozzle 20 and the surface of the second joint 1062 have two roughnesses, or in other words, the second joint 1062 and the surface at position D include at least two roughnesses, respectively corresponding to... Figure 15B The first part of the 2011 concave surface and Figure 15B The second part of 2012 was formed by applying pressure to the frosted surface, in which Figure 16 At position D in Figure 15, pressure is applied to form the first part 2011 in Figure 15. Figure 16 The second joint 1062 in the figure is formed by applying pressure to the second part 2012 in Figure 15. The second joint 1062, away from position D, is formed by cutting the wire by the first part 2011 or the second part 2012 through an outward wiping action. Its surface roughness is close to Figure 16 The surface roughness at position D can improve the problem of fracture at position D to some extent.

[0101] In other embodiments, the surface of the ceramic nozzle may also be configured with more than two different roughness regions, so that the surface of the joint formed by the pressure application also has more than two different roughness regions, which can also improve the problem of breakage at position D to some extent. In addition, the surfaces of the ceramic nozzle with different surface roughnesses can also be non-annularly distributed, and can be mutually independent block or strip distribution, or other forms of distribution, as long as there are obvious surfaces with two or more surface roughnesses on the surface of the ceramic nozzle where pressure is applied.

[0102] In some embodiments, the wire hole on the ceramic nozzle has at least two aperture sizes. The wire hole may include a frustum-shaped through-hole portion and a cylindrical through-hole portion connected to the smaller surface of the frustum-shaped through-hole, wherein the diameter of the larger surface of the frustum-shaped through-hole is larger than the diameter of the wire.

[0103] In the above embodiments, the problem of conductive part breakage can be improved by changing the surface structure of the second joint.

[0104] In other embodiments of the present invention, the conductive portion 106 is formed by a BWB (Ball Wire Bonding) bonding process, so as to... Figure 8 As shown in the example, similarly, a ball-shaped solder needs to be pre-placed on the first electrical connection portion of the LED chip 102. During bonding, the first bonding portion 1061 is formed first, followed by the second bonding portion 1062. The second bonding portion 1062 is formed by pressing down the ceramic nozzle to bond the wire to the ball-shaped solder pre-placed on the first electrical connection portion, and then continuing to solder another ball-shaped solder on it, thus forming a... Figure 17A The second joint 1062 shown (which is a structural schematic diagram of the second joint in one embodiment of the present invention) forms a three-layer structure in which the conductive part 106 is sandwiched between two welding materials; Figure 17B This is a corresponding cross-sectional schematic diagram. This design ensures that the second end of the conductive part is protected by solder balls, effectively preventing breakage at position D. Specifically, in this solution, firstly, a first spherical solder needs to be bonded to the corresponding position of the LED chip 102 and pressure is applied to form the required shape. Then, the conductive part 106 is bonded to the side of the first spherical solder away from the LED chip 102. Finally, the conductive part 106 is fixed to the LED chip 102 by a second spherical solder bonded to the side of the conductive part 106 away from the first spherical solder, ultimately forming a second bonding part 1062. The LED chip 102 is first bonded to the molten solder. During conduction, the current is first conducted from the conductive part 106 to the solder bonded to the LED chip 102 (i.e., the first spherical solder), and then to the LED chip 102.

[0105] In some embodiments, when the first and second spherical solders are bonded to the conductive portion 106, the projections of the first and second spherical solders on the LED chip 102 are both greater than the projections of the bonding positions of the conductive portion 106 with the first and second spherical solders on the LED chip 102. The first and second spherical solders enclose the conductive portion 106 and the bonding portions therebetween, and the first and second spherical solders are at least partially bonded. The spherical solders can completely enclose the bonding area of ​​the conductive portion 106, thereby increasing the strength of the bonding area of ​​the conductive portion 106 and preventing breakage.

[0106] In some embodiments, the projection of the bonding area between the conductive portion 106 and the ball solder on the LED chip is smaller than the projection of the first ball solder on the LED chip, and the projection of the first ball solder on the LED chip is smaller than the projection of the second ball solder on the LED chip. The second ball solder completely covers the bonding area between the first ball solder and the conductive portion 106 on the LED chip 102, and the second ball solder is at least partially bonded to the LED chip 102.

[0107] In some other embodiments of the present invention, the conductive portion 106 is formed by a BBOS (Bond Ball on Stitch) wire bonding process, so as to... Figure 8As shown in the example, during bonding, the first bonding portion 1061 is first formed. After moving the ceramic nozzle, it is pressed down to bond the wire to the first electrical connection portion of the LED chip 102, and then a solder ball is formed on it, thus forming a bonding structure as shown in the example. Figure 18A and 18B ( Figure 18A It is shown as a structural schematic diagram of the second joint portion in one embodiment of the present invention. Figure 18B For the corresponding Figure 18A The second bonding portion 1062 shown in the cross-sectional schematic diagram has a solder ball covering the second end of the conductive portion, which greatly improves the problem of breakage at position D of the conductive portion and improves the wire bonding efficiency. In this embodiment, the first electrical connection portion of the LED chip 102 is configured as the positive electrode (also called the anode) of the LED chip 102, and the second electrical connection portion is configured as the negative electrode (also called the cathode) of the LED chip 102. That is, the first bonding portion 1061 is formed on the negative electrode of the LED chip 101, and the second bonding portion 1062 is formed on the positive electrode of the LED chip 102. In this embodiment, the conductive part 106 is first bonded to the LED chip 102, and then a spherical solder is bonded to the side of the conductive part 106 away from the LED chip 102 to finally form a second bonding part 1062. The projected area of ​​the solder on the LED chip 102 is larger than the bonding area between the conductive part 106 and the LED chip 102, which can completely wrap the bonding area of ​​the conductive part 106 on the LED chip 102. That is, the conductive part 106 itself is bonded to the LED chip 102, and then it is also wrapped on the LED chip by the spherical solder. The fixation is improved by at least two fixation steps, and there are relatively few process steps.

