Sapphire inlaying equipment and semiconductor device
By combining a limiting plate, a correction device, a clamping device, and a sealing device, the problem of unstable sapphire setting was solved, and sapphire was firmly set on the metal surface, thus improving product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-18
- Publication Date
- 2026-03-31
AI Technical Summary
When sapphire is set on a metal surface, some of it is exposed and cannot be completely encased by the metal, resulting in an unstable setting and affecting product quality.
By employing a limiting plate, a correction device, a pressing device, and a sealing device, the sidewalls of the sapphire setting groove are deformed through the processes of correction, pressing, and sealing, thus achieving a secure setting of the sapphire.
This ensures that the sapphire is securely set in the metal surface, improving product quality.
Smart Images
Figure CN224059743U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor fabrication technology, and in particular to a sapphire inlay device and a semiconductor device. Background Technology
[0002] Sapphire setting involves setting sapphires onto a metal surface, with some of the sapphire exposed on the outside of the metal. Because the metal cannot completely enclose the sapphire, it cannot be securely set on the metal surface, affecting the quality of the product.
[0003] Therefore, there is an urgent need for a sapphire setting device to solve the above-mentioned technical problems. Utility Model Content
[0004] The purpose of this invention is to provide a sapphire setting device that can solve the problem that when setting sapphires on a metal surface, with the sapphire partially exposed on the outside of the metal surface, the metal cannot completely enclose the sapphire, resulting in the sapphire not being securely set on the metal surface, thus affecting product quality.
[0005] To achieve this objective, the present invention adopts the following technical solution:
[0006] A sapphire setting device, including
[0007] The limiting plate is equipped with limiting holes;
[0008] The correction device includes a correction pressure head, the shape of which matches the shape of the sapphire setting groove 62.
[0009] A clamping device is provided with a clamping head, the clamping head having a first groove, the shape of the first groove matching the shape of the sapphire exposed on the inlaid metal surface;
[0010] A sealing device is provided with a sealing head, the sealing head having a conical groove, the inner diameter of the bottom of the conical groove being equal to the outer diameter of the first groove;
[0011] When the correction device, the pressing device, and the sealing device are respectively placed in the limiting hole, the correction head, the pressing head, and the sealing head are at least located outside the limiting hole.
[0012] As an optional solution, the correction device further includes a first pressure-applying part and a first limiting rod connected to the first pressure-applying part. The correction pressure head is disposed at the lower end of the first limiting rod. The diameter of the first limiting rod is equal to the inner diameter of the limiting hole, and the diameter of the first pressure-applying part is greater than the inner diameter of the limiting hole.
[0013] As an optional solution, the clamping device further includes a second pressing part and a second limiting rod connected to the second pressing part. The clamping head is disposed at the lower end of the second limiting rod. The diameter of the second limiting rod is equal to the inner diameter of the limiting hole, and the diameter of the second pressing part is greater than the inner diameter of the limiting hole.
[0014] As an optional solution, the sealing device includes a third pressure-applying part and a third limiting rod connected to the third pressure-applying part. The sealing device is located at the lower end of the third limiting rod. The diameter of the third limiting rod is equal to the inner diameter of the limiting hole, and the diameter of the third pressure-applying part is greater than the inner diameter of the limiting hole.
[0015] As an optional solution, a workbench is also included, the workbench comprising a tabletop and a support plate connected to the tabletop, and a positioning device is provided on the surface of the tabletop away from the support plate.
[0016] As an optional solution, the positioning device is a positioning strip disposed around the table surface, the positioning strip having fixing holes for fixing the limiting plate.
[0017] As an alternative, a fixing device is provided on the surface of the platform away from the support plate.
[0018] As an optional solution, the tabletop is provided with a through-hole for picking up and putting down items.
[0019] As an alternative, the workbench also includes a base plate connected to the lower end of the support plate.
[0020] This application also provides a semiconductor device, including a body and a sapphire mounting groove disposed on the body, wherein a second groove is provided between the outer wall of the sapphire mounting groove and the body.
