Micro differential pressure sensor

Abstract

The utility model discloses a micro differential pressure sensor. The micro differential pressure sensor comprises a substrate, an outer shell and a chip module, the outer shell is fixedly connected with the base plate, and the outer shell and the base plate are enclosed to form an accommodating cavity; the chip module is located in the containing cavity and fixed to the substrate. A pressure equalizing groove is formed in the base plate, an air hole penetrating through the outer shell is formed in the outer shell, and the pressure equalizing groove is matched with the air hole to form a pressure equalizing channel so that the interior of the containing cavity can be communicated with the external environment. Through the arrangement of the technical characteristics, the air leakage efficiency of the micro differential pressure sensor can be improved, and the working reliability of the micro differential pressure sensor is further improved.

Description

Technical Field

[0001] This application relates to the field of microelectromechanical systems (MEMS) technology, specifically to a differential pressure sensor. Background Technology

[0002] Differential pressure sensors, as precision measuring devices, are widely used in the electronic cigarette industry. By detecting minute changes in airflow or gas pressure, they convert pressure differences into electrical signals, thereby enabling precise control of the electronic cigarette atomizer's operating status.

[0003] In practical applications, the air passage design in the overall structure of electronic cigarettes is unreasonable, and the vent hole is blocked by e-liquid vapor. After the smoking action, the internal air return of the electronic cigarette structure is slow, which leads to slow rebound of the MEMS chip and causes the problem of delayed output. Utility Model Content

[0004] In view of the above-mentioned deficiencies of the prior art, the technical problem to be solved by this application is to improve the leakage efficiency of the differential pressure sensor itself, so as to avoid the delayed output problem caused by leakage defects in the overall structure.

[0005] To address at least one of the aforementioned technical problems, this application discloses a differential pressure sensor.

[0006] According to one aspect of this application, a differential pressure sensor is provided, comprising:

[0007] substrate;

[0008] The outer shell is fixedly connected to the substrate and forms an accommodating cavity with the substrate;

[0009] The chip module is located inside the accommodating cavity and fixed on the substrate;

[0010] The substrate is provided with a pressure equalization groove, and the outer shell is provided with a vent hole that penetrates the outer shell. The pressure equalization groove and the vent hole form a pressure equalization channel to realize the communication between the inside of the accommodating cavity and the external environment.

[0011] Optionally, the direction perpendicular to the substrate surface is the first direction, the direction parallel to the substrate radial direction and perpendicular to the first direction is the second direction, and the direction perpendicular to both the first and second directions is the third direction.

[0012] The equalizing groove extends on the substrate along a second direction. The size of the equalizing groove in the first direction ranges from 0.02 mm to 0.05 mm, and the size in the third direction ranges from 0.05 mm to 0.3 mm.

[0013] Optionally, the substrate includes a solder resist layer, on which a receiving groove is formed;

[0014] The equalizing groove is larger in size in the second direction than the receiving groove in the second direction; the second direction is parallel to the radial direction of the substrate.

[0015] Optionally, the housing includes an extension and a connecting portion:

[0016] The extension extends along a first direction and includes a first part and a second part, the first part being connected to the connecting part, and the second part protruding from the first part toward the substrate;

[0017] The second part is connected to the substrate so that a gap is formed between the first part and the substrate in the first direction.

[0018] Optionally, the vent is located in the connecting part and includes a first vent and a second vent, wherein the first vent communicates with the receiving cavity through the second vent.

[0019] Optionally, the first vent hole has a first projection on the surface of the substrate, and the second vent hole has a second projection on the surface of the substrate. The area of ​​the second projection is smaller than the area of ​​the first projection, and the second projection is located inside the first projection.

[0020] Optionally, the outer casing also includes a plurality of partitions located within the second vent to divide the second vent into a plurality of first through holes.

[0021] Optionally, it further includes: an adhesive layer located within a receiving groove; the receiving groove is disposed along the circumference of the substrate so that the second part of the housing is fixedly connected to the substrate by the adhesive layer.

[0022] Optionally, a second through hole is provided on the substrate;

[0023] The chip module includes:

[0024] The MEMS differential pressure detection chip has a back cavity, and the MEMS differential pressure detection chip covers a second through hole so that the back cavity is connected to the second through hole.