[0108] Furthermore, in any of the above embodiments where pressure is applied to the wire using a ceramic nozzle to complete the wire bonding, if the supporting surface under the wire is uneven, such as a step under the wire, the area where pressure is applied will experience a significant shearing effect due to the lack of support underneath, making the wire extremely prone to breakage, as follows: Figure 19A and Figure 19B As shown, schematic diagrams of the shearing positions of the second end of the conductive part in different embodiments are displayed. The shearing position M is circled in the figure. When the bonding position is too close to the edge of the LED chip or electrode, the area below the wire under pressure will be at or near the edge of the LED chip or electrode. This edge usually has a height change. As a result, the bonding position of the second end of the conductive part will be sheared, which greatly increases the risk of breakage of the conductive part.

[0109] Therefore, in any of the above embodiments where pressure is applied to the wire using a ceramic nozzle to complete wire bonding, a second bonding portion can be further disposed on the LED chip (or electrode) and at a first preset distance from the edge of the LED chip (or electrode). In this embodiment, the edge of the LED chip (or electrode) refers to the edge corresponding to the side where the projection of the LED chip (or electrode) and the conductive portion in the height direction of the LED filament intersects. The first preset distance between the second bonding portion and the edge of the LED chip (or electrode) means that during wire bonding, the location where pressure is applied to the wire has a flat bearing surface, which eliminates shearing effects and greatly reduces the risk of wire breakage. Figure 18A and 18B For example, the second bonding portion 1062 and the edge of the LED chip 102 have a first preset distance wd. The bonding surface between the second bonding portion 1062 and the conductive portion 106 formed on the positive electrode of the LED chip 102 gradually slopes or rises from the near end to the far end (that is, from the positive electrode of the LED chip 102 towards the conductive portion 106), thus forming a bonding slope or bonding surface, or forming a bonding portion that gradually thickens from the near end to the far end, thereby eliminating the... Figure 19A and Figure 19B The edge shown exhibits abrupt changes in height; the bonding surface between the second bonding portion 1062 of the positive electrode of the LED chip 102 and the conductive portion 106 forms a complete bearing surface for the second bonding portion 1062; compared to Figure 19B Its second joint 1062 has been moved forward a certain distance toward the interior of the LED chip, thereby Figure 18A The area beneath the wire is a complete bearing surface, and no shearing occurs at position D, further reducing the risk of wire breakage.

[0110] It should be understood that, Figure 18A and 18B The first preset distance is represented by the distance between the edge of the second joint 1062 and the edge of the LED chip (or electrode). For example, the first preset distance between the second joint and the edge can be configured as any value between 20µm and 60µm, preferably any value between 30µm and 50µm, such as 30µm, 35µm, 40µm, 45µm, or 50µm. Of course, in other embodiments, the first preset distance can also be represented by the distance between the center point of the second joint 1062 and the edge of the LED chip (or electrode), as long as... Figure 18A and 18BBased on the above, the length corresponding to the radius of the second joint can be superimposed. For example, the first preset distance between the second joint and the first joint can be configured as any value from 20um+R1 to 60um+R1, preferably any value from 30um+R1 to 50um+R1, such as 30um+R1, 35um+R1, 40um+R1, 45um+R1, or 50um+R1. Wherein, R1 represents the radius of the second joint.

[0111] In some embodiments, the second bonding portion is formed during wire bonding by continuously pressing down on the wire after the ceramic nozzle descends to the electrical connection portion on the LED chip (or electrode) to be connected. Therefore, in some embodiments, the second bonding portion can also be located on the LED chip (or electrode) and at a first preset distance from the edge of the LED chip (or electrode) by configuring the electrical connection portion on the LED chip (or electrode) to have a second preset distance from the edge of the LED chip (or electrode). The first and second preset distances are not necessarily related in magnitude; the second preset distance can be equal to, greater than, or less than the first preset distance. In some examples, the second preset distance is represented by the distance between the edge of the electrical connection portion and the edge of the LED chip (or electrode). For example, the second preset distance can be configured as any value between 20µm and 60µm, preferably any value between 30µm and 50µm, such as 30µm, 35µm, 40µm, 45µm, or 50µm. In other examples, the second preset distance can be represented by the distance between the center of the electrical connection and the edge of the LED chip (or electrode). For example, the second preset distance can be configured as any value from 20um+R2 to 60um+R2, preferably any value from 30um+R2 to 50um+R2, such as 30um+R2, 35um+R2, 40um+R2, 45um+R2, or 50um+R2. Here, R2 represents the radius of the electrical connection. For example, the radius R2 of the electrical connection can be configured as any value from 25um to 35um, such as 25um, 30um, or 35um.

[0112] The above Figures 9 to 19B The description mainly analyzes and solves the example of the conductor 106 breaking at position D. However, the conductor 106 may also break at position B. The break at position B will still cause the conductor 106 to malfunction, which in turn will cause the LED filament to malfunction.

[0113] In some related technologies, the conductive part is usually made of gold-plated silver conductive metal wire. This type of conductive metal wire is inexpensive, but due to the differences in properties between gold and silver, their fluidity during melting and the time required for re-solidification differ. During the formation of the first bonding part, abnormalities occur in the burning ball of the ignition rod, resulting in severe damage at position B, as shown in... Figure 20 As shown, this is a schematic diagram of the structure of the first joint in the related art of the present invention. In the area circled in the dashed circle, the wire is severely misaligned vertically, and breakage is very likely to occur in the misaligned area. Therefore, in some embodiments of the present invention, the conductive part is configured as a conductive metal wire made of silver. This conductive metal wire is cheaper than gold-plated silver, and because a single-property metal is used, the sintering process is normal during the formation of the first joint, and position B is undamaged, as shown in the diagram. Figure 21 As shown, it is a structural schematic diagram of the first joint in one embodiment of the present invention, with the wire extending smoothly up and down without misalignment.

[0114] Furthermore, such as Figure 8 As shown, the conductive part 106 extends between the first joint 1061 and the second joint 1062 and has a certain arc. Please refer to... Figure 22A and Figure 22B The images shown are partial schematic diagrams of the first end of the corresponding conductive portion from different perspectives in the prior art of the invention. The first bonding portion 1061 is formed on the surface of the LED chip 101, and the conductive portion 106 extends upward along the first bonding portion 1061, forming an angle of approximately 90 degrees with the surface where the first bonding portion 1061 is located. That is, the conductive portion 106 extends approximately along the height direction of the LED chip. Figure 22A and Figure 22B The conductive portion 106 extends from the first joint portion 1061 in the Z-axis direction. The conductive portion 106 also has a bending portion 1063 (also called a bending point), through which the extending direction of the conductive portion 106 bends from the height direction of the LED chip to the length direction of the LED chip. Figure 22A and Figure 22B (Y-axis direction in the middle).

