Water-cooling heat dissipation device applied to semiconductor vehicle-mounted refrigerator

Abstract

The utility model discloses a water-cooling heat dissipation device applied to a semiconductor vehicle-mounted refrigerator, and belongs to the technical field of refrigeration equipment. The device comprises a box body shell, a box body inner container and a semiconductor chilling plate, the box body inner container is arranged in the box body shell, the device further comprises a heat dissipation mechanism, the heat dissipation mechanism is arranged on one side of the outer portion of the box body inner container, the heat dissipation mechanism comprises a cold conduction block and a water-cooling heat exchanger, a mounting platform is arranged on the large face of the cold conduction block, and the water-cooling heat exchanger is arranged on the water-cooling heat exchanger. The cold end of the semiconductor chilling plate is pasted on the installation platform, the hot end of the semiconductor chilling plate is tightly pressed with the water-cooling heat exchanger, the cold conduction block is connected with the water-cooling heat exchanger, and the semiconductor chilling plate is located between the cold conduction block and the water-cooling heat exchanger. The semiconductor vehicle-mounted refrigerator is used for solving the problems that the semiconductor vehicle-mounted refrigerator is low in heat dissipation efficiency and poor in effect.

Description

TECHNICAL FIELD

[0001] The utility model relates to refrigeration equipment technical field, especially a water cooling heat abstractor applied to semiconductor vehicle refrigerator. BACKGROUND

[0002] In modern vehicle life, semiconductor vehicle refrigerator becomes the important equipment of improving travel quality with the advantages of small size and convenient installation, and is widely used in various vehicles to provide cool drinks and fresh food for users in the journey.

[0003] At present, the conventional semiconductor refrigerator mainly relies on the external TEC for refrigeration, and its heat dissipation mode is usually to blow away the heat generated by the TEC by using the fan to realize the cooling of the refrigeration fin, and then maintain the low temperature environment inside the refrigerator. This heat dissipation mode can meet the basic heat dissipation demand of the semiconductor refrigerator in general environment, and ensure the normal operation of the refrigerator.

[0004] However, when the semiconductor refrigerator is applied to the vehicle scene, the existing heat dissipation technology exposes obvious defects. The vehicle refrigerator is usually arranged in the inside of the vehicle instrument panel, and the space of this position is relatively closed, and the air circulation is not smooth. Especially in hot summer, the temperature in the vehicle is high, and the fan is difficult to effectively dissipate the heat generated by the TEC, and the heat continuously accumulates in the small space, resulting in that the internal cooling speed of the semiconductor refrigerator is extremely slow, and even the expected cooling effect cannot be achieved, and the water and food in the refrigerator are difficult to be fully cooled. This not only affects the user's demand experience for cool drinks and fresh food during driving, but also limits the use efficiency of the semiconductor vehicle refrigerator in the vehicle environment, and reduces the practicability and user satisfaction of the product.

[0005] Therefore, a new heat dissipation solution is needed to break through the limitation of traditional fan heat dissipation and bring better vehicle refrigeration experience to users. CONTENT OF THE UTILITY MODEL

[0006] The utility model provides a water cooling heat abstractor applied to semiconductor vehicle refrigerator can solve the low heat dissipation efficiency, the problem of poor effect in prior art.

[0007] A water cooling heat abstractor applied to semiconductor vehicle refrigerator, comprising a box body shell, a box body liner and a semiconductor refrigeration fin, the box body liner is arranged in the box body shell,

[0008] Further comprising a heat dissipation mechanism, the heat dissipation mechanism is arranged on one side outside the box body liner, the heat dissipation mechanism comprises a cold conducting block and a water cooling heat exchanger, the large surface of the cold conducting block is provided with a mounting platform, the cold end of the semiconductor refrigeration fin is pasted on the mounting platform, the hot end of the semiconductor refrigeration fin is pressed tightly with the water cooling heat exchanger, and the cold conducting block is connected with the water cooling heat exchanger, and the semiconductor refrigeration fin is located between the cold conducting block and the water cooling heat exchanger.

