LED display device and LED display module
By setting recessed structures at the four corners of the LED display device and covering the encapsulation body, combined with the snap-on design of the mask, the problem of poor fixation of the CHIP type LED bead mask is solved, achieving stable mask snap-on and optimized display effect.
Patent Information
- Application Number
- CN202520564760.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-27
- Publication Date
- 2026-03-03
- Estimated Expiration
- 2035-03-27
AI Technical Summary
The structure of CHIP-type LEDs is a full cube, which leads to poor mask fixation and affects the display effect. Existing technologies solve this problem by thickening the mask, but this affects the light emission from the side of the LEDs.
Recessed structures are set at the four corners of the LED display device, and an encapsulation body is covered on the recessed structures to form through holes for snapping the mask. Combined with the snap-on design of the mask, the snap-on accuracy and stability of the mask are improved.
It improves the precision and stability of the mask's connection to the LED display module, enhances the consistency and uniformity of the display module, and optimizes the display effect.
Smart Images
Figure CN223968166U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED display technology, and in particular to an LED display device and an LED display module. Background Technology
[0002] With the continuous development of LED full-color display technology, the market demand for high-contrast displays is increasing. High-contrast LED display modules can improve image quality and color, thus delivering a more premium display experience. To improve display contrast, LED display modules need to undergo "blackening" processing, which involves blackening the entire appearance of the display module to enhance the contrast between light and dark areas, thereby improving the display experience. Currently, the "blackening" process typically involves adding a black mask to the gaps between the LED display devices after they have been laminated to form the LED display module, thus improving the uniformity of the LED display module's display. However, there are some technical problems and shortcomings when using a mask to "fill the gaps" of CHIP LED beads: CHIP LED beads have a full cubic structure with a regular and flat bottom. There are no clips for the mask, resulting in poor fixation. Since the mask cannot be clipped onto the display module, it needs to be thickened. However, the thickened mask will block the side light emission of the CHIP LED beads, affecting the display effect. Utility Model Content
[0003] The purpose of this utility model is to overcome the shortcomings of the prior art. This utility model provides an LED display device and an LED display module, which improves the accuracy and stability of the mask being attached to the LED display module, improves the consistency and uniformity of the display module, and effectively optimizes the display effect.
[0004] This utility model provides an LED display device, which includes a device substrate, an LED chip and an encapsulation covering the LED chip are disposed on the upper surface of the device substrate, and the four corners of the device substrate are recessed from the outside to the inside to form a recessed structure, and the encapsulation covers the recessed structure.
[0005] Furthermore, the upper surface of the device substrate is provided with pads and electrical wires, and copper plating layers are provided on the sides of the recessed structures at the four corners of the device substrate. The copper plating layers form electrodes, and the LED chip is disposed on the pads. The pads are connected to the electrodes based on the electrical wires.
[0006] Furthermore, the length L of the recessed structures at the four corners of the device substrate and the width D of the electrical conductor satisfy the following relationship: 3.5D <L<5D;
[0007] The width W of the recessed structure and the width D of the electrical conductor satisfy the following relationship: 3.5D <W<5D;
[0008] The area S of the recessed structure and the width D of the conductor satisfy the following relationship: 3.5D * 3.5D <S<5D*5D。
[0009] Furthermore, the cross-section of the recessed structure at the four corners of the device substrate is rectangular, quarter-circular, or isosceles right triangle.
[0010] Furthermore, a pressing plate is also provided on the device substrate, and the device substrate and the pressing plate are bonded together by pressing adhesive. A light emission channel is provided on the pressing plate corresponding to the LED chip, and the LED chip is located in the light emission channel, which forms a reflector cup for the LED chip.
[0011] This utility model also provides an LED display module, which includes a module substrate and a plurality of the above-mentioned LED display devices. The LED display devices are disposed on the module substrate and arranged in an array. The recessed structure at the corner of the device substrate of every four adjacent LED display devices forms a through hole.
