Liquid cooling heat dissipation structure

Abstract

The utility model provides a liquid cooling heat radiation structure, the liquid cooling heat radiation structure comprises a cooling housing, the cooling housing comprises a cooling pedestal and a cooling cover plate, the cooling pedestal is connected with a packaging substrate of a chip structure, the cooling pedestal is provided with a through hole, and the cooling cover plate is provided with a through hole. A cooling cavity is defined by the side wall of the through hole and the upper wall face of the chip structure, the cooling cavity is used for introducing a cooling medium, the cooling cover plate is detachably connected with the cooling base, the cooling cover plate is provided with a cooling inlet and a cooling outlet, the cooling inlet and the cooling outlet are both communicated with the cooling cavity, and the chip structure is arranged in the cooling cavity. And the cooling medium enters the cooling cavity through the cooling inlet, is in contact with the chip, exchanges heat with the chip and then flows out of the cooling outlet. The liquid cooling heat dissipation structure has the advantages of being simple in structure and good in heat dissipation effect.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor device heat dissipation technology, specifically, it relates to a liquid cooling heat dissipation structure. Background Technology

[0002] When a chip is working, it generates heat due to power consumption. Overheating of the chip can lead to a decrease in performance. The core reason is that the electron migration rate of semiconductor devices slows down as the temperature rises, and the switching delay of transistors increases, which directly affects the efficiency of computing and data transmission.

[0003] In related technologies, chip heat dissipation methods are all achieved through heat sinks (passive heat dissipation) or external heat dissipation (such as air cooling and water cooling), which cannot meet the heat dissipation needs of high power consumption chips (such as AI chips). Utility Model Content

[0004] This utility model aims to at least partially solve one of the technical problems in the related art.

[0005] Therefore, embodiments of this utility model propose a liquid cooling heat dissipation structure, which has the advantages of simple structure and good heat dissipation effect.

[0006] The liquid cooling heat dissipation structure of this utility model embodiment includes:

[0007] A cooling housing includes a cooling base and a cooling cover. The cooling base is connected to the packaging substrate of the chip structure. The cooling base has a through hole, and the sidewall of the through hole and the upper wall of the chip structure define a cooling chamber for introducing a cooling medium.

[0008] The cooling cover plate is detachably connected to the cooling base. The cooling cover plate has a cooling inlet and a cooling outlet. Both the cooling inlet and the cooling outlet are connected to the cooling chamber. The cooling medium enters the cooling chamber through the cooling inlet, contacts the chip for heat exchange, and then flows out through the cooling outlet.

[0009] The liquid cooling structure of this embodiment features a cooling chamber at the top of the chip structure, enabling direct heat exchange between the cooling medium and the chip's heat-generating surface. This overcomes the bottleneck of traditional heat dissipation methods in dealing with ultra-high power density chips (such as AI chips). It effectively maintains the chip at a low operating temperature, ensuring that the electron migration rate and transistor switching characteristics of the semiconductor device are not affected by high temperatures, ultimately ensuring that high-power chips can operate stably and reliably under their rated high performance.

[0010] In some embodiments, the cooling chamber includes a first chamber and a second chamber, wherein the first chamber is located above the second chamber in the height direction of the cooling housing, and the space capacity of the first chamber is greater than that of the second chamber.

[0011] In some embodiments, in a plane orthogonal to the height direction of the cooling housing, the projected area of ​​the first cavity is greater than the projected area of ​​the second cavity, and the projected profile of the second cavity is substantially equal to the projected profile of the upper wall of the chip structure.

[0012] In some embodiments, the liquid cooling heat dissipation structure of this utility model further includes a first control component. The first control component includes a first detection element and a first control valve. The first control valve is disposed at least one of the cooling inlet and the cooling outlet. The first detection element is located in the cooling chamber and connected to the cooling base. The first detection element is arranged adjacent to the chip structure to monitor the temperature change of the chip structure. The first detection element is electrically connected to the first control valve so that the first control valve is used to adjust the flow rate of the cooling medium according to the temperature information transmitted by the first detection element.

[0013] In some embodiments, the liquid cooling heat dissipation structure of this utility model further includes a waterproof gasket, which is arranged around the cooling chamber in the circumferential direction and disposed between the cooling base and the cooling cover plate in the height direction of the cooling housing.

[0014] In some embodiments, the liquid cooling heat dissipation structure of this utility model further includes a waterproof groove, which is disposed on the side of the cooling cover plate adjacent to the cooling base and / or the side of the cooling base adjacent to the cooling cover plate, and the waterproof groove is adapted to the waterproof gasket.

[0015] In some embodiments, the liquid cooling heat dissipation structure of this utility model further includes a water-proof rubber ring and an insulating rubber ring. The cooling base has a first protrusion and a second protrusion. The first protrusion extends toward the packaging substrate and is connected to the packaging substrate through the insulating rubber ring. The second protrusion extends toward the center line of the cooling housing and is connected to the upper wall of the chip structure through the water-proof rubber ring. The sidewall of the second protrusion constitutes part of the sidewall of the through hole.