[0021] This utility model has at least the following beneficial effects:
[0022] In the sapphire setting device provided by this utility model, the conical groove can be engaged with the outer periphery of the side wall of the sapphire setting groove. The side wall of the conical groove is located in the second groove. As the conical groove moves continuously toward the sapphire under the action of external force, the side wall of the sapphire setting groove is continuously deformed, thereby making the body hold the sapphire tightly and the sapphire firmly set on the surface of the object. Attached Figure Description
[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments of this utility model will be briefly introduced below.
[0024] Figure 1 A schematic diagram of a sapphire setting device provided for an embodiment of this utility model;
[0025] Figure 2 An exploded view of a sapphire setting device provided in an embodiment of this utility model;
[0026] Figure 3 A schematic diagram of the correction device provided in this embodiment of the utility model;
[0027] Figure 4 A schematic diagram of the pressing device provided in this embodiment of the utility model;
[0028] Figure 5 A schematic diagram of the sealing device provided in this embodiment of the utility model;
[0029] Figure 6 A structural schematic diagram of the sealing device provided in this embodiment of the utility model from another angle;
[0030] Figure 7 This is a schematic diagram of the structure of a semiconductor device provided in an embodiment of the present invention;
[0031] Figure 8 for Figure 7 Enlarged view of part A in the image;
[0032] Figure 9 A schematic diagram of the structure of the workbench provided in an embodiment of this utility model.
[0033] Figure label:
[0034] 1. Limiting plate; 11. Limiting hole; 2. Correction device; 21. Correction pressure head; 22. First limiting rod; 23. First pressure application part; 3. Pressing device; 31. Pressing pressure head; 311. First groove; 32. Second limiting rod; 33. Second pressure application part; 4. Sealing device; 41. Sealing pressure head; 411. Conical groove; 42. Third limiting rod; 43. Third pressure application part; 5. Worktable; 51. Table surface; 511. Positioning device; 512. Fixing device; 513. Pick-up and drop hole; 52. Support plate; 53. Base plate; 6. Semiconductor device; 61. Body; 62. Sapphire inlay groove; 63. Second groove. Detailed Implementation
[0035] In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.
[0036] In the prior art, when sapphire is set on a metal surface and is required to be partially exposed on the outside of the metal surface, the metal cannot completely cover the sapphire, resulting in the sapphire not being securely set on the metal surface, which affects the quality of the product.
[0037] Therefore, such as Figures 1 to 9 As shown, an embodiment of this utility model provides a sapphire setting device to solve the above-mentioned technical problems.
[0038] This application provides a semiconductor device 6, such as Figure 7 , Figure 8 As shown, it includes a body 61 and a sapphire setting groove 62 disposed on the body 61. The sapphire setting groove 62 can accommodate the sapphire to be set. The body 61 can be made of metal. A second groove 63 is provided between the outer wall of the sapphire setting groove 62 and the body 61. In this way, when the sapphire is placed in the sapphire setting groove 62, the outer wall of the sapphire setting groove 62 can easily wrap the sapphire under the action of external force.
[0039] This application also provides a sapphire setting device, such as Figures 1 to 6 As shown, the device includes a limiting plate 1, a correction device 2, a pressing device 3, and a sealing device 4. The limiting plate 1 has a limiting hole 11. The correction device 2 has a correction pressure head 21, the shape of which matches the shape of the sapphire setting groove 62. The pressing device 3 has a pressing pressure head 31, on which a first groove 311 is provided, the shape of which matches the shape of the sapphire protruding from the body 61. The sealing device 4 has a sealing pressure head 41, which has a conical groove 411, the inner diameter of which is equal to the outer diameter of the sapphire setting groove 62. During the process of setting the sapphire into the body 61, firstly, the correction device 2 is placed inside the limiting hole 11, and the shape of the sapphire setting groove 62 is corrected using the correction pressure head 21 to ensure that the height of the sapphire protruding from the body 61 meets the production requirements; then, the sapphire is placed inside the sapphire setting groove 62, the pressing device 3 is placed inside the limiting hole 11, and the pressing pressure head 31 is used to squeeze the sapphire, so that part of the sapphire enters the sapphire setting groove 62, and part of the sapphire is located in the first groove. Within 311, this allows for precise control of the height at which the sapphire protrudes from the surface of the body 61. Finally, the sealing device 4 is placed in the limiting hole 11, and the conical groove 411 can be engaged with the outer periphery of the side wall of the sapphire setting groove 62. The side wall of the conical groove 411 is located within the second groove 63. As the conical groove 411 moves towards the sapphire under the action of external force, the side wall of the sapphire setting groove 62 continuously deforms, thereby allowing the body 61 to hold the sapphire tightly and prevent the sapphire from falling off the surface of the body 61.
[0040] In some embodiments, such as Figure 3 As shown, the correction device 2 also includes a first pressing part 23 and a first limiting rod 22 connected to the first pressing part 23. A correction pressure head 21 is disposed at the lower end of the first limiting rod 22. The diameter of the first limiting rod 22 is equal to the inner diameter of the limiting hole 11. This prevents the correction device 2 from tilting when the first limiting rod 22 is placed in the limiting hole 11, ensuring the correction effect of the correction pressure head 21 on the sapphire mounting groove 62. The sum of the length of the first limiting rod 22 and the length of the correction pressure head 21 is greater than the depth of the limiting hole 11, thus ensuring... When the correction device 2 is placed in the limiting hole 11, at least part of the correction pressure head 21 protrudes from the limiting hole 11. Alternatively, the length of the first limiting rod 22, the length of the correction pressure head 21, and the depth of the limiting hole 11 can be determined according to the actual production needs, so that the correction pressure head 21 can have a better correction effect on the sapphire inlay groove 62. The diameter of the first pressing part 23 is larger than the inner diameter of the limiting hole 11, which makes it easier to apply external force to the correction device 2 and also limits the position of the first limiting rod 22 in the limiting hole 11.
[0041] In some embodiments, such as Figure 4 As shown, the clamping device 3 also includes a second pressing part 33 and a second limiting rod 32 connected to the second pressing part 33. The clamping head 31 is disposed at the lower end of the second limiting rod 32. The diameter of the second limiting rod 32 is equal to the inner diameter of the limiting hole 11. This prevents the clamping device 3 from tilting as a whole when the second limiting rod 32 is placed in the limiting hole 11, ensuring the squeezing effect of the clamping head 31 on the sapphire. The sum of the length of the second limiting rod 32 and the length of the clamping head 31 is greater than the limiting hole 11, thus ensuring the clamping device 3 can be placed in a position that allows for proper clamping. When placed inside the limiting hole 11, at least part of the pressing head 31 can protrude from the limiting hole 11, ensuring that the pressing head 31 can squeeze the sapphire. In order to achieve a better squeezing effect of the pressing head 31 on the sapphire, the length of the second limiting rod 32, the length of the pressing head 31, and the depth of the limiting hole 11 can be adjusted according to actual needs. The diameter of the second pressing part 33 is larger than the inner diameter of the limiting hole 11, which makes it convenient to apply external force to the pressing device 3 and also better limits the length of the second limiting rod 32 inside the limiting hole 11.
[0042] In some embodiments, such as Figure 5 , Figure 6 As shown, the sealing device 4 includes a third pressing part 43 and a third limiting rod 42 connected to the third pressing part 43. The sealing device 4 is located at the lower end of the third limiting rod 42. The diameter of the third limiting rod 42 is equal to the inner diameter of the limiting hole 11. This prevents the sealing device 4 from tilting when the third limiting rod 42 is placed in the limiting hole 11, thus ensuring the sealing effect of the sealing device 4 on the sapphire. The diameter of the third pressing part 43 is larger than the inner diameter of the limiting hole 11, which facilitates the application of external force to the sealing device 4 and also better limits the length of the third limiting rod 42 in the limiting hole 11.
[0043] In some embodiments, such as Figure 9 As shown, in order to facilitate the setting of sapphire on the surface of the body 61, this application also includes a worktable 5. The worktable 5 includes a table surface 51 and a support plate 52 connected to the table surface 51. A positioning device 511 is provided on the surface of the table surface 51 away from the support plate 52. The positioning device 511 is used to limit the body 61 on the table surface 51.
[0044] In some embodiments, to reduce the manufacturing cost of the sapphire setting device of this application, the positioning device 511 can be a positioning strip disposed around the table 51, and the area and shape enclosed by the positioning strips are the same as the body 61; the positioning strip is provided with fixing holes. In the process of setting the sapphire on the surface of the body 61, the body is first placed on the table 51, and then the fixing limiting plate 1 is fixed to the positioning strip with bolts and fixing holes. This can prevent the limiting plate 1 from moving relative to the body 61 during operation.