[0025] The circuit chip is connected to the MEMS differential pressure detection chip via a first bonding wire and to the substrate via a second bonding wire.

[0026] Optionally, it also includes: an oil-proof mesh covering the outer casing, with a portion of the oil-proof mesh in contact with the vent holes.

[0027] The differential pressure sensor in this application improves the venting efficiency by creating an equalizing groove and forming an equalizing channel with a vent hole.

[0028] Specifically, a pressure equalization groove is provided on the side where the substrate connects to the outer casing, and a vent hole is provided on the outer casing. The pressure equalization groove and the vent hole form a pressure equalization channel, allowing the negative pressure inside the accommodating cavity to be restored to the same air pressure value as the outside through the pressure equalization channel. This improves the venting efficiency of the differential pressure sensor without affecting the product's sensitivity, thereby avoiding the problem of delayed shutdown of the differential pressure sensor during operation caused by a long venting process due to vent blockage or other reasons. This improves its application sensitivity and reliability during operation.

[0029] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of this application, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0031] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0032] Figure 1 A structural cross-section of a differential pressure sensor provided for exemplary embodiments of this disclosure. Figure 1 ;

[0033] Figure 2 A top view of the structure of a differential pressure sensor provided for an exemplary embodiment of this disclosure;

[0034] Figure 3 A structural cross-section of a differential pressure sensor provided for exemplary embodiments of this disclosure. Figure 2 ;

[0035] Figure 4 Structural cross-section of another differential pressure sensor provided for exemplary embodiments of this disclosure Figure 1 ;

[0036] Figure 5 Structural cross-section of another differential pressure sensor provided for exemplary embodiments of this disclosure Figure 2 ;

[0037] Figure 6 Top view of the structure of yet another differential pressure sensor provided as an exemplary embodiment of this disclosure;

[0038] Figure 7 A cross-sectional view of the structure of another differential pressure sensor provided as an exemplary embodiment of this disclosure.

[0039] Explanation of reference numerals in the attached figures:

[0040] 10-Substrate, 11-Second through hole, 12-Accommodation cavity, 13-Accommodation groove, 14-First region, 15-Equalizing groove, 16-Solder resist layer;

[0041] 20-Outer shell, 21-Connecting part, 22-First vent, 23-Second vent, 24-Separating part, 25-First through hole, 26-Extension, 27-First part, 28-Second part;

[0042] 30-Chip module, 31-MEMS differential pressure detection chip, 32-Circuit chip, 33-First bonding wire, 34-Second bonding wire;

[0043] 40-Oil-proof mesh;

[0044] 50 - Adhesive layer;

[0045] T1 - Inhalation path, T2 - Pressure equalization path. Detailed Implementation

[0046] The technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this specification, and not all of them. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this application.

[0047] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such as a process, method, system, product, or server that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.

[0048] Various exemplary embodiments, features, and aspects of this disclosure will now be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of the embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.

[0049] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0050] In this document, the term "and / or" describes a relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists alone, A and B exist simultaneously, and B exists alone. Additionally, the term "at least one" in this document means any combination of at least two of any one or more elements. For example, including at least one of A, B, and C can mean including any one or more elements selected from the set consisting of A, B, and C.

[0051] Furthermore, to better illustrate this disclosure, numerous specific details are set forth in the following detailed description. Those skilled in the art will understand that this disclosure can be practiced without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art have not been described in detail in order to highlight the main points of this disclosure.

[0052] Figure 1 This illustration shows a structural cross-section of a differential pressure sensor provided in an exemplary embodiment of the present disclosure. Figure 1 , Figure 2 This diagram shows a top view of a micro differential pressure sensor provided by an exemplary embodiment of the present disclosure. The direction perpendicular to the surface of the substrate 10 is a first direction; the direction parallel to the radial direction of the substrate 10 and perpendicular to the first direction is a second direction; and the direction perpendicular to both the first and second directions is a third direction. Figure 1 and Figure 2 As shown, the first direction is the y-direction, the second direction is the x-direction, and the third direction is the z-direction. A differential pressure sensor includes:

[0053] The substrate 10 is provided with a second through hole 11 penetrating the substrate 10;

[0054] The outer shell 20 is fixedly connected to the substrate 10 and forms an accommodating cavity 12 with the substrate 10;

[0055] The chip module 30 is located in the accommodating cavity 12 and fixed on the substrate 10.