[0016] In some embodiments, the cooling base and the packaging substrate define a sealed chamber for introducing an inert gas.

[0017] In some embodiments, the liquid cooling heat dissipation structure of this utility model further includes a second control component, the second control component includes a second control valve and a second detection element, the cooling housing also has a vent hole, the vent hole penetrates the cooling housing and communicates with the sealed chamber, the second control component is disposed in the vent hole, the second detection element is used to monitor the gas pressure in the sealed chamber, and the inert gas is used to be introduced into the sealed chamber through the second control valve.

[0018] In some embodiments, the liquid cooling heat dissipation structure of this utility model further includes a warning element, which is electrically connected to the second detection element. When the pressure value detected by the second detection element is lower than a preset value, the warning element issues a warning signal. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the liquid cooling heat dissipation structure according to an embodiment of the present invention.

[0020] Figure label:

[0021] 10. Chip structure; 101. Packaging substrate.

[0022] 1. Cooling housing; 11. Cooling base; 110. Through hole; 111. Cooling chamber; 1111. First chamber; 1112. Second chamber; 112. First protrusion; 113. Second protrusion; 12. Cooling cover plate; 13. Vent hole.

[0023] 2. Waterproof gaskets,

[0024] 3. Waterproof rubber ring,

[0025] 4. Insulating rubber ring,

[0026] 5. Sealed chamber. Detailed Implementation

[0027] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0028] like Figure 1As shown, the liquid cooling heat dissipation structure of this utility model embodiment includes a cooling shell 1, which includes a cooling base 11 and a cooling cover plate 12. The cooling base 11 is connected to the packaging substrate 101 of the chip structure 10. The cooling base 11 has a through hole 110. The side wall of the through hole 110 and the upper wall of the chip structure 10 define a cooling chamber 111. The cooling chamber 111 is used to introduce a cooling medium. The cooling cover plate 12 is detachably connected to the cooling base 11. The cooling cover plate 12 has a cooling inlet and a cooling outlet. Both the cooling inlet and the cooling outlet are connected to the cooling chamber 111. The cooling medium enters the cooling chamber 111 through the cooling inlet, contacts the chip for heat exchange, and then flows out through the cooling outlet.

[0029] Specifically, such as Figure 1 As shown, the packaging substrate 101 of the chip structure 10 is directly connected to the cooling base 11, meaning the cooling base 11 can be directly fixed or tightly attached to the substrate carrying the chip. A through-hole 110 is formed on the cooling base 11. The sidewall of this through-hole 110, together with the upper wall of the chip structure 10 (i.e., the chip itself), forms a closed or semi-closed cooling chamber 111. The cooling cover plate 12 is detachably connected to the cooling base 11 by bolts, screws, or clips. The cover plate has a cooling inlet and a cooling outlet, both of which communicate with the aforementioned cooling chamber 111. The position design of the cooling inlet and cooling outlet determines the flow pattern of the cooling medium within the chamber (e.g., unilateral inflow / outflow, convection, etc.).

[0030] It is understandable that the cooling chamber 111 formed by the sidewall of the through hole 110 and the upper wall of the chip structure 10 allows the cooling medium entering the cooling chamber 111 to directly contact the chip structure 10, eliminating the air gap, thermal grease layer or complex indirect channels between the chip and the heat sink in traditional heat dissipation, so that the cooling medium can flow to the position as close as possible to the heat source of the chip.

[0031] The cooling cover 12 is detachably connected to the cooling base 11, facilitating installation, maintenance, chip replacement, or chamber cleaning, thus improving the system's maintainability and flexibility. Control valves are installed in both the cooling inlet and outlet to form a complete forced convection circulation system. The cooling medium is pumped in through the cooling inlet, flows through the cooling chamber 111, and exits through the cooling outlet, achieving continuous and directional flow of the cooling medium.

[0032] Therefore, the liquid cooling structure of this embodiment of the invention provides a cooling chamber 111 on the top of the chip structure 10, realizing direct heat exchange between the cooling medium and the chip's heat-generating surface. This solves the bottleneck of traditional heat dissipation methods in related technologies when dealing with ultra-high power density chips (such as AI chips). It effectively maintains the chip's low-temperature operating state, thereby ensuring that the electron migration rate and transistor switching characteristics of semiconductor devices are not affected by high temperatures, ultimately ensuring that high-power chips can operate stably and reliably under their rated high performance.

[0033] In some embodiments, the cooling chamber 111 includes a first chamber 1111 and a second chamber 1112, which are located in the height direction of the cooling housing 1 (e.g., ...). Figure 1 In the vertical direction, the first cavity 1111 is located above the second cavity 1112, and the spatial capacity of the first cavity 1111 is greater than that of the second cavity 1112.

