Superconducting magnet assembly and nuclear magnetic resonance spectrometer

Abstract

The utility model relates to the field of medical equipment, and provides a superconducting magnet assembly and a nuclear magnetic resonance spectrometer, which comprise a cooling source, a superconducting assembly and a thermal buffer part. The superconducting assembly is in heat-conducting connection with the cooling source. The heat buffering part is attached to the superconducting assembly so as to form heat conduction connection with the superconducting assembly, and the heat buffering part is made of a solid material which has high heat capacity at low temperature and normal pressure. The heat buffering part is additionally arranged on the superconducting assembly, the heat buffering part is directly attached to the superconducting assembly, the heat conduction efficiency between the heat buffering part and the superconducting coil can be maximized, the overall cold storage capacity is improved, the change rate of the temperature of the superconducting coil can be remarkably reduced, and the risk of superconducting magnet quenching caused by local temperature fluctuation is reduced; when the cooling source is shut down, the reaction time of the superconducting system can be prolonged.

Description

Technical Field

[0001] This utility model relates to the field of medical equipment, and in particular to a superconducting magnet assembly and a nuclear magnetic resonance imaging (MRI) device. Background Technology

[0002] Superconducting components have important applications in many fields, particularly in medical magnetic resonance imaging (MRI) systems, where they are used to generate powerful magnetic fields. A key component of a superconducting component is the superconducting coil, which needs to be maintained in a superconducting state to ensure the proper functioning of the magnet.

[0003] In existing technologies, superconducting components without liquid helium or with low liquid helium are typically connected to a dry cooling system. Because the heat capacity of a superconducting coil at its critical temperature is extremely limited, localized temperature fluctuations in the superconducting component can cause the coil to lose its superconducting state, affecting the normal operation of the magnet. Furthermore, if the dry cooling system malfunctions, the coil temperature will rise rapidly, and insufficient response time may lead to the coil losing its superconductivity. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, the purpose of this utility model is to propose a superconducting magnet assembly and nuclear magnetic resonance spectrometer to improve the cooling capacity of the superconducting assembly.

[0005] To achieve the above and other related objectives, one embodiment of this utility model provides a superconducting magnet assembly for use in a nuclear magnetic resonance spectrometer, the superconducting magnet assembly comprising:

[0006] Cooling source;

[0007] The superconducting component is thermally connected to the cooling source;

[0008] A thermal buffer portion is attached to the superconducting component to form a thermally conductive connection with the superconducting component.

[0009] In one specific embodiment of this utility model, the superconducting component includes a plurality of superconducting coils, and the heat buffer is attached to the surface of the superconducting coils.

[0010] In one specific embodiment of this utility model, the heat buffer part is a plate-shaped structure, and the plate surface of the heat buffer part is fitted to the superconducting coil.

[0011] In one specific embodiment of this utility model, the heat buffer is connected to the superconducting coil via a core material.

[0012] In one specific embodiment of this utility model, the heat buffer portion is connected to the superconducting coil via a substrate, and the substrate covers the heat buffer portion, the superconducting coil, and the skeleton.

[0013] In one specific embodiment of this utility model, the substrate is coated with the heat buffer, the superconducting coil and the skeleton by an impregnation process.

[0014] In one specific embodiment of this utility model, the heat buffer is disposed on the side of the superconducting coil near the working area.

[0015] In one specific embodiment of this utility model, the heat buffer is disposed on the side of the superconducting coil away from the working area.

[0016] In one specific embodiment of this utility model, the heat buffer is made of a magnetic cold storage material.

[0017] One embodiment of this utility model also discloses a nuclear magnetic resonance spectrometer, including the superconducting magnet assembly.

[0018] This invention proposes a superconducting magnet assembly and a nuclear magnetic resonance spectrometer. By adding a thermal buffer to the superconducting assembly, the thermal buffer can maximize the heat conduction efficiency between the assembly and the superconducting coil by directly attaching to the superconducting assembly, thereby improving the overall cold storage capacity. This can significantly slow down the rate of temperature change of the superconducting coil, reduce the risk of superconducting magnet quenching caused by local temperature fluctuations, and extend the response time of the superconducting system when the cooling source is shut down. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of a superconducting magnet assembly in one embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of the heat buffer portion of the present invention connected to the superconducting coil via a reinforcing material in one embodiment;

[0022] Figure 3 This is a schematic diagram illustrating the change in specific heat capacity of various types of magnetic cold storage materials with temperature in one embodiment of this utility model.