[0012] The LED display module also includes a mask that fills the gaps between adjacent LED display devices and the through-holes formed between every four adjacent LED display devices.
[0013] Furthermore, the mask includes several longitudinally arranged first frame strips and several transversely arranged second frame strips. A buckle is provided at the intersection of any first frame strip and any second frame strip. The buckle engages with the through hole formed between every four adjacent LED display devices. The first frame strip fills the gap between adjacent column LED display devices, and the second frame strip fills the gap between adjacent row LED display devices.
[0014] Furthermore, the width d1 of the first frame strip, the patch spacing T of the LED display module, and the dot pitch P of the LED display device satisfy the following relationship: 0.9*(TP) <d1<0.95*(T-P);
[0015] The width d2 of the second frame strip, the patch spacing T of the LED display module, and the dot pitch P of the LED display device satisfy the following relationship: 0.9*(TP) <d2<0.95*(T-P)。
[0016] Furthermore, the area C of the buckle and the area S of the recessed structure satisfy the following relationship: C = 0.9 * 4S.
[0017] Furthermore, the thickness b of the mask and the thickness B of the device substrate satisfy the following relationship: 0.5B <b<B。
[0018] Furthermore, the buckle is rectangular, circular, or rhomboid in shape.
[0019] This utility model provides an LED display device and an LED display module. The LED display device has recessed structures at its four corners, and an encapsulation layer is provided to cover them. After the LED display device is surface-mounted to form an LED display module, the recessed structures form through holes, allowing the mask's clips to be engaged in the through holes and held in place by the encapsulation body. This improves the accuracy and stability of the mask being engaged in the LED display module, enhances the consistency and uniformity of the display module, and effectively optimizes the display effect. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a first schematic diagram of the LED display device structure in Embodiment 1 of this utility model;
[0022] Figure 2 This is a second schematic diagram of the LED display device structure in Embodiment 1 of this utility model;
[0023] Figure 3 This is a first structural cross-sectional view of the LED display device in Embodiment 1 of this utility model;
[0024] Figure 4 This is a cross-sectional view of the second structure of the LED display device in Embodiment 1 of this utility model;
[0025] Figure 5 This is a first schematic diagram of the LED display module structure in Embodiment 2 of this utility model;
[0026] Figure 6 This is a second schematic diagram of the LED display module structure in Embodiment 2 of this utility model;
[0027] Figure 7 This is a third schematic diagram of the LED display module structure in Embodiment 2 of this utility model;
[0028] Figure 8 This is a schematic diagram of the mask structure in Embodiment 2 of this utility model. Detailed Implementation
[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.
[0030] In this invention, it should be understood that terms such as “comprising” or “having” are intended to indicate the presence of features, figures, steps, actions, components, portions or combinations thereof disclosed in this specification, and are not intended to exclude the possibility of the presence or addition of one or more other features, figures, steps, actions, components, portions or combinations thereof.
[0031] It should also be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.
[0032] Example 1
[0033] This utility model provides an LED display device, which includes a device substrate, an LED chip and an encapsulation covering the LED chip on the upper surface of the device substrate, and four corners of the device substrate are recessed from the outside to the inside to form a recessed structure, and the encapsulation covers the recessed structure.
[0034] In one optional implementation of this embodiment, such as Figure 1 , Figure 2 and Figure 3 As shown, Figure 1 This shows a first schematic diagram of the LED display device structure in Embodiment 1 of the present invention. Figure 2 This shows a second schematic diagram of the LED display device structure in Embodiment 1 of the present invention. Figure 3 A cross-sectional view of the first structure of the LED display device according to Embodiment 1 of the present invention is shown. The LED display device includes a device substrate 1, an LED chip 2 and an encapsulation body 3 covering the LED chip 2 are disposed on the upper surface of the device substrate 1, and the four corners of the device substrate 1 are recessed from the outside to the inside to form a recessed structure 4, and the encapsulation body 3 covers the recessed structure 4.
