Component for preventing silicon wafer fragments from being sucked into sucking pump and silicon wafer coating equipment

Abstract

The utility model relates to the technical field of solar cell manufacturing, in particular to an assembly for preventing silicon wafer fragments from being sucked into an air pump and silicon wafer coating equipment. The assembly for preventing the silicon wafer fragments from being sucked into the sucking pump comprises a first pipeline and a second pipeline, one end of the second pipeline is communicated with the middle of the first pipeline, and the other end of the second pipeline is communicated with the sucking pump; the first pipeline is provided with an upper opening and a lower opening, the upper opening is communicated with the vacuum cavity, the lower opening is located below the second pipeline in the first direction, the upper opening is communicated with the lower opening, the lower opening is detachably connected with a blocking piece, and the blocking piece is configured to block the lower opening. As the lower opening of the first pipeline is positioned below the second pipeline, the silicon wafer fragments can fall into the collecting area between the lower opening of the first pipeline and the second pipeline, so that the phenomenon that the silicon wafer fragments are sucked into the sucking pump by the sucking pump to damage the sucking pump is avoided, the later maintenance cost is reduced, and the working efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to solar cell manufacturing technical field especially relates to a kind of component for preventing silicon chip fragment suction into air suction pump and silicon chip coating equipment. BACKGROUND

[0002] With the development of economy and the progress of science and technology, solar cell as one of new energy products, is favored by people constantly. In the preparation process of solar cell, it is usually necessary to use physical vapor deposition equipment (Physical Vapor Deposition, PVD) to coat anti-reflective film on silicon wafer, so as to reduce the reflectivity of solar cell to light and improve the light absorption efficiency. However, in the PVD coating process, due to the vibration of the carrier plate or the mechanical hand feeding, the silicon wafer is not placed in place, which will cause the silicon wafer to be broken, and the broken silicon wafer will fall into the vacuum pipeline under the carrier plate. When the air suction pump is pumping, the silicon wafer fragments are easily sucked into the air suction pump with the airflow, which will cause damage to the butterfly valve and the air suction pump on the vacuum pipeline, increase the maintenance cost and reduce the work efficiency.

[0003] Therefore, it is urgent to design a kind of component for preventing silicon chip fragment suction into air suction pump and silicon chip coating equipment to solve the above technical problems. UTILITY MODEL CONTENT

[0004] The first purpose of the utility model is to provide a kind of component for preventing silicon chip fragment suction into air suction pump, which can reduce maintenance cost and improve work efficiency.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] The utility model provides a kind of component for preventing silicon chip fragment suction into air suction pump, including first pipeline and second pipeline, one end of the second pipeline is communicated with the middle part of the first pipeline, and the other end is communicated in air suction pump;The first pipeline has upper opening and lower opening, the upper opening is communicated with vacuum chamber, along the first direction, the lower opening is located below the second pipeline, and the upper opening and the lower opening are communicated, and the lower opening is detachably connected with blocking piece, and the blocking piece is configured to block the lower opening.

[0007] As an optional technical solution of a kind of component for preventing silicon chip fragment suction into air suction pump, the blocking piece includes first flange, cover plate and first fastener, the first fastener installs the cover plate at the lower opening through the first flange.

[0008] As an optional technical solution of a kind of component for preventing silicon chip fragment suction into air suction pump, the first fastener is provided as multiple, and multiple first fasteners are uniformly distributed along the circumference of the first flange.

[0009] As an optional technical solution of the component for preventing the silicon wafer fragments from being sucked into the air pump, the first pipeline is a three-way pipeline, the first pipeline has a side opening between the upper opening and the lower opening, and the side opening is communicated with the second pipeline.

[0010] As an optional technical solution of the component for preventing the silicon wafer fragments from being sucked into the air pump, the component for preventing the silicon wafer fragments from being sucked into the air pump further comprises a second flange and a second fastener, the side opening is connected with the second pipeline through the second flange, and the second fastener is arranged on the second flange.

[0011] As an optional technical solution of the component for preventing the silicon wafer fragments from being sucked into the air pump, the second fastener is arranged in a plurality of forms, and the plurality of second fasteners are uniformly distributed along the circumference of the second flange.

[0012] As an optional technical solution of the component for preventing the silicon wafer fragments from being sucked into the air pump, the distance between the lower opening and the side opening is set as L, and the L is not less than the diagonal length of the silicon wafer.

[0013] As an optional technical solution of the component for preventing the silicon wafer fragments from being sucked into the air pump, the component for preventing the silicon wafer fragments from being sucked into the air pump further comprises a third flange, and the second pipeline is connected with the air pump through the third flange.