[0023] Figure reference numerals: 1. Specific heat capacity change curve of GdVO4 compound; 2. Specific heat capacity change curve of GdAlO3 compound; 3. Specific heat capacity change curve of Gd2O2S compound; 4. Specific heat capacity change curve of HoCu2 compound; 5. Specific heat capacity change curve of lead; 10. Superconducting coil; 20. Thermally conductive connector; 30. Cold head; 40. Thermal buffer section; 50. Ribbon material. Detailed Implementation

[0024] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0025] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0026] The key component of the superconducting assembly is the superconducting coil 10, which needs to be maintained in a superconducting state to ensure the normal operation of the magnet. To ensure the superconducting performance of the superconducting coil 10, the coil temperature must be kept below its critical temperature, a process typically achieved through liquid helium cooling.

[0027] Liquid helium, due to its extremely low temperature and efficient thermal buffering capacity, is often used in the cooling systems of superconducting components. Immersing a superconducting coil 10 in liquid helium can effectively reduce the coil temperature, preventing the superconducting material from losing its superconducting properties due to temperature increases. Furthermore, liquid helium possesses a high heat capacity, allowing it to stably maintain a superconducting state over extended periods, enabling continuous operation of the magnet.

[0028] In recent years, dry cooling technology has emerged as a new cooling method, especially in applications where liquid helium cooling is costly and complex. In dry-cooled superconducting components, cooling no longer relies on liquid helium but is achieved through a thermally conductive connection between a cryogenic cooler and the coil. This cooling method offers significant advantages, such as eliminating the need for expensive liquid helium and reducing the overall complexity of the cooling system. However, dry-cooled superconducting components have lower cooling capacity, and the coil's thermal buffering capacity is significantly reduced.

[0029] However, due to the extremely limited heat capacity of the superconducting coil 10 at its critical temperature, a failure in the dry cooling system will cause the coil temperature to rise rapidly. Insufficient fault response time prevents timely active field reduction, leading to coil loss of superconductivity and significantly increasing the magnet's recovery time. Furthermore, localized temperature fluctuations during magnet operation can also cause the superconducting coil 10 to lose its superconducting state, affecting the magnet's normal operation. Compared to traditional liquid helium cooling, thermal conductivity cooling is less effective. Therefore, in practical operation, the temperature of the coil in dry-cooled superconducting components is more prone to fluctuations during long-term operation, and under certain extreme operating conditions, excessively high temperatures can even cause the superconducting coil 10 to lose its superconductivity.

[0030] To solve the above technical problems, such as Figure 1-2 As shown, one embodiment of this utility model provides a superconducting magnet assembly for use in a nuclear magnetic resonance spectrometer. The superconducting magnet assembly includes a cooling source, a superconducting component, and a thermal buffer 40. The cooling source is a component used to reduce the temperature of the superconducting component and ensure that the superconducting coil 10 is maintained in a superconducting state. The cooling source can be a cryogenic cooler (e.g., a compressor cooling system), a closed-loop cooling system, a refrigerator, etc. Specifically, the cooling source is preferably a cryogenic cooler (also called a refrigerator or refrigeration system), which is a device that cools by compressing and expanding gases (such as nitrogen, helium, etc.). This cooling source does not rely on liquid helium and is suitable for dry cooling of the superconducting component. The cryogenic cooler helps maintain the coil at a low temperature through a thermally conductive connection with the superconducting coil 10. Compared with liquid helium, the cryogenic cooler is more sustainable, especially in environments where liquid helium is not suitable, as it can provide a more stable low temperature.