[0009] Further, the heat dissipation mechanism further comprises a cold end heat dissipation fin, which is fixedly connected with the inner container of the box body through bolts, and is connected with the cold conducting block through a threaded fastener.

[0010] Further, the cold end heat dissipation fin comprises a plurality of aluminum heat dissipation fins in a right trapezoidal shape.

[0011] Further, the heat dissipation mechanism further comprises a fan assembly arranged below the cold end heat dissipation fin and connected with the inner container of the box body.

[0012] Further, the fan assembly comprises a mounting frame mounted on the inner container of the box body and a turbine fan arranged inside the mounting frame, and the mounting frame is aligned with a hollow side of the inner container of the box body.

[0013] Further, the mounting frame is composed of a mounting plate and a fan cover, the fan cover is detachably connected with the mounting plate through buckles, and the fan cover is fixedly connected with the inner container of the box body through a threaded fastener.

[0014] Further, a circular air outlet is formed on one side of the inner container of the box body, and the circular air outlet is aligned with the turbine fan.

[0015] Further, a strip array air outlet is formed on one side of the inner container of the box body, and the strip array air outlet is aligned with the inclined edge of the aluminum heat dissipation fin of the cold end heat dissipation fin.

[0016] Further, the semiconductor refrigeration piece is provided with two.

[0017] Further, the cold conducting block and the water-cooled heat exchanger are connected through a through bolt to form a pressure-adjustable mechanical connection.

[0018] The beneficial effects of the utility model are as follows:

[0019] The utility model provides a water-cooled heat dissipation device applied to a semiconductor vehicle-mounted refrigerator, a heat dissipation mechanism is arranged outside the inner container of the box body, and forms an integrated module with a refrigeration piece, the heat dissipation mechanism comprises a cold conducting block and a water-cooled heat exchanger, a large surface mounting platform of the cold conducting block is closely combined with the cold end of the semiconductor refrigeration piece, the hot end is connected with the water-cooled heat exchanger through physical compression, and a double-layer heat dissipation path of "cold end cold conducting-hot end liquid cooling" is formed. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 A water-cooling heat dissipation device structure schematic view applied to the semiconductor vehicle-mounted refrigerator is provided in the utility model.

[0021] Figure 2 A box body shell and a box body inner container structure schematic view is provided in the utility model.

[0022] Figure 3 A heat dissipation mechanism structure schematic view is provided in the utility model.

[0023] Figure 4 A water-cooling heat dissipation device structure explosion view applied to the semiconductor vehicle-mounted refrigerator is provided in the utility model.

[0024] BRIEF DESCRIPTION OF DRAWINGS

[0025] 1, box body shell; 2, box body inner container; 3, semiconductor refrigeration piece; 4, heat dissipation mechanism; 21, circular air outlet; 22, strip array type air outlet; 41, cold conducting block; 42, water-cooling heat exchanger; 43, cold end heat dissipation fin; 44, fan assembly; 441, mounting plate; 442, turbine fan; 443, fan cover. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0027] As Figures 1 to 4 shown, the utility model embodiment provides a water-cooling heat dissipation device applied to semiconductor vehicle-mounted refrigerator, including box body shell 1, box body inner container 2, semiconductor refrigeration piece 3 and heat dissipation mechanism 4, box body inner container 2 is located in box body shell 1, and heat dissipation mechanism 4 is arranged at the one side outside box body inner container 2.

