Silicon wafer cutting and grinding wastewater treatment mechanism and production equipment

Abstract

The utility model provides a silicon wafer cutting and grinding wastewater treatment mechanism, production equipment, a collecting tank and a pipeline for inputting wastewater into the collecting tank, wherein a crushing part for treating crushed silicon wafers and a medicament part for adsorbing impurities and flocculating are also arranged on the pipeline; a magnetic attraction assembly is further arranged on the wall face of the collecting tank, and smashed fragments or impurities are gathered together, attracted by the magnetic attraction assembly and tightly attached to the inner wall of the collecting tank. According to the silicon wafer cutting and grinding wastewater treatment mechanism, broken silicon wafers and mortar in wastewater can be efficiently and safely removed, impurities with different characteristics can be treated in a targeted mode, primary purification operation of the wastewater is achieved, and a guarantee is provided for subsequent secondary utilization.

Description

Technical Field

[0001] This application belongs to the field of silicon wafer processing wastewater treatment technology, and in particular relates to a silicon wafer cutting and grinding wastewater treatment mechanism and production equipment equipped with such a treatment mechanism. Background Technology

[0002] During silicon wafer processing, the cutting and grinding of silicon wafers generates a large amount of wastewater containing silicon wafer fragments and slurry. If discharged directly, the tiny silicon wafer fragments may remain in the natural environment, posing a potential threat to ecological elements such as soil and water bodies. Simultaneously, the chemical components in the slurry may alter the pH of the water, harming the habitat of aquatic organisms. Furthermore, if these impurities are not properly treated and enter the sewage system, they may cause blockages, affecting the drainage function of the entire factory area.

[0003] Current wastewater treatment methods involve filtration followed by activated carbon backwashing. However, this backwashing process consumes a large amount of water, and due to its limitations, the results are unsatisfactory, leading to easy caking of the filter bed and eventual ineffectiveness. Furthermore, existing methods are still not effective and fast enough for wastewater treatment, and the collected wastewater contains impurities that cannot be reused, resulting in high production costs. Summary of the Invention

[0004] This application provides a silicon wafer cutting and grinding wastewater treatment mechanism and production equipment to solve the technical problems of poor wastewater treatment effect, low efficiency and high cost caused by unreasonable design of existing wastewater treatment mechanisms.

[0005] To solve at least one of the above-mentioned technical problems, the technical solution adopted in this application is:

[0006] A silicon wafer cutting and grinding wastewater treatment device includes: a collection tank and a pipe for inputting wastewater into the collection tank. The pipe is also equipped with a crushing section for processing broken silicon wafers and a reagent section for adsorbing impurities and flocculating. A magnetic attraction component is also provided on the wall of the collection tank, so that the crushed fragments or impurities agglomerate together and are attracted by the magnetic attraction component, sticking tightly to the inner wall of the collection tank.

[0007] Furthermore, the pipeline includes an upstream section and a downstream section, the downstream section being connected to the top surface of the collection tank; along the wastewater flow direction, the pulverizing section and the reagent section are sequentially arranged on the downstream section.

[0008] Furthermore, the downstream section is configured to be inclined downwards, with an angle of 30-60° between it and the upstream section.

[0009] Furthermore, the crushing unit includes a housing, a pair of rollers placed inside the housing, and a motor for driving the pair of rollers, which drives the pair of rollers to crush broken silicon wafers or large particulate impurities in the wastewater.

[0010] Furthermore, the radial surface of the roller shaft is provided with a number of mutually cooperating grid protrusions; and the housing is also provided with an inlet and an outlet corresponding to the position of the roller shaft.

[0011] Furthermore, the reagent section is provided in two parts, one for injecting magnetic powder into the pipeline and the other for injecting flocculant into the pipeline. The reagent section for injecting magnetic powder is located above the reagent section for injecting flocculant. A supply pump and a control valve are also provided in the channel connecting the reagent section and the pipeline.

[0012] Furthermore, a stirrer is suspended at the top of the collection tank, and a ladder, a temperature sensor, and a liquid level sensor are also provided inside the collection tank; a drain outlet is also provided in the lower section of the collection tank, and a filter screen is also provided above the drain outlet.

[0013] Furthermore, the magnetic suction assembly includes a plurality of magnetic pole blocks aligned and disposed on the outer wall of the collection tank, the magnetic pole blocks being configured in the middle and upper sections of the collection tank.

[0014] Furthermore, the magnetic pole blocks configured at the same height are evenly distributed around the radial periphery of the collection groove; the magnetic pole blocks configured along the height of the collection groove can be spaced apart or staggered.

[0015] A production equipment is equipped with a silicon wafer cutting and grinding wastewater treatment mechanism as described above.

[0016] The silicon wafer cutting and grinding wastewater treatment mechanism designed in this application can efficiently and safely remove broken silicon wafers and slurry from wastewater, and can perform targeted treatment on impurities with different characteristics, achieving preliminary wastewater purification and ensuring subsequent secondary utilization. This application also proposes a production equipment equipped with this treatment mechanism. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the silicon wafer cutting and grinding wastewater treatment mechanism in this application;

[0018] Figure 2 This is a schematic diagram of the pulverizing section in this application;

[0019] Figure 3 This is a top view of the magnetic pole block distribution in this application.

[0020] In the diagram: 10. Collection tank; 11. Agitator; 12. Filter screen; 13. Drain pump; 20. Pipeline; 21. Upstream section; 22. Downstream section; 30. Crushing section; 31. Housing; 32. Double roller shaft; 33. Motor; 40. Chemical section one; 50. Chemical section two; 60. Magnetic suction assembly. Detailed Implementation

[0021] The present application will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0022] This embodiment proposes a silicon wafer cutting and grinding wastewater treatment mechanism, such as... Figure 1 As shown, the system includes a collection tank 10 and a pipe 20 for inputting wastewater into the collection tank 10. The pipe 20 is also equipped with a crushing section 30 for processing silicon wafer fragments, a first reagent section 40 for adsorbing impurities, and a second reagent section 50 for flocculation. A magnetic adsorption component 60 is also provided on the wall of the collection tank 10. After the crushed fragments or impurities and the magnetic powder adsorbing the impurities are treated with flocculant, they will agglomerate together and be adsorbed by the magnetic adsorption component 60, sticking tightly to the inner wall of the collection tank 10. These adsorbed materials are then removed from the collection tank 10 by mechanical or manual means and processed in other processes. The remaining wastewater is free of impurities or silicon wafer fragments and has completed preliminary purification. After being filtered by the filter screen 12, it flows directly into the next process from the drain outlet.

[0023] Wastewater generated in the silicon wafer dicing and grinding production area is connected to the wastewater collection tank 10 through an open-structure pipe 20. The wastewater is sloped before entering the collection tank 10. Specifically, the pipe 20 includes an upstream section 21 and a downstream section 22. The upstream section 21 is directly connected to the production area. Wastewater from silicon wafer dicing and grinding in the production area flows directly into the pipe 20, then flows through the upstream section 21 and turns into the downstream section 22, finally flowing through the downstream section 22 into the top opening of the collection tank 10. The connection between the upstream section 21 and the downstream section 22 is horizontal, while the downstream section 22 is inclined downwards, with a distance between its height and the top of the collection tank 10, facilitating the downward flow of wastewater under gravity. Preferably, the angle θ between the downstream section 22 and the upstream section 21 is 30-60° to prevent blockages during horizontal flow; this inclined pipe design also facilitates downward flow of the water.

[0024] In the downstream section 22, along the direction of wastewater flow, the pulverizing section 30, the first reagent section 40, and the second reagent section 50 are arranged sequentially.

[0025] like Figure 2As shown, the crushing unit 30 is mainly used to crush silicon wafers or large particles of impurities. Its structure includes a housing 31, a roller shaft 32 housed within the housing 31, and a motor 33 for driving the roller shaft 32 to rotate. The motor 33 is located on the outer side of the housing 31. The opening of the housing 31 corresponds to the cross-section of the pipe, and the inlet and outlet of the housing 31 correspond to the positions of the roller shaft 32, thereby driving the motor 33 to drive the roller shaft 32 to crush the silicon wafers or large particles of impurities in the wastewater. The outer diameter surface of the roller shaft 32 has several corresponding and cooperating grid protrusions; alternatively, it can be a meshing toothed groove and gear structure; or a cooperating smooth roller shaft structure. Its main purpose is to crush silicon wafers or large particles of impurities so that they can be micronized and flocculated in the collection tank 10.

[0026] In this embodiment, there are two reagent sections, including a reagent section 40 for injecting magnetic powder into the pipe 20 and a reagent section 50 for injecting flocculant into the pipe 20. For the pulverized waste liquid particles, magnetic powder is first injected so that the surface of the impurity particles is coated with easily adsorbed magnetic powder; then, flocculant is injected into the wastewater so that the impurity particles with magnetic powder are agglomerated by the flocculant, forming large, viscous, and easily adsorbed agglomerates. After being adsorbed by magnetic poles attached to the wall of the collection tank 10, these agglomerates separate from the wastewater and adhere tightly to the wall of the collection tank 10, awaiting further treatment. To improve the flow control of the magnetic powder and flocculant, supply pumps and control valves are installed on all pipes.

[0027] Both reagent section 40 and reagent section 50 consist of corrosion-resistant, sealed storage tanks, each equipped with an inlet, an outlet, and a stirring device, and both have control valves on their flow pipelines. The tank structure is typical of this field, and accompanying drawings are omitted here. Magnetic powder is directly added to the pulverized waste material through reagent section 40, coating the surface of particulate impurities with magnetic powder that is easily attracted by the magnetic pole blocks, facilitating subsequent collection and processing.

[0028] To ensure precise flocculant control, a nozzle or drip outlet is installed at the discharge end, and the flow rate is automatically controlled by a control valve to ensure accurate and reasonable addition of flocculant to the wastewater. Preferably, polydimethyldiallyl ammonium chloride is used as the flocculant, which can bind particulate impurities such as broken silicon wafers, mortar, and magnetic powder in the wastewater. The cationic groups in the flocculant molecular structure can electrostatically adsorb negatively charged particles such as broken silicon wafers and mortar, and at the same time interact with magnetic powder, promoting the formation of agglomerates of these impurities, which are easy to separate from the wastewater, effectively improving wastewater treatment efficiency.

[0029] like Figure 1As shown, in order to improve the flowability of wastewater in the collection tank 10, a stirrer 11 is suspended at the top of the collection tank 10. It is a commonly used electrically powered propeller, which can not only improve the flocculation effect, but also promote the agglomerates to move towards the periphery of the wall of the collection tank 10, so that the agglomerates are quickly adsorbed onto the wall by the magnetic pole block.

[0030] Preferably, a corresponding cleaning method can be set based on the size of the collection tank 10. When the collection tank 10 is large, a ladder can be installed inside the collection tank 10 to facilitate personnel entering the tank to clean sludge or replace parts. Of course, other auxiliary mechanisms can be set to help personnel clean aggregates or sludge, such as underwater robots or mechanical nets, etc., which are not specifically limited here.

[0031] Regardless of the size of the collection tank 10, it is equipped with a temperature sensor, a liquid level sensor 14, and a drain pump 13 to ensure the flocculation effect and magnetic adsorption quality of the wastewater. A drain outlet is also provided in the lower section of the collection tank 10, and a filter screen 12 is provided above the drain outlet to prevent untreated sludge from clogging the drain outlet.

[0032] The magnetic adsorption assembly 60 includes several magnetic pole blocks aligned and disposed on the outer wall of the collection tank 10. These magnetic pole blocks are positioned in the middle and upper sections of the collection tank 10. Due to the agitation of the stirrer 11, the wastewater rotates and flows within the tank. The flocculants, affected by the buoyancy of the wastewater and the centrifugal force of the liquid, remain suspended in the middle or upper section of the tank instead of sinking. Therefore, magnetic pole blocks need to be distributed in the middle and upper sections of the collection tank 10 to adsorb these magnetically charged agglomerates. The magnetic pole blocks can be ring-shaped and connected to the periphery of the tank. The size of the magnetic poles can be determined based on the size of the tank and is not specifically limited here.

[0033] Furthermore, for magnetic pole blocks of the same height, they are evenly arranged on the radial periphery of the collecting groove 10, and can be seamlessly connected as a single piece; or they can be evenly spaced apart, as shown in the top view below. Figure 3 As shown. For the magnetic pole blocks arranged along the height of the collection groove 10, the upper and lower layers can be arranged alternately or staggered, as shown in the attached figure.

[0034] Wastewater flows out through the horizontally set upstream section 21 via a pipeline, and then passes through the roller shafts 32 in the crushing section 30 on the downstream section 22 with a certain slope to crush silicon wafers or large particles into smaller particles. Magnetic powder is then added to the crushed wastewater through the first reagent section 40 to coat the small particles with magnetic powder. Flocculant is then added through the second reagent section 50. Under the action of the flocculant, the fragments and small mortar particles in the wastewater form a flocculated mixture with the magnetic powder. The flocculated mixture flows into the collection tank 10 along with the wastewater. The flocculated mixture begins to swirl under the action of the agitator 11. Under the combined action of gravity and centrifugal force, it agglomerates and mixes and moves toward the edge of the tank. Since the flocculated mixture contains magnetic powder, the magnetic pole block placed on the tank wall has a magnetic effect on the magnetic powder in the flocculated mixture, which can quickly and accurately adsorb part of the flocculated mixture onto the tank wall. Other particles settle on the filter screen 12, and the filtered wastewater is discharged from the drain port through the drain pump 13.

[0035] A production equipment is equipped with a silicon wafer cutting and grinding wastewater treatment mechanism as described above.

[0036] The silicon wafer cutting and grinding wastewater treatment mechanism designed in this application can efficiently and safely remove broken silicon wafers and slurry from wastewater, and can perform targeted treatment on impurities with different characteristics, achieving preliminary wastewater purification and ensuring subsequent secondary utilization. This application also proposes a production equipment equipped with this treatment mechanism.

[0037] The embodiments of this application have been described in detail above. These descriptions are merely preferred embodiments and should not be construed as limiting the scope of this application. All equivalent variations and modifications made within the scope of this application should still fall within the patent coverage of this application.

Claims

1. A silicon wafer cutting and grinding wastewater treatment mechanism, characterized in that, include: The collection tank and the pipe into which wastewater is fed are provided. The pipe is also equipped with a crushing section for processing broken silicon wafers and a reagent section for adsorbing impurities and flocculating. A magnetic adsorption component is also provided on the wall of the collection tank. The crushed fragments or impurities are aggregated together and adsorbed by the magnetic adsorption component, sticking tightly to the inner wall of the collection tank.

2. The silicon wafer cutting and grinding wastewater treatment mechanism according to claim 1, characterized in that, The pipeline includes an upstream section and a downstream section, the downstream section being connected to the top surface of the collection tank; along the wastewater flow direction, the pulverizing section and the reagent section are sequentially arranged on the downstream section.

3. The silicon wafer cutting and grinding wastewater treatment mechanism according to claim 2, characterized in that, The downstream section is configured to be inclined downwards, and the angle between it and the upstream section is 30-60°.

4. A silicon wafer cutting and grinding wastewater treatment mechanism according to any one of claims 1-3, characterized in that, The crushing unit includes a housing, a pair of rollers placed inside the housing, and a motor for driving the pair of rollers. The motor drives the pair of rollers to crush broken silicon wafers or large particulate impurities in the wastewater.

5. A silicon wafer cutting and grinding wastewater treatment mechanism according to claim 4, characterized in that, The roller shaft has several mutually cooperating grid protrusions on its radial surface; and the housing also has an inlet and an outlet corresponding to the position of the roller shaft.

6. A silicon wafer cutting and grinding wastewater treatment mechanism according to any one of claims 1-3 and 5, characterized in that, The reagent section is provided in two parts, one for injecting magnetic powder into the pipeline and the other for injecting flocculant into the pipeline. The reagent section for injecting magnetic powder is located above the reagent section for injecting flocculant. A supply pump and a control valve are also provided in the channel connecting the reagent section and the pipeline.

7. A silicon wafer cutting and grinding wastewater treatment mechanism according to claim 6, characterized in that, A stirrer is suspended at the top of the collection tank, and a ladder, a temperature sensor, and a liquid level sensor are also installed inside the collection tank. A drain outlet is also provided in the lower section of the collection tank, and a filter screen is installed above the drain outlet.

8. A silicon wafer cutting and grinding wastewater treatment mechanism according to any one of claims 1-3, 5, and 7, characterized in that, The magnetic attraction assembly includes a plurality of magnetic pole blocks aligned and disposed on the outer wall of the collection tank, the magnetic pole blocks being configured in the middle and upper sections of the collection tank.

9. A silicon wafer cutting and grinding wastewater treatment mechanism according to claim 8, characterized in that, The magnetic pole blocks with the same height are evenly distributed around the radial periphery of the collection groove; the magnetic pole blocks arranged along the height of the collection groove can be spaced apart or staggered.

10. A production equipment, characterized in that, It is equipped with a silicon wafer cutting and grinding wastewater treatment device as described in any one of claims 1-9.

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