S-shaped runner liquid cooling plate for heat dissipation of semiconductor vehicle-mounted refrigerator and heat dissipation device of S-shaped runner liquid cooling plate

Abstract

The S-shaped flow channel liquid cooling plate for heat dissipation of the semiconductor vehicle-mounted refrigerator and the heat dissipation device of the S-shaped flow channel liquid cooling plate comprise a liquid cooling plate body, at least one S-shaped flow channel and a linear flow channel are arranged in the liquid cooling plate body, the liquid inlet side of the S-shaped flow channel is connected with a liquid inlet, all the S-shaped flow channels converge to the linear flow channel, and the other end of the linear flow channel is communicated with a liquid outlet. Each S-shaped flow channel comprises a plurality of flow channels shaped like a Chinese character'ji ', and the adjacent flow channels shaped like the Chinese character'ji' are communicated with each other. The heat dissipation performance can be effectively improved, the flowing path of cooling liquid is optimized, a flowing dead zone is avoided, and the overall heat dissipation efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of semiconductor refrigeration, specifically relates to a S type flow channel liquid cooling plate for the heat dissipation of semiconductor vehicle refrigerator, and relates to a heat dissipation device adopting the improved liquid cooling plate. BACKGROUND

[0002] With the development of vehicle refrigerator and semiconductor refrigeration technology, more and more vehicle refrigerators adopt semiconductor refrigeration systems. The semiconductor refrigeration technology has the advantages of no mechanical moving parts and high reliability, but under the condition of high power density, the heat dissipation problem becomes the bottleneck restricting performance improvement. Most of the traditional heat dissipation modes rely on air cooling or linear flow channel liquid cooling plate, and the air cooling has low efficiency and large noise, and the linear flow channel liquid cooling plate is difficult to uniformly dissipate heat due to uneven fluid flow, resulting in unsatisfactory heat dissipation effect. UTILITARY MODEL CONTENTS

[0003] The utility model solves the technical problem of how to improve the heat dissipation efficiency of the vehicle refrigerator, thereby improving the refrigeration efficiency of the vehicle refrigerator, and therefore provides a S type flow channel liquid cooling plate for the heat dissipation of semiconductor vehicle refrigerator, and relates to a heat dissipation device adopting the improved liquid cooling plate.

[0004] To solve the above problems, the utility model is realized by the following technical scheme:

[0005] The S type flow channel liquid cooling plate for the heat dissipation of semiconductor vehicle refrigerator comprises a liquid cooling plate body, at least one S type flow channel and a linear flow channel are arranged in the liquid cooling plate body, the liquid inlet side of the S type flow channel is connected with the liquid inlet, all the S type flow channels converge to the linear flow channel, and the other end of the linear flow channel is connected with the liquid outlet.

[0006] The S type flow channel comprises a plurality of "J" type flow channels, and adjacent "J" type flow channels are connected with each other.

[0007] The S type flow channel comprises a first S type flow channel and a second S type flow channel, the "J" type flow channel width D1 of the first S type flow channel is 12mm, the longitudinal length L1 of the first S type flow channel is 22mm, and the flow channel width D2 in the first S type flow channel is 4mm; the "J" type flow channel width D3 of the second S type flow channel is 6mm, the longitudinal length L2 of the second S type flow channel is 34mm, and the flow channel width D4 in the second S type flow channel is 4mm.

[0008] The circular angle radius of the flow channel of all the "J" type flow channels in the first S type flow channel and the second S type flow channel is 2mm.

[0009] The linear flow channel is a transverse flow channel.

[0010] At least one mounting hole is arranged on the liquid cooling plate body.

[0011] A heat dissipation device using the liquid cooling plate, comprising a semiconductor refrigeration sheet, a hot end fin plate is arranged at the hot end of the semiconductor refrigeration sheet, and a liquid cooling plate is arranged at the cold end of the semiconductor refrigeration sheet, and the liquid cooling plate is provided with a cold end fin; the liquid cooling plate is connected with an in-vehicle compressor refrigeration system through the liquid inlet pipe and the liquid outlet pipe.

[0012] The liquid cooling plate is connected with an in-vehicle compressor refrigeration system through the liquid inlet pipe and the liquid outlet pipe.

[0013] The hot end fin plate is provided with a heat dissipation fan.

[0014] The semiconductor refrigeration sheet and the cold end fin are installed in a refrigerator cavity.

[0015] Compared with the prior art, the heat dissipation device has the beneficial effects that the heat dissipation performance is effectively improved, the cooling liquid flow path is optimized, the flow dead zone is avoided, and the overall heat dissipation efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a structural diagram of the heat dissipation device of the utility model;

[0017] Figure 2 It is a flow channel structure diagram of the liquid cooling plate;

[0018] Figure 3 It is a flow channel plan view;

[0019] Figure 4 It is a working principle diagram of the utility model. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0021] In the description of the utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0022] As Figure 2 , Figure 3As shown, an S-shaped flow channel liquid cooling plate 2 for a semiconductor vehicle refrigerator is provided, comprising a liquid cooling plate body 16, at least one S-shaped flow channel 13 and a straight flow channel 14 are arranged in the liquid cooling plate body 16, the liquid inlet side of the S-shaped flow channel 13 is connected with the liquid inlet 11, all S-shaped flow channels 13 converge into the straight flow channel 14, and the other end of the straight flow channel 14 is connected with the liquid outlet 12.

[0023] The S-shaped flow channel 13 comprises a plurality of "several" shaped flow channels, and adjacent "several" shaped flow channels are communicated with each other.

[0024] Further, the S-shaped flow channel 13 comprises a first S-shaped flow channel 131 and a second S-shaped flow channel 132, but the design parameters of the first S-shaped flow channel 131 and the second S-shaped flow channel 132 are different, specifically: the "several" shaped flow channel width D1 of the first S-shaped flow channel 131 is 12mm, the longitudinal length L1 of the first S-shaped flow channel 131 is 22mm, and the flow channel width D2 in the first S-shaped flow channel 131 is 4mm. The "several" shaped flow channel width D3 of the second S-shaped flow channel 132 is 6mm, the longitudinal length L2 of the second S-shaped flow channel 132 is 34mm, and the flow channel width D4 in the second S-shaped flow channel 132 is 4mm.

[0025] Better, the corner radius of the flow channel of all "several" shaped flow channels in the first S-shaped flow channel 131 and the second S-shaped flow channel 132 is 2mm.

[0026] Further, the straight flow channel 14 is a transverse flow channel.

[0027] Better, at least one mounting hole 15 is arranged on the liquid cooling plate body 16 for mounting the liquid cooling plate.

[0028] In the utility model, the S-shaped flow channel of the liquid cooling plate is designed as a plurality of flow channel sections ("several" shaped flow channels), the liquid is divided into two paths after entering the flow channel, and is uniformly distributed in the middle of the liquid cooling plate, the direction and flow rate of each "several" shaped flow channel in each S-shaped flow channel are accurately designed, the stable flow and uniform distribution of the cooling liquid are ensured through the zigzag design of the S-shaped flow channel, local overheating is avoided, finally converges into the transverse flow channel, and finally is discharged from the liquid outlet 12, so that the setting can better improve the non-uniform temperature of the cooling liquid flowing through each part of the liquid cooling plate, can effectively cover the whole heat source surface, ensures that the heat transfer from the heat source to the cooling liquid is more efficient, and effectively guarantees the cooling effect of the liquid cooling plate.

[0029] Therefore, in the utility model, the cooling liquid flow channel in the liquid cooling plate body 16 adopts an S-shaped layout, the bending design of the S-shaped flow channel 13 can change the flow path of the fluid, reduce the formation of dead zones, and ensure that the cooling liquid can uniformly flow through the whole heat source area, and the heat dissipation efficiency is maximized.

[0030] As Figure 1 、 Figure 4 shown, a heat dissipation device for a vehicle-mounted refrigerator, including a semiconductor refrigeration sheet 7, the hot end 8 of the semiconductor refrigeration sheet 7 is provided with a hot end fin plate 5, the cold end 9 of the semiconductor refrigeration sheet 7 is provided with a liquid cooling plate 2, the liquid cooling plate 2 is provided with a cold end fin 1; The liquid cooling plate 2 is respectively communicated with the liquid inlet pipe 3 and the liquid outlet pipe 4. It should be noted that, under normal circumstances, the semiconductor refrigeration sheet 7 is powered on.

[0031] In the utility model, the liquid cooling plate 2 is as liquid cooling structure, is the core component of this heat dissipation device, the liquid cooling plate 2 is installed on the semiconductor refrigeration sheet 7, and the liquid cooling plate 2 is connected with the in-vehicle compressor refrigeration system through the liquid inlet pipe 3 and the liquid outlet pipe 4, can maintain the hot face temperature of the semiconductor refrigeration sheet 7 at 5 DEG C minimum, greatly reduces the cold face temperature of the refrigeration sheet compared with air cooling, to improve the refrigeration effect of the refrigerator.

