Circulating water changing device of bonding wire plating line

Abstract

The utility model provides a circulating water changing device for a bonding wire plating line, which comprises a cleaning assembly and a water changing assembly, the cleaning assembly is connected with the water changing assembly and is used for filtering and circulating cleaning water in the bonding wire plating line, the cleaning assembly comprises a cleaning box for cleaning a bonding wire, and the cleaning box is connected with the water changing assembly. A first filtering part is installed on the outer side surface of the cleaning box, and the water changing assembly comprises a storage box used for storing a circulated water source. Compared with the prior art, the water changing assembly has the following advantages that when the water changing assembly is arranged, the first filtering part is mainly used for conducting preliminary filtering on cleaning water in the cleaning box and intercepting large-particle impurities during use; and the filter part II can be used for carrying out secondary fine filtration on the water which is subjected to primary filtration and is circulated to the storage box, fine particles, metal ions, other soluble impurities and the like in the water can be further removed, graded filtration is realized, the water quality is purer, and the high requirement of bonding wire cleaning on the water quality is better met.

Description

TECHNICAL FIELD

[0001] The utility model belongs to water equipment field, especially relate to a kind of circulating water changing device of wire bonding electroplating line. BACKGROUND

[0002] Wire bonding electroplating line is a kind of professional production line equipment for wire bonding electroplating treatment, in the electroplating process, wire bonding surface will be attached to the various chemical substances in electroplating solution, unreacted metal ions and some impurity particles that may be generated etc., cleaning can remove these substances to the inside of cleaning tank, in the current wire bonding electroplating production practice, part of production line adopts open type cleaning water system, this traditional design has certain limitation in resource utilization efficiency. Cleaning water is directly discharged after single use, leading to significant increase in water consumption, the conventional method is to use the way of fixed-time fixed-quantity discharging old water and supplementing fresh water, although the way is simple to operate, but it will cause a large amount of waste of water resources, so a new structure needs to be proposed to solve the above technical problems. SUMMARY

[0003] In view of the deficiencies in the prior art, the utility model aims to provide a kind of circulating water changing device of wire bonding electroplating line, to solve the problems raised in the above background.

[0004] The utility model discloses the following technical scheme realizes: a kind of circulating water changing device of wire bonding electroplating line, comprising: cleaning component and water changing component, the cleaning component is connected with water changing component and is used to filter and circulate the cleaning water in the inside of wire bonding electroplating line, the cleaning component includes the cleaning tank for cleaning wire bonding, the outside surface of the cleaning tank is installed with filter piece one, the water changing component includes the storage tank for storing water source after circulation, the outside surface of the storage tank is installed with filter piece two by water inlet pipe two, filter piece two is connected by pipeline with filter piece one.

[0005] As a preferred implementation, the inside of the cleaning tank is installed with a waterproof monitoring device for monitoring the cleaning liquid, the monitoring device is installed on the inner wall of the rear side of the cleaning tank, and the lower edge of the front surface of the cleaning tank is installed with a water outlet valve.

[0006] As a preferred implementation, the right surface of the cleaning tank is installed with a circulating pipe one, the filter piece one includes a water inlet pipe one, a primary filter and a secondary filter, the left surface of the cleaning tank is installed with a primary filter by a water inlet pipe one, and a water pump one is arranged at the connection between the water inlet pipe one and the cleaning tank. In use, the primary filter and the secondary filter inside the filter piece one can preliminarily filter the cleaning water in the cleaning tank, effectively intercepting large-particle impurities, metal scraps and the like in the cleaning water, so that the cleaning water maintains relatively high purity.

[0007] As a preferred implementation, the primary filter and the secondary filter are connected by a pipeline, the secondary filter comprises a filter cartridge, a second water inlet pipe and a second water pump, and the secondary filter is connected to the filter cartridge by a pipeline.

[0008] As a preferred implementation, the upper side surface of the filter cartridge is provided with the second water pump, the water outlet end of the second water pump is provided with the second water inlet pipe, and the end of the second water inlet pipe away from the second water pump is connected to the side surface of the storage tank.

[0009] As a preferred implementation, the outer side surface of the second water inlet pipe is provided with a valve, the front side surface of the storage tank is provided with a second circulation pipe, the second circulation pipe has the same structure as the first circulation pipe, the water inlet end of the second circulation pipe is arranged at the bottom inside the storage tank, in use, the primary filter is mainly used to preliminarily filter the cleaning water in the cleaning tank to intercept large-particle impurities, and the secondary filter is used to finely filter the water that has been preliminarily filtered and circulated to the storage tank, so as to further remove small-particle impurities in the water, facilitating the use of the user.