[0014] The second purpose of the utility model lies in providing a silicon wafer coating equipment, saves the cost, improves work efficiency.

[0015] In order to achieve the purpose, the utility model adopts the following technical scheme:

[0016] The utility model provides a silicon wafer coating equipment, including vacuum chamber, air pump and above described component for preventing the silicon wafer fragments from being sucked into the air pump, one end of the component for preventing the silicon wafer fragments from being sucked into the air pump is communicated with the vacuum chamber, and the other end is communicated with the air pump.

[0017] As an optional technical solution of the silicon wafer coating equipment, the silicon wafer coating equipment further comprises a butterfly valve assembly, and the butterfly valve assembly is arranged between the component for preventing the silicon wafer fragments from being sucked into the air pump and the air pump.

[0018] The utility model has at least the following beneficial effects:

[0019] The utility model provides a kind of prevent silicon chip fragment suction air pump's assembly, the prevent silicon chip fragment suction air pump's assembly includes first pipeline and second pipeline, one end of second pipeline is communicated with the middle part of first pipeline, and the other end is communicated in air pump;First pipeline has upper opening and lower opening, upper opening is communicated with vacuum chamber, along first direction, lower opening is below second pipeline, and upper opening and lower opening are communicated, and lower opening is detachably connected with blocking piece, blocking piece is configured to block lower opening.Due to the lower opening of first pipeline is below second pipeline, silicon chip fragment will fall in the collection area between the lower opening of first pipeline and second pipeline, to avoid the phenomenon that silicon chip fragment is sucked into air pump by air pump and damages air pump, reduce the maintenance cost of later period, improve work efficiency.

[0020] The utility model also provides a kind of silicon chip coating equipment, which can make silicon chip fragment fall in the collection area of first pipeline, so that silicon chip fragment will not enter butterfly valve and air pump with airflow when air pump is pumping, avoiding damage to butterfly valve and air pump, saving cost and improving work efficiency. DRAWINGS

[0021] To more clearly illustrate the technical scheme in the embodiments of the utility model, the drawings needed to be used in the description of the embodiments of the utility model will be simply introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained according to the contents of the embodiments of the utility model and these drawings without creative labor for those skilled in the art.

[0022] Figure 1 The structure diagram of the prevent silicon chip fragment suction air pump's assembly provided by the embodiments of the utility model is shown.

[0023] Figure 2 The front view of the silicon chip coating equipment provided by the embodiments of the utility model is shown.

[0024] REFERENCE NUMERALS

[0025] 100, first pipeline;110, upper opening;200, second pipeline;210, second flange;220, second fastener;300, blocking piece;310, first flange;320, cover plate;330, first fastener;400, air pump;500, vacuum chamber;600, butterfly valve assembly. DETAILED DESCRIPTION

[0026] To make the technical problems solved by the utility model, the technical scheme adopted and the technical effects reached more clear, the technical scheme of the utility model will be further illustrated below by specific implementation manner and combining with the drawings.

[0027] In the description of the utility model, unless another definite provision and limitation, the term "link", "connect", "fix" should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or be integrated;Can be mechanical connection, also can be electrical connection;Can be directly connected, also can be indirectly connected through the intermediate medium, can be two elements inside the communication or two element's mutual action relation.For the ordinary skill in the art, the specific meaning of the above-mentioned terms in the utility model can be understood according to the specific circumstances.

[0028] In the utility model, unless another definite provision and limitation, the first feature is "on" or "under" the second feature can include the first and second features direct contact, also can include the first and second features are not direct contact but contact through the additional feature between them.Moreover, the first feature is "on", "above" and "on" the second feature includes the first feature is directly above and obliquely above the second feature, or just indicates that the horizontal height of the first feature is higher than the second feature.The first feature is "under", "below" and "under" the second feature includes the first feature is directly below and obliquely below the second feature, or just indicates that the horizontal height of the first feature is less than the second feature.

[0029] In the description of the embodiment, the orientation or position relationship of the terms "on", "under", "left", "right" and the like is based on the orientation or position relationship shown in the drawing, only for the convenience of description and simplification of operation, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore cannot be understood as a limitation on the utility model.In addition, the terms "first", "second" are only used to distinguish in description, and have no special meaning.