[0056] The substrate 10 is provided with a pressure equalization groove 15, and the outer shell 20 is provided with a vent hole penetrating the outer shell 20. The pressure equalization groove 15 and the vent hole form a pressure equalization channel to realize the communication between the inside of the accommodating cavity 12 and the external environment.

[0057] In some embodiments, the differential pressure sensor may include a substrate 10, a chip module 30 located on the substrate 10, and a housing 20 fixedly connected to the substrate 10.

[0058] like Figure 1 As shown, the substrate 10 has a first surface and a second surface that are opposite and parallel to each other. The chip module 30 and the housing 20 are mounted on the first surface of the substrate 10. The chip module 30 includes:

[0059] The MEMS differential pressure detection chip 31 has a back cavity, and the MEMS differential pressure detection chip 31 covers the second through hole 11 so that the back cavity is connected to the second through hole 11.

[0060] The circuit chip 32 is connected to the MEMS differential pressure detection chip 31 via a first bonding line 33, and to the substrate 10 via a second bonding line 34.

[0061] In some embodiments, the chip module 30 may include a MEMS differential pressure detection chip 31 and a circuit chip 32. In a first direction, the substrate 10 has a second through hole 11 penetrating its body. One side surface of the MEMS differential pressure detection chip 31 communicates with the second through hole 11, and the other side surface of the MEMS differential pressure detection chip 31 communicates with the outside through a receiving cavity 12 and a vent hole, so that the MEMS differential pressure detection chip 31 can sense the pressure difference signal between the second through hole 11 and the vent hole.

[0062] The MEMS differential pressure detection chip 31 and the circuit chip 32 are connected via a first bonding wire 33, and the circuit chip 32 is connected to the substrate 10 via a second bonding wire 34. The MEMS differential pressure detection chip 31 is used to sense minute pressure changes in the airflow and output the pressure change as an electrical signal. The circuit chip 32 is used to receive and process the electrical signals sent by the MEMS differential pressure detection chip 31.

[0063] In some embodiments, the back cavity of the MEMS differential pressure detection chip 31 is covered by the second through hole 11, so that the MEMS differential pressure detection chip 31 can directly contact the airflow flowing through the second through hole 11, thereby sensing the small pressure changes brought about by the airflow and improving the accuracy of the MEMS differential pressure detection chip 31 in sensing pressure and outputting electrical signals.

[0064] like Figure 1 As shown, the differential pressure sensor also includes a receiving groove 13 and an adhesive layer 50. The adhesive layer 50 is located inside the receiving groove 13, and the housing 20 is fixedly connected to the substrate 10 through the adhesive layer 50.

[0065] In some embodiments, the first surface of the substrate 10 has a solder resist layer 16 and a copper foil layer. The receiving groove 13 can be formed by opening a portion of the solder resist layer 16, i.e., by removing a portion of the solder resist layer 16. Alternatively, the receiving groove 13 can be formed by opening a portion of both the solder resist layer 16 and the copper foil layer, i.e., by removing a portion of the stacked solder resist layer 16 and the copper foil layer. In this embodiment, the copper foil layer is not shown in the drawings, and the receiving groove 13 is formed by opening a portion of both the solder resist layer 16 and the copper foil layer, and is disposed on the first surface along the circumference of the substrate 10.

[0066] The adhesive layer 50 is located within the recessed receiving groove 13 relative to the solder resist layer 16, such that the second portion 28 of the extension 26 is bonded to the first surface of the substrate 10 via the adhesive layer 50. The adhesive layer 50 may be an adhesive.

[0067] In some embodiments, the shape of the receiving slot 13 can be adaptively adjusted according to the overall shape of the differential pressure sensor. For example, as Figure 2 As shown, when the top view of the differential pressure sensor is circular, the receiving groove 13 can be annular. The setting of the receiving groove 13 can accurately limit the position of the adhesive layer 50, avoid the adhesive layer 50 from overflowing and flowing into the cutting path of the entire product plate, which would cause inter-structure adhesion, thereby improving the convenience and accuracy of product cutting.