[0031] like Figure 1 As shown, the superconducting component is thermally connected to the cooling source, and the superconducting component includes multiple superconducting coils 10. The superconducting coils 10 are cooled by thermally conductive connectors 20 (e.g., copper braided tape or copper strips) that are thermally connected to the cold head 30 of a cryogenic cooler. Through these thermally connected materials, the cold head 30 of the cryogenic cooler transfers the low temperature to the superconducting coils 10, removing the heat generated by the superconducting coils 10 and maintaining their operation below the superconducting critical temperature. Through the efficient design of the cryogenic cooler, the cold head 30, and the thermal connections, a stable low-temperature environment can be effectively maintained for the superconducting component, ensuring it remains in a superconducting state and provides the required strong magnetic field.

[0032] like Figure 1As shown, the heat buffer 40 is attached to the superconducting component to form a thermally conductive connection. When the cooling source fails, the superconducting component will heat up through heat conduction from the cooling connection and other sources such as radiant heat. When the temperature rises above the critical temperature, the superconducting component will lose its superconductivity. The heat buffer 40 is in close contact with the superconducting component, forming a thermally conductive connection. When the cooling source fails, the heat rising from the superconducting component will be transferred to the heat buffer. This process helps to slow down the temperature rise of the superconducting component, thereby preventing the superconducting component from rapidly exceeding the critical temperature.

[0033] Specifically, such as Figure 1 As shown, the heat buffer 40 is attached to the surface of the superconducting coil 10. The heat buffer 40, through its contact with the surface of the superconducting coil 10, forms good thermal contact, ensuring that heat can be rapidly conducted from the superconducting coil 10 to the heat buffer 40. Thus, when the temperature of the superconducting coil 10 rises, the heat buffer 40 can absorb excess heat in a timely manner, reducing the rapid increase in the temperature of the superconducting coil 10.

[0034] In one specific embodiment of this invention, the heat buffer 40 is disposed on the side of the superconducting coil 10 near the working area. The working area refers to the area where the patient lies down and undergoes examination. In MRI equipment, the superconducting coil 10 is typically responsible for generating a strong magnetic field to ensure clear images. During this process, the superconducting coil 10 is not only affected by the ambient temperature but also by the localized heat generated by the current passing through the superconducting material, causing its temperature to rise. Particularly on the side near the working area, the temperature rise is usually more significant due to the presence of the patient and heat release from other equipment. Therefore, placing the heat buffer 40 on the side of the superconducting coil 10 near the working area effectively manages heat and ensures stable operation of the equipment.

[0035] like Figure 1 As shown, the heat buffer section 40 is located on the side of the superconducting coil 10 away from the working area. This side typically has more space, facilitating the design and arrangement of the heat buffer section 40. This relatively spacious location can accommodate more thermal management equipment and materials. Because of the ample space on this side away from the working area, necessary improvements can be made to the design of the heat buffer section 40 without significantly altering the existing design of the superconducting coil 10. This reduces research and development and manufacturing costs, while also minimizing equipment downtime.

[0036] like Figure 2As shown, the heat buffer 40 has a plate-like structure. Compared to other complex shapes, the plate-like structure provides a larger surface area for contact with the superconducting coil 10. This helps achieve more efficient heat conduction and diffusion. Specifically, the heat buffer 40 can be a thin plate of different shapes, such as a strip or a disc. A strip-shaped heat buffer 40 is suitable for areas with relatively uniform coil surfaces, covering longer areas, and is suitable for certain long strip areas of the superconducting coil 10. A disc-shaped heat buffer 40 is suitable for designs that need to surround certain circular or curved areas of the superconducting coil 10. The disc shape can effectively mate with the circular surface of the superconducting coil 10, minimizing gaps and improving heat conduction efficiency.

[0037] The heat buffer 40 is fitted to the superconducting coil 10. The superconducting coil 10 typically has a curved or circular structure; therefore, the shape of the heat buffer 40 needs to be optimized according to the curved surface of the superconducting coil 10. Flexible thin sheet material is used, or precise cutting and customization during manufacturing are employed to ensure the sheet material fits as closely as possible to the coil surface, minimizing air gaps.

[0038] In one specific embodiment of this invention, thermal grease can be added between the heat buffer portion 40 and the superconducting coil 10. The thermal grease can effectively fill the tiny gaps between the heat buffer portion 40 and the coil surface, ensuring a tighter thermal contact between the two and improving the overall heat conduction efficiency.