[0115] In such Figure 8 , Figure 22A ,as well as Figure 22B The diagram shows the arc structure of the conductive portion 106 in the prior art. The starting orientation of the bend 1063 corresponds to the height direction of the LED chip (i.e., the direction towards the first joint portion 1061 or...). Figure 22A The bending direction is along the Z-axis (or the length direction of the corresponding LED chip). Figure 22A(in the Y-axis direction). This arc structure makes the position where the conductive part 106 and the first joint part 1061 are joined (i.e., position B) constitute the fulcrum of the bending part 1063. The force on the bending part 1063 will eventually be transmitted to position B. Thus, in the production or use of LED filament, when vibration, bending, or falling occurs, the bending part 1063 will be subjected to force, resulting in breakage at position B and causing abnormality of the LED filament.

[0116] Therefore, in some embodiments of the present invention, the arc structure of the conductive portion is structurally designed to improve the problem of breakage at position B. In one embodiment, the conductive portion includes at least two bends, such that the conductive portion extends in at least two different planes. For example, the conductive portion is provided with a first bend and a second bend, such that the conductive portion has at least a portion perpendicular to the LED chip (or along the height direction of the LED chip) and a portion parallel to the LED chip.

[0117] Please see Figure 23A and Figure 23B The figure shows a partial schematic diagram of the first end of the corresponding conductive portion in one embodiment of the present invention. As shown, the conductive portion 106 extends upward from the first bonding portion 1061 (which can be understood as forming an angle of approximately 90 degrees with the surface where the first bonding portion 1061 is located) and bends along the width direction of the LED chip to form a first bent portion 1064. The conductive portion 106 continues to extend and bends along the length direction of the LED chip to form a second bent portion 1065. That is to say, the conductive portion 106 has a first bent portion 1064 and a second bent portion 1065. The conductive portion extends upward from the first bonding portion 1061, passes through the first bent portion 1064 so that the conductive portion 106 extends towards the width direction of the LED chip, and passes through the second bent portion 1065 so that the conductive portion 106 extends towards the length direction of the LED chip. The upward extension of the conductive portion 106 from the first bonding portion 1061 can also be understood as the conductive portion 106 extending approximately along the height direction or vertical direction of the LED chip. Figure 23A and Figure 23B The conductive part 106 extends from the first joint 1061 in the Z-axis direction, and the extension of the conductive part 106 toward the width direction of the LED chip can also be understood as extending approximately along the width direction of the LED chip.

[0118] Compared to Figure 22A and Figure 22B The structure shown, Figure 23A and Figure 23B The conductive portion 106 shown herein, wherein the area between the first bend 1064 and the second bend 1065 can serve as a buffer area to cushion or distribute the force on the conductive portion 106, thereby preventing or reducing deformation of the conductive portion 106 and preventing breakage at position B. Specifically, Figure 23A and Figure 23BThe first bending portion 1064 and the second bending portion 1065 are provided. The extension direction of the conductive portion 106 extending perpendicular to the chip surface can be adjusted to the chip width direction first, and then the extension direction of the conductive portion 106 can be adjusted to the chip length direction through the second bending portion 1065. This does not affect the connection between the conductive portion 106 and the adjacent LED chips, nor does it affect the connection between the LED chip and the electrode. However, this structure causes the conductive portion 106 to form an arc-shaped outward swing, which corresponds to a buffer area. The force on the conductive portion 106 is released in the buffer area (or it can be said that it is divided into forces in different directions in the buffer area). It cannot be conducted to the first bending portion 1064, or only a very small part will be conducted to the first bending portion 1064 and the subsequent B position. The easily broken area is not under obvious force, thus making the conductive portion 106 less prone to breakage.

[0119] Furthermore, the height of the first bend 1064 (i.e., the height of the first bend 106 from the surface of the LED chip) D1 is configured to be any value between 80um and 120um. The length of the buffer region (i.e., the length between the first bend 1064 and the second bend 1065) D2 is configured to be any value between 100um and 120um.

[0120] In some embodiments, please refer to Figure 24A and Figure 24B The images show partial structural diagrams of an LED filament from different perspectives in one embodiment of the present invention. The conductive portion 106 has a first portion 1066, a second portion 1067 connecting the first portion 1066, and a third portion 1068 connecting the second portion 1067. The first portion 1066 is located in the LED filament height or thickness direction (e.g., ...). Figure 24A and Figure 24B When the Z-axis direction of the LED is projected onto the corresponding LED chip (or electrode), it falls completely within the range defined by the LED chip (or electrode). Alternatively, it can be understood that the first part 1066 is within the length direction of the LED filament (e.g., Figure 24A and Figure 24BThe second part 1067, when projected onto the two adjacent LED chips (or one LED chip and one electrode) connected to the conductive part 106 in the LED filament length direction, is located between the two adjacent LED chips (or one LED chip and one electrode). Alternatively, it can be understood that the second part 1067 is located between the two adjacent LED chips (or one LED chip and one electrode) connected to it in the LED filament length direction, which is also between the opposite edge sections of the two adjacent LED chips (or one LED chip and one electrode). The third part 1068 corresponds to the second end of the conductive part 106 and is used to connect the LED chip (or electrode). When projected onto the corresponding LED chip (or electrode) in the LED filament height or thickness direction, it completely falls within the range defined by the LED chip (or electrode). Alternatively, it can be understood that the third part 1068 does not exceed the edge section of its corresponding LED chip (or electrode) in the LED filament length direction.

[0121] In some embodiments, the first portion 1066 corresponds to the first end of the conductive portion 106, one end of which is connected to the LED chip (or electrode), and the other end is connected to the second portion 1067, wherein the other end does not extend beyond the corresponding LED chip (or electrode) in the length direction of the LED filament. Further, the first portion 1066 includes, for example... Figure 23A and Figure 23B The first bend 1064 and the second bend 1065 are shown.