[0028] Specifically, as Figure 3 and Figure 4As shown, the heat dissipation mechanism 4 includes a cold conducting block 41, a water-cooled heat exchanger 42, a cold end heat dissipation fin 43 and a fan assembly 44, the cold conducting block 41 is a stepped aluminum alloy component, a large surface of the cold conducting block 41 is provided with a mounting platform, in the embodiment, two semiconductor refrigeration pieces 3 are provided, the cold ends of the two semiconductor refrigeration pieces 3 are pasted on the mounting platform through a heat conducting adhesive layer, the hot ends of the semiconductor refrigeration pieces 3 are pressed against the water-cooled heat exchanger 42, and the cold conducting block 41 and the water-cooled heat exchanger 42 are connected through through bolts to form a mechanical connection with adjustable pressure, the semiconductor refrigeration pieces 3 are located between the cold conducting block 41 and the water-cooled heat exchanger 42, the cold end heat dissipation fin 43 is fixedly connected with the inner container 2 of the box through bolts, the cold end heat dissipation fin 43 is connected with the cold conducting block 41 through a threaded fastener, the cold end heat dissipation fin 43 includes a plurality of aluminum heat dissipation fins, the aluminum heat dissipation fins are in right-angled trapezoidal shape, and the fan assembly 44 is arranged below the cold end heat dissipation fin 43 and connected with the inner container 2 of the box.

[0029] The cold conducting block 41 transmits the low temperature of the cold end of the semiconductor refrigeration piece 3 to the cold end heat dissipation fin 43 and the inner container 2 of the box; the water-cooled heat exchanger 42 quickly leads out the heat generated by the hot end of the semiconductor refrigeration piece 3 through the vehicle cooling liquid circulation, avoids heat dissipation failure caused by the excessively high temperature of the vehicle environment, and significantly improves the heat dissipation efficiency; the cold conducting block 41 and the water-cooled heat exchanger 42 are connected through bolts to form a mechanical pressure, so that the hot end of the semiconductor refrigeration piece 3 is closely attached to the water-cooled heat exchanger 42, contact failure caused by vibration or thermal deformation is avoided, the pressure is adjustable, and stable heat conduction efficiency is ensured; the cold end heat dissipation fin 43 is connected with the cold conducting block 41 on one hand, and uniformly spreads the cold of the cold conducting block 41 to the inner container wall through heat conduction, and on the other hand, cooperates with the fan assembly 44 to realize internal circulation cooling, the fan assembly 44 operates to generate forced air flow through the surface of the aluminum heat dissipation fin, and the convection heat dissipation efficiency is improved.

[0030] Specifically, the fan assembly 44 includes a mounting frame and a turbine fan 442, the mounting frame is mounted on the inner container 2 of the box, the turbine fan 442 is arranged in the mounting frame, and the mounting frame is aligned with one side of the hollow inner container 2 of the box; the mounting frame is composed of a mounting plate 441 and a fan cover 443, the fan cover 443 is detachably connected with the mounting plate 441 through buckles, and the fan cover 443 is fixedly connected with the inner container 2 of the box through a threaded fastener. The detachable design of the fan cover 443 facilitates cleaning and replacement of the turbine fan 442, and the reliability in the vehicle vibration environment is ensured through the threaded fastening.

[0031] One side of the inner container 2 of the box is provided with a circular air outlet 21, the circular air outlet 21 is aligned with the turbine fan 442, one side of the inner container 2 of the box is provided with a strip array type air outlet 22, and the strip array type air outlet 22 is aligned with the inclined edges of the aluminum heat dissipation fins in the cold end heat dissipation fin 43.

[0032] The use principle of the utility model is as follows.

[0033] After the semiconductor refrigeration sheet 3 is powered on, the cold end thereof absorbs the heat of the inner container 2, and the heat is transferred to the cold end heat dissipation fin 43 through the cold conducting block 41, and the cold end heat dissipation fin 43 diffuses the cold to the wall of the inner container 2, so as to continuously cool the storage space; the heat released by the hot end is absorbed by the water-cooled heat exchanger 42, and the heat is transported to the external radiator through the vehicle cooling liquid circulation.

[0034] At the same time, the turbine fan 442 is operated, the central area forms a low pressure, and the hot air in the inner container 2 is sucked through the circular air outlet 21; after the air enters the fan, the air is accelerated by the impeller and is thrown out along the radial direction to form a high-speed airflow; the airflow blows out along the inclined edge direction of the aluminum heat dissipation fin of the cold end heat dissipation fin 43, fully contacts the surface of the aluminum heat dissipation fin, and transmits the cold to the air through the convection heat exchange, so as to accelerate the diffusion speed of the cold transmitted by the cold conducting block 41 to the cold end heat dissipation fin 43 to the inner container 2; the cooled cold air returns to the inner container 2 through the strip array air outlet 22, and a closed circulation path of suction, cooling and exhaust is formed in the container, and at the same time, the airflow in the inner container can also avoid that the local temperature difference is too large, so that the temperature distribution in the storage space is more uniform.