[0030] As Figures 1-2 shown, the embodiment provides a kind of to prevent the component of silicon chip fragment suction into air pump, which mainly includes first pipeline 100 and second pipeline 200, one end of second pipeline 200 is communicated with the middle part of first pipeline 100, and the other end is communicated in air pump 400;First pipeline 100 has upper opening 110 and lower opening, upper opening 110 is communicated with vacuum chamber 500, along first direction, lower opening is below second pipeline 200, and upper opening 110 and lower opening are communicated, and lower opening is detachably connected with obturator 300, obturator 300 is configured to obturate lower opening.It needs to be explained that the first direction in the embodiment is X-axis direction in Figure 1 .

[0031] Based on the above design, in the embodiment, the silicon wafer is placed on the carrier plate in the vacuum chamber 500. In the normal coating process, the vacuum pump 400 is started, and the vacuum pump 400 evacuates the vacuum chamber 500 through the second pipeline 200 and the first pipeline 100 to perform the coating process. When the carrier plate vibrates or the mechanical hand loads the silicon wafer to cause the silicon wafer to be not placed in place, the silicon wafer fragments will fall to the bottom of the first pipeline 100 and be supported by the blocking piece 300. Since the lower opening of the first pipeline 100 is located below the second pipeline 200, at this time, the silicon wafer fragments are in the collection area between the lower opening of the first pipeline 100 and the second pipeline 200, thereby avoiding the phenomenon that the silicon wafer fragments are sucked into the vacuum pump 400 by the vacuum pump 400 and damage the vacuum pump 400, reducing the maintenance cost in the later period and improving the work efficiency.

[0032] Optionally, the vacuum pump 400 in the embodiment can be provided in multiple groups, for example, three groups, four groups, or five groups, etc., thereby forming a vacuum pump group.

[0033] As shown in Figure 1 In the embodiment, the blocking piece 300 includes a first flange 310, a cover plate 320, and a first fastener 330, and the first fastener 330 installs the cover plate 320 at the lower opening through the first flange 310. The detachable connection of the blocking piece 300 and the lower opening can be realized through the first flange 310, the cover plate 320, and the first fastener 330. When the PVD equipment is shut down for maintenance, the operating personnel only need to disassemble the cover plate 320 to clean out the silicon wafer fragments in the first pipeline 100, which is convenient and fast, saves time and effort, and improves the maintenance efficiency. Of course, the blocking piece 300 can also be provided as other components, which are threadedly connected with the lower opening to support the silicon wafer fragments. The selection and arrangement of the components need to ensure the sealing with the lower opening to ensure the vacuum degree of the first pipeline 100.

[0034] Further, the first fastener 330 in the embodiment can be provided as a bolt, and the first fastener 330 is provided in multiple numbers and is uniformly distributed along the circumference of the first flange 310, thereby improving the uniformity of the stress of the first flange 310 and avoiding the phenomenon of stress concentration.

[0035] As shown in Figure 1 In the embodiment, the first pipeline 100 is a three-way pipeline, and the first pipeline 100 has a side opening between the upper opening 110 and the lower opening. The side opening is in communication with the second pipeline 200, thereby improving the convenience and reliability of the communication between the first pipeline 100 and the second pipeline 200.

[0036] Furthermore, the component for preventing silicon wafer fragments from being sucked into the vacuum pump in this embodiment also includes a second flange 210 and a second fastener 220. The side opening is connected to the second pipeline 200 through the second flange 210, and the second fastener 220 is disposed on the second flange 210. Multiple second fasteners 220 are provided, and these multiple second fasteners 220 are evenly distributed along the circumference of the second flange 210, thereby improving the uniformity of stress on the second flange 210 and avoiding stress concentration.

[0037] Optionally, the second fastener 220 in this embodiment can be a bolt.

[0038] Optionally, the component for preventing silicon wafer fragments from being sucked into the vacuum pump in this embodiment also includes a third flange, through which the second pipeline 200 is connected to the vacuum pump 400 to improve airtightness and reduce air leakage.

[0039] like Figure 1 As shown, in this embodiment, the distance between the lower opening and the side opening of the first conduit 100 is set to L. Since the silicon wafer is typically square, the value of L is not less than the diagonal length of the silicon wafer. This ensures that fallen silicon wafer fragments can be completely contained within a collection area of ​​height L, preventing the fragments from clogging the side opening and ensuring the normal operation of the coating process. Of course, in this embodiment, the inner diameters of both the first conduit 100 and the second conduit 200 are greater than the diagonal length of the silicon wafer, ensuring that the silicon wafer fragments can fall smoothly into the collection area.