[0122] In some embodiments, the ratio of the length of the first portion 1066 to the distance from the connection point of the first portion 1066 to the LED chip to the edge section of the LED chip in the length direction (the projected length of the first portion 1066 in the height or thickness direction of the LED filament) is greater than 1.15, 1.2, 1.3 or 1.4, so as to reduce the risk of the connection point between the first portion 1066 and the LED chip breaking due to tensile force.

[0123] In some embodiments, the ratio of the length of the first portion 1066 to the distance from the connection point of the first portion 1066 to the LED chip to the edge section of the LED chip along its length direction (the projected length of the first portion 1066 in the height or thickness direction of the LED filament) is less than 2. If the first portion 1066 is too long, it will inevitably have a larger bending radius or occupy space in the height or thickness direction of the LED filament, both of which will have an adverse effect on the LED filament (for example, a larger bending radius may lead to greater internal stress in the first portion 1066, while occupying space in the height or thickness direction of the LED filament requires covering it with a thicker light conversion layer).

[0124] In some embodiments, the ratio of the length of the first portion 1066 to the projected length of the first portion 1066 in the height or thickness direction of the LED filament is greater than the ratio of the length of the second portion 1067 to the projected length of the second portion 1067 in the height or thickness direction of the LED filament. This can be expressed by the formula: L1 / T1 > L2 / T2, where L1 is the length of the first portion 1066, T1 is the projected length of the first portion 1066 in the height or thickness direction of the LED filament, L2 is the length of the second portion 1067, and T2 is the projected length of the second portion 1067 in the height or thickness direction of the LED filament. Typically, when the LED filament is bent, the connection point between the first portion 1066 and the LED chip (or electrode) is more susceptible to breakage under tensile force. Therefore, by setting L1 / T1 > L2 / T2, the risk of breakage at the connection point between the first portion 1066 and the LED chip (or electrode) can be further reduced.

[0125] The length of the third part 1068 is the same as the length configured in any embodiment of the first part 1066. Please refer to the description of the first part 1066. The third part 1068 will not be described in detail here.

[0126] When the LED filament bends, the second portion 1067 of the conductive part 106 is the main bending area (the part where the LED chip itself is located is not easily bent). To reduce the risk of the second portion 1067 breaking when the LED filament bends, the length of the second portion 1067 is configured to be greater than the distance between its two adjacent LED chips (or an LED chip and an electrode). In other words, the length of the second portion 1067 is configured to be greater than the projected length of the second portion 1067 in the height or thickness direction of the LED filament. This design provides the conductive part 106 with more leeway when the LED filament 100 bends, preventing breakage.

[0127] In some embodiments, the ratio of the length of the second portion 1067 to the distance between its two adjacent LED chips (or an LED chip and an electrode) (or the projected length of the second portion 1067 in the height or thickness direction of the LED filament) is greater than 1.1, 1.2, 1.3 or 1.4, so that the second portion 1067 has sufficient length to deform with bending when the LED filament is bent, so as to prevent the second portion 1067 from being pulled apart.

[0128] In some embodiments, the ratio of the length of the second portion 1067 to the distance between its two adjacent LED chips (or an LED chip and an electrode) (or the projected length of the second portion 1067 in the height or thickness direction of the LED filament) is less than 2. If the length of the second portion 1067 is configured to be too long, it will be detrimental to the coverage effect of the light conversion layer, and may even result in the conductive portion 106 being exposed in the light conversion layer. In addition, an excessively long second portion 1067 also leads to material waste.

[0129] In some embodiments, the second portion 1067 has at least two inflection points such that the conductive portion 106 is generally wavy (“w”-shaped or “m”-shaped), as shown below. Figure 24A As shown, the second part 1067 has a first inflection point 1067a and a second inflection point 1067b. Using the surface where the LED chip connects to the conductive part 106 as a reference plane, the first inflection point 1067a is located in the height region below the first joint 1061 or the second joint 1062, and the second inflection point 1067b is located in the height region above the first joint 1061 or the second joint 1062. This causes the second part 1067, after connecting to the first part 1066, to first extend with a downward trend to the first inflection point 1067a, then turn upward at the first inflection point 1067a to extend to the second inflection point 1067b, and finally turn downward at the second inflection point 1067b to connect to the third part 1068. This results in a wavy shape (inverted "W" shape or "M" shape) from the conductive part 106, further giving the conductive part 106 a large elongation and reducing its breakage. (Invention)

[0130] In one embodiment, please refer to Figure 25 The figure shows a schematic diagram of the LED chips being tilted in one embodiment of the present invention. As shown, two adjacent LED chips are tilted relative to the length direction of the LED filament, and the long sides of the two connected LED chips remain parallel, that is, they are tilted at the same angle. This reduces the arc span of the conductive portion between the chips by 1 / 3, increases the extensibility of the conductive portion, and reduces the risk of breakage of the conductive portion between the chips. Furthermore, the tilt angle of the LED chips can be configured to any value between 10° and 20°, where the tilt angle is the angle between the long side of the LED chip and the length direction of the filament, i.e., ... Figure 25 Angle α in the equation.

[0131] The conductive portion used to connect the LED chip and the electrode is prone to breakage at position C, for example, in embodiments with multiple rows of LED chips and different distances between the LED chips in two rows near the electrode. Figure 6 and Figure 7 As shown, two rows of LED chips are arranged alternately, LED chip b nThe distance to electrode 104 is significantly smaller than that to LED chip a. m The distance from electrode 104 is such that it is directly connected to LED chip a m The arc span of the conductive portion 106 between electrode 104 and the electrode 104 is significantly larger than that directly connected to LED chip b. n The arc span of the conductive portion 106 between the electrode 104 and the electrode 104, thus, compared to the LED chip b n The conductive portion 106 between the electrode 104 and the LED chip a m The conductive portion 106 between the electrode 104 and the conductor has a small arc elongation rate and is prone to breakage.