[0068] like Figure 1 and Figure 2 As shown, the equalizing groove 15 can be located in the first region 14 and extends on the substrate 10 along the second direction. The dimension of the equalizing groove 15 in the third direction is between 0.05 mm and 0.3 mm, and the dimension in the first direction is between 0.02 mm and 0.05 mm.

[0069] In some embodiments, the equalizing trench 15 can be formed on the solder resist layer 16 of the substrate 10, i.e., by removing a portion of the solder resist layer 16 to form the equalizing trench 15; alternatively, it can be formed on the stacked solder resist layer 16 and copper foil layer, i.e., by removing a portion of the stacked solder resist layer 16 and copper foil layer. The equalizing trench 15 can be arranged in any direction on the solder resist layer 16 and copper foil layer of the substrate 10. In this embodiment, the copper foil layer is not shown in the drawings, and the equalizing trench 15 is formed on the stacked solder resist layer 16 and copper foil layer.

[0070] In some embodiments, the width of the equalizing groove 15 in the third direction can be set between 0.05 mm and 0.3 mm, and the height of the equalizing groove 15 in the first direction can be set between 0.02 mm and 0.05 mm. This application does not impose specific limitations on the dimensions of the equalizing groove 15 in the first, second, and third directions. While meeting the above-mentioned dimensional ranges and ensuring the venting cross-sectional area, adaptive adjustments can be made according to different pressure relief requirements.

[0071] The equalizing groove 15 is formed on the solder resist layer 16 of the substrate 10, and its dimensions in the second and third directions are limited. Compared to venting by slotting the housing 20, the position and size of the equalizing groove 15 in this embodiment can prevent the equalizing groove 15 from being too large due to manufacturing limitations when it is placed on the housing 20, thus affecting the working sensitivity of the differential pressure sensor, while expanding the equalizing channel. Therefore, the size and position of the equalizing groove 15 in this embodiment can ensure the working sensitivity of the differential pressure sensor.

[0072] Figure 3 A structural cross-section of a differential pressure sensor provided for exemplary embodiments of this disclosure. Figure 2 .like Figure 3 As shown, in some other embodiments, the equalizing groove 15 may also be formed inside the substrate 10. Compared to Figure 1 , Figure 3 The equalization groove 15 is not formed through the solder resist layer 16 and the copper foil layer, but is disposed inside the substrate 10.

[0073] Furthermore, such as Figure 2 As shown, the dimension of the equalizing groove 15 in the second direction is larger than that of the receiving groove 13 in the second direction. By setting the dimension of the equalizing groove 15 in the second direction to be larger than that of the receiving groove 13 in the second direction, the outer casing is prevented from blocking the equalizing groove.

[0074] In some embodiments, Figure 1 The dashed line shows the pressure equalization path T2 corresponding to the pressure equalization channel formed by the pressure equalization groove 15. The pressure equalization groove 15, together with the vent hole, forms a pressure equalization channel, thereby achieving air release. This allows the negative pressure inside the accommodating cavity 12 to recover to the same air pressure value as the outside, thus improving the air release efficiency of the differential pressure sensor without affecting the product's sensitivity. This avoids the problem of delayed shutdown of the differential pressure sensor during operation, improving its application sensitivity and reliability.

[0075] In some embodiments, the pressure equalization groove 15 can be positioned on the solder resist layer 16 close to the receiving groove 13. Since the receiving groove 13 has an adhesive layer 50 for connecting the substrate 10 and the housing 20, the positioning of the pressure equalization groove 15 ensures that the pressure equalization channel has the shortest path to the external environment, thereby improving venting efficiency. Simultaneously, it also ensures that the pressure equalization groove 15 is not blocked by overflow of the adhesive layer 50, improving the application reliability of the pressure equalization channel.