[0035] It should be noted that, Figure 1 To better showcase the LED chip 2 on the device substrate 1, the package 3 is hidden.
[0036] In an optional implementation of this embodiment, the upper surface of the device substrate 1 is further provided with pads 11 and electrical wires 12, and copper plating layers are provided on the sides of the recessed structures 4 at the four corners of the device substrate 1. The copper plating layers form electrodes, and the LED chip 2 is disposed on the pads 11. The pads 11 are connected to the electrodes based on the electrical wires 12.
[0037] In an optional implementation of this embodiment, the relationship between the length L of the recessed structures 4 at the four corners of the device substrate 1 and the width D of the electrical conductor 12 is: 3.5D <L<5d;
[0038] The relationship between the width W of the recessed structure 4 and the width D of the electrical conductor 12 is: 3.5D <W<5D;
[0039] The relationship between the area S of the recessed structure 4 and the width D of the conductor 12 is: 3.5D * 3.5D <S<5D*5D。
[0040] Specifically, the size of the recessed structure is set here. If it is too large, it will cause short circuits between the circuits on the device, affecting the reliability of the device. If it is too small, it will affect the accuracy and stability of the subsequent installation of the mask clip.
[0041] In an optional implementation of this embodiment, the depth of the recessed structure 4 is the same as the thickness of the device substrate 1.
[0042] Specifically, the recessed structure 4 completely penetrates the device substrate 1.
[0043] In one optional implementation of this embodiment, the cross-section of the recessed structures 4 at the four corners of the device substrate 1 is rectangular, quarter-circular, or isosceles right triangle.
[0044] Specifically, in this embodiment, the cross-section of the recessed structure 4 is rectangular.
[0045] In an optional implementation of this embodiment, a pressing plate is further provided on the device substrate, and the device substrate and the pressing plate are bonded together by pressing adhesive. A light emission channel is provided on the pressing plate corresponding to the LED chip, and the LED chip is located in the light emission channel, which forms a reflector cup for the LED chip.
[0046] Specifically, such as Figure 4 As shown, Figure 4A cross-sectional view of the second structure of the LED display device in Embodiment 1 of this utility model is shown. A pressing plate 6 is also provided on the device substrate 1. The device substrate 1 and the pressing plate 6 are bonded together by pressing adhesive 7. A light-emitting channel 8 is provided on the pressing plate 6 corresponding to the LED chip 2, and the LED chip 2 is located in the light-emitting channel 8. The light-emitting channel 8 forms a reflector cup of the LED chip 2.
[0047] Here, a pressing plate is set up to form a reflector cup that creates the light emission channel for the LED chip, providing excellent light-focusing effect.
[0048] In summary, Embodiment 1 of this utility model provides an LED display device with recessed structures at the four corners of the LED display device and an encapsulation layer covering them. After the LED display device is surface-mounted to form an LED display module, the recessed structures enclose and form through holes, allowing the mask's clips to be engaged in the through holes and held in place by the encapsulation body. This improves the accuracy and stability of the mask being engaged in the LED display module, enhances the consistency and uniformity of the display module, and effectively optimizes the display effect.
[0049] Example 2
[0050] This utility model provides an LED display module in embodiment two. The LED display module includes a module substrate and a plurality of LED display devices as described in embodiment one. The LED display devices are disposed on the module substrate and arranged in an array. The recessed structure at the corner of the device substrate of every four adjacent LED display devices forms a through hole.
[0051] In one optional implementation of this embodiment, such as Figure 5 As shown, Figure 5 The diagram shows a first schematic diagram of the LED display module structure in Embodiment 2 of the present invention. The LED display module includes a module substrate 51 and a plurality of LED display devices 52 as described in Embodiment 1. The LED display devices 52 are disposed on the module substrate 51 and arranged in an array. The recessed structure of the corners of every four adjacent LED display devices forms a through hole 53.
