COB display module with decorative surface lines and display screen

Abstract

The utility model belongs to the technical field of LED display, and relates to a COB display module with decorative surface lines and a display screen, the COB display module comprises a white PCB substrate, an LED chip, a white packaging layer and a surface line layer; the LED chips are evenly laid on the front face of the white PCB substrate, the white packaging layer is arranged on the front face of the white PCB substrate and wraps the LED chips, scattering particles are scattered in the white packaging layer, and the surface grain layer is arranged on the front face of the white packaging layer in an attached mode. The COB display module has the beneficial effects that the white PCB substrate and the white packaging layer with scattering particles are cooperatively matched, secondary light extraction is realized through the high reflection characteristic of the white PCB substrate and controllable scattering of the white packaging layer, and the surface texture layer is directly printed on the white packaging layer, so that the overall light transmittance of the COB display module is greatly improved; the technical problems that an existing COB display module is large in luminous efficiency loss and distorted in color are solved.

Description

Technical Field

[0001] This utility model relates to the field of LED display technology, and in particular to a COB display module and display screen with decorative surface texture. Background Technology

[0002] Currently, MiniLED COB direct-view technology achieves high-definition display through high-density packaging and has been widely used in commercial displays, conference screens, and other fields. For COB display modules targeting interior decoration scenarios (such as wood grain, marble texture wall displays, and other texture displays), most adopt a UV inkjet printing solution, printing patterns on a black PCB ink substrate.

[0003] Because traditional COB display modules prioritize black contrast in their packaging, the base color of COB packaging is mostly black. If printing is to be done on the packaging layer, a white base layer usually needs to be printed first to ensure a better pattern display effect. However, this process leads to a significant loss of light efficiency in the COB display module, resulting in excessive light decay and color distortion. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a COB display module and display screen with decorative surface texture, which solves the technical problems of large light effect loss and color distortion in the existing COB display modules.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, the main technical solutions adopted by this utility model include:

[0008] In a first aspect, this utility model provides a COB display module with decorative surface texture, including a white PCB substrate, an LED chip, a white encapsulation layer, and a surface texture layer;

[0009] LED chips are evenly distributed on the front side of a white PCB substrate. A white encapsulation layer is set on the front side of the white PCB substrate and covers the LED chips. Scattering particles are dispersed in the white encapsulation layer. A surface texture layer is attached to the front side of the white encapsulation layer to decorate the display surface of the COB display module.

[0010] Optionally, the white PCB substrate includes a fiberglass board, and the surface of the fiberglass board is printed with white solder resist ink.

[0011] Optionally, the white encapsulation layer includes a transparent epoxy resin layer.

[0012] Alternatively, the scattering particles include single-material particles and core-shell structured scattering particles.

[0013] Optionally, the scattering particles include core-shell structured SiO2@TiO2 scattering particles.

[0014] Optionally, the particle size of SiO2@TiO2 scattering particles is ≥2μm and ≤5μm, and the haze of the white encapsulation layer is 40% to 60%.

[0015] Optionally, the surface texture layer can be formed on the front side of the white encapsulation layer using nanoimprinting or inkjet printing processes, creating a decorative texture with a thickness of 10μm-50μm.

[0016] Optionally, the LED chip includes flip-chip MiniLED chips.

[0017] Secondly, this utility model embodiment provides a display screen, including the aforementioned COB display module with decorative surface texture.

[0018] (III) Beneficial Effects

[0019] The beneficial effects of this utility model are:

[0020] 1. This utility model discloses a COB display module and display screen with decorative surface texture. By using a white PCB substrate and a white encapsulation layer with scattering particles in synergy, secondary light extraction is achieved through the high reflectivity of the white PCB substrate and the controllable scattering of the white encapsulation layer. The surface texture layer is directly printed on the white encapsulation layer, which greatly improves the overall light transmittance of the COB display module and solves the technical problems of large light efficiency loss and color distortion in existing COB display modules.

[0021] 2. A surface texture layer is set on the surface of the white encapsulation layer to decorate the COB display module. The surface microstructure of the surface texture layer serves both as light diffusion and decorative texture, reducing interface reflection loss.

[0022] 3. White PCB substrates are printed with white solder resist ink. The white solder resist ink formula is compatible with existing PCB substrate manufacturing lines and can be used with screen printing equipment, thus improving process compatibility. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of a COB display module and display screen with decorative surface texture according to the present invention.

[0024] [Explanation of Labels in the Attached Image]

[0025] 1. White PCB substrate;

[0026] 2. White encapsulation layer;

[0027] 3. LED chips;

[0028] 4. Surface texture layer. Detailed Implementation

[0029] To better explain and facilitate understanding of this utility model, a detailed description of its specific embodiments is provided below with reference to the accompanying drawings. In this document, directional terms such as "upper" and "lower" are used interchangeably with... Figure 1 With the orientation as a reference, the direction of the surface texture layer 4 is "up" and the direction of the white PCB substrate 1 is "down".