[0076] In one specific embodiment, one application scenario for a differential pressure sensor could be electronic cigarettes. By assembling the differential pressure sensor into the entire device for application, when along... Figure 1When air intake begins in the direction of the arrow in the middle intake path T1, a negative pressure is generated inside the accommodating cavity 12. This causes deformation of the MEMS diaphragm of the MEMS differential pressure detection chip 31, resulting in a change in capacitance. When the capacitance change reaches a preset value, the cigarette lighting action is initiated. After the intake action stops, the negative pressure inside the accommodating cavity 12 will pass through... Figure 1 The pressure equalization path T2 corresponding to the pressure equalization channel shown achieves pressure equalization, that is, rapid air return is achieved through the vent and pressure equalization groove 15, causing the MEMS diaphragm to rebound, the capacitance change to the initial value, and the circuit to detect the cessation of smoking and the cigarette lighting action. The arrow direction of the pressure equalization path T2 indicates the gas flow direction during the pressure equalization and air return process. The setting of the pressure equalization channel can reduce the impact of e-liquid wetting the vent on the negative pressure change efficiency within the accommodating cavity 12, improve the gas release efficiency, and allow the MEMS diaphragm to promptly return to its initial state after the smoking and inhalation actions stop, thereby improving the reliability of the differential pressure sensor application.

[0077] like Figure 1 As shown, the vent includes a first vent 22 and a second vent 23. The outer casing 20 includes:

[0078] The extension 26 extends along a first direction and includes a first part 27 and a second part 28 protruding from the first part 27 toward the substrate 10. The second part 28 is connected to the substrate 10 so that a gap is formed between the first part 27 and the substrate 10 in the first direction.

[0079] The connecting part 21 is connected to the first part 27 of the extension part 26; the first vent 22 and the second vent 23 are both located in the connecting part 21.

[0080] In some embodiments, the outer casing 20 may be a box structure with an open opening. The outer casing 20 may be divided into an extension 26 and a connecting portion 21, the connecting portion 21 being arranged parallel to the surface of the substrate 10, and the extension 26 being arranged perpendicular to the surface of the substrate 10. One end of the extension 26 is connected to the substrate 10, and the other end is connected to the connecting portion 21.

[0081] In some embodiments, the extension 26 may be further divided into a first portion 27 and a second portion 28 protruding from the first portion 27 toward the substrate 10, such that the end of the extension 26 connected to the substrate 10 is stepped. Figure 1As shown, the extension 26 is connected to the connecting portion 21 via the first portion 27 and to the substrate 10 via the second portion 28, so that there is a gap between the first portion 27 of the extension 26 and the substrate 10 in the first direction. Simultaneously, the diameter of the substrate 10 in the second direction is larger than the diameter of the housing 20 in the second direction. This, combined with the stepped design at one end of the extension 26, improves the difficulty of cutting and the problem of products falling off when cutting a whole sheet into individual items during the manufacturing process of the differential pressure sensor, thereby improving the cutting convenience of the differential pressure sensor. Furthermore, the products can be promptly detached after cutting, reducing the scrap rate due to adhesion, thus improving the overall manufacturing quality of the differential pressure sensor.

[0082] The first vent 22 has a first projection on the first surface of the substrate 10, and the second vent 23 has a second projection on the first surface of the substrate 10. The area of ​​the second projection is smaller than the area of ​​the first projection, and the second projection is located inside the first projection.

[0083] In some embodiments, a first vent 22 and a second vent 23 are disposed on the connecting portion 21, and the first vent 22 communicates with the outside through the second vent 23. The area of ​​the second projection is set to be smaller than the area of ​​the first projection, and the second projection is located inside the first projection, so that the cross-sections of the first vent 22 and the second vent 23 present a T-shaped structure.

[0084] The first vent 22 is relatively large, which effectively improves the clogging problem caused by e-liquid seepage into the vent compared to related technologies. Furthermore, since the area of ​​the second projection corresponding to the second vent 23 is smaller than the area of ​​the first projection corresponding to the first vent 22, and the second projection is located inside the first projection, when tiny impurities such as dust particles pass through the first vent 22, they will fall onto the outer casing 20. This prevents micro-dust particles from entering the product through the vents during the packaging process and falling onto the chip module 30, causing abnormal chip performance, thereby improving the reliability of the differential pressure sensor.