[0052] It should be noted that a portion of the area above the through-hole 53 is covered by the package of the LED display device 52.
[0053] More, Figure 5 The structure of the mask is not shown in the text.
[0054] Furthermore, the through hole 53 only penetrates the device substrate of the LED display device 52, but does not penetrate the module substrate 51 of the LED display module.
[0055] In an optional implementation of this embodiment, the LED display module further includes a mask that fills the gaps between adjacent LED display devices and the through holes formed between every four adjacent LED display devices.
[0056] Specifically, such as Figure 6 and Figure 7 As shown, Figure 6 This shows a second schematic diagram of the LED display module structure in Embodiment 2 of the present invention. Figure 7 The diagram shows a third schematic of the LED display module structure in Embodiment 2 of the present invention. The LED display module further includes a mask 54, which fills the gaps between adjacent LED display devices 52 and the through holes 53 formed between every four adjacent LED display devices 52.
[0057] It should be noted that, in Figure 5 and Figure 6 The schematic diagram of the LED display device structure and Figure 1 Compared to China, Figure 5 and Figure 6 The solid line indicates that the package above the through-hole holds the face mask in place. Figure 1 The encapsulated object is then hidden.
[0058] In one optional implementation of this embodiment, such as Figure 8 As shown, Figure 8 The diagram shows a schematic of the mask structure in Embodiment 2 of this utility model. The mask 54 includes several longitudinally arranged first frame strips 55 and several transversely arranged second frame strips 56. Any first frame strip 55 and any second frame strip 56 are perpendicular to each other, and a buckle 57 is provided at the intersection of any first frame strip 55 and any second frame strip 56.
[0059] In an optional implementation of this embodiment, the buckle 57 is engaged with the through hole 53 formed by the LED display device 51, the first frame strip 55 fills the gap between adjacent column LED display devices 52, and the second frame strip 56 fills the gap between adjacent row LED display devices 52.
[0060] Specifically, in an array of LED display devices, in any 2x2 arrangement of LED display devices, the recessed structures at the lower right corner of the upper left LED display device, the upper right corner of the lower left LED display device, the lower left corner of the upper right LED display device, and the upper left corner of the lower right LED display device are close together and enclose to form a through hole. The upper left corner of the buckle located at this through hole is engaged with the recessed structure at the lower right corner of the upper left LED display device and is restricted from falling outward by the package of the upper left LED display device. The lower left, upper right, and lower right corners of the buckle are similarly secured.
[0061] The recessed structure of the LED display device forms a through hole that cooperates with the package body to snap onto the cover, thereby improving the accuracy and stability of the cover snapping onto the LED display module.
[0062] In an optional implementation of this embodiment, the relationship between the width d1 of the first frame strip, the patch spacing T of the LED display module, and the dot pitch P of the LED display device is: 0.9*(TP) <d1<0.95*(T-P);
[0063] The relationship between the width d2 of the second frame strip and the patch spacing T of the LED display module and the dot pitch P of the LED display device is: 0.9 * (TP) <d2<0.95*(T-P)。
[0064] Setting the width of the first and second frame strips here ensures better filling of the gaps between the LED beads. If the width is too small, it cannot fill the gaps completely; if the width is too large, it cannot fit into the gaps.
[0065] In an optional implementation of this embodiment, the relationship between the area C of the buckle and the area S of the through hole is: C = 0.9 * 4S.
[0066] The area of the buckle is set here so that it can be snapped into the through hole, improving the accuracy and stability of the mask snapping.
[0067] In an optional implementation of this embodiment, the relationship between the thickness b of the mask and the thickness B of the device substrate is: 0.5B <b<B。
[0068] The thickness of the mask is set here to reduce its impact on the light emission from the side of the display device and improve the light emission effect. If it is too thick, it will affect the light emission from the side of the device; if it is too thin, it will affect the performance of the mask.
[0069] In one optional implementation of this embodiment, the buckle 57 is rectangular, circular, or rhomboid in shape.