[0132] Therefore, in some embodiments, by connecting at least two LED chips located near the electrode and needing to be connected to the electrode using a shared solder joint, the length of the conductive portion can be reduced, thereby decreasing the likelihood of breakage of the conductive portion between the chip and the electrode. Please refer to... Figure 26 The diagram shows a schematic of the connection between an electrode and an LED chip in one embodiment of the present invention, wherein the LED chip a m LED chip b is the chip closest to electrode 104 in the first column of chips. n The chip closest to electrode 104 in the second row of chips has a conductive portion 106 with its two ends connected to LED chip a. m The first electrical connection point with LED chip b n The first electrical connection point so that the LED chip a m With LED chip b n Common electrode (common cathode or common anode, if the first electrical connection is configured as cathode, then the common electrode is common cathode; if the first electrical connection is configured as anode, then the common electrode is common anode), that is, the LED chip b n The first electrical connection point serves as a common electrode connection point, and is connected between the common electrode connection point and the electrode 104 via another conductive part 106. In this configuration, with LED chip a... m The arc span required for the connected conductive part 106 is greatly reduced (almost by half), which can reduce the possibility of chip-to-electrode conductive part breakage.

[0133] In addition, other methods can be used to improve the problem of breakage in the conductive parts used to connect the LED chip and the electrode. In some embodiments, the LED chip and its corresponding electrode are connected by at least two conductive parts, each conductive part having at least two bends to form at least two bending regions, and the bending regions of the at least two conductive parts are staggered in the height or thickness direction of the LED filament. In some examples, the at least two conductive parts can be configured as the structure of the conductive parts described in any of the foregoing embodiments, as can be seen in the foregoing description of the conductive parts. Figures 22A to 24B According to the description, it is only necessary to adjust the connection positions of at least two conductive parts accordingly.

[0134] Please see Figures 27A to 27C The figures show schematic diagrams of the structure of an LED chip and its corresponding electrode connected by two conductive parts from different perspectives in one embodiment of the present invention. For ease of explanation, the two conductive parts are referred to as the first conductive part 106' and the second conductive part 106" respectively. The first end of the first conductive part 106' is connected to the LED chip 101, and the second end is connected to the electrode 104. The first end of the second conductive part 106" is connected to the electrode 104, and the second end is connected to the LED chip 101. The first conductive part 106' has a first inflection point 1067a' and a second inflection point 1067b'. The first inflection point 1067a' corresponds to forming a first bent region with an upward opening (which can also be understood as the first conductive part 106' first extending with a downward trend, then turning at the first inflection point 1067a' to extend with an upward trend to form the first bent region). The second inflection point 1067b' corresponds to forming a second bent region with a downward opening (which can also be understood as the first conductive part 106' turning at the first inflection point 1067a' to extend with an upward trend, then turning at the second inflection point 1067b' to extend with a downward trend to form the second bent region). The second conductive part 106" has a first inflection point 1067a" and a second inflection point 1067b". The first inflection point 1067a" corresponds to the formation of a first bent region with an upward opening (or it can be understood that the second conductive part 106" first extends in a downward trend and then turns to extend in an upward trend after the first inflection point 1067a" to form the first bent region). The second inflection point 1067b" corresponds to the formation of a second bent region with a downward opening (or it can be understood that the second conductive part 106" extends in an upward trend after turning at the first inflection point 1067a" and then turns to extend in a downward trend after turning at the second inflection point 1067b" to form the second bent region). Since the first conductive portion 106' and the second conductive portion 106" are connected between the LED chip 101 and the electrode 104 with opposite upward and downward trends, after connection, the first bending area formed by the first inflection point 1067a' of the first conductive portion 106' is vertically staggered with the second bending area formed by the second inflection point 1067b' of the second conductive portion 106"; and the second bending area formed by the second inflection point 1067b' of the first conductive portion 106' is vertically staggered with the first bending area formed by the first inflection point 1067a' of the second conductive portion 106". It should be understood that this vertical staggering does not necessarily require the two bending areas to be absolutely aligned in the height or thickness direction of the LED filament; it is sufficient that the overall bending trends of the two bending areas are staggered.

[0135] The location and manner in which the inflection points of the first conductive portion 106' and the second conductive portion 106" are formed can be referred to the aforementioned [reference needed]. Figure 24A and Figure 24BThe description will not be repeated here. The connection method and arc structure between the first end of the first conductive part 106' and the LED chip 101 can adopt the aforementioned method for 22A to Figure 23B In any embodiment of the structure described above, the connection method between the first end of the second conductive part 106" and the electrode 104, as well as the arc structure, can adopt the aforementioned method for 22A to Figure 23B The structures described in any of the embodiments are not repeated here. Furthermore, the first conductive portion 106' and the second conductive portion 106" may also have more inflection points, for example... Figure 27B The second conductive part 106" also has a third inflection point 1067c", and the second conductive part 106" continues to be connected to the LED chip 101 via the third inflection point 1067c".

[0136] In any embodiment where at least two conductive parts are connected between the LED chip and its corresponding electrode, the bending areas of the at least two conductive parts are staggered in the height or thickness direction of the LED filament, thereby forming a complementary relationship and achieving force distribution and shared bearing to avoid breakage of the conductive parts near the electrode and between the chip.

[0137] like Figure 27C At least two conductive parts, the conductive part closest to the edge of the LED filament (i.e. Figure 27B The length D3 of the first conductive part 106' from the edge of the electrode is configured to be greater than or equal to 30 μm; preferably greater than or equal to 50 μm.

[0138] like Figure 27A As shown, viewed from the length direction of the LED filament, the first inflection point 1067a' of the first conductive portion 106' leads to the corresponding junction on the chip ( Figure 27A The height difference h1 (i.e., the inflection point distance) of the junction of the LED chip 101 is configured to be 40um ± 5%. The distance from the second inflection point 1067b' of the first conductive part 106' to the junction on the corresponding chip ( Figure 27A The height difference h2 (i.e., the distance between the two inflection points) of the junction of the LED chip 21 is configured to be 75um ± 5%. From the perspective of the LED filament height or thickness, the vertical distance from the first inflection point 1067a' of the first conductive portion 106' to the corresponding chip surface is any value ranging from 30um to 100um below the height of the chip surface (the surface connected to the first conductive portion 106'). Figure 27A The vertical distance from the second inflection point 1067b' of the first conductive part 106' to the corresponding chip surface is any value ranging from 100um to 160um above the chip surface (the surface connected to the first conductive part 106'). Figure 27A (The height of the two inflection points in the middle).