[0032] Better, the hot end fin plate 5 is provided with a cooling fan 6, for the air cooling of the hot end fin plate 5.

[0033] In the utility model, the semiconductor refrigeration sheet 7 and the cold end fin 1 are installed in the refrigerator cavity, and the refrigerator structure is not described here.

[0034] The utility model provides a kind of S-shaped flow passage liquid cooling plate design for semiconductor vehicle-mounted refrigerator heat dissipation, greatly improves the flow uniformity and heat dissipation efficiency of cooling liquid by innovative flow channel layout design, solve the problems such as uneven flow, local overheating in traditional liquid cooling plate. The design is not only suitable for vehicle-mounted refrigerator, but also can be widely used in the thermal management system of other high power density equipment, with broad application prospect.

[0035] The preferred embodiments described above are only the preferred embodiments of the utility model, and it should be pointed out that, for those skilled in the art, without departing from the overall concept of the utility model, a number of changes and improvements can be made, which should be considered as the protection range of the utility model.

Claims

1. An S-shaped flow channel liquid cooling plate for heat dissipation in a semiconductor vehicle refrigerator, characterized in that: It includes a liquid cooling plate body (16). At least one S-shaped flow channel (13) and a straight flow channel (14) are provided inside the liquid cooling plate body (16). The liquid inlet side of the S-shaped flow channel (13) is connected to the liquid inlet (11). All the S-shaped flow channels (13) converge to the straight flow channel (14), and the other end of the straight flow channel (14) is connected to the liquid outlet (12).

2. The S-shaped flow channel liquid cooling plate for heat dissipation of a semiconductor vehicle refrigerator according to claim 1, characterized in that: Each of the S-shaped flow channels (13) includes a number of "Ji"-shaped flow channels, and adjacent "Ji"-shaped flow channels are connected to each other.

3. The S-shaped flow channel liquid cooling plate for heat dissipation of a semiconductor vehicle refrigerator according to claim 2, characterized in that: The S-shaped flow channel (13) includes a first S-shaped flow channel (131) and a second S-shaped flow channel (132). The width D1 of the "Ji"-shaped flow channel of the first S-shaped flow channel (131) is 12 mm, the longitudinal length L1 of the first S-shaped flow channel (131) is 22 mm, and the flow channel width D2 in the first S-shaped flow channel (131) is 4 mm; the width D3 of the "Ji"-shaped flow channel of the second S-shaped flow channel (132) is 6 mm, the longitudinal length L2 of the second S-shaped flow channel (132) is 34 mm, and the flow channel width D4 in the second S-shaped flow channel (132) is 4 mm.

4. The S-shaped flow channel liquid cooling plate for heat dissipation of a semiconductor vehicle refrigerator according to claim 2, characterized in that: For all the "Ji"-shaped flow channels in the first S-shaped flow channel (131) and the second S-shaped flow channel (132), the fillet radius of the flow channel is 2 mm.

5. The S-shaped flow channel liquid cooling plate for heat dissipation of a semiconductor vehicle refrigerator according to claim 1, characterized in that: The straight flow channel (14) is a transverse flow channel.

6. The S-shaped flow channel liquid cooling plate for heat dissipation of a semiconductor vehicle refrigerator according to claim 1, characterized in that: At least one mounting hole (15) is provided on the liquid cooling plate body (16).

7. A heat dissipation device employing the S-shaped flow channel liquid cooling plate for heat dissipation of a semiconductor vehicle refrigerator as described in any one of claims 1-6, characterized in that: It includes a semiconductor refrigeration chip (7). A hot-end fin plate (5) is provided at the hot end (8) of the semiconductor refrigeration chip (7). A liquid cooling plate (2) is provided at the cold end (9) of the semiconductor refrigeration chip (7), and a cold-end fin (1) is provided on the liquid cooling plate (2); the liquid cooling plate (2) is respectively connected to the liquid inlet pipe (3) and the liquid outlet pipe (4).

8. The heat dissipation device according to claim 7, characterized in that: The liquid cooling plate (2) is connected to the in-vehicle compression refrigeration system through the liquid inlet pipe (3) and the liquid outlet pipe (4).

9. The heat dissipation device according to claim 7, characterized in that: A cooling fan (6) is provided on the hot-end fin plate (5).

10. The heat dissipation device according to claim 7, characterized in that: The semiconductor refrigeration chip (7) and the cold-end fin (1) are installed in the refrigerator cavity.

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