Camera module

Abstract

The utility model relates to a camera module. The camera module includes: a lens barrel in which at least one lens is disposed; a housing configured to support the lens barrel; a fixing pin protruding from the housing and extending in the optical axis direction; a sensor plate having first and second surfaces facing each other and a pin insertion hole into which the fixing pin is inserted; and a welding portion provided in the pin insertion hole, protruding from the first surface and the second surface of the sensor plate, and fixing the fixing pin.

Description

Technical Field

[0001] This disclosure relates to a camera module and a method for manufacturing a camera module. Background Technology

[0002] Autonomous and driverless vehicles include higher-performance electronic cameras. Emerging and established electronics component companies are anticipating an increasing number of new camera developments. Development is accelerating for wide field-of-view (WFoV) cameras with a field of view of 180 degrees or greater and narrow field-of-view (NFoV) cameras with a field of view of 52 degrees or less to provide peripheral perception from the front. Furthermore, as camera performance advances, high-resolution (5M to 12M) sensors and lenses with various viewing angles are being developed for improved recognition.

[0003] When manufacturing camera modules, active alignment, the process of placing the lens onto the image sensor, can be used. During active alignment, it may be desirable to precisely adjust the lens's focus so that it is accurately aligned with the image sensor. Therefore, resin adhesives such as epoxy resin can be applied to fix the lens housing and sensor plate. However, the resin adhesive shrinks or expands during the curing process, and defocusing deviations may occur, causing manufacturing defects.

[0004] The above information is presented as background information and is intended to aid in understanding this disclosure. No determination or assertion is made regarding whether any of the above content constitutes an application of prior art to this disclosure. Utility Model Content

[0005] This summary is provided to present the selection of ideas in a simplified form, while these ideas are further described in the following detailed description. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to help determine the scope of the claimed subject matter.

[0006] In one or more general aspects, the camera module includes: a lens barrel, in which at least one lens is disposed; a housing configured to support the lens barrel; a retaining pin protruding from the housing and extending in the optical axis direction; a sensor plate having a first surface and a second surface opposite to each other and a pin insertion hole into which the retaining pin is inserted; and a welding portion disposed in the pin insertion hole, protruding from the first surface and the second surface of the sensor plate, and securing the retaining pin.

[0007] The pin insertion hole can be a through hole.

[0008] The welding section can be partially disposed on the first and second surfaces of the sensor plate.

[0009] The welded portion can be disposed on the first and second surfaces to cover the edge of the pin insertion hole while surrounding the retaining pin.

[0010] The housing may have a bottom surface facing the first surface of the sensor plate, and a retaining pin may extend from the bottom surface toward the first surface of the sensor plate.

[0011] The retaining pin can be inserted from the first surface of the sensor plate into the pin insertion hole to protrude from the second surface of the sensor plate.

[0012] The portion of the welded part located in the pin insertion hole can be connected to another portion of the welded part located on the first or second surface.

[0013] The retaining pin may be made of metal.

[0014] The sensor board may include an image sensor mounted on a first surface.

[0015] The welding part may include thermosetting solder paste surrounding the retaining pin in the pin insertion hole.

[0016] The welding part may include laser-cured solder paste.

[0017] In another general aspect, a method of manufacturing a camera module having a housing configured to support a lens barrel and be fixed to a sensor plate is provided, the method comprising: applying solder in a pin insertion hole extending through a surface of the sensor plate; inserting a retaining pin of the housing into the pin insertion hole; performing active alignment while moving the housing; and curing the solder to secure the retaining pin in the pin insertion hole.

[0018] Curing can include irradiating the solder with a laser beam after performing active alignment.

[0019] Setting the solder can include applying solder paste into the pin insertion hole.

[0020] Applying solder paste may include applying solder paste to a portion of the surface of one of the sensor plates and to the pin insertion holes.

[0021] Inserting a retaining pin may include inserting the retaining pin when the pin insertion hole is filled with solder paste.

[0022] Setting up the solder may include placing a solder ring on the sensor board.

[0023] Curing can include laser welding of the weld ring.

[0024] In another general aspect, a camera module having a housing configured to support a lens barrel includes: a retaining pin configured to protrude from the housing and extend in the optical axis direction; a sensor plate having opposing surfaces and a pin insertion hole extending through the opposing surfaces; and a welding portion disposed in the pin insertion hole, configured to protrude from the opposing surface of the sensor plate and secure the retaining pin.

[0025] The welding part can be partially set on the opposite surface of the sensor plate, and the retaining pin can extend from the bottom surface of the housing toward one of the opposite surfaces of the sensor plate.