[0085] Figure 4 and Figure 5 A cross-sectional view of another differential pressure sensor provided as an exemplary embodiment of this disclosure. Figure 4 and Figure 5 This is a schematic diagram of a differential pressure sensor corresponding to different cross-sections. Another differential pressure sensor according to an embodiment of this application is shown below. Figure 4 and Figure 5 As shown, this embodiment is similar to Figures 1 to 3 The difference in the corresponding embodiment is the setting of the oil-proof mesh 40.

[0086] In this embodiment, the differential pressure sensor, in addition to the substrate 10, housing 20, and chip module 30, also includes an oil-proof mesh 40. The oil-proof mesh 40 covers the housing 20. The structure, position, and other configuration of the substrate 10, housing 20, and chip module 30 can be found in [reference needed]. Figures 1 to 3 The corresponding implementation examples will not be described in detail here.

[0087] like Figure 4 and Figure 5 As shown, the first vent 22 and the second vent 23 are located at the part of the outer casing 20 that contacts the oil-proof mesh 40. The oil-proof mesh 40 is used for preliminary filtration of e-liquid.

[0088] The first vent 22 is connected to the accommodating cavity 12 through the second vent 23, and the first vent 22 is in contact with the oil-proof mesh 40, which can further prevent the oil-proof mesh 40 from being blocked by e-liquid after being soaked in e-liquid.

[0089] This embodiment is compared to Figures 1 to 3 In a corresponding embodiment, an oil-proof mesh 40 is introduced and placed on the outer shell 20 at the location where the first vent hole 22 and the second vent hole 23 are opened, which can further improve the wetting and clogging of the vent holes by e-liquid.

[0090] Figure 6 This is a top view of the structure of another differential pressure sensor provided in an exemplary embodiment of this disclosure. Another differential pressure sensor in this application embodiment is shown below. Figure 6 As shown, this embodiment is similar to Figures 1 to 3 Corresponding embodiments and Figures 4 to 5 The difference in the corresponding embodiment is the change in the number of equalizing tanks 15.

[0091] In this embodiment, the structure of the differential pressure sensor, including the oil-proof mesh 40, substrate 10, housing 20, chip module 30, second through hole 11 on substrate 10, and receiving groove 13, remains unchanged and will not be described in detail here. The following will describe in detail the changes in the number of equalizing grooves 15 in this embodiment.

[0092] In some embodiments, the number of equalizing grooves 15 can be one or more; this embodiment is an exemplary description of a plurality of equalizing grooves 15. Figure 6 As shown, in this embodiment, there are two equalizing grooves 15. Figure 6 This is a specific form of multiple arrangements of equalizing grooves 15. This application does not limit the arrangement of these grooves, as long as the venting cross-sectional area of ​​the multiple equalizing grooves 15 meets the venting requirements of the differential pressure sensor.

[0093] In some embodiments, such as Figure 6As shown, since the equalizing groove 15 is located in the first region 14, when there are multiple equalizing grooves 15, the number of first regions 14 also changes to multiple. At this time, the receiving groove 13 is divided into two arc-shaped structures by the two first regions 14.

[0094] The configuration of each structure in this embodiment can achieve the same result as... Figures 1 to 3 Corresponding embodiments and Figure 4 and Figure 5 The corresponding embodiments achieve the same technical effects, which will not be repeated here. The arrangement of multiple equalizing grooves 15 can further expand the venting path, thereby improving venting efficiency and enhancing the sensitivity of the differential pressure sensor application.

[0095] Figure 7 This is a cross-sectional view of the structure of another differential pressure sensor provided in an exemplary embodiment of this disclosure. Another differential pressure sensor in this application embodiment is shown below. Figure 7 As shown, this embodiment is similar to Figures 1 to 3 The difference in the corresponding embodiment is the structural change of the second vent 23 and the setting of the oil-proof mesh 40; and Figure 4 and Figure 5 The difference in the corresponding embodiment is the structural change of the second vent 23; and Figure 6 The difference in the corresponding embodiments is the change in the number of equalizing grooves 15 and the structural change in the second vent 23.

[0096] In this embodiment, the structural configurations of the differential pressure sensor, including the oil-proof mesh 40, substrate 10, housing 20, chip module 30, and the second through hole 11 on the substrate 10, remain unchanged and will not be described in detail here. This embodiment will focus on the structural changes of the second vent hole 23.