[0039] like Figure 2 As shown, the heat buffer 40 is connected to the superconducting coil 10 via a support 50. The support 50 can be materials such as tape or fiberglass cloth, and the heat buffer 40 is connected to the superconducting coil 10 by pasting or wrapping. Both pasting and wrapping methods ensure a tight connection of the heat buffer 40 to the superconducting coil 10, while avoiding reduced heat conduction efficiency due to poor contact. Pasting allows for quick fixation, while wrapping provides stronger mechanical support.

[0040] In one specific embodiment of this utility model, the heat buffer 40 is connected to the superconducting coil 10 via a substrate. The substrate provides additional mechanical support, ensuring that the connection between the heat buffer 40 and the superconducting coil 10 remains secure during long-term use. By covering these components, the substrate enhances the stability of the entire structure, preventing loosening or damage caused by vibration, external forces, or temperature changes. The substrate covers the heat buffer 40, the superconducting assembly, and the core 50. The substrate refers to a material that can fill and cover the aforementioned components and then solidify. The substrate material solidifies under specific conditions after filling, meaning that the substrate forms a robust connection structure during solidification, ensuring that all components are tightly fixed together. This effectively secures the heat conduction path between the heat buffer 40, the superconducting coil 10, and other related components, preventing loosening of connections or reduced heat conduction efficiency due to prolonged operation or external factors. Specifically, the substrate can be epoxy resin or other resins, which have good fluidity, can completely fill gaps, and provide sufficient strength and stability after solidification.

[0041] In this application, the substrate and reinforcement material 50 used for filling are used in combination. The substrate is the main part of the material, bearing most of the stress and function. The reinforcement material 50 is a reinforcing material added to the substrate, usually a hard, strong, but brittle material, such as glass fiber. The reinforcement material 50 can effectively disperse external forces and increase the overall tensile strength of the material. The introduction of the reinforcement material 50 can change the rheological properties of the substrate, making it more stable during processing. For example, some filler materials can reduce the fluidity of the material at high temperatures, helping to control the molding process. Due to the low coefficient of thermal expansion of some reinforcement materials 50, they can effectively reduce the dimensional changes of the material caused by thermal expansion and contraction, making the composite material more stable in environments with large temperature variations.

[0042] In a specific embodiment of this utility model, the substrate can be selected as a colloid used in the impregnation process. The substrate covers the heat buffer part 40, the superconducting coil 10, and the core material 50 through the impregnation process. Existing superconducting coils 10 already require an impregnation process for outer surface coverage. Using existing impregnation processes, the heat buffer part 40 and the core material 50 can be fixed to the superconducting coil 10 without adding additional steps, thus saving time and cost. Traditional superconducting coils 10 typically already require impregnation; therefore, directly fixing the heat buffer part 40 and the core material 50 during this process effectively reduces production complexity. The impregnation material usually has good adhesion, firmly bonding the heat buffer part 40 and the core material 50 to the superconducting coil 10. The colloid forms a uniform protective layer during curing, ensuring the stability of the heat buffer part 40 and the core material 50 under high temperatures and long-term use.

[0043] The specific steps for the superconducting coil 10 with the additional thermal buffer section 40 are as follows:

[0044] Before the impregnation process, the heat buffer 40 and the core 50 are first precisely fixed to the superconducting coil 10. The fixing method can use adhesives or clamps for temporary positioning to ensure they remain in the correct position during the impregnation process.

[0045] The superconducting coil 10, with the heat buffer 40 and the core 50 fixed in place, is immersed entirely in a colloid, ensuring that the colloid completely covers the entire surface of the component. During the impregnation process, the colloid penetrates into the gaps between all components, firmly bonding the heat buffer 40 and the core 50 to the superconducting coil 10 and forming an integral protective layer.

[0046] After coating, the colloid needs to be hardened and shaped by heating or natural curing. During the curing process, the colloid forms a robust protective layer and provides stable thermal management functions through its combination with the superconducting coil 10, the heat buffer 40, and the core material 50.