[0040] like Figure 2 As shown, this embodiment also provides a silicon wafer coating apparatus, which includes a vacuum chamber 500, a vacuum pump 400, and the aforementioned component for preventing silicon wafer fragments from being sucked into the vacuum pump. One end of the component for preventing silicon wafer fragments from being sucked into the vacuum pump is connected to the vacuum chamber 500, and the other end is connected to the vacuum pump 400. The silicon wafer coating apparatus also includes a butterfly valve assembly 600, which is disposed between the component for preventing silicon wafer fragments from being sucked into the vacuum pump and the vacuum pump 400. By controlling the opening of the butterfly valve assembly 600, the operator can control the vacuum level in the vacuum chamber 500, which is beneficial for debugging and optimizing the coating process. This silicon wafer coating apparatus allows silicon wafer fragments to fall into the collection area of ​​the first pipeline 100, thereby preventing silicon wafer fragments from entering the butterfly valve assembly 600 and the vacuum pump 400 with the airflow when the vacuum pump 400 is pumping air, avoiding damage to the butterfly valve assembly 600 and the vacuum pump 400, saving costs, and improving work efficiency.

[0041] Obviously, the above only preferred embodiments of the present application and the use of technical principles. Those skilled in the art will understand that the present application is not limited to the specific embodiments here, those skilled in the art can make various obvious changes, re-adjustment and replacement without departing from the scope of the present application. Therefore, although the above embodiments of the present application has been described in more detail, but the present application is not limited to the above examples, without departing from the present application, the idea can also include more other equivalent embodiments, and the scope of the present application is determined by the appended claims.

[0042] Note that in the description of the present specification, the description referring to the terms "some embodiments", "other embodiments", and the like means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In the present specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. A component for preventing silicon wafer fragments from being sucked into a vacuum pump, characterized in that, It includes a first pipe (100) and a second pipe (200), one end of the second pipe (200) is connected to the middle of the first pipe (100), and the other end is connected to a vacuum pump (400); the first pipe (100) has an upper opening (110) and a lower opening, the upper opening (110) is connected to a vacuum chamber (500), and along a first direction, the lower opening is located below the second pipe (200), and the upper opening (110) and the lower opening are connected, and a sealing member (300) is detachably connected to the lower opening, the sealing member (300) being configured to seal the lower opening.

2. The component for preventing silicon wafer fragments from being sucked into the air pump according to claim 1, characterized in that, The sealing component (300) includes a first flange (310), a cover plate (320), and a first fastener (330), the first fastener (330) mounting the cover plate (320) to the lower opening via the first flange (310).

3. The component for preventing silicon wafer fragments from being sucked into the air pump according to claim 2, characterized in that, The first fastener (330) is provided in multiple ways, and the multiple first fasteners (330) are evenly distributed along the circumference of the first flange (310).

4. The component for preventing silicon wafer fragments from being sucked into the air pump according to claim 1, characterized in that, The first pipe (100) is a tee pipe, and the first pipe (100) has a side opening, which is located between the upper opening (110) and the lower opening, and the side opening is connected to the second pipe (200).

5. The component for preventing silicon wafer fragments from being sucked into the air pump according to claim 4, characterized in that, The assembly for preventing silicon wafer fragments from being sucked into the air pump also includes a second flange (210) and a second fastener (220), the side opening being connected to the second pipeline (200) via the second flange (210), and the second fastener (220) being disposed on the second flange (210).

6. The assembly for preventing silicon wafer fragments from being sucked into the air pump according to claim 5, characterized in that, The second fastener (220) is provided in multiple forms, and the multiple second fasteners (220) are evenly distributed along the circumference of the second flange (210).

7. The assembly for preventing silicon wafer fragments from being sucked into the air pump according to claim 4, characterized in that, The distance between the lower opening and the side opening is set to L, where L is not less than the diagonal length of the silicon wafer.

8. The component for preventing silicon wafer fragments from being sucked into the air pump according to claim 1, characterized in that, The assembly for preventing silicon wafer fragments from being sucked into the vacuum pump also includes a third flange, through which the second pipeline (200) is connected to the vacuum pump (400).

9. A silicon wafer coating equipment, characterized in that, The device includes a vacuum chamber (500), a vacuum pump (400), and an assembly for preventing silicon wafer debris from being sucked into the vacuum pump according to any one of claims 1-8, wherein one end of the assembly for preventing silicon wafer debris from being sucked into the vacuum pump is connected to the vacuum chamber (500), and the other end is connected to the vacuum pump (400).

10. The silicon wafer coating equipment according to claim 9, characterized in that, The silicon wafer coating equipment also includes a butterfly valve assembly (600), which is disposed between the assembly preventing silicon wafer fragments from being sucked into the vacuum pump and the vacuum pump (400).

Images