Grid-connected energy storage converter system
By designing a centralized storage and cascaded communication topology, the problems of high hardware cost, poor scalability, and low communication efficiency of grid-connected energy storage converter systems are solved, achieving cost reduction and improved scalability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN LIGOO NEW ENERGY TECH CO LTD
- Filing Date
- 2025-05-21
- Publication Date
- 2026-04-24
AI Technical Summary
Existing grid-connected energy storage converter systems suffer from high hardware costs, poor scalability, and low communication efficiency due to distributed parameter storage and star communication architecture.
The system employs a centralized storage design and a cascaded communication topology. It utilizes Flash memory to centrally store system parameters and upgrade files, and achieves data transmission through the cascaded topology, thereby reducing optocoupler isolation devices and improving system scalability and communication efficiency.
Significantly reduces hardware costs, simplifies PCB layout, and improves system scalability and communication efficiency, enabling flexible system management.
Smart Images

Figure CN224164773U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of energy storage converter technology, specifically relating to a grid-connected energy storage converter system. Background Technology
[0002] Currently, grid-connected power storage converter (PCS) systems typically employ a distributed parameter storage architecture and a star communication topology. In traditional solutions:
[0003] Parameter storage: Each power control module (such as DSP) needs to be connected to an independent EEPROM chip to store grid-connected safety parameters (such as over- and under-voltage protection values, high and low voltage penetration thresholds, etc.), while the system management module (such as ARM) is connected to an external Flash memory to store upgrade files.
[0004] Communication architecture: The ARM and each DSP are directly connected via point-to-point isolated communication (such as UART + optocoupler) to form a star topology. For example, the ARM needs to communicate with DSP1 and DSP2 separately via two pairs of optocouplers to achieve parameter synchronization and OTA upgrades.
[0005] However, existing technical solutions have the following significant problems:
[0006] 1. High hardware cost: Each DSP needs to be equipped with an independent EEPROM, and the unit capacity cost of EEPROM is much higher than that of Flash, which leads to an increase in BOM cost.
[0007] 2. Star-shaped communication requires multiple pairs of optical couplers for isolation (e.g., N pairs of optical couplers are needed for N DSPs), which significantly increases device cost and PCB layout complexity.
[0008] 3. Poor scalability: The number of DSPs is limited by the number of communication ports of the ARM. Adding a new DSP requires additional isolation links, making system expansion difficult.
[0009] 4. Low efficiency: Traditional polling communication requires accessing the DSP one by one, which cannot support parallel data transmission across multiple nodes and limits real-time performance. Utility Model Content
[0010] The purpose of this invention is to provide a grid-connected energy storage converter system to solve the technical problems of high hardware cost, poor scalability and low communication efficiency caused by distributed parameter storage and star communication architecture in grid-connected energy storage converter systems.
[0011] This utility model achieves the above objectives through the following technical solutions:
[0012] This utility model proposes a grid-connected energy storage converter system, which is connected between the DC side and the AC side for energy conversion. The system includes a system management module and a power control module and a storage module connected to the system management module.
[0013] The storage module is used to store system parameters and system upgrade files;
[0014] The power control module is used to access data in the storage module through the system management module; wherein, the power control module is connected to the system management module via a communication link;
[0015] The communication link is a cascaded topology, in which the system management module is set as the master node and the power control module is set as the slave node.
[0016] Furthermore, the power control module includes a first power control submodule and a second power control submodule;
[0017] The first power control submodule is directly connected to the system management module.
[0018] The second power control submodule is indirectly connected to the system management module through the first power control submodule.
[0019] Furthermore, the communication link includes a pair of optical isolation devices, which are located between the system management module and the first power control submodule.
[0020] Furthermore, both the first power control submodule and the second power control submodule are DSP chips.
[0021] Furthermore, the storage module employs a Flash memory, connected to the system management module, and is used to store at least one of the following data:
[0022] Grid connection safety parameters;
[0023] Firmware upgrade files for the power control module and system management module.
[0024] Furthermore, the system management module is an ARM chip.
[0025] Furthermore, the Flash memory and the ARM chip are located on the same basic PCB board.