[0010] As a preferred implementation, the water inlet end of the second circulation pipe is provided with a waterproof pump machine through the storage tank, the second circulation pipe is connected to the first circulation pipe, and the first circulation pipe and the second circulation pipe are connected to a spraying system.

[0011] After the above technical scheme is adopted, the beneficial effects of the present application are as follows: 1. The cleaning assembly is connected to the water replacement assembly and used to filter and circulate the cleaning water inside the bonding wire electroplating line, the cleaning assembly comprises a cleaning tank used to clean the bonding wire, and the outer side surface of the cleaning tank is provided with a primary filter, in use, the primary filter and the secondary filter inside the primary filter can preliminarily filter the cleaning water in the cleaning tank, effectively intercept large-particle impurities, metal scraps and the like in the cleaning water, keep the cleaning water at a relatively high purity, improve the cleaning effect of the bonding wire, ensure that the impurities on the surface of the bonding wire are more thoroughly removed, and improve the quality of the bonding wire.

[0012] 2. The water replacement assembly comprises a storage tank used to store the water source after circulation, the outer side surface of the storage tank is provided with a secondary filter through a second water inlet pipe, the secondary filter is connected to the primary filter by a pipeline, in use, the primary filter is mainly used to preliminarily filter the cleaning water in the cleaning tank to intercept large-particle impurities, and the secondary filter is used to finely filter the water that has been preliminarily filtered and circulated to the storage tank, further remove small-particle impurities, metal ions and other soluble impurities, realize graded filtration, make the water quality more pure, and better meet the high requirements of the bonding wire cleaning on the water quality. BRIEF DESCRIPTION OF DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings described in the following are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0014] Fig. 1 It is a whole structure schematic view of the circulating water changing device of the bonding wire electroplating line of the present application.

[0015] Fig. 2 It is a schematic view of the cleaning assembly of the circulating water changing device of the bonding wire electroplating line of the present application.

[0016] Fig. 3 It is a schematic view of the water changing assembly of the circulating water changing device of the bonding wire electroplating line of the present application.

[0017] In the figure, 100 is a cleaning assembly, 110 is a cleaning tank, 120 is a monitoring element, 130 is a circulating pipe one, 140 is a water inlet pipe one, 150 is a primary filter, 160 is a secondary filter;

[0018] 200 is a water changing assembly, 210 is a storage tank, 220 is a circulating pipe two, 230 is a filter cartridge, 240 is a water pump two, 250 is a water inlet pipe two. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0020] Please refer to Figs. 1 to 3 The present application provides a technical solution: a circulating water changing device of a bonding wire electroplating line, comprising: a cleaning assembly 100 and a water changing assembly 200, the cleaning assembly 100 and the water changing assembly 200 are connected for filtering and circulating the cleaning water inside the bonding wire electroplating line, the cleaning assembly 100 comprises a cleaning tank 110 for cleaning the bonding wire, the outer surface of the cleaning tank 110 is provided with a filter one, the water changing assembly 200 comprises a storage tank 210 for storing the water source after circulation, the outer surface of the storage tank 210 is provided with a filter two through a water inlet pipe two 250, the filter two and the filter one are connected through a pipeline.

[0021] Please refer to Figs. 1 to 3The utility model discloses a cleaning box 110's inside is equipped with the waterproof monitoring device 120 for monitoring the cleaning fluid, and the monitoring device 120 is installed in the rear side inner wall of cleaning box 110, and the lower edge of the front side surface of cleaning box 110 is equipped with the water outlet valve,

[0022] The right side surface of cleaning box 110 is equipped with the circulating pipe no.

[0023] The first filter piece 150 and the second filter piece 160 are connected through a pipeline, and the second filter piece 160 is connected with the filter cylinder 230 through a pipeline.

[0024] When in use, the spraying system can clean the bonding wire after electroplating, and then the liquid after cleaning falls in the inside of the cleaning box 110, at this time, when the monitoring device 120 (the monitoring device 120 is prior art, which can be selected to be composed of a suitable sensor, so as to be connected with a computer device and the water pump no.

[0025] Please refer to Figs. 1 to 3 As a second embodiment of the utility model: the upper side surface of the filter cylinder 230 is equipped with the water pump no.

[0026] The outer side surface of the second water inlet pipe is provided with a valve, and the front side surface of the storage tank 210 is provided with a second circulating pipe 220 which has the same structure as the first circulating pipe 130, and the water inlet end of the second circulating pipe 220 is arranged at the bottom inside the storage tank 210.

[0027] The water inlet end of the second circulating pipe 220 is provided with a waterproof pump machine through the storage tank 210, the second circulating pipe 220 is connected with the first circulating pipe 130, and the first circulating pipe 130 is connected with the second circulating pipe 220 and is provided with a spraying system.