[0026] Other features and aspects will become apparent from the following detailed description, drawings, and claims. Attached Figure Description

[0027] Figure 1 This is a schematic cross-sectional view of a camera module according to an embodiment.

[0028] Figure 2 This is a flowchart explaining a method for manufacturing a camera module according to another embodiment.

[0029] Figure 3 This is a cross-sectional view of the camera module, shown to explain... Figure 2 The method for manufacturing the camera module is shown.

[0030] Figures 4 to 6 This is an enlarged cross-sectional view showing the pin insertion hole of the sensor plate, which is shown to explain... Figure 2 The method for manufacturing the camera module is shown.

[0031] Figure 7 This is a flowchart for explaining a method of manufacturing a camera module according to yet another embodiment.

[0032] Figure 8 This is a cross-sectional view of a camera module, shown to explain a method of manufacturing a camera module according to yet another embodiment.

[0033] Figure 9 and Figure 10 This is an enlarged cross-sectional view showing the pin insertion hole of the sensor plate, which is shown to explain... Figure 7 The method for manufacturing the camera module is shown.

[0034] Throughout the accompanying drawings and detailed embodiments, the same reference numerals denote the same elements unless otherwise described. For clarity, illustration, and convenience, the drawings may not be drawn to scale, and the relative dimensions, scale, and depiction of elements in the drawings may be exaggerated. Detailed Implementation

[0035] In the following text, although examples of this disclosure will be described in detail with reference to the accompanying drawings, it should be noted that the examples are not limited thereto.

[0036] The following detailed embodiments are provided to aid the reader in gaining a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will be apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein, but can be altered as will become apparent upon understanding this disclosure, except for operations that must occur in a specific order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.

[0037] The features described herein may be implemented in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein are provided merely to illustrate some of the many possible ways in which the methods, apparatuses, and / or systems described herein will be apparent upon understanding this disclosure.

[0038] Throughout the specification, when an element (such as a layer, region, or substrate) is described as being "on," "connected to," or "attached to" another element, it may be directly "on," directly "connected to," or directly "attached to" the other element, or there may be one or more other elements in between. Conversely, when an element is described as being "directly" "on," "directly connected to," or "directly attached to" another element, there are no other elements in between.

[0039] As used herein, the term “and / or” includes any one of the associated listed items and any combination of any two or more of the associated listed items; similarly, “at least one of…” includes any one of the associated listed items and any combination of any two or more of the associated listed items.

[0040] Although terms such as “first,” “second,” and “third” may be used in this document to describe various components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts are not limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, the first component, first assembly, first region, first layer, or first part mentioned in the examples described herein may also be referred to as a second component, second assembly, second region, second layer, or second part without departing from the teachings of the examples.

[0041] For ease of description, spatial relative terms such as “above,” “upper,” “below,” and “lower” are used herein to describe the relationship between one element and another, as shown in the accompanying drawings. In addition to the orientation depicted in the drawings, these spatial relative terms are intended to also include different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as “above” or “upper” relative to another element will consequently be “below” or “lower” relative to said other element. Therefore, the term “above” includes both upper and lower orientations, depending on the spatial orientation of the device. The device may also be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein will be interpreted accordingly.

[0042] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. The terms “a,” “an,” and “the” are intended to include the plural form as well, unless the context clearly indicates otherwise. The terms “comprising,” “including,” and “having” specify the presence of the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0043] The shapes shown in the accompanying drawings may vary due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include shape variations that occur during manufacturing.

[0044] In this article, it is important to note that the term “may” is used with respect to examples. For example, regarding what an example may include or implement, it means that there exists at least one example that includes or implements this feature, but not all examples are limited to this.

[0045] As will be apparent upon understanding this disclosure, the features of the examples described herein can be combined in various ways. Furthermore, although the examples described herein have multiple configurations, other configurations are also possible, as will be apparent upon understanding this disclosure.

[0046] Figure 1 This is a schematic cross-sectional view of a camera module according to an embodiment.

[0047] exist Figure 1 According to this embodiment, the camera module 100 includes a lens barrel 110, an upper housing (or housing) 120 configured to support the lens barrel 110, and a sensor plate 130 on which an image sensor 131 is mounted. The upper housing 120 can be fixedly connected to the sensor plate 130. At least one lens (not shown) can be disposed in the lens barrel 110. When multiple lenses are provided, the multiple lenses can be mounted in the lens barrel 110 along the optical axis OA.