[0034] Specifically, such as Figure 1 As shown, the first chamber 1111 is located above the second chamber 1112 and is directly connected to the cooling inlet and cooling outlet, so that the cooling medium can enter the second chamber 1112 after passing through the first chamber 1111. The space capacity of the first chamber 1111 is greater than that of the second chamber 1112. When the cooling medium is introduced into the cooling chamber 111, the cooling medium stored in the first chamber 1111 is more than that in the second chamber 1112.

[0035] Understandably, during use, the cooling medium is introduced into the cooling chamber 111, and the cooling medium gradually fills the second chamber 1112 and the first chamber 1111. When the chip structure 10 enters the working state, the cooling medium in the second chamber 1112 directly contacts and exchanges heat with the chip structure 10. As the cooling medium exchanges heat, its own temperature gradually rises. Then, the pump can be started to introduce a low-temperature cooling medium into the cooling chamber 111 to reduce the overall temperature of the cooling medium in the cooling chamber 111.

[0036] It should be noted that since the space capacity of the first cavity 1111 is greater than that of the second cavity 1112, when the cooling medium of the second cavity 1112 exchanges heat with the chip structure 10, it can also exchange heat with the cooling medium of the first cavity 1111. Under the state of cooling medium flow in the cooling chamber 111, and the fact that the space capacity of the first cavity 1111 is greater than that of the second cavity 1112, it can be ensured that there is a sufficient amount of cooling medium in the first cavity 1111 to mix and exchange heat with the cooling medium in the second cavity 1112, thereby ensuring the heat exchange effect in the cooling chamber 111.

[0037] In some embodiments, in a plane orthogonal to the height direction of the cooling housing 1, the projected area of ​​the first cavity 1111 is greater than the projected area of ​​the second cavity 1112, and the projected profile of the second cavity 1112 is substantially equal to the projected profile of the upper wall of the chip structure 10.

[0038] It is understandable that, such as Figure 1 As shown, since the projected area of ​​the first cavity 1111 is larger than the projected area of ​​the second cavity 1112 and the space capacity of the first cavity 1111 is larger than the space capacity of the second cavity 1112, the height of the first cavity 1111 can be selected according to the design height of the cooling housing 1, so as to avoid the overall height of the cooling housing 1 being too high in order to maintain a large space, which facilitates the adaptation and installation with the chip structure 10.

[0039] The projected contour of the second cavity 1112 is approximately equal to the projected contour of the upper wall of the chip structure 10, so that the cooling medium located in the second cavity 1112 can uniformly exchange heat with the chip structure 10, ensuring the heat exchange effect.

[0040] In some embodiments, the liquid cooling heat dissipation structure of this utility model further includes a first control component (not shown in the figure). The first control component includes a first detection element and a first control valve. The first control valve is disposed in at least one of the cooling inlet and the cooling outlet. The first detection element is located in the cooling chamber 111 and connected to the cooling base 11. The first detection element is arranged adjacent to the chip structure 10 to monitor the temperature change of the chip structure 10. The first detection element is electrically connected to the first control valve so that the first control valve is used to adjust the flow rate of the cooling medium according to the temperature information transmitted by the first detection element.

[0041] Understandably, the first control valve can be installed at either the cooling inlet or the cooling outlet. Of course, the first control valve can be installed at both the cooling inlet and the cooling outlet to ensure the smooth flow and subsequent regulation of the cooling medium. The first detection element is connected to the cooling base 11 and can be stably installed in the chamber structure using screws or other connecting parts (e.g., on the side wall of the base through hole 110, or connected by a bracket).

[0042] The first detection element is placed inside the cooling chamber 111, adjacent to the heat exchange interface (i.e. the upper surface of the chip structure 10), so that the temperature information of the chip structure 10 can be obtained in real time. This facilitates the subsequent use of the first control valve to control the flow rate of the cooling medium flowing into the cooling chamber 111, thereby ensuring the heat exchange between the cooling medium and the chip structure 10 and ensuring that the temperature of the chip structure 10 is kept within the preset temperature range.

[0043] In some embodiments, the liquid cooling heat dissipation structure of this utility model further includes a waterproof gasket 2, which is arranged around the cooling chamber 111 in the circumferential direction. In the height direction of the cooling shell 1, the waterproof gasket 2 is disposed between the cooling base 11 and the cooling cover plate 12.

[0044] Specifically, such as Figure 1 As shown, the waterproof gasket 2 is installed between the cooling base 11 and the cooling cover plate 12. That is, when connecting the cooling cover plate 12 and the cooling base 11, the waterproof gasket 2 can be fixed between the two by the compression between them, so as to achieve a circumferential seal of the cooling chamber 111.

[0045] Understandably, the cooling medium (typically water or other liquid) flowing within the cooling chamber 111 has high pressure and flow rate. Any minute leak could allow liquid to seep into the chip package or electronic device, causing short circuits, corrosion, