LED display screen module

By using a reflective layer and a light-absorbing layer to adjust the light-emitting area of ​​the sub-pixels in the LED display, and by using two blue LED chips as blue sub-pixels, the problems of graininess and blue light damage are solved, achieving better display effects and cost control.

CN223968162UActive Publication Date: 2026-03-03SHENZHEN YUNMIXIN DISPLAY TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-05
Publication Date
2026-03-03

AI Technical Summary

Technical Problem

Existing LED displays suffer from graininess when viewed at close range, and reducing pixel pitch would increase costs and cause blue light to harm the eyes.

Method used

The system employs a glass circuit board and glass cover assembly, and sets up a reflective layer and a light-absorbing layer. The area of ​​the light-emitting region of the sub-pixel is adjusted by adjusting the size of the reflective layer, and two blue LED chips are used as blue sub-pixels to reduce the blue light energy density.

Benefits of technology

It effectively improves the graininess of the display and reduces the harm of blue light to the human eye while lowering costs, thus improving the display effect.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an LED display screen module which comprises a glass circuit board assembly and a glass cover plate assembly which are attached to each other, the glass circuit board assembly comprises a glass circuit board, a plurality of LED chips arranged on the first side face of the glass circuit board and arranged in an array mode, and first reflecting layers filled among the LED chips; the glass cover plate assembly comprises a glass cover plate and a plurality of second reflecting layers which are arranged on the first side face of the glass cover plate and correspond to the LED chips in a one-to-one mode, first through holes right facing the LED chips are formed in the centers of the second reflecting layers, and therefore light emitted by the LED chips in the vertical direction can be transmitted out of the glass cover plate through the first through holes. And light rays at other angles are reflected back to the surface of the first reflecting layer of the glass circuit board through the second reflecting layer, are scattered, reflected and refracted for multiple times and then penetrate through the glass cover plate, so that the area of a sub-pixel light-emitting region is increased, and the problem of granular sensation of display is greatly improved.
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Description

Technical Field

[0001] This utility model relates to the field of LED display technology, and in particular to an LED display module. Background Technology

[0002] like Figure 1 As shown, existing LED displays 100' typically drive three LEDs (red, green, and blue) directly as a single pixel 110', meaning each pixel 110' has three sub-pixels. The common practice is to group the three sub-pixel LEDs (red, green, and blue) into a small package area, which facilitates the manufacturing of individual pixel devices and reduces costs.

[0003] LED displays have pixels arranged at equal intervals along the X and Y directions. The pixel density is typically described by the pixel pitch. For example, P2.5 means a display with a pixel pitch of 2.5 mm, and P1.2 means a display with a pixel pitch of 1.2 mm. The larger the pixel pitch, the greater the spacing between sub-pixels within adjacent pixels. At close range, the human eye may perceive individual LEDs, a phenomenon known in the industry as "graininess." (See also...) Figure 2 As shown, taking a commonly used LED with a length of 0.2 mm and a width of 0.1 mm as an example, if the display screen 100' is arranged with 3*3 pixels 110', and the pixel pitch is designed to be 2.1 mm, then its X-direction pitch L1 is 2.1 mm, and its Y-direction pitch L2 is 0.7 mm, resulting in severe graininess in the X direction. To solve the graininess when viewed at close range, the current approach is to reduce the pixel pitch, for example, from P2.1 to P1.0. However, when the pixel pitch is reduced, the number of LEDs and the number of ICs driving the LEDs increase exponentially, leading to a several-fold increase in cost, making it difficult to meet the needs of large-scale product applications.

[0004] To reduce costs, the industry is moving towards using smaller LEDs. Larger LEDs are more expensive, so the only option is to minimize their size. Currently, red, green, and blue LEDs with dimensions of 200 micrometers or less are commonly used. However, when blue LEDs are shrunk, the blue light radiation per unit area increases significantly to maintain the same display brightness. Directly viewing blue LEDs can cause retinal damage because high-energy-density blue light is harmful to the eyes. Furthermore, using smaller red, green, and blue LEDs increases the spacing between them, reducing the light-emitting area and further exacerbating the graininess issue.

[0005] Therefore, it is necessary to provide an improved LED display module to increase the light-emitting area of ​​red, green and blue sub-pixels and significantly improve the graininess of the display. Utility Model Content

[0006] The purpose of this invention is to provide an improved LED display module that increases the light-emitting area of ​​red, green and blue sub-pixels and significantly improves the graininess of the display.

[0007] To achieve the above objectives, the technical solution of this utility model is as follows: An LED display module is provided, comprising a glass circuit board assembly and a glass cover assembly; wherein, the glass circuit board assembly includes a glass circuit board and a plurality of LED chips arranged in an array on its first side, and the first side is further provided with a first reflective layer filling between each of the LED chips; the glass cover assembly includes a glass cover and a plurality of second reflective layers disposed on its first side and corresponding one-to-one with each of the LED chips, the second reflective layers having a first through hole at their center, and the second side of the glass cover covering the top of each of the LED chips, with the first through hole facing the LED chip.

[0008] Preferably, the area of ​​the second reflective layer is proportional to the spacing between each of the LED chips. That is, when the spacing between each of the LED chips is small, the size of the second reflective layer is reduced to prevent crosstalk between pixels. When the spacing between each of the LED chips is large, the size of the second reflective layer is increased. Thus, the area of ​​the light-emitting region of a single sub-pixel can be adjusted by adjusting the size of the second reflective layer.

[0009] Preferably, the glass cover assembly further includes a light-absorbing layer, which is disposed on the second reflective layer and has an outer diameter less than or equal to the outer diameter of the second reflective layer. The light-absorbing layer has a second through hole at its center that is directly opposite to the first through hole. The light-absorbing layer absorbs ambient light, thereby providing a black screen when the LED chip is not emitting light.

[0010] Preferably, both the first reflective layer and the second reflective layer are white. Therefore, the light emitted by the LED chip can pass through the first through hole and be transmitted through the glass cover in the vertical direction, while the light at other angles is reflected by the second reflective layer to the surface of the first reflective layer of the glass circuit board. After multiple scattering, reflection and refraction, the light penetrates the glass cover, thereby increasing the area of ​​the sub-pixel light-emitting area and greatly improving the graininess problem of the display.

[0011] Preferably, the light-absorbing layer is black, and it absorbs ambient light to provide a black screen when the LED chip is not emitting light.

[0012] Preferably, the glass circuit board assembly further includes a plurality of driver ICs, each of which is disposed on the second side of the glass circuit board and electrically connected to each of the LED chips, thereby driving each of the LED chips.

[0013] Preferably, the glass circuit board has a first single-layer circuit on its first side and a second single-layer circuit on its second side. Each LED chip is electrically connected to the first single-layer circuit, and each driver IC is electrically connected to the second single-layer circuit. The driver IC is also electrically connected to each LED chip.

[0014] Preferably, the glass circuit board has multiple vias through which the driver IC is electrically connected to each of the LED chips.

[0015] Preferably, the LED display module further includes a transparent adhesive layer, through which the first side of the glass circuit board and the second side of the glass cover are bonded together.

[0016] Preferably, the LED spacing between any two adjacent LED chips is the same, so that the LED spacing of the entire display screen is consistent. Therefore, when displaying images, the pixelation between pixels can be improved more effectively.

[0017] Preferably, four LED chips arranged in an array constitute a pixel unit, that is, the four LED chips of each pixel unit are arranged in a 2*2 matrix, so that the glass circuit board has multiple pixel units arranged in an array.

[0018] Preferably, the LED spacing between two horizontally or vertically adjacent LED chips within each pixel unit is the same; the LED spacing between two horizontally or vertically adjacent LED chips in each pixel unit is the same as the LED spacing within each pixel unit. That is, all LED spacing in the entire display screen is consistent, thereby ensuring that all LED spacing remains uniform and can be reduced compared to the prior art. In other words, the pixel spacing of the entire display screen is reduced and remains consistent, thus more effectively improving the graininess of existing display screens.

[0019] Preferably, the LED spacing is the spacing between the same sides of two adjacent LED chips in the lateral direction and the spacing between the same sides of two adjacent LED chips in the longitudinal direction.

[0020] Preferably, the LED spacing is less than or equal to 1.05 mm, thus making all LED spacing the same and reducing it compared to the prior art, thereby more effectively improving the graininess between pixels.

[0021] Preferably, in each pixel unit, the two LED chips arranged on one diagonal are blue LED chips, and the two LED chips arranged on the other diagonal are a red LED chip and a green LED chip, respectively. Because two blue LED chips are used as the blue sub-pixel, the blue light energy density of the blue LED chip is reduced by half at the same display brightness, thus significantly reducing the harmful effects of blue light on the human eye. In other words, this application solves the problem of blue light causing eye damage in the prior art while maintaining low cost by using small-sized LED chips.

[0022] Preferably, two blue LED chips positioned diagonally are driven in parallel to form a blue sub-pixel, while the red LED chip positioned on the other diagonal is driven as a red sub-pixel and the green LED chip is driven as a green sub-pixel. Therefore, at the same display brightness, the blue light energy density of the blue LED chip is reduced by half, thus significantly reducing the harmful effects of blue light on the human eye.

[0023] Preferably, the LED chip is a miniaturized LED chip with a flip-chip structure, which facilitates the direct connection of the positive and negative pads of the LED chip to the pads on the glass circuit board.

[0024] Compared with the prior art, the LED display module of this utility model firstly sets a first reflective layer on the first side of its glass circuit board, filling the spaces between each LED chip, and then sets a second reflective layer on the first side of the glass cover plate, corresponding one-to-one with each LED chip, and the center of the second reflective layer has a first through hole facing the LED chip; in this way, the light emitted by the LED chip can pass through the first through hole and be transmitted out of the glass cover plate assembly in the vertical direction, while the light at other angles is reflected back to the surface of the first reflective layer of the glass circuit board through the second reflective layer, and then penetrates the glass cover plate assembly after multiple scattering, reflection and refraction, thereby increasing the area of ​​the sub-pixel light-emitting area and thus greatly improving the problem of graininess in the display. Attached Figure Description

[0025] Figure 1 This is a structural diagram of an existing LED display screen.

[0026] Figure 2 yes Figure 1 A schematic diagram of the pixel pitch of an LED display screen.

[0027] Figure 3 This is a schematic diagram of the LED display module of this utility model.

[0028] Figure 4 yes Figure 3 Top view.

[0029] Figure 5 yes Figure 3 A schematic diagram of pixel units.

[0030] Figure 6 yes Figure 5 A schematic diagram illustrating the driving principle of each pixel unit.

[0031] Figure 7 yes Figure 3 Schematic diagram of light emission principle

[0032] Figure 8 yes Figure 3 The actual light-emitting effect diagram. Detailed Implementation

[0033] Embodiments of the present invention will now be described with reference to the accompanying drawings, in which similar element reference numerals represent similar elements. It should be noted that the directional descriptions involved in the present invention, such as up, down, left, right, front, and back, indicating directions or positional relationships, are based on the directions or positional relationships shown in the drawings and are only for the convenience of describing the technical solutions of this application or / and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "first," "second," etc., described are only used to distinguish technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the sequential relationship of the indicated technical features.

[0034] First combine Figure 3-4 , Figure 7 As shown, in one embodiment of this utility model, an LED display module 100 is provided, which includes a glass circuit board assembly 110 and a glass cover assembly 120. The glass circuit board assembly 110 includes a glass circuit board 111 and a plurality of LED chips 112 arranged in an array on its first side. The first side also has a first reflective layer 113 filling the spaces between the LED chips 112. The glass cover assembly 120 includes a glass cover 121 and a plurality of second reflective layers 122 arranged in an array on its first side. Each second reflective layer 122 corresponds to one LED chip 112, and a first through-hole 122a is formed in the center of each second reflective layer 122. The second side of the glass cover 121 covers the LED chips 112, with the first through-hole 122a in the center of the second reflective layer 122 facing the LED chip 112. Figure 3As shown. Therefore, the light emitted by the LED chip 112 can pass through the first through-hole 122a and be transmitted out of the glass cover assembly 120 in the vertical direction, while light at other angles is reflected by the second reflective layer 122 to the surface of the first reflective layer 113 on the glass circuit board 111, and then penetrates the glass cover assembly 120 after multiple scattering, reflection, and refraction, as shown. Figure 7 As shown. This increases the area of ​​the sub-pixel's light-emitting region, thereby effectively improving the graininess of the display.

[0035] Continue to combine Figure 3-4 , Figure 7 As shown, in this embodiment, both the first reflective layer 113 and the second reflective layer 122 are white. Preferably, white ink is used to form the first reflective layer 113 and the second reflective layer 122. Specifically, white ink is printed on the entire first side of the glass circuit board 111 to form the first reflective layer 113 filling between each LED chip 112; white ink is printed on the entire first side of the glass cover plate 121, and then the second reflective layer 122, arranged in a matrix, is formed in one step using a photolithography process. The aforementioned forming method makes the forming of the first reflective layer 113 and the second reflective layer 122 convenient and provides a good reflective effect. Of course, other materials with good reflective effects can also be used to form the first reflective layer 113 and the second reflective layer 122.

[0036] Combination Figure 3 , Figure 5 , Figure 7 As shown, in this embodiment, the area of ​​the second reflective layer 122 is proportional to the spacing between each LED chip 112, that is, the area of ​​the second reflective layer 122 is proportional to the LED spacing L (described later). Specifically, when the spacing between each LED chip 112 is small, that is, when the LED spacing L is small, the size of the second reflective layer 122 is reduced to make its area smaller, in order to prevent crosstalk between pixels; when the spacing between each LED chip 112 is large, that is, when the LED spacing L is large, the size of the second reflective layer 122 is increased to make its area larger. Thus, the area of ​​the light-emitting region of a single sub-pixel can be adjusted by adjusting the size of the second reflective layer 122. The specific area of ​​the second reflective layer 122 is not limited, and is set according to different LED spacing L.

[0037] Continue to combine Figure 3-4 , Figure 7As shown, in one embodiment of this utility model, the glass cover assembly 120 further includes a light-absorbing layer 123, which is disposed above the second reflective layer 122. The shape of the light-absorbing layer 123 and the shape of the second reflective layer 122 may be the same or different, and the outer diameter of the light-absorbing layer 123 is less than or equal to the outer diameter of the second reflective layer 122. Figure 3-4 In the illustrated embodiment, the shape of the light-absorbing layer 123 is the same as that of the second reflective layer 122, and the outer diameter of the light-absorbing layer 123 is slightly smaller than that of the second reflective layer 122. Furthermore, a second through-hole 123a is formed at the center of the light-absorbing layer 123, directly opposite the first through-hole 122a. Preferably, the diameter of the second through-hole 123a is the same as that of the first through-hole 122a. Figure 3 As shown. When the LED chip 112 emits light, light in the vertical direction can pass through the first through hole 122a and the second through hole 123a and be transmitted out of the glass cover assembly 120, as shown. Figure 7 As shown. Meanwhile, the light-absorbing layer 123 is used to absorb ambient light, thereby providing a black screen when the LED chip 112 is not emitting light.

[0038] In this embodiment, the light-absorbing layer 123 is black. Preferably, the light-absorbing layer 123 is formed by printing black ink across its entire surface, followed by a photolithography process to create a pattern matrix in one step. This facilitates the forming of the light-absorbing layer 123 and allows for greater absorption of ambient light, providing a high-quality black image when the LED chip 112 is not emitting light. Of course, other light-absorbing materials can also be used to form the light-absorbing layer 123.

[0039] Continue reading Figure 3 As shown, in one embodiment of this utility model, the glass circuit board assembly 110 further includes a plurality of driver ICs 114. Each driver IC 114 is respectively disposed on the second side of the glass circuit board 111 and is electrically connected to each LED chip 112. The driver IC drives each LED chip 112 to emit light. The arrangement of the driver IC 114 and the way it drives the LED chip 112 are conventional methods in the art.

[0040] More specifically, the glass circuit board 111 has a first single-layer circuit on its first side and a second single-layer circuit on its second side, and the glass circuit board 111 also has multiple vias. The arrangement of the first single-layer circuit, the second single-layer circuit, and the vias are all conventional methods in the art. Each LED chip 112 is electrically connected to the first single-layer circuit. Specifically, the positive and negative pads of each LED chip 112 are directly electrically connected to the pads on the first single-layer circuit. Each driver IC 114 is electrically connected to the second single-layer circuit, and through the vias, each driver IC 114 is electrically connected to the LED chip 112 of a sub-pixel. The driver IC 114 drives the LED chip 112 to emit light, thereby forming a blue sub-pixel, a red sub-pixel, and a green sub-pixel, respectively.

[0041] See again Figure 3 As shown, in one embodiment of this utility model, the LED chip 112 is a flip-chip miniaturized LED chip, which facilitates direct connection of the positive and negative pads of the LED chip 112 to the pads on the glass circuit board 111. Of course, the LED chip 112 can also be selected from other types of chips as needed.

[0042] See again Figure 3 As shown, in this invention, the LED display module 100 further includes a transparent adhesive layer 130, through which the first side of the glass circuit board 111 and the second side of the glass cover plate 121 are bonded. Preferably, the thickness of the transparent adhesive layer 130 is greater than or equal to the height of the LED chip 112, thereby stably bonding the glass circuit board 111 and the glass cover plate 121 with good sealing performance. Furthermore, the transparent adhesive layer 130 has good light transmittance, thus improving the scattering, reflection, and refraction of light between the glass circuit board 111 and the glass cover plate assembly 120. Of course, the glass circuit board 111 and the glass cover plate 121 can also be bonded using other methods.

[0043] The following is combined Figure 4-5 As shown, in one embodiment of this utility model, a pixel unit 110a is composed of four LED chips 112 arranged in an array, that is, the four LED chips 112 of each pixel unit 110a are arranged in a 2*2 matrix. Furthermore, the LED spacing L between any two adjacent LED chips 112 is the same, thus ensuring that the LED spacing L of the entire display screen is consistent. This further effectively improves the pixelation effect when displaying images.

[0044] The following is combined Figure 4-5As shown, in this embodiment, the LED display module 100 has multiple pixel units 110a, which are also arranged in an array. Specifically, the multiple pixel units 110a are arranged in an M*N matrix, where M and N are natural numbers greater than 1. The specific number of M and N is not specifically limited in this invention. For example, Figure 5 The image only schematically illustrates a 2x2 matrix arrangement of pixel units 110a. Each pixel unit 110a includes four LED chips 112 arranged in a 2x2 matrix, with the same LED spacing L between any two adjacent LED chips 112.

[0045] The following is combined Figure 5-6 As shown, in one embodiment of this utility model, in each pixel unit 110a, the two LED chips arranged on one diagonal are blue LED chips 112a, and the two LED chips arranged on the other diagonal are red LED chip 112b and green LED chip 112c, respectively. The two blue LED chips 112a arranged on one diagonal are driven in parallel to form a blue sub-pixel, and the red LED chip 112b arranged on the other diagonal is driven as a red sub-pixel, and the green LED chip 112c is driven as a green sub-pixel. Figure 6 As shown, this application uses two blue LED chips 112a as blue sub-pixels. Therefore, at the same display brightness, the blue light energy density of the blue LED chips 112a is reduced by half, thus significantly reducing the harmful effects of blue light on the human eye. Therefore, the pixel unit 110a arrangement in this application significantly reduces the harmful effects of blue light on the human eye at the same display brightness while reducing the LED spacing L to minimize graininess and using small-sized LED chips to maintain low cost.

[0046] See Figure 5 As shown, in one specific embodiment, in each pixel unit 110a, blue LED chips 112a are arranged at the upper left and lower right corners, a red LED chip 112b is arranged at the lower left corner, and a green LED chip 112c is arranged at the upper right corner. This structural arrangement, using two blue LED chips 112a on a diagonal as blue sub-pixels, reduces the blue light energy density of the blue LED chips 112a by half at the same display brightness, significantly reducing the harmful effects of blue light on the human eye. Understandably, it is also possible to interchange the positions of the two blue LED chips 112a with the red LED chips 112b and green LED chips 112c, and the positions of the red LED chips 112b and green LED chips 112c can also be interchanged.

[0047] Continue to combine Figure 4-5As shown, in this utility model, the LED spacing L is the spacing between the same sides of two adjacent LED chips 112 in the horizontal direction (X direction) or the spacing between the same sides of two adjacent LED chips 112 in the vertical direction (Y direction). Figure 4-5 Taking pixel unit 110a as an example, for two adjacent LED chips 112 in the horizontal (X direction), the LED spacing L refers to the distance between the right side of the first LED chip 112 and the right side of the second LED chip 112, and the distance between the right side of the second LED chip 112 and the right side of the third LED chip 112. Alternatively, the LED spacing L can be the distance between the left side of the first LED chip 112 and the left side of the second LED chip 112, and the distance between the left side of the second LED chip 112 and the left side of the third LED chip 112, and so on. Figure 5 In the specific embodiment shown, taking the first row at the top as an example, the distance L between the right side of the first blue LED chip 112a and the right side of the second green LED chip 112c, and the distance L between the right side of the second green LED chip 112c and the right side of the third blue LED chip 112a are both the LED spacing L, and the LED spacing L in the horizontal (X direction) direction is similar.