[0048] A retaining pin 123 may protrude from the upper housing 120. The retaining pin 123 may protrude from the bottom surface of the upper housing 120 and extend in the optical axis direction. Multiple retaining pins 123 may be configured to surround the image sensor 131. The retaining pin 123 may be made of a metallic material. The retaining pin 123 may be made of the same material as the upper housing 120 and integrated with it. Alternatively, the retaining pin 123 may be made of a different material than the upper housing 120 and configured to be separable from the upper housing 120. For example, a retaining pin 123 integrated with the upper housing 120 may include aluminum (Al). A retaining pin 123 configured to be separable from the upper housing 120 may include nickel (Ni) and tin (Sn). The separable retaining pin 123 may be securely inserted into a connecting groove formed on the bottom surface of the upper housing 120.

[0049] The upper housing 120 can be connected to the lower housing 140, which is configured to cover the sensor plate 130. The upper housing 120 and the lower housing 140 can be connected to each other to form the housing of the camera module 100. The sensor plate 130, on which the image sensor 131 is mounted, can be disposed in the space defined by connecting the upper housing 120 and the lower housing 140.

[0050] The sensor plate 130 has a first surface 130a and a second surface 130b that are opposite to each other. The first surface 130a may be the surface facing the lens barrel 110, and the image sensor 131 may be mounted on the first surface 130a. The sensor plate 130 has a pin insertion hole 133, that is, a through hole extending from the first surface 130a to the second surface 130b through the sensor plate 130. A retaining pin 123 protruding from the upper housing 120 may be inserted into the pin insertion hole 133.

[0051] The bottom surface of the upper housing 120 may face the first surface 130a of the sensor plate 130, and the retaining pin 123 may extend from the bottom surface to the first surface 130a. In this case, the retaining pin 123 may be inserted from the first surface 130a of the sensor plate 130 into the pin insertion hole 133, penetrate the sensor plate 130, and protrude from the second surface 130b.

[0052] A welding portion 136 may be disposed in a pin insertion hole 133 to secure a retaining pin 123 inserted into the pin insertion hole 133. The welding portion 136 may be located on a first surface 130a and a second surface 130b of the sensor plate 130. The welding portion 136 disposed on the first surface 130a and the second surface 130b may protrude from the surface of the sensor plate 130. Furthermore, the welding portion 136 may be disposed on the first surface 130a and the second surface 130b and configured to cover the edge of the pin insertion hole 133 while surrounding the retaining pin 123. A portion of the welding portion 136 disposed in the pin insertion hole 133 may be connected to another portion of the welding portion 136 disposed on the first surface 130a or the second surface 130b.

[0053] The weld portion 136 can be thermally cured by irradiating the solder with a laser beam. The solder can be solder paste or solder ring. The cured weld portion 136 can be obtained by laser welding solder paste disposed in the pin insertion hole 133 or solder ring disposed on the sensor plate 130 onto the pin insertion hole 133.

[0054] When solder paste is used as solder, an active alignment process can be performed to position the solder paste in the pin insertion hole 133 and move the fixing pin 123 in the optical axis direction within the pin insertion hole 133. The solder paste can be thermally cured by a laser beam after the active alignment process, so that the fixing pin 123 can be fixed in the pin insertion hole 133. Therefore, the position of the upper housing 120 relative to the sensor plate 130 can also be fixed, and the position of the lens barrel 110 relative to the image sensor 131 can also be fixed.

[0055] When the weld ring is used as solder, the center opening of the weld ring is 235a (see...). Figure 9 The fixing pin 123 is located on the sensor plate 130 to correspond to the pin insertion hole 133, and the active alignment process can be performed while the fixing pin 123 moves in the optical axis direction within the pin insertion hole 133. The laser beam can melt the welding ring, and after the active alignment process, the fixing pin 123 can be fixed in the pin insertion hole 133 after curing.

[0056] Figure 2 This is a flowchart explaining a method for manufacturing a camera module according to another embodiment. Figure 3 This is a cross-sectional view of the camera module, shown to explain... Figure 2 The method for manufacturing the camera module is shown. Figures 4 to 6 This is an enlarged cross-sectional view showing the pin insertion hole of the sensor plate, which is shown to explain... Figure 2 The method for manufacturing the camera module is shown.

[0057] The method of manufacturing the camera module 100 according to this embodiment includes the following steps: performing active alignment on an upper housing 120 in which a lens barrel 110 is supported, and then fixing the upper housing 120 to a sensor plate 130. At least one lens (not shown) may be disposed in the lens barrel 110. For example, multiple lenses may be mounted in the lens barrel 110 along the optical axis OA.