[0139] like Figure 27B As shown, looking along the length of the LED filament, the horizontal distance S1 (i.e., the distance from the first inflection point 1067a" of the second conductive portion 106" to the joint on the corresponding electrode 104 is configured to be 40um ± 5%. The horizontal distance S2 (i.e., the distance from the second inflection point 1067b" of the second conductive portion 106" to the joint on the corresponding electrode 104 is configured to be 75um ± 5%. The horizontal distance S3 (i.e., the distance from the third inflection point 1067c" of the second conductive portion 106" to the joint on the corresponding electrode 104 is configured to be 90um ± 5%. Looking at the height or thickness of the LED filament, the distance from the first inflection point 1067a" of the second conductive portion 106" to the joint on the corresponding chip (… Figure 27B The vertical distance from the surface of the LED chip 101 is any value ranging from 30µm to 100µm below the height of the chip surface (the surface connected to the second conductive part 106") Figure 27B The second inflection point 1067b" of the second conductive part 106" is connected to the corresponding chip (1 inflection point height). Figure 27B The vertical distance from the surface of the LED chip 21 is any value ranging from 80µm to 120µm above the chip surface (the surface connected to the second conductive part 106") Figure 27B (The height of the two inflection points in the middle).

[0140] It should be understood that for an LED filament, there may be situations where one electrode needs to be connected to multiple LED chips through conductive parts, and different LED chips are connected to different electrodes. This invention does not necessarily require that the connection between the LED chip and its corresponding electrode adopt the same structure. Those skilled in the art can use combinations of the methods provided above, for example... Figure 27A and Figure 27B As shown, near electrode 104, the LED chip 101, which is farther from electrode 104, is connected to it using a dual-wire connection, while the LED chip 102, which is closer to electrode 104, is connected to it using a single-wire connection. Of course, this can also be... Figure 27A and Figure 27B The method shown, which involves setting at least two conductive parts, is used to connect two adjacent LED chips, but the present invention does not limit this.

[0141] This invention also discloses a method for connecting chips to chips and a method for connecting chips to electrodes. These methods are used to form the structure corresponding to the LED filament disclosed in any embodiment of this invention. Please refer to the foregoing description of... Figures 1 to 27C The relevant descriptions are not elaborated here.

[0142] This invention also discloses an LED filament lamp, which is configured with an LED filament as disclosed in any embodiment of this invention. For the structure of the LED filament, please refer to the foregoing description. Figures 1 to 27C The relevant descriptions will not be repeated here. Specifically, LED filaments can be bent or deformed in a certain way in LED filament lamps; an example of an LED filament lamp is a bulb lamp.

[0143] This invention also discloses an LED bulb, which includes a bulb housing and a bulb head connected to the bulb housing. The bulb housing contains at least one cantilever, a core post, and at least one LED filament. The core post includes a vertical rod. Each cantilever includes a first end and a second end, the first end of which is connected to the vertical rod, and the second end of which is connected to the LED filament. The structure of the LED filament can be configured as the LED filament disclosed in any embodiment of this invention; please refer to the foregoing description of... Figures 1 to 27C The relevant descriptions will not be repeated here. The LED bulb can also have other structures. For example, the LED bulb includes a bulb housing, a bulb head connected to the bulb housing, and a core post and LED filament are provided inside the bulb housing.

[0144] See details Figure 28 As shown, Figure 28 This is shown as an embodiment of the present invention. Figures 1 to 27AA schematic diagram of the LED bulb lamp. The LED bulb lamp 1 includes a lamp head 4 and a lamp housing 5 connected to the lamp head 4. The lamp housing 5 and the lamp head 4 form a sealed cavity, which is provided with at least one cantilever 31, a core post 3, and at least one LED filament 10. The core post 3 is connected to the lamp head 4 and extends a vertical rod 30 in a direction away from the lamp head 4. At least one cantilever 31 is also provided on the core post 3. Each cantilever 31 includes a first end and a second end. The first end of the cantilever is connected to the vertical rod 30 (or the core post 3), and the second end of the cantilever 31 is connected to the LED filament 10. In some other embodiments, the cantilever can also be referred to as a conductive support. The LED filament 10 has electrodes 103 and 104 at its ends. One electrode is connected to the cantilever 31, and the other electrode is connected to the support rod 30 (or core post 3). The LED filament 10 includes a light conversion layer 105, at least one LED chip (101, 102), at least one electrode (103, 104), and a conductive part 106. The light conversion layer 105 includes a top layer 1051 and a carrier layer 1052. The top layer 105 includes opposing upper and lower surfaces, the carrier layer 1052 includes opposing upper and lower surfaces, the chip (101, 102) includes opposing upper and lower surfaces, and the upper surface of the carrier layer 1052 is connected to at least one LED chip (101, 102). A portion of the LED chip (101, 102) is in contact with the lower surface of the top layer 1051. The upper surface of the LED chip (101, 102) is closer to the upper surface of the top layer 1051 than the lower surface of the LED chip. The distance from the lower surface of the LED chip (101, 102) to the lower surface of the carrier layer is less than the distance from the lower surface of the LED chip to the upper surface of the top layer. Adjacent LED chips are connected and conductive through the conductive portion. The light conversion layer covers at least a portion of the LED chip (101, 102), the conductive portion 106, and the electrode. The conductive portion includes at least two bends and extends in at least two different planes.

[0145] The LED filament 10 located inside the LED bulb has LED chips (101, 102) arranged alternately along the width direction of the filament 1. The ratio of the sum of the lengths of the LED chips (101, 102) along the length of the filament to the length of the filament is greater than or equal to 0.5. The LED chips are connected in series or in parallel, or in a series-then-parallel or parallel-then-series configuration, or a combination of both. The conductive portion 106 in the LED filament 1 includes a first bend and a second bend. The first bend extends along the length direction of the LED chip, and the second bend extends along the width direction of the LED chip. A buffer region is formed between the first bend and the second bend. This buffer region is an arc-shaped structure or other structure with multiple bends, and its length is 100µm to 120µm.

