Multilayer board-type chip embedded circuit board

By stacking conductive modules and filling them with heat-dissipating material under the circuit board, the heat dissipation and signal transmission problems of the circuit board in the inverter are solved, achieving stable operation and efficient heat dissipation, and adapting to the usage scenarios of the inverter.

CN223515101UActive Publication Date: 2025-11-04ZF FRIEDRICHSHAFEN AG
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Patent Information

Application Number
CN202423005043.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-05
Publication Date
2025-11-04
Estimated Expiration
2034-12-05

AI Technical Summary

Technical Problem

In vehicle inverters, as integration increases, the heat generated on the circuit board becomes concentrated and signal transmission becomes unstable. Effective heat dissipation and ensuring stable electrical signal transmission are key issues.

Method used

Multiple sets of first conductive modules are stacked under the prefabricated circuit board to form a signal enhancement layer and heat dissipation structure. Auxiliary heat dissipation material is used to fill the heat dissipation cavity, and a cooling device is used to achieve rapid heat dissipation. The signal transmission capability is enhanced by the multi-layer conductive modules.

Benefits of technology

It achieves stable operation and signal transmission of the circuit board, enhances mechanical strength, adapts to the high current operating requirements of the inverter, and extends service life.

✦ Generated by Eureka AI based on patent content.
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Abstract

The utility model relates to the technical field of automobile parts, and provides a multilayer board-type chip embedded circuit board, which comprises a prefabricated circuit board, the chip packaging unit is embedded in the prefabricated circuit board; and the plurality of groups of first conductive modules are stacked below the prefabricated circuit board, the plurality of groups of first conductive modules are provided with slotted holes for exposing the chip packaging unit, a heat dissipation cavity is formed between the back surface of the chip packaging unit and the slotted holes, and the heat dissipation cavity is filled with an auxiliary heat dissipation material in contact with the chip packaging unit and the plurality of groups of first conductive modules. According to the utility model, the plurality of groups of first conductive modules are stacked below the prefabricated circuit board embedded with the chip packaging unit, so that the signal transmission capability can be greatly enhanced, the stable operation of the circuit board is ensured, and the stable transmission of electric signals is realized; and heat generated in the working process of the chip packaging unit and the first conductive module is quickly taken away through the auxiliary heat dissipation material filled in the heat dissipation cavity, so that effective heat dissipation is realized.
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