[0045] In some embodiments, to prevent the body 61 from moving on the tabletop 51, a fixing device 512 is provided on the surface of the tabletop 51 away from the support plate 52. The fixing device 512 can be a fixing post, and the body 61 can be provided with a through hole. When the body is placed on the tabletop 51, the through hole is fitted onto the fixing post.
[0046] In some embodiments, the work surface 51 is provided with a pick-up and put-down hole 513 that penetrates the work surface 51, so that the operator can apply an upward force to the body 61 through the pick-up and put-down hole 513, thereby facilitating the removal of the body 61 from the work surface 51.
[0047] In some embodiments, the worktable 5 further includes a base plate 53, which is connected to the lower end of the support plate 52, thereby enhancing the stability of the worktable 5.
[0048] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.
Claims
1. A sapphire mounting apparatus, characterized by, Comprising A limiting plate (1) is provided with a limiting hole (11); A correction device (2) is provided with a correction pressure head (21), the shape of the correction pressure head (21) matches the shape of the sapphire inlay groove; A compression device (3) is provided with a compression pressure head (31), the first groove (311) is provided on the compression pressure head (31), the shape of the first groove (311) matches the shape of the sapphire exposed inlay metal surface; The sealing and pressing device (4) is provided with a sealing and pressing pressure head (41), the sealing and pressing pressure head (41) is provided with a tapered groove (411), the inner diameter of the bottom of the tapered groove (411) is equal to the outer diameter of the first groove (311); When the correction device (2), the compression device (3) and the sealing and pressing device (4) are placed in the limiting hole (11) respectively, the correction pressure head (21), the compression pressure head (31) and the sealing and pressing pressure head (41) are located at least outside the limiting hole (11).
2. A sapphire mounting apparatus according to claim 1, wherein The correction device (2) further comprises a first pressure applying part (23) and a first limiting rod (22) connected to the first pressure applying part (23), the correction pressure head (21) is arranged at the lower end of the first limiting rod (22), the diameter of the first limiting rod (22) is equal to the inner diameter of the limiting hole (11), and the diameter of the first pressure applying part (23) is greater than the inner diameter of the limiting hole (11).
3. The sapphire mounting apparatus of claim 1, wherein, The compression device (3) further comprises a second pressure applying part (33) and a second limiting rod (32) connected to the second pressure applying part (33), the compression pressure head (31) is arranged at the lower end of the second limiting rod (32), the diameter of the second limiting rod (32) is equal to the inner diameter of the limiting hole (11), and the diameter of the second pressure applying part (33) is greater than the inner diameter of the limiting hole (11).
4. The sapphire mounting apparatus of claim 1, wherein, The sealing and pressing device (4) comprises a third pressure applying part (43) and a third limiting rod (42) connected to the third pressure applying part (43), the sealing and pressing device (4) is arranged at the lower end of the third limiting rod (42), the diameter of the third limiting rod (42) is equal to the inner diameter of the limiting hole (11), and the diameter of the third pressure applying part (43) is greater than the inner diameter of the limiting hole (11).
5. A sapphire mounting apparatus according to any one of claims 1 to 4, wherein Further comprising a workbench (5), the workbench (5) comprises a table top (51) and a supporting plate (52) connected to the table top (51), and a positioning device (511) is arranged on the surface of the table top (51) away from the supporting plate (52).
6. A sapphire mounting apparatus according to claim 5, wherein The positioning device (511) is a positioning strip arranged around the table top (51), and a fixing hole is arranged on the positioning strip, which is used for fixing the limiting plate (1).
7. A sapphire mounting apparatus according to claim 5, wherein A fixing device (512) is arranged on the surface of the table top (51) away from the supporting plate (52).
8. The sapphire mounting apparatus of claim 5, wherein, The table top (51) is provided with a taking and placing hole (513) penetrating through the table top (51).
9. The sapphire mounting apparatus of claim 5, wherein, The workbench (5) further comprises a bottom plate (53) connected to the lower end of the supporting plate (52).
10. A semiconductor device (6), characterized by Comprising a body (61) and a sapphire inlay groove (62) arranged on the body (61), and a second groove (63) is arranged between the outer wall of the sapphire inlay groove (62) and the body (61).