[0047] The heat buffer section 40 is made of a material with high heat capacity at low temperature and normal pressure. High heat capacity materials can absorb a large amount of heat while experiencing minimal temperature change at low temperatures. Heat capacity (also known as specific heat capacity) is the ability of a substance to absorb heat per unit mass. High heat capacity materials can store a large amount of thermal energy, thus they can slowly release or absorb heat during temperature fluctuations, thereby preventing rapid temperature changes within the system.

[0048] This high-heat-capacity material is solid at low temperatures and normal pressure. Unlike liquid or gaseous materials, solid materials do not require complex sealing and container designs. They can be more easily processed into various shapes and integrated into existing systems. Solid materials have no flowability, ensuring stability during installation and preventing leaks or displacement caused by material movement. Solid materials are more reliable in long-term use, especially at low temperatures, avoiding phase changes or other instabilities that can occur with liquids or gases due to temperature variations.

[0049] In one specific embodiment of this utility model, the heat buffer 40 is made of magnetic cold storage material. The magnetic cold storage material mainly utilizes the magnetocaloric effect, that is, when the material is under the action of an external magnetic field, the arrangement of magnetic moments inside the material changes, thereby causing the temperature of the material to change.

[0050] The magnetic cold storage material has a specific heat capacity greater than 0.1 J / cm² in the temperature range of 2–8 K. 3K. 2–8K is the operating temperature range of the superconducting coil 10, which needs to maintain its superconducting state within this temperature range. The specific heat capacity of the magnetic cold storage material is set to absorb or release a large amount of heat while keeping its own temperature change relatively small. This is helpful for buffering temperature changes caused by fluctuations in external heat load.

[0051] Specifically, the magnetic cold storage material can be selected from one or more of the following: GdAlO3 compound (gadolinium aluminate), GdVO4 compound (gadolinium vanadate), Gd2O2S compound (gadolinium sulfide), or GOS-HoCu2 composite material (a composite material containing lanthanide elements and transition metals).

[0052] like Figure 3 The diagram shows the specific heat capacity of the above material compared to lead, as a function of temperature. The horizontal axis represents temperature (K), and the vertical axis represents specific heat capacity (cm³). 3 K). Figure 3 The curves shown are: 1 for the specific heat capacity of GdVO4 compound, 3 for the specific heat capacity of GdAlO3 compound, 4 for the specific heat capacity of Gd2O2S compound, 5 for the specific heat capacity of HoCu2 compound, and 6 for the specific heat capacity of lead.

[0053] It can be seen that GdAlO3 compounds, GdVO4 compounds, Gd2O2S compounds, and GOS-HoCu2 composites all exhibit high specific heat capacities in the 2–8 K range. The order of temperatures at which each material reaches its maximum specific heat capacity is: lead > HoCu2 compound > Gd2O2S compound > GdAlO3 compound > GdVO4 compound. Looking at the specific heat capacity data, Gd2O2S compound has the highest specific heat capacity value in the 2–8 K temperature range.

[0054] GdAlO3 compounds, as materials with high specific heat capacity, can effectively absorb heat in the temperature range of 2–8 K. Although their specific heat capacity is lower than that of Gd2O2S compounds, they still exhibit good thermal buffering performance.

[0055] Similar to GdAlO3 compounds, GdVO4 compounds (gadolinium vanadate) have a high specific heat capacity, with its maximum value occurring in a lower temperature range. This makes them ideal for low-temperature applications. The advantage of GdVO4 compounds lies in their high specific heat capacity at lower temperatures, which effectively mitigates temperature fluctuations caused by cooling systems or external heat sources, maintaining system stability.

[0056] Gd₂O₂S compounds possess the highest achievable specific heat capacity among all materials, enabling them to effectively absorb and buffer heat over a wide temperature range. This makes them a preferred material for low-temperature thermal buffering systems, particularly suitable for applications requiring high heat capacity and low-temperature stability.

[0057] HoCu2 compounds exhibit a gradual increase in specific heat capacity with increasing temperature in the 2–8 K range. The more gradual change in specific heat capacity of HoCu2 compounds may be advantageous in environments requiring a large, stable specific heat capacity with temperature variations. For example, in applications where heat capacity needs to be adjusted according to temperature changes, HoCu2 compounds can demonstrate better performance, and their temperature dependence and thermal stability can be better utilized in certain applications.