[0070] Specifically, when the recessed structure of the LED display device is rectangular, the enclosed through hole is rectangular and the buckle is rectangular; when the recessed structure of the LED display device is a quarter circle, the enclosed through hole is circular and the buckle is circular; when the recessed structure of the LED display device is an isosceles right triangle, the enclosed through hole is rhomboid and the buckle is rhomboid.
[0071] In summary, Embodiment 2 of this utility model provides an LED display module, including the LED display device and mask as described in Embodiment 1. Recessed structures are provided at the four corners of the LED display device, and an encapsulation layer covers them. After the LED display device is surface-mounted to form the LED display module, the recessed structures enclose and form through holes, allowing the mask's clips to be engaged in the through holes and held in place by the encapsulation body. This improves the accuracy and stability of the mask's engagement with the LED display module, enhances the consistency and uniformity of the display module, and effectively optimizes the display effect.
[0072] The above provides a detailed description of an LED display device and LED display module provided by the embodiments of this utility model. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.
Claims
1. An LED display device, characterized by, The LED display device comprises a device substrate, an upper surface of the device substrate is provided with an LED chip and a package covering the LED chip, four corners of the device substrate are recessed from outside to inside to form recessed structures, and the package covers above the recessed structures.
2. The LED display device of claim 1, wherein, The upper surface of the device substrate is further provided with a solder pad and an electric lead wire, a copper plating layer is provided on the side surface of the recessed structure of the four corners of the device substrate, the copper plating layer forms an electrode, the LED chip is arranged on the solder pad, and the solder pad is connected with the electrode based on the electric lead wire.
3. The LED display device of claim 2, wherein, Length of the recessed structure of the four corners of the device substrate Width of the electrical wire Satisfies the relationship: ; width of the recessed structure width of the electrical conductor satisfies the relationship: ; Area of the recessed structure Width of the electrical conductor satisfies the relationship: .
4. The LED display device of claim 1, wherein, The cross section of the recessed structure of the four corners of the device substrate is in a rectangular shape, a quarter circle shape or an isosceles right triangle shape.
5. The LED display device of claim 1, wherein, The device substrate is further provided with a pressing plate, the device substrate and the pressing plate are adhered by pressing glue, the pressing plate is provided with a light outlet channel penetrating the pressing plate corresponding to the LED chip, the LED chip is located in the light outlet channel, and the light outlet channel forms a reflection cup of the LED chip.
6. An LED display module, characterized in that, The LED display module comprises a module substrate and a plurality of LED display devices according to any one of claims 1-5, the LED display devices are arranged on the module substrate and arranged in an array, and the recessed structures of the corners of the device substrates of every four adjacent LED display devices enclose a through hole. The LED display module further comprises a mask, the mask is filled in the gap between adjacent LED display devices and the through hole formed between every four adjacent LED display devices. 7.The LED display module of claim 6, wherein, The mask comprises a plurality of first frame strips arranged longitudinally and a plurality of second frame strips arranged transversely, a buckle is arranged at the intersection of any first frame strip and any second frame strip, the buckle is clamped in the through hole formed between every four adjacent LED display devices, the first frame strips are filled in the gap between adjacent column LED display devices, and the second frame strips are filled in the gap between adjacent row LED display devices. 8.The LED display module of claim 7, wherein, Width of the first frame strip Pitch between patches of the LED display module Pitch between points of the LED display device Satisfies the relationship: ; Width of the second frame strip Pitch between patches of the LED display module Pitch between points of the LED display device Satisfies the relationship: . 9.The LED display module of claim 7, wherein, The area of the buckle The area of the recessed structure Satisfies the relationship: . 10.The LED display module of claim 6, wherein, The thickness of the face mask The thickness of the device substrate The relationship is satisfied: . 11.The LED display module of claim 7, wherein, The buckle is in a rectangular shape, a circular shape or a diamond shape.