[0035] The above embodiment of the utility model is described in detail, but the content described can only be the preferred embodiment of the utility model, and cannot be considered as limiting the scope of the utility model. Any equivalent change and improvement within the scope of the utility model application should still belong to the patent coverage range of the utility model.

Claims

1. A water-cooled heat dissipation device applied to a semiconductor car refrigerator, comprising a box shell (1), a box liner (2) and a semiconductor refrigeration sheet (3), the box liner (2) is arranged in the box shell (1), characterized in that: a heat dissipation mechanism (4) is further arranged on one side outside the box liner (2), the heat dissipation mechanism (4) comprises a cold conducting block (41) and a water-cooled heat exchanger (42), a large surface of the cold conducting block (41) is provided with a mounting platform, the cold end of the semiconductor refrigeration sheet (3) is pasted on the mounting platform, the hot end of the semiconductor refrigeration sheet (3) is pressed against the water-cooled heat exchanger (42), the cold conducting block (41) is connected with the water-cooled heat exchanger (42), and the semiconductor refrigeration sheet (3) is located between the cold conducting block (41) and the water-cooled heat exchanger (42).

2. The water-cooling heat dissipation device for a semiconductor car refrigerator according to claim 1, characterized in that, The heat dissipation mechanism (4) further comprises a cold end heat dissipation fin (43), the cold end heat dissipation fin (43) is fixedly connected with the box liner (2) through bolts, and the cold end heat dissipation fin (43) is connected with the cold conducting block (41) through a threaded fastener.

3. The water-cooling heat-dissipation device for the semiconductor car refrigerator according to claim 2, characterized in that, The cold end heat dissipation fin (43) comprises a plurality of aluminum heat dissipation fins, and the aluminum heat dissipation fins are in the shape of a right trapezoid.

4. The water-cooling heat dissipation device for a semiconductor car refrigerator according to claim 3, characterized in that, The heat dissipation mechanism (4) further comprises a fan assembly (44), the fan assembly (44) is arranged below the cold end heat dissipation fin (43) and connected with the box liner (2).

5. The water-cooling heat sink device for a semiconductor car refrigerator according to claim 4, wherein The fan assembly (44) comprises a mounting rack and a turbine fan (442), the mounting rack is mounted on the box liner (2), the turbine fan (442) is arranged inside the mounting rack, and the mounting rack is aligned with a hollow side of the box liner (2).

6. The water-cooling heat dissipation device for a semiconductor car refrigerator according to claim 5, wherein The mounting rack is composed of a mounting plate (441) and a fan cover (443), the fan cover (443) is detachably connected with the mounting plate (441) through buckles, and the fan cover (443) is fixedly connected with the box liner (2) through a threaded fastener.

7. The water-cooling heat dissipation device for a semiconductor car refrigerator according to claim 6, characterized in that, A circular air outlet (21) is formed in one side of the box liner (2), and the circular air outlet (21) is aligned with the turbine fan (442).

8. The water-cooling heat dissipation device for a semiconductor car refrigerator according to claim 7, characterized in that, A strip array air outlet (22) is formed in one side of the box liner (2), and the strip array air outlet (22) is aligned with the inclined edges of the aluminum heat dissipation fins of the cold end heat dissipation fin (43).

9. The water-cooling heat dissipation device for a semiconductor car refrigerator according to claim 1, characterized in that, The semiconductor refrigeration sheet (3) is provided with two.

10. The water-cooling heat dissipation device for a semiconductor vehicle refrigerator according to claim 1 or 9, wherein The cold conducting block (41) and the water-cooled heat exchanger (42) are connected through through-bolts to form a pressure-adjustable mechanical connection.

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