Thin-wall multi-cavity building profile extrusion die
By using the insertion mechanism and the interlocking design of the thermal expansion plates, the problem of a single stress point in the aluminum profile extrusion die is solved, thereby achieving the stability and ease of assembly of the die and extending its service life.
Patent Information
- Application Number
- CN202520512916.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-24
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-03-24
AI Technical Summary
In the installation process of existing aluminum profile extrusion dies, the bolt connection point is the only rigid support area, resulting in a single stress point and potential for insufficient installation stability.
The system employs an interlocking mechanism, which uses the interlocking of the interlocking pieces and the thermal expansion pieces to achieve dynamic self-locking by utilizing the difference in thermal expansion coefficients. This eliminates single-point stress concentration, and the interlocking pieces and slots form an interference fit. Combined with the rectangular plate structure and stepped fastening, this enhances the stability of the mold.
It improves the overall stability and connection strength of the mold, avoids stress concentration, enhances the convenience of assembly and disassembly, and extends the service life of the mold.