[0058] GOS-HoCu2 composite material can combine high specific heat capacity and temperature adaptability in the low temperature range, making the thermal buffer performance more stable. Especially in applications that require dynamic adjustment of heat capacity according to temperature changes, it provides better thermal management effect.

[0059] Depending on the operating temperature of the superconducting component, an appropriate material can be selected as the thermal buffer medium. For example, when the superconducting component needs to operate at a temperature of 7-8K, HoCu2 compound is selected as the magnetic cold storage material; while when the operating temperature is 2-3K, GdVO4 compound is selected as the magnetic cold storage material.

[0060] One embodiment of this utility model also discloses a nuclear magnetic resonance spectrometer, including the superconducting magnet assembly.

[0061] In summary, this invention adds a heat buffer 40 to the superconducting component. By directly attaching the heat buffer 40 to the superconducting component, it maximizes the heat transfer efficiency between the component and the superconducting coil 10, improving the overall cold storage capacity. This significantly slows down the rate of temperature change in the superconducting coil 10, reducing the risk of superconducting magnet quenching failure caused by localized temperature fluctuations. Furthermore, it extends the response time of the superconducting system when the cooling source is shut down. It also increases the heat capacity of the area surrounding the superconducting component and reduces the impact of temperature fluctuations on the superconducting material. Through stable thermal management, these materials can extend the stable operating time of the superconducting component and reduce magnet loss due to temperature fluctuations. Using existing impregnation processes, the heat buffer 40 and the reinforcing material 50 can be fixed to the superconducting coil 10 without requiring additional steps, thus saving time and costs.

[0062] The present invention has been shown and described in detail above with reference to the accompanying drawings and preferred embodiments. However, the present invention is not limited to these disclosed embodiments, and other solutions derived by those skilled in the art are also within the protection scope of the present invention.

[0063] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

[0064] The above description of the embodiments shown in this utility model (including the content set forth in the abstract of the specification) is not intended to be an exhaustive enumeration or to limit the utility model to the precise forms disclosed herein. Although specific embodiments and examples of the utility model have been described herein for illustrative purposes only, various equivalent modifications are possible within the spirit and scope of the utility model, as will be recognized and understood by those skilled in the art. As indicated, these modifications can be made to the utility model in accordance with the above description of the embodiments described herein, and such modifications will be within the spirit and scope of the utility model.

Claims

1. A superconducting magnet assembly, characterized in that, The superconducting magnet assembly, used in nuclear magnetic resonance (NMR) instruments, includes: Cooling source; The superconducting component is thermally connected to the cooling source; A thermal buffer portion is attached to the superconducting component to form a thermally conductive connection with the superconducting component.

2. The superconducting magnet assembly of claim 1, wherein, The superconducting assembly includes multiple superconducting coils, and the heat buffer is attached to the surface of the superconducting coils.

3. The superconducting magnet assembly of claim 2, wherein, The heat buffer section has a plate-like structure, and the plate surface of the heat buffer section is fitted to the superconducting coil.

4. The superconducting magnet assembly of claim 2, wherein, The heat buffer section is connected to the superconducting coil via a core material.

5. The superconducting magnet assembly of claim 4, wherein, The heat buffer is connected to the superconducting coil via a substrate, and the substrate covers the heat buffer, the superconducting coil, and the bone material.

6. The superconducting magnet assembly of claim 5, wherein, The substrate is coated with the heat buffer, the superconducting coil and the skeleton by an impregnation process.

7. The superconducting magnet assembly of claim 2, wherein, The heat buffer section is located on the side of the superconducting coil closest to the working area.

8. The superconducting magnet assembly of claim 2, wherein, The heat buffer section is located on the side of the superconducting coil away from the working area.

9. The superconducting magnet assembly of claim 1, wherein, The heat buffer section is made of magnetic cold storage material.

10. A nuclear magnetic resonance apparatus characterized by comprising: Includes the superconducting magnet assembly as described in any one of claims 1 to 9.

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