[0026] The beneficial effects of this utility model are as follows:
[0027] 1. This application adopts a centralized storage design, eliminating the external EEPROM memory of each power control module (DSP) and retaining only the Flash memory connected to the system management module (ARM) to uniformly store system parameters and upgrade files, which greatly reduces hardware costs and simplifies PCB layout.
[0028] 2. This application innovatively adopts a cascaded communication topology and uses an address routing protocol to achieve data forwarding. This allows the ARM to communicate directly with the first-level DSP, and subsequent DSPs relay data through the cascaded link. This not only reduces the number of optical coupler isolation devices but also breaks through the port number limitation of the traditional star topology, making the system expansion more flexible. Attached Figure Description
[0029] Figure 1 This is a schematic diagram of the structure of a grid-connected energy storage converter system in one embodiment of this application;
[0030] Figure 2 This is a schematic diagram of the structure of a grid-connected energy storage converter system in another embodiment of this application;
[0031] Figure 3 This is a schematic diagram of a structural design of an existing grid-connected energy storage system in a specific embodiment of this application. Detailed Implementation
[0032] The present application will now be described in further detail with reference to the accompanying drawings. It should be noted that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.
[0033] Combination Figure 3 As shown, in existing grid-connected energy storage systems, due to grid connection safety regulations, the power control unit (DSP) often needs to store some parameters, such as grid connection safety parameters (over / under voltage / over / under frequency power protection values, high / low voltage protection values). Typically, the DSP is connected to an external EEPROM (Electrically Erasable Programmable Read-Only Memory) chip to store configuration parameters.
[0034] Meanwhile, the other ARM chip responsible for monitoring needs to store the OTA upgrade files for both the DSP and ARM. Because the upgrade files are quite large, the ARM typically uses an external Flash chip to store the .bin files used for upgrades. Parameter settings are relatively few, so an EEPROM storage chip is usually placed on the DSP side to save parameters when power is off. To facilitate upgrades, the ARM communicates with both DSP1 and DSP2 via UART for upgrades and information transmission. Since the power supply and communication components are grounded differently, communication isolation is required. Therefore, two pairs of optocouplers are needed.
[0035] like Figure 1-2 As shown, in response to the above problems, this application proposes a grid-connected energy storage converter system in a specific embodiment, which is connected between the DC side and the AC side for energy conversion. The system includes a system management module and a power control module and a storage module connected to the system management module.
[0036] Furthermore, the DC side can be a battery pack, and the AC side can be the power grid. The connection between the grid-connected energy storage converter system and the DC and AC sides allows the system to convert DC power into AC power and feed it into the power grid, or receive AC power from the power grid and convert it to charge the battery pack or power other loads.
[0037] In this embodiment, the storage module is connected to the system management module and is used to store system parameters and system upgrade files; the power control module includes a first power control submodule and a second power control submodule; the first power control submodule is directly connected to the system management module; the second power control submodule is indirectly connected to the system management module through the first power control submodule.
[0038] Understandably, the system management module typically uses an ARM chip as the core controller of the entire system, responsible for managing and coordinating the operation of various modules. The storage module, on the other hand, uses Flash memory to centrally store system parameters (such as grid connection safety parameters) and system upgrade files (such as firmware upgrade files). Through this connection method, the system management module can easily access and modify the data in the storage module, enabling flexible configuration of system parameters and unified management of upgrade files.
[0039] In this embodiment, the power control module is used to access data in the storage module through the system management module; wherein, the power control module is connected to the system management module through a communication link; the communication link is a cascaded topology, in which the system management module is set as the master node and the power control module is set as the slave node.
[0040] Understandably, the communication link between the power control module and the system management module adopts a cascaded topology. In this structure, the system management module acts as the master node, responsible for initiating and controlling communication; the power control module acts as a slave node, comprising a first power control submodule and a second power control submodule, which communicate with the system management module directly and indirectly, respectively. The first power control submodule communicates directly with the system management module, while the second power control submodule communicates indirectly through the first power control submodule. This design reduces the use of communication ports and improves system scalability and communication efficiency.