[0028] In use, before the cleaning liquid is delivered into the filter cartridge 230 through the operation steps of the first embodiment, the second water pump 240 starts to work, thereby increasing the delivery strength of the cleaning liquid, when the cleaning liquid enters into the filter cartridge 230, secondary filtration can be carried out (the inside of the filter cartridge 230 is a wastewater filtration device which adopts multiple treatment processes such as sedimentation, filtration, adsorption and reverse osmosis to treat the cleaning liquid discharged from the cleaning tank 110 and remove heavy metal ions, organic matters and other pollutants, the model thereof can be selected from the existing market models, and only needs to meet the use, and the specific structure and working principle thereof will not be described here), when the filter cartridge 230 finishes cleaning the cleaning liquid, the cleaning liquid can be discharged into the storage tank 210 for temporary storage through the second water inlet pipe 250, when the spraying system works again, the waterproof pump machine at the bottom inside the storage tank 210 will pump out the cleaning liquid into the second circulating pipe 220, and then deliver it to the spraying system for water cleaning operation, when the liquid inside the cleaning tank 110 loses too much through the operation steps of the first embodiment, the second circulating pipe 220 will be branched, so that part of the cleaning liquid inside the second circulating pipe 220 enters into the cleaning tank 110 through the first circulating pipe 130, thereby balancing the cleaning liquid inside the cleaning tank 110, since the first filter element mainly performs primary filtration on the cleaning water in the cleaning tank 110 to intercept large-particle impurities, and the second filter element can perform secondary fine filtration on the water which is circulated to the storage tank 210 after primary filtration, so as to further remove small-particle impurities, metal ions and other dissolved impurities, thereby realizing graded filtration and making the water quality more pure and better meeting the high requirements of the key wire cleaning on water quality.

[0029] The above only describes the preferred embodiments of the present application, and is not used to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A recirculating water system for a wire bonding galvanic wire comprising: The utility model provides a cleaning assembly (100) and water changing assembly (200), its characterized in be connected for the cleaning of the cleaning assembly (100) and water changing assembly (200) to the inside of the bonding wire electroplating line cleaning water filtration circulation, the cleaning assembly (100) includes the cleaning box (110) for the cleaning of the bonding wire, the outside surface of cleaning box (110) is equipped with filter piece no.

2. A water recirculating system for wire electro-deposition bonding wires as claimed in claim 1, wherein: The inside of the cleaning box (110) is equipped with waterproof monitoring device (120) for monitoring cleaning liquid, the monitoring device (120) is installed in the back inner wall of cleaning box (110), and the front side surface lower edge of the cleaning box (110) is equipped with water outlet valve.

3. A water recirculating system for wire electro-deposition bonding wires as claimed in claim 2, wherein: The right side surface of the cleaning box (110) is equipped with circulating pipe no. (130), the filter piece no. 1 includes water inlet pipe no. (140), primary filter piece (150) and secondary filter piece (160), the left side surface of the cleaning box (110) is equipped with primary filter piece (150) through water inlet pipe no. (140), and the connecting place of water inlet pipe no. (140) and the cleaning box (110) is provided with water pump no.

1.

4. A water recirculating system for wire bonding and plating as defined in claim 3 wherein: The primary filter piece (150) and the secondary filter piece (160) are connected through pipelines, and the filter piece no. 2 includes filter cartridge (230), water inlet pipe no. (250) and water pump no. (240), and the secondary filter piece (160) is connected with the filter cartridge (230) through pipelines.

5. A water recirculating system for wire electro-deposition bonding wires as claimed in claim 4, wherein: The upper side surface of the filter cartridge (230) is equipped with water pump no. (240), the water outlet end of water pump no. (240) is equipped with water inlet pipe no. (250), and the end, away from water pump no. (240), of water inlet pipe no. (250) is connected with the side of storage tank (210).

6. A water recirculating system for electroplating wirebonds as defined in claim 5 wherein: The outside surface of the water inlet pipe no. (250) is equipped with valve, the front side surface of the storage tank (210) is equipped with circulating pipe no. (220), the circulating pipe no. (220) is same in structure with circulating pipe no. (130), and the water inlet end of the circulating pipe no. (220) is arranged at the bottom in the storage tank (210).

7. A water recirculating system for wire electro-deposition bonding wires as claimed in claim 6, wherein: The water inlet end of the circulating pipe no. (220) is equipped with waterproof pump machine through the storage tank (210), the circulating pipe no. (220) is connected with the circulating pipe no. (130), and the circulating pipe no. (130) and the circulating pipe no. (220) are connected with spraying system.

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