[0048] Continue to combine Figure 4-5 As shown, correspondingly, for two adjacent LED chips 112 in the longitudinal (Y direction), the LED spacing L refers to the distance between the upper edge of the first LED chip 112 and the upper edge of the second LED chip 112, and the distance between the upper edge of the second LED chip 112 and the upper edge of the third LED chip 112. Alternatively, the LED spacing L can be the distance between the lower edge of the first LED chip 112 and the lower edge of the second LED chip 112, and the distance between the lower edge of the second LED chip 112 and the lower edge of the third LED chip 112, and so on. Figure 5 In the specific embodiment shown, taking the first column on the left as an example, the distance L between the lower side of the first blue LED chip 112a and the lower side of the second red LED chip 112b, and the distance L between the lower side of the second red LED chip 112b and the lower side of the third blue LED chip 112a are both the LED spacing L, and the LED spacing L in the longitudinal (Y direction) direction is similar.

[0049] Combined again Figure 4-5As shown, the array arrangement of the blue LED chip 112a, red LED chip 112b, and green LED chip 112c ensures that the LED spacing L between any two adjacent LED chips 112 in the horizontal (X-direction) or vertical (Y-direction) direction within each pixel unit 110a is the same. Simultaneously, it also ensures that the LED spacing L between any two adjacent LED chips 112 in the horizontal (X-direction) or vertical (Y-direction) direction between any two adjacent pixel units 110a is also the same. Specifically, Figure 5 In the diagram, the LED spacing L between the green LED chip 112c of the first pixel unit 110a and the blue LED chip 112a of the second pixel unit 110a in the horizontal (X direction) direction is the same as the LED spacing L within each pixel unit 110a. Similarly, the LED spacing L between the blue LED chip 112a of the first pixel unit 110a and the red LED chip 112b of the second pixel unit 110a in the horizontal (X direction) direction is the same as the LED spacing L within each pixel unit 110a, and so on. Likewise, the LED spacing L between the red LED chip 112b of the first pixel unit 110a and the blue LED chip 112a of the second pixel unit 110a in the vertical (Y direction) direction is the same as the LED spacing L within each pixel unit 110a; and the LED spacing L between the blue LED chip 112a of the first pixel unit 110a and the green LED chip 112c of the second pixel unit 110a in the vertical (Y direction) direction is the same as the LED spacing L within each pixel unit 110a, and so on. This ensures that the spacing L of all LEDs in the entire display screen is consistent, meaning that the spacing between all pixels in the entire display screen is consistent. Therefore, the array arrangement of LED chips 112 in each pixel unit 110a in this application, while reducing the LED spacing L between any two adjacent LED chips 112, also ensures that all LED spacing L is consistent, thereby further and effectively improving the graininess of existing displays.

[0050] Continue reading Figure 5 As shown, in one embodiment of this utility model, the LED spacing L between two adjacent LED chips 112 in the horizontal direction (X direction) and the LED spacing L between two adjacent LED chips 112 in the vertical direction (Y direction) are both less than or equal to 1.05 mm. In a specific embodiment, the pixel distance is preferably 1.05 mm. Compared to Figure 2Compared with the prior art shown, all LED spacing L in this application is reduced, and all LED spacing L is consistent, thereby more effectively improving the graininess between pixels. Furthermore, based on the reduction of all LED spacing L, smaller LED chips 112 can be selected, thereby maintaining low cost and reducing the harm of blue light to the human eye.

[0051] The following is combined Figures 3-8 As shown, in use, the LED display module 100 of this utility model emits light from the LED chip 112. Light rays in the vertical direction can pass through the first through-hole 122a and the second through-hole 123a and be transmitted out of the glass cover assembly 120. Light rays at other angles are reflected back to the surface of the first reflective layer 113 of the glass circuit board 111 through the second reflective layer 122, and then penetrate the glass cover assembly 120 after multiple scattering, reflection, and refraction. Figure 7 As shown, this increases the area of ​​the sub-pixel light-emitting region, thereby significantly improving the graininess of the display.

[0052] See Figure 4-5 As shown, since the four LED chips 112 in each pixel unit 110a are arranged in a 2*2 matrix, and the LED spacing L between any two adjacent LED chips 112 is the same, that is, the LED spacing L between two adjacent LED chips 112 in the horizontal (X direction) or vertical (Y direction) direction within each pixel unit 110a is the same, and the LED spacing L between two adjacent LED chips 112 in the horizontal (X direction) or vertical (Y direction) direction of two pixel units 110a is also the same as the LED spacing L within each pixel unit 110a. This makes all LED spacing L of the entire display screen consistent, that is, all pixel spacing of the entire display screen is consistent, thereby further improving the graininess between pixels. In other words, this application, while making all LED spacing L of the entire display screen the same and reducing it compared to the prior art, further increases the area of ​​the sub-pixel light-emitting region, thereby significantly improving the graininess between pixels during display. The actual light-emitting effect diagram of the LED display module 100 of this application is shown below. Figure 8 As shown.

[0053] Continue reading Figure 5 As shown, this application further sets the LED chips on a pair of diagonals in each pixel unit 110a as blue LED chips 112a. Thus, after the size of the blue LED chip 112a is reduced, while maintaining the same display brightness, the blue light energy density of the blue LED chip 112a is reduced by half, thereby significantly reducing the blue light damage to the human eye.

[0054] In addition, the way the LED chip is arranged in each pixel unit 110 in this application allows for the use of smaller LED chips while improving graininess and reducing blue light damage, thereby maintaining low cost.

[0055] In summary, the LED display module 100 of this utility model firstly provides a first reflective layer 113 filled between each LED chip 112 on the first side of its glass circuit board 111, and then provides a second reflective layer 122 corresponding to each LED chip 112 on the first side of the glass cover plate 121, with a first through hole 122a facing the LED chip 112 at the center of the second reflective layer 122. In this way, the light emitted by the LED chip 112 can be transmitted through the first through hole 122a and out of the glass cover plate assembly 120 in the vertical direction, while the light at other angles is reflected back to the surface of the first reflective layer 113 of the glass circuit board 111 through the second reflective layer 122, and then penetrates the glass cover plate assembly 120 after multiple scattering, reflection and refraction, thereby increasing the area of ​​the sub-pixel light-emitting area and thus greatly improving the problem of graininess in the display.

[0056] The structures of other parts of the display screen involved in this utility model are all conventional structures well known to those skilled in the art, and will not be described in detail here.

[0057] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Therefore, any equivalent variations made in accordance with the scope of the present utility model application shall still fall within the scope of the present utility model.

Claims

1. An LED display module, characterized in that, include: A glass circuit board assembly includes a glass circuit board and a plurality of LED chips disposed on a first side and arranged in an array, wherein the first side is further provided with a first reflective layer filled between each of the LED chips; A glass cover assembly includes a glass cover and a plurality of second reflective layers disposed on its first side and corresponding to each of the LED chips. A first through hole is provided in the center of the second reflective layer. The second side of the glass cover covers the LED chips and the first through hole is directly facing the LED chips.

2. The LED display module as described in claim 1, characterized in that, The area of ​​the second reflective layer is proportional to the spacing between each of the LED chips.

3. The LED display module as described in claim 1, characterized in that, The glass cover assembly further includes a light-absorbing layer, which is disposed on the second reflective layer and has an outer diameter less than or equal to the outer diameter of the second reflective layer. The center of the light-absorbing layer has a second through hole that is directly opposite to the first through hole.

4. The LED display module as described in claim 3, characterized in that, The first reflective layer and the second reflective layer are both white, and the light-absorbing layer is black.

5. The LED display module as described in claim 1, characterized in that, The glass circuit board assembly also includes multiple driver ICs, each of which is disposed on the second side of the glass circuit board and electrically connected to each of the LED chips.

6. The LED display module as described in any one of claims 1-5, characterized in that, It also includes a transparent adhesive layer, through which the first side of the glass circuit board and the second side of the glass cover are bonded together.

7. The LED display module as described in any one of claims 1-5, characterized in that, The LED spacing between any two adjacent LED chips is the same, and four LED chips arranged in an array constitute a pixel unit, so that the glass circuit board has multiple pixel units arranged in an array.

8. The LED display module as described in claim 7, characterized in that, The LED spacing is the spacing between the same sides of two adjacent LED chips in the horizontal direction and the spacing between the same sides of two adjacent LED chips in the vertical direction.

9. The LED display module as described in claim 7, characterized in that, The LED spacing is less than or equal to 1.05 mm.

10. The LED display module as described in claim 7, characterized in that, In each pixel unit, the two LED chips arranged on one diagonal are blue LED chips, and the two LED chips arranged on the other diagonal are red LED chips and green LED chips, respectively. The two blue LED chips are driven in parallel to form a blue sub-pixel, the red LED chip is driven to form a red sub-pixel, and the green LED chip is driven to form a green sub-pixel.