[0041] More specifically, the system management module is directly connected to the storage module via an SPI interface, and both are integrated on the main control board. The storage module can use NOR Flash chips and is divided into a parameter storage area and an upgrade file storage area. The first power control submodule establishes a point-to-point connection with the system management module through an isolated UART interface, and an optocoupler isolator is used in the communication link to achieve electrical isolation. The second power control submodule is cascaded with the first power control submodule through another set of UART interfaces to form a master-slave communication architecture.
[0042] In one specific embodiment, combined with Figure 2 As shown, the communication link includes a pair of optically isolated devices ( Figure 2 Optical coupler 1 and optical coupler 2 are a pair of optocoupler isolation devices located between the system management module and the first power control submodule. The optocoupler isolation devices achieve electrical isolation between the high-voltage and communication components through photoelectric conversion. During operation, the system management module (such as an ARM chip) acts as the master node, responsible for initiating communication requests and sending control commands or data.
[0043] In one specific embodiment, both the first power control submodule and the second power control submodule are DSP chips, and the storage module is a Flash memory connected to the system management module for storing at least one of the following data: grid connection safety parameters; firmware upgrade files of the power control module and the system management module.
[0044] Understandably, the system uses an ARM chip as the system management module, with an external Flash memory for centralized storage of system parameters and upgrade files; two DSP chips serve as power control modules, with DSP1 directly connected to the ARM via UART and configured with optocoupler isolation, and DSP2 communicating indirectly with the ARM through DSP1. The communication uses a cascaded topology to achieve address routing and forwarding. During operation, the ARM reads parameters from the Flash memory and transmits them to the DSPs via the communication link; data from DSP2 needs to be relayed through DSP1. This implementation replaces the traditional DSP-external EEPROM solution with centralized storage and reduces the number of optocouplers by utilizing cascaded communication, significantly reducing hardware costs while maintaining functional integrity.
[0045] Furthermore, the Flash memory and the ARM chip are located on the same basic PCB board. The Flash memory and the system management module (ARM chip) adopt a shared board design, realizing the external Flash memory of the ARM chip.
[0046] Working Principle: This invention is based on a centralized storage and cascaded communication architecture. The system consists of a system management module (ARM chip), a power control module (including first and second power control sub-modules, both DSP chips), and a storage module (Flash memory). The storage module centrally stores system parameters and upgrade files for shared access by all modules. The system management module acts as the master node, communicating directly with the first power control sub-module through a pair of optocoupler isolation devices to ensure electrical isolation and stable communication. The second power control sub-module communicates indirectly through the first power control sub-module, forming a cascaded topology.
[0047] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A grid-connected energy storage converter system, connected between a DC side and an AC side for energy conversion, characterized in that, The system includes a system management module, as well as a power control module and a storage module connected to the system management module; The storage module is used to store system parameters and system upgrade files; The power control module is used to access data in the storage module through the system management module; wherein, the power control module is connected to the system management module via a communication link; The communication link is a cascaded topology, in which the system management module is set as the master node and the power control module is set as the slave node.
2. The grid-connected energy storage converter system according to claim 1, characterized in that, The power control module includes a first power control submodule and a second power control submodule; The first power control submodule is directly connected to the system management module. The second power control submodule is indirectly connected to the system management module through the first power control submodule.
3. The grid-connected energy storage converter system according to claim 2, characterized in that, The communication link includes a pair of optical couplers, which are located between the system management module and the first power control submodule.
4. The grid-connected energy storage converter system according to claim 2, characterized in that, Both the first power control submodule and the second power control submodule are DSP chips.
5. A grid-connected energy storage converter system according to claim 1, characterized in that, The storage module uses a Flash memory and is connected to the system management module to store at least one of the following data: Grid connection safety parameters; Firmware upgrade files for the power control module and system management module.
6. A grid-connected energy storage converter system according to claim 5, characterized in that, The system management module is an ARM chip.
7. A grid-connected energy storage converter system according to claim 6, characterized in that, The Flash memory and the ARM chip are located on the same basic PCB board.