[0146] The LED filament 10 located inside the LED bulb includes a conductive portion 106 comprising a first portion, a second portion connecting to the first portion, and a third portion connecting to the second portion. The first portion, when projected onto the mating LED chip (or electrode) in the thickness direction of the LED filament, falls entirely within the area defined by the LED chip (or electrode). The second portion, when projected onto two adjacent LED chips (or connected LED chips and electrodes) connected by the conductive portion in the length direction of the LED filament, is located between the two adjacent LED chips (or LED chips and electrodes). The third portion, corresponding to the second end of the conductive portion, is used to connect to the LED chip (or electrode) and, when projected onto the mating LED chip (or electrode) in the thickness direction of the LED filament, falls entirely within the area defined by the LED chip (or electrode).

[0147] The LED filament 10 located inside the LED bulb includes an LED chip (101, 102) with a first electrical connection portion and a second electrical connection portion. A conductive portion 106 forms a first bonding portion on the first electrical connection portion and a second bonding portion is formed on the first bonding portion by a solder ball. The second bonding portion has a preset distance from the edge of the LED chip, and in some embodiments, the surface of the second bonding portion has at least two roughnesses.

[0148] In some embodiments, the LED filament 10 located inside the LED bulb includes an LED chip (10, 102) and electrodes (103, 104) connected by at least two conductive portions 106.

[0149] In some embodiments, the LED filament 10 located inside the LED bulb has a conductive portion 106 comprising a first conductive portion and a second conductive portion, the first conductive portion and the second conductive portion having a first inflection point and a second inflection point; the first inflection point of the first conductive portion corresponds to forming an upward-facing first bending region, and the second inflection point corresponds to forming a downward-facing second bending region; the first inflection point of the second conductive portion corresponds to forming a downward-facing first bending region, and the second inflection point corresponds to forming an upward-facing second bending region; that is, the first conductive portion and the second conductive portion are connected between the LED chip and the electrode with opposite upward and downward trends.

[0150] In some embodiments, an LED filament 10 with a three-dimensional structure is provided inside the LED bulb 1.

[0151] In some embodiments, the LED bulb 1 has at least two intertwined LED filaments 10 inside.

[0152] refer to Figure 28 Further elaborating on the preceding description, the LED bulb 1 has a lamp housing 5 with a central axis, meaning the housing 5 is symmetrically designed about the central axis. In some embodiments, this central axis is also the central axis of the lamp head 4, which is connected to the housing 5, and a core post 3 located inside the lamp housing 5 is also provided along the central axis of the lamp housing 5;

[0153] At least one cantilever 31 is also provided inside the lamp housing 5. The cantilever 31 can also be called a conductive support 31. In one embodiment, it includes two conductive supports 31, and the two conductive supports have opposite polarities.

[0154] A driving circuit is disposed inside the lamp holder 4, and the driving circuit is electrically connected to the two conductive supports 31; and a flexible LED filament is disposed inside the lamp housing and electrically connected to the two conductive supports, the flexible LED filament comprising:

[0155] The LED segment includes a plurality of LED chips (101, 102) connected in series and a light conversion layer 105 enclosing the plurality of LED chips; a first conductive electrode 103 is located at one of the two ends of the LED segment and electrically connected to the plurality of LED chips (101, 102) and one of the two conductive supports 31, wherein a portion of the first conductive electrode 103 is enclosed by the light conversion layer 105.

[0156] like Figure 1-3 As shown, a second conductive electrode 104 is provided at the other end of both ends of the LED segment, that is, the second conductive electrode 104 is fixed and electrically connected to another of the plurality of LED chips and the two conductive supports 31, wherein a part of the second conductive electrode 104 is wrapped by the light conversion layer 105; a conductive part 106 is provided between the plurality of LED chips, the conductive part 106 connects and conducts to adjacent LED chips or LED chips and electrodes, that is, the conductive part 106 electrically connected between the plurality of LED chips;

[0157] Each of the multiple LED chips has an electrical connection portion, and one end of the conductive portion is connected to the electrical connection portion, such as... Figure 23A and 23BAs shown, the conductive portion 106 has a first bending portion 1064 and a second bending portion 1065. The conductive portion extends from the electrical connection portion along a first direction of the LED chip (101, 102), extends through the first bending portion 1064 into a second direction of the LED chip, and extends through the second bending portion 1065 into a third direction of the LED chip. The first direction, second direction, and third direction are different directions. The first direction is the height direction of the LED chip, the second direction is the width direction of the LED chip, and the third direction is the length direction of the LED chip. The distance between the first bending portion 1064 and the surface of the LED chip is between 80 μm and 120 μm, and the distance between the first bending portion 1064 and the second bending portion 1065 is between 100 μm and 120 μm.

[0158] like Figure 18A and 18B As shown, the LED filament also includes a first solder layer, which is made of soldering material (such as solder paste, solder balls, etc.). The end of the conductive part 106 is located between the electrical connection part of the LED chip 102 and the first solder layer. The projected area of ​​the first solder layer 1062 on the electrical connection part of the LED chip 102 is greater than the projected area of ​​the bonding region between the conductive part 106 and the electrical connection part of the LED chip 102.

[0159] like Figure 18B As shown, the end of the conductive part 106 (or its end point), the electrical connection part on the LED chip 102 and the first solder layer together form a connection part 1062. The connection part 1062 has a mesh surface, and multiple protrusions and multiple indentations are alternately arranged on the mesh surface.

[0160] like Figure 17A and 17B As shown, the LED filament also includes a second solder layer, which is made of solder material (such as solder paste, solder balls, etc.), and the end of the conductive part 106 is located between the first solder layer and the second solder layer.

[0161] Each of the projected area of ​​the first solder layer on the electrical connection portion of the LED chip 102 and the projected area of ​​the second solder layer on the electrical connection portion of the LED chip 102 is greater than the projected area of ​​the bonding region between the conductive portion and the first solder layer and the second solder layer on the electrical connection portion of the LED chip 102.

