Compact laser light source packaging structure

Abstract

The utility model relates to the technical field of compact laser light source projection, in particular to a compact laser light source packaging structure. Comprising a copper bearing body, the copper bearing body is provided with three connecting surfaces, one connecting surface is provided with a first laser diode mounting position, the other connecting surface is provided with a second laser diode mounting position, and the remaining connecting surface is provided with a third laser diode mounting position. The bearing body is provided with three connecting surfaces which are respectively provided with a first laser diode mounting position, a second laser diode mounting position and a third laser diode mounting position, the unique design breaks through an existing conventional bearing body structure, the bearing body is designed into various shapes such as an equilateral triangle, an isosceles triangle or a right triangle, the space structure advantages are fully utilized, and meanwhile, the bearing body is more compact in structure. And different numbers of laser diode mounting positions are reasonably arranged on different connecting surfaces, so that the compact arrangement effect of the laser diodes is realized, and the arrangement density of the laser diodes is improved.

Description

Technical Field

[0001] This utility model relates to the field of compact laser light source projection technology, and in particular to a compact laser light source packaging structure. Background Technology

[0002] In the field of methane detection, the laser diode is a key light source component, and its performance and application directly affect the accuracy and efficiency of methane detection. Existing laser diode carrier technology has played an important role in the development of methane detection equipment. Some traditional carrier structures, such as simple planar carrier structures, can meet the installation requirements of laser diodes to a certain extent, enabling the laser diodes to emit laser light stably and provide a stable light source for methane detection.

[0003] With the development of technology, some carriers have also made certain improvements in heat dissipation design. By adopting some heat dissipation materials or heat dissipation structures, the heat generated when the laser diode is working can be dissipated in a timely manner, ensuring the stability of the laser diode's performance, thereby improving the reliability and stability of methane detection. These beneficial effects have led to the application and promotion of existing laser diode carrier technology in the field of methane detection to a certain extent.

[0004] However, in terms of laser diode arrangement, most existing carrier structures are relatively conventional, making it difficult to achieve a compact arrangement effect. Existing carrier structures lack innovation in structural design, with limited exploration of different shapes and structures, and cannot fully utilize the advantages of spatial structure to improve the arrangement density of laser diodes. Utility Model Content

[0005] The purpose of this invention is to provide a compact laser source packaging structure, which aims to solve the technical problems in the existing technology of laser diode arrangement, where the existing carrier structures are mostly conventional and it is difficult to achieve a compact arrangement effect. The existing carriers lack innovation in structural design, have limited exploration of different shapes and structures, and cannot make full use of the spatial structure advantages to improve the arrangement density of laser diodes.

[0006] To achieve the above objectives, this utility model adopts a compact laser source packaging structure, including a copper carrier. The copper carrier has three connecting surfaces, one of which is provided with a first laser diode mounting position, another of which is provided with a second laser diode mounting position, and the remaining connecting surface is provided with a third laser diode mounting position.

[0007] The copper carrier is a one-piece molded structure.

[0008] The copper carrier is one of an equilateral triangle, an isosceles triangle, or a right triangle.

[0009] The number of the first laser diode mounting positions is 2 to 4.

[0010] The number of mounting positions for the second laser diode is 3-6.

[0011] The number of mounting positions for the third laser diode is 4-7.

[0012] The first laser diode mounting position is located on one side of the copper carrier, the second laser diode mounting position is located on the other side of the copper carrier, and the first laser diode mounting position and the second laser diode mounting position are symmetrically arranged. The third laser diode mounting position is located below the copper carrier.

[0013] This utility model discloses a compact laser source packaging structure, including a copper carrier. The copper carrier has three connecting surfaces, one of which has a first laser diode mounting position, another has a second laser diode mounting position, and the remaining connecting surface has a third laser diode mounting position. By using the copper carrier, which is a one-piece molded structure with three connecting surfaces and the first, second, and third laser diode mounting positions respectively, this unique design breaks away from the existing conventional carrier structure. Furthermore, by designing the carrier into various shapes such as equilateral triangles, isosceles triangles, or right triangles, different spatial structures are explored, making full use of the advantages of spatial structures. At the same time, different numbers of laser diode mounting positions are reasonably set on different connecting surfaces, such as 2-4 first laser diode mounting positions, 3-6 second laser diode mounting positions, and 4-7 third laser diode mounting positions. The first and second laser diode mounting positions are symmetrically arranged, achieving a compact arrangement effect of laser diodes and improving the arrangement density of laser diodes. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a left view of the compact laser source packaging structure of this utility model.

[0016] Figure 2 This is a top view of the compact laser source packaging structure of this utility model.

[0017] Figure 3 This is a front view of the compact laser source packaging structure of this utility model.

[0018] Figure 4 This is a bottom view of the compact laser source packaging structure of this utility model.

[0019] 1-Copper carrier, 2-Connecting surface, 3-First laser diode mounting position, 4-Second laser diode mounting position, 5-Third laser diode mounting position. Detailed Implementation

[0020] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0021] Please see Figures 1 to 4 This utility model provides a compact laser source packaging structure, including a copper carrier 1. The copper carrier 1 has three connecting surfaces 2, one of which is provided with a first laser diode mounting position 3, another of which is provided with a second laser diode mounting position 4, and the remaining connecting surface 2 is provided with a third laser diode mounting position 5.

[0022] In this embodiment, a copper carrier 1 is used. Copper has good thermal conductivity, which can quickly conduct away the heat generated by the laser diode, ensuring that the laser diode operates at a suitable temperature and improving its stability and service life. At the same time, the carrier has three connecting surfaces 2 and is respectively provided with first, second and third laser diode mounting positions 5. This layout provides multiple position options for the installation of the laser diode. Compared with the traditional single mounting surface structure, it can arrange the distribution of the laser diode more flexibly, providing a basis for achieving compact arrangement. It helps to integrate more laser diodes in a limited space and improve the power and performance of the light source.

[0023] Furthermore, the copper carrier 1 is a one-piece molded structure.

[0024] In this embodiment, the one-piece molding process eliminates the connection gaps in the carrier during manufacturing, avoiding the problem of increased thermal resistance caused by gaps, further improving heat conduction efficiency, and ensuring that the heat generated by the laser diode can be dissipated quickly and evenly. In addition, the one-piece molding structure also enhances the overall strength and stability of the carrier, reduces the impact of structural loosening or deformation on the installation accuracy of the laser diode, and improves the reliability and durability of the packaging structure.

[0025] Furthermore, the copper carrier 1 is one of an equilateral triangle, an isosceles triangle, or a right triangle.

[0026] In this embodiment, these special shapes can make fuller use of space compared to traditional square or circular carriers. The triangular structure can form multiple different installation angles and positions within a limited space, allowing the laser diodes to be arranged in a more compact manner. Different shaped triangular carriers can also be flexibly selected according to specific application scenarios and needs, providing more possibilities for the packaging design of laser light sources, further optimizing space utilization, and improving the arrangement density of laser diodes.

[0027] Furthermore, the number of the first laser diode mounting positions 3 is 2 to 4.

[0028] In this embodiment, this number setting provides a certain degree of flexibility. In practical applications, an appropriate number of first laser diodes can be selected for installation based on factors such as the power requirements and beam quality requirements of the laser source. A smaller number of installation positions is suitable for scenarios with lower power requirements and simpler structures, which can reduce costs and complexity. A larger number of installation positions can provide more space for laser diode installation when higher power output is required, meeting the needs of different application scenarios. At the same time, it also helps to achieve a more uniform beam distribution through reasonable layout.

[0029] Furthermore, the number of the second laser diode mounting positions 4 is 3-6.