[0030] This utility model proposes a COB display module and display screen with decorative surface texture. The COB display module includes a white PCB substrate, LED chips, a white encapsulation layer, and a surface texture layer. The LED chips are uniformly distributed on the front side of the white PCB substrate, and the white encapsulation layer is disposed on the front side of the white PCB substrate and covers the LED chips. Scattering particles are dispersed in the white encapsulation layer, and the surface texture layer is attached to the front side of the white encapsulation layer. Compared with the prior art, by using the white PCB substrate and the white encapsulation layer with scattering particles in synergy, secondary light extraction is achieved through the high reflectivity of the white PCB substrate and the controllable scattering of the white encapsulation layer, and the surface texture layer is directly printed on the white encapsulation layer, the overall light transmittance of the COB display module is greatly improved, solving the technical problem of large light efficiency loss in existing COB display modules.

[0031] To better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention can be understood more clearly and thoroughly, and that the scope of the present invention can be fully conveyed to those skilled in the art.

[0032] Example 1:

[0033] Reference Figure 1 This embodiment 1 provides a COB display module with decorative surface texture, including a white PCB substrate 1, LED chips 3, a white encapsulation layer 2, and a surface texture layer 4. The LED chips 3 are uniformly distributed on the front side of the white PCB substrate 1. The white encapsulation layer 2 is disposed on the front side of the white PCB substrate 1 and covers the LED chips 3. The white encapsulation layer 2 contains scattered particles. The surface texture layer 4 is attached to the front side of the white encapsulation layer 2 and is used to decorate the display surface of the COB display module.

[0034] In some feasible solutions, the white PCB substrate 1 is typically made of fiberglass board, and the surface of the fiberglass board is printed with white solder resist ink, which has high reflectivity after curing. The white solder resist ink can be existing TiO2-containing epoxy resin ink; during the production process, permanent W-102 type white solder resist ink can be used. Compared with black ink, the white solder resist ink used in this application results in higher reflectivity and lower light absorption of the white PCB substrate 1, which can increase brightness by 10% to 20%.

[0035] The white encapsulation layer 2 is a transparent epoxy resin layer mixed with 5 wt% scattering particles. Combined with the white PCB substrate 1, the white encapsulation layer 2 has higher light transmittance. Using the white encapsulation layer 2 mixed with scattering particles makes the encapsulation surface white, making it easier to apply textures or patterns using UV nanoimprinting. Compared to a black encapsulation base, pattern coloring is easier, color display is better, color reproduction is higher, and light decay is less.

[0036] Furthermore, the scattering particles can be single-material particles, such as TiO2 or SiO2, and can be core-shell structured SiO2@TiO2 scattering particles, ZrO2@SiO2 scattering particles, etc.

[0037] The scattering particles include core-shell structured SiO2@TiO2 scattering particles, with silicon dioxide as the core and titanium dioxide as the shell. The large refractive index difference between the titanium dioxide shell and the transparent epoxy resin layer can improve scattering efficiency.

[0038] In some feasible solutions, the particle size of SiO2@TiO2 scattering particles is ≥2μm and ≤5μm, and the haze of the white encapsulation layer 2 is generally controlled between 40% and 60%, achieving a balance between luminous efficacy, uniformity, and reliability. Haze represents the scattering ability of a material to incident light, and is the ratio of light deviating from the incident direction by more than 2.5° to all light passing through the material. The ratio of luminous flux emitted by a light source to power consumed is called luminous efficiency, or simply luminous efficacy. Since the particle size of 2μm-5μm SiO2@TiO2 scattering particles is larger than the incident light wavelength of 400-700nm, Mie scattering is dominant, and the scattering direction exhibits obvious forward scattering characteristics, meaning that the scattered light mainly propagates along the incident direction, and the scattering direction is controllable. The light emitted from LED chip 3 enters the white encapsulation layer 2 and reaches the SiO2@TiO2 scattering particles, resulting in Mie scattering. Most of the scattered light propagates along the incident direction and exits from the surface texture layer 4, while some is backscattered. Some of the backscattered light reaches the white PCB substrate 1 and is reflected, exiting from the surface texture layer 4. The SiO2@TiO2 scattering particles form a diffuse reflection network in the white encapsulation layer 2, ensuring uniform light scattering and avoiding localized overly bright or dark areas.