[0097] The outer casing 20 also includes a plurality of partitions 24 located within the second vent 23 to divide the second vent 23 into a plurality of first through holes 25.

[0098] In some embodiments, the arrangement of multiple first through holes 25 makes the size of the second vent hole 23 smaller than that of the previous embodiment. This reduces the risk of foreign objects such as e-liquid, smoke, and dust particles entering the cavity 12 of the differential pressure sensor during actual application. It also prevents e-liquid from clogging the vent hole and foreign particles from falling onto the chip module 30, which could cause abnormal chip performance. This ensures the reliability of the differential pressure sensor and extends its service life.

[0099] Accordingly, this application also provides an electronic device, including the differential pressure sensor described in any of the above embodiments. This electronic device can be used in devices such as electronic cigarettes and microphones that require the use of a differential pressure sensor.

[0100] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0101] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0102] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0103] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent variations, or alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application. The terminology used herein is chosen to best explain the principles, practical applications, or technical improvements to the market of the various embodiments, or to enable other persons skilled in the art to understand the various embodiments disclosed herein.

Claims

1. A differential pressure sensor, characterized in that, include: substrate; The outer shell is fixedly connected to the substrate and forms an accommodating cavity with the substrate; The chip module is located within the accommodating cavity and fixed to the substrate; The substrate is provided with a pressure equalization groove, and the outer shell is provided with a vent hole that penetrates the outer shell. The pressure equalization groove and the vent hole form a pressure equalization channel to realize the communication between the inside of the accommodating cavity and the external environment.

2. The differential pressure sensor according to claim 1, characterized in that, The direction perpendicular to the surface of the substrate is the first direction, the direction parallel to the radial direction of the substrate and perpendicular to the first direction is the second direction, and the direction perpendicular to both the first and second directions is the third direction. The equalizing groove extends on the substrate along the second direction, with a size range of 0.02mm to 0.05mm in the first direction and a size range of 0.05mm to 0.3mm in the third direction.

3. The differential pressure sensor according to claim 1, characterized in that, The substrate includes a solder resist layer, and a receiving groove is formed on the solder resist layer; The dimension of the equalizing groove in the second direction is larger than the dimension of the receiving groove in the second direction; the second direction is a direction parallel to the radial direction of the substrate.

4. The differential pressure sensor according to claim 1, characterized in that, The outer casing includes an extension and a connecting portion: The extension extends along a first direction and includes a first part and a second part, wherein the first part is connected to the connecting part and the second part protrudes from the first part toward the substrate; The second part is connected to the substrate so that the first part and the substrate form a gap in the first direction.

5. The differential pressure sensor according to claim 4, characterized in that, The vent is located in the connecting part and includes a first vent and a second vent. The first vent communicates with the accommodating cavity through the second vent.

6. The differential pressure sensor according to claim 5, characterized in that, The first vent hole has a first projection on the surface of the substrate, and the second vent hole has a second projection on the surface of the substrate. The area of ​​the second projection is smaller than the area of ​​the first projection, and the second projection is located inside the first projection.

7. The differential pressure sensor according to claim 5, characterized in that, The outer casing also includes multiple partitions. The plurality of partitions are located within the second vent hole to divide the second vent hole into a plurality of first through holes.

8. The differential pressure sensor according to claim 3, characterized in that, Also includes: An adhesive layer is located within the receiving groove; The receiving groove is arranged circumferentially along the substrate so that the second part of the outer casing is fixedly connected to the substrate through the adhesive layer.

9. The differential pressure sensor according to claim 1, characterized in that, The substrate is provided with a second through hole penetrating the substrate; The chip module includes: The MEMS differential pressure detection chip has a back cavity, and the MEMS differential pressure detection chip covers the second through hole so that the back cavity is connected to the second through hole; The circuit chip is connected to the MEMS differential pressure detection chip via a first bonding wire and to the substrate via a second bonding wire.

10. The differential pressure sensor according to claim 1, characterized in that, Also includes: An oil-proof mesh is installed on the outer casing, and part of the oil-proof mesh is in contact with the vent holes.

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