[0030] In this embodiment, this range of numbers further enriches the installation options for the laser diodes. In conjunction with the first laser diode mounting position 3, the number and distribution of the first and second laser diodes can be flexibly adjusted according to specific packaging design requirements to achieve a more optimized beam combination and power output. In some applications that require specific beam shapes or intensities, by reasonably setting the number of the second laser diode mounting positions 4, the arrangement and luminous effect of the laser diodes can be precisely controlled, thereby improving the performance and application range of the laser source.

[0031] Furthermore, the number of the third laser diode mounting positions 5 is 4-7.

[0032] In this embodiment, increasing the total number of laser diodes helps to further improve the power of the laser source. The arrangement of multiple third laser diode mounting positions 5 allows for full utilization of space for laser diode installation even below the support structure, forming a three-dimensional laser diode arrangement structure with the first and second laser diode mounting positions 4, greatly improving space utilization and laser diode arrangement density. This high-density arrangement can achieve higher laser output power within a limited space, meeting the needs of some applications with high power requirements.

[0033] Furthermore, the first laser diode mounting position 3 is disposed on one side of the copper carrier 1, the second laser diode mounting position 4 is disposed on the other side of the copper carrier 1, and the first laser diode mounting position 3 and the second laser diode mounting position 4 are symmetrically arranged, and the third laser diode mounting position 5 is disposed below the copper carrier 1.

[0034] In this embodiment, this layout has significant advantages. The symmetrical arrangement of the first and second laser diode mounting positions 4 helps to achieve a uniform beam distribution, reduce beam deviation and non-uniformity, and improve the beam quality of the laser source. The third laser diode mounting position 5 is located at the bottom, which further makes full use of the space of the carrier, allowing the laser diodes to be reasonably distributed in three-dimensional space and forming a more compact structure.

[0035] In this invention, the copper carrier 1 is first selected as an equilateral triangle, isosceles triangle, or right triangle according to actual needs. Since the copper carrier 1 is a one-piece molded structure, it has good thermal conductivity and structural stability. On one of the connecting surfaces 2, 2-4 first laser diodes are installed according to design requirements; on the other connecting surface 2, 3-6 second laser diodes are installed. The first laser diode mounting positions 3 and the second laser diode mounting positions 4 are symmetrically arranged on both sides of the carrier, which helps to achieve a uniform beam distribution. Finally, 4-7 third laser diodes are installed on the lower connecting surface 2 of the carrier. Through this layout, the three connecting surfaces 2 of the carrier are fully utilized, and a high-density arrangement of laser diodes is achieved in a limited space, which improves the power and performance of the laser source. It can be widely used in fields with high requirements for the compactness and power of the laser source.

[0036] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Those skilled in the art can understand that implementing all or part of the above-described embodiments and making equivalent changes in accordance with the claims of the present utility model are still within the scope of the utility model.

Claims

1.A compact laser light source package structure, characterized in that, a copper material carrier is provided, the copper material carrier has three connecting surfaces, and one of the connecting surfaces is provided with a first laser diode mounting position, another of the connecting surfaces is provided with a second laser diode mounting position, and the remaining one of the connecting surfaces is provided with a third laser diode mounting position. 2.The compact laser light source package structure according to claim 1, characterized in that, the copper material carrier is an integral structure. 3.The compact laser light source package structure according to claim 2, characterized in that, the copper material carrier is one of an equilateral triangle, an isosceles triangle, or a right triangle. 4.The compact laser light source package structure according to claim 3, characterized in that, the number of the first laser diode mounting positions is 2-4. 5.The compact laser light source package structure according to claim 4, characterized in that, the number of the second laser diode mounting positions is 3-6. 6.The compact laser light source package structure according to claim 5, characterized in that, the number of the third laser diode mounting positions is 4-7. 7.The compact laser light source package structure according to claim 6, characterized in that, the first laser diode mounting positions are arranged on one side of the copper material carrier, the second laser diode mounting positions are arranged on the other side of the copper material carrier, the first laser diode mounting positions and the second laser diode mounting positions are arranged symmetrically, and the third laser diode mounting positions are arranged below the copper material carrier.

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