[0039] In some feasible solutions, the surface texture layer 4 can be formed on the front side of the white encapsulation layer 2 using nanoimprinting or inkjet printing processes, creating a decorative texture with a thickness of 10μm-50μm. When using UV nanoimprinting, a marble-like microstructure (25μm depth, 100μm spacing) is formed on the front side of the white encapsulation layer 2; the parameters of the microstructure can be adjusted according to actual needs. The microstructure surface scatters light, creating a soft, marble-like light effect, which is anti-glare and has good decorative properties. When using inkjet printing, a colored pattern or design is printed using a Seiko GS1024 printhead and various colored inks. UV nanoimprinting and inkjet printing are existing technologies and will not be described in detail here.

[0040] As a feasible solution, LED chip 3 can be a flip-chip MiniLED chip 3, which provides SMT die bonding. The MiniLED chip 3 has a size of 75μm×150μm.

[0041] Because this application uses a white PCB substrate 1 and a white encapsulation layer 2 with scattering particles to work together, secondary light extraction is achieved through the high reflectivity of the white PCB substrate 1 and the controllable scattering of the white encapsulation layer 2. The surface texture layer 4 is directly printed on the white encapsulation layer 2, which greatly improves the overall light transmittance of the COB display module, resulting in better color performance and providing a decorative COB display module with high light transmittance and high color fidelity.

[0042] In addition, the COB display module of this application has a high appearance yield, meets the IPC-A-610G Class II standard, and the interlayer bonding strength is increased to more than 15MPa. The interlayer bonding strength is greater, and there is no delamination after thermal cycling test (-40℃~125℃, 1000 times). It has good brightness uniformity and small brightness decay.

[0043] The surface texture layer 4 of this application can be any texture or decorative pattern such as wood grain or marble, corresponding to the formation of various COB display modules such as imitation wood grain or marble, which are more suitable for the home decoration and artistic decoration market. Taking the imitation marble pattern conference MiniLED COB display module as an example, its production process is as follows:

[0044] 1. Preparation of white PCB substrate 1: FR-4 fiberglass board is selected, and white solder resist ink (Permanent W-102 type) is screen printed. After curing, it has high reflectivity.

[0045] 2. Packaging of LED chip 3: First, the flip-chip MiniLED (75μm×150μm) is laid on the white PCB substrate 1 through SMT die bonding process, and then white encapsulation glue is applied to form a white encapsulation layer 2 to encapsulate and fix the MiniLED chip.

[0046] 3. Creation of surface texture layer 4:

[0047] A. A marble-textured microstructure (25 μm depth, 100 μm spacing) can be formed on the surface of the white encapsulation layer 2 using UV-assisted nanoimprint lithography.

[0048] B. Inkjet printing technology can be used to print color patterns or designs (Seiko GS1024 printhead, 6-color ink).

[0049] 4. Performance Testing:

[0050] Peak brightness: 1200 nits, higher than traditional solutions at the same power consumption.

[0051] Example 2:

[0052] Reference Figure 1 This embodiment 2 provides a display screen, including the aforementioned COB display module with decorative surface texture, which is suitable for interior decoration scenarios such as wood grain and marble grain wall displays.

[0053] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0054] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0055] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "beneath" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0056] In the description of this specification, the terms "one embodiment," "some embodiments," "embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0057] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make modifications, alterations, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A COB display module with decorative surface texture, characterized in that: It includes a white PCB substrate (1), an LED chip (3), a white encapsulation layer (2), and a surface texture layer (4); The LED chip (3) is uniformly mounted on the front side of the white PCB substrate (1). The white encapsulation layer (2) is disposed on the front side of the white PCB substrate (1) and covers the LED chip (3). Scattering particles are dispersed in the white encapsulation layer (2). The surface texture layer (4) is attached to the front side of the white encapsulation layer (2) and is used to decorate the display surface of the COB display module. 2.The COB display module with decorative surface texture of claim 1, wherein: The white PCB substrate (1) includes a fiberglass board, and the surface of the fiberglass board is printed with white solder resist ink. 3.The COB display module with decorative surface texture of claim 1, wherein: The white encapsulation layer (2) includes a transparent epoxy resin layer. 4.The COB display module with decorative surface texture of claim 1, wherein: The scattering particles include single-material particles and core-shell structured scattering particles. 5.The COB display module with decorative surface texture of claim 4, wherein: The scattering particles include core-shell structured SiO2@TiO2 scattering particles. 6.The COB display module with decorative surface texture of claim 5, wherein: The particle size of the SiO2@TiO2 scattering particles is ≥2μm and ≤5μm, and the haze of the white encapsulation layer (2) is 40% to 60%. 7.The COB display module with decorative surface texture of claim 1, wherein: The surface texture layer (4) is made using nanoimprinting or inkjet printing, and its thickness is 10μm-50μm. 8.The COB display module with decorative surface texture of claim 1, wherein: The LED chip (3) includes a flip-chip MiniLED chip.

9. A display screen, characterized by: Includes a COB display module with decorative surface texture as described in any one of claims 1 to 8.

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