[0058] The retaining pin 123 can protrude from the bottom surface of the upper housing 120 and extend in the optical axis direction. The sensor plate 130 has a first surface 130a and a second surface 130b that are opposite each other. The first surface 130a can be the surface facing the lens barrel 110, and the image sensor 131 can be mounted on the first surface 130a. The sensor plate 130 also has a pin insertion hole 133 configured as a through hole.

[0059] refer to Figure 2 According to the method for manufacturing the camera module 100 according to this embodiment, solder paste 136A is applied to the pin insertion hole 133 of the sensor plate 130 (step S110). Solder paste 136A is a soft material that, if not thermally cured, allows active alignment to be performed by inserting the retaining pin 123. (See reference...) Figure 4 Alternatively, solder paste 136A can be applied to the pin insertion hole 133 and to a portion of the surface of the sensor board 130. Solder paste 136A can be applied to the surface of the sensor board 130 and to the periphery including the edge of the pin insertion hole 133.

[0060] Next, refer to Figure 3 and Figure 4 Move the upper housing 120 or sensor plate 130 so that the retaining pin 123 is inserted into the pin insertion hole 133 (step S120). The retaining pin 123 can reciprocate in the optical axis direction within the pin insertion hole 133. The retaining pin 123 can be inserted into the pin insertion hole 133 while the pin insertion hole 133 is filled with solder paste 136A. In this case, the retaining pin 123 can be surrounded by the solder paste 136A filling the pin insertion hole 133. However, because the solder paste 136A is in a soft state before being heat-cured, the retaining pin 123 is still movable.

[0061] Next, active alignment is performed while the upper housing 120 is moved relative to the sensor plate 130 (step S130). Active alignment is the process of aligning the optical axis of the lens placed on the image sensor during the manufacturing of the camera module. An active alignment device can be used to precisely align the camera lens portion and the image sensor portion, and can align the image sensor and the optical axis so that the focal points of the image sensor and the lens are precisely aligned with each other.

[0062] Next, refer to Figure 5 and Figure 6 Soldering is performed using thermosetting solder paste 136A (step S140). After active alignment, soldering can be performed by irradiating solder paste 136A with a laser beam L. The entire retaining pin 123 and the entire solder paste 136A can be uniformly irradiated with the laser beam L. When the solder paste 136A is irradiated with the laser beam L, the solder paste 136A can be immediately cured while shrinking in the direction towards the center C. In this way, the solder paste 136A can be thermosetting and shrinking to form the welded part 136.

[0063] The solder portion 136 is cured, allowing the retaining pin 123 to be secured in the pin insertion hole 133. Solder paste 136A can be applied not only to the pin insertion hole 133 but also to the surface of the sensor plate 130. Therefore, the cured solder portion 136 can be positioned around the pin insertion hole 133 and protrude from the surface of the sensor plate 130.

[0064] Figure 7 This is a flowchart for explaining a method of manufacturing a camera module according to yet another embodiment. Figure 8 This is a cross-sectional view of a camera module, shown to explain a method of manufacturing a camera module according to yet another embodiment. Figure 9 and Figure 10 This is an enlarged cross-sectional view showing the pin insertion hole of the sensor plate, which is shown to explain... Figure 7 The method for manufacturing the camera module is shown.

[0065] refer to Figure 7 and Figure 8 According to the method for manufacturing the camera module 200 of this embodiment, a weld ring 235 is provided on the sensor plate 230 to correspond to the pin insertion hole 233 (step S210). The weld ring 235 can be formed into an annular welded member with a central opening 235a by molding solder. The weld ring 235 can be disposed on the second surface 230b of the sensor plate 230 such that the central opening 235a corresponds to the pin insertion hole 233. That is, the weld ring 235 can be pre-disposed on the sensor plate 230 before performing active alignment. The second surface 230b can be the surface opposite to the first surface 230a on which the image sensor 231 is mounted.

[0066] Next, the upper housing 220 or sensor plate 230 is moved so that the retaining pin 223 is inserted into the pin insertion hole 233 (step S220). The retaining pin 223 can reciprocate in the optical axis direction within the pin insertion hole 233. Because the central opening 235a of the welding ring 235 is configured to correspond to the pin insertion hole 233, the retaining pin 223 can move simultaneously through the pin insertion hole 233 and the central opening 235a of the welding ring 235. In this case, the diameters of the pin insertion hole 233 and the central opening 235a of the welding ring 235 are larger than the diameter of the cross-section of the retaining pin 223, allowing the retaining pin 223 to move unrestricted in the optical axis direction.

[0067] Next, active alignment is performed while the upper housing 220 is moved relative to the sensor plate 230 (step S230). Because the lens barrel 210 is fixedly supported by the upper housing 220, the lens barrel 210 can also move when the upper housing 220 is operated. An active alignment device can be used to precisely align the camera lens portion and the image sensor portion, and can align the image sensor and the optical axis so that the focal points of the image sensor and the lens are precisely aligned with each other.

[0068] Next, refer to Figure 9 and Figure 10 The retaining pin 223 is welded into the pin insertion hole 233 by laser welding of the weld ring 235 (step S240). When the weld ring 235 is irradiated with the laser beam L, the weld ring 235 melts and solidifies. As the weld ring 235 irradiated with the laser beam L melts and flows around the retaining pin 223, the pin insertion hole 233 can be filled with the weld ring 235. In this case, flux can be applied to the retaining pin 223 to induce solder flow. The flux is an acidic mixture that removes metal oxides and achieves a smooth metallurgical bond during the welding process.

[0069] The solder filling the pin insertion hole 233 can be rapidly cured, allowing the retaining pin 223 to be secured within the pin insertion hole 233, forming a welded portion 236. Therefore, the upper housing 220 can be fixed to the sensor plate 230. The cured welded portion 236 can be configured to protrude upwards and downwards from the surface of the sensor plate 230.

[0070] One or more embodiments disclose a method for rapidly fixing a lens housing and a sensor plate during an active alignment process without using epoxy resin and a curing process.

[0071] One or more embodiments disclose a camera module and a method of manufacturing the camera module, which enables rapid fixation of the lens housing and sensor plate during an active alignment process without causing defects.

[0072] One or more embodiments disclose a camera module and a method for manufacturing the camera module, which is used to quickly fix the lens housing and sensor plate during an active alignment process without causing process defects due to defocusing deviation.

[0073] In one or more embodiments, after the active alignment process, the lens portion and the image sensor portion can be welded and fixed by laser welding, thereby improving processing speed and production capacity.

[0074] While specific examples have been shown and described above, it will be apparent upon understanding this disclosure that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered descriptive only and not for limiting purposes. The description of features or aspects in each example is to be applied to similar features or aspects in other examples. Suitable results may also be obtained if the described techniques are performed in a different order, and / or if components in the described system, architecture, device, or circuit are combined in a different manner and / or replaced or supplemented by other components or their equivalents. Therefore, the scope of this disclosure is not limited by the specific embodiments but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents shall be construed as included in this disclosure.

Claims

1. A camera module, characterized in that, include: Lens tube; A housing configured to support the lens barrel; A retaining pin protrudes from the housing and extends along the optical axis; A sensor plate having a first surface and a second surface opposite to each other and a pin insertion hole into which a retaining pin is inserted; as well as A welding part is disposed in the pin insertion hole, protruding from the first surface and the second surface of the sensor plate, and fixing the fixing pin.

2. The camera module according to claim 1, characterized in that, The pin insertion hole is a through hole.

3. The camera module according to claim 1, characterized in that, The welded portion is partially disposed on the first surface and the second surface of the sensor plate.

4. The camera module according to claim 1, characterized in that, The welded portion is disposed on the first surface and the second surface to cover the edge of the pin insertion hole and surround the retaining pin.

5. The camera module according to claim 1, characterized in that, The housing has a bottom surface facing the first surface of the sensor plate, and The retaining pin extends from the bottom surface toward the first surface of the sensor plate.

6. The camera module according to claim 1, characterized in that, The retaining pin is inserted from the first surface of the sensor plate into the pin insertion hole, and protrudes from the second surface of the sensor plate.

7. The camera module according to claim 1, characterized in that, The portion of the welded part located in the pin insertion hole is connected to another portion of the welded part located on the first surface or the second surface.

8. The camera module according to claim 1, characterized in that, The retaining pin is made of metal.

9. The camera module according to claim 1, characterized in that, The sensor board includes an image sensor mounted on the first surface.

10. The camera module according to claim 1, characterized in that, The weld portion includes thermosetting solder paste surrounding the retaining pin in the pin insertion hole.

11. The camera module according to claim 10, characterized in that, The welding part includes laser-cured solder paste.

12. A camera module having a housing configured to support a lens barrel, characterized in that, The camera module includes: A retaining pin is configured to protrude from the housing and extend in the optical axis direction; A sensor plate having opposing surfaces and a pin insertion hole extending through said opposing surfaces; and A welding section is disposed in the pin insertion hole and configured to protrude from the opposite surface of the sensor plate and fix the fixing pin.

13. The camera module according to claim 12, characterized in that, The welded portion is partially disposed on the opposing surface of the sensor plate, and The retaining pin extends from the bottom surface of the housing toward one of the opposing surfaces of the sensor plate.

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