[0162] The projected area of ​​the bonding region between the conductive part 106 and the electrical connection part of the LED chip 102 is smaller than the projected area of ​​the first solder layer, and the projected area of ​​the first solder layer is smaller than the projected area of ​​the second solder layer.

[0163] like Figure 7 As shown, the plurality of LED chips (101, 102) also includes a first row of LED chips and a second row of LED chips. The first row of LED chips and the second row of LED chips are connected in parallel. The LED chips in the first row of LED chips are connected in series. The LED chips in the second row of LED chips are connected in series. The first row of LED chips and the second row of LED chips are arranged alternately along the width direction of the LED filament.

[0164] like Figure 27A , 27B As shown in 27C, the LED filament further includes a first conductive portion 106' and a second conductive portion 106" electrically connected between the LED chip 101 and the first conductive electrode 104; wherein one end of the first conductive portion 106' is connected to the LED chip 101, and the other end of the first conductive portion 106' is connected to the first conductive electrode 104; one end of the second conductive portion 106" is connected to the first conductive electrode 104, and the other end of the second conductive portion 106" is connected to the LED chip 101; wherein the first conductive portion 106' first extends downward and then upward with the first bending point 1067a' of the first conductive portion as the first turning point of the first conductive portion, and then extends upward and then downward with the second bending point 1067b' of the first conductive portion as the second turning point of the first conductive portion; the second conductive portion 106" first extends upward and then downward with the first bending point 1067b" of the second conductive portion as the first turning point of the second conductive portion, and then extends downward and then upward with the second bending point 1067a" of the second conductive portion as the second turning point of the second conductive portion.

[0165] It should be noted that the above-described features of the present invention can be arranged and combined in any way to improve LED lights, and the above embodiments are described by way of example only. The present invention is not limited thereto, and many modifications are possible without departing from the spirit of the invention and the scope defined by the appended claims.

[0166] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. An LED filament lamp, characterized in that, include: A lamp housing with a central axis; The lamp holder is connected to the lamp housing; A core column is disposed inside the lamp housing along the central axis of the lamp housing; Two conductive supports are disposed inside the lamp housing, and the two conductive supports have opposite polarities; A drive circuit is installed inside the lamp holder and electrically connected to the two conductive brackets. as well as The flexible LED filament is disposed inside the lamp housing and electrically connected to the two conductive supports. The flexible LED filament includes an LED segment, which includes multiple LED chips connected in series and a light conversion layer that wraps the multiple LED chips. A first conductive electrode is disposed at one of the two ends of the LED segment and electrically connected to the plurality of LED chips and one of the two conductive supports, wherein a portion of the first conductive electrode is wrapped by the light conversion layer; A second conductive electrode is disposed at the other end of both ends of the LED segment and electrically connected to the plurality of LED chips and another of the two conductive supports, wherein a portion of the second conductive electrode is wrapped by the light conversion layer; and Conductive portions electrically connected between the plurality of LED chips; Among the plurality of LED chips, one LED chip has an electrical connection portion, one end of the conductive portion is connected to the electrical connection portion, the conductive portion has a first bending portion and a second bending portion, the conductive portion extends from the electrical connection portion along a first direction of the LED chip, extends through the first bending portion to a second direction of the LED chip, and extends through the second bending portion to a third direction of the LED chip, wherein the first direction, the second direction and the third direction are different directions.

2. The LED filament lamp according to claim 1, characterized in that: The first direction is the height direction of the LED chip, the second direction is the width direction of the LED chip, and the third direction is the length direction of the LED chip.

3. The filament lamp according to claim 1, characterized in that: The distance between the first bent portion and the surface of the LED chip is between 80 μm and 120 μm, and the distance between the first bent portion and the second bent portion is between 100 μm and 120 μm.

4. The LED filament lamp according to claim 1, characterized in that: The LED filament further includes a first solder layer, which is made of welding material, and the end of the conductive part is located between the electrical connection part of the LED chip and the first solder layer.

5. The LED filament lamp according to claim 4, characterized in that: The projected area of ​​the first solder layer on the electrical connection portion of the LED chip is greater than the projected area of ​​the bonding region between the conductive portion and the electrical connection portion of the LED chip.

6. The LED filament lamp according to claim 4, characterized in that: The end of the conductive part, the electrical connection part of the LED chip, and the first solder layer together form a connection part, the connection part having a mesh surface, and multiple protrusions and multiple indentations are alternately arranged on the mesh surface.

7. The LED filament lamp according to claim 4, characterized in that: The LED filament includes a second solder layer made of solder material, and the end of the conductive part is located between the first solder layer and the second solder layer.

8. The LED filament lamp according to claim 7, characterized in that: Each of the projected area of ​​the first solder layer on the electrical connection portion of the LED chip and the projected area of ​​the second solder layer on the electrical connection portion of the LED chip is greater than the projected area of ​​the bonding region between the conductive portion and the first solder layer and the second solder layer on the electrical connection portion of the LED chip.

9. The LED filament lamp according to claim 7, characterized in that: The projected area of ​​the bonding region between the conductive part and the electrical connection part of the LED chip is smaller than the projected area of ​​the first solder layer, and the projected area of ​​the first solder layer is smaller than the projected area of ​​the second solder layer.

10. The LED filament lamp according to claim 1, characterized in that: The plurality of LED chips also includes a first row of LED chips and a second row of LED chips. The first row of LED chips and the second row of LED chips are connected in parallel. The LED chips in the first row of LED chips are connected in series. The LED chips in the second row of LED chips are connected in series. The first row of LED chips and the second row of LED chips are arranged alternately along the width direction of the LED filament.

11. The LED filament lamp according to claim 1, characterized in that: The LED filament further includes a first conductive portion and a second conductive portion electrically connected between the LED chip and the first conductive electrode; wherein one end of the first conductive portion is connected to the LED chip, the other end of the first conductive portion is connected to the first conductive electrode, one end of the second conductive portion is connected to the first conductive electrode, and the other end of the second conductive portion is connected to the LED chip; wherein the first conductive portion first extends downward and then upward with a first bending point as a first turning point, and then extends upward and then downward with a second bending point as a second turning point; the second conductive portion first extends upward and then downward with a first bending point as a first turning point, and then extends downward and then upward with a second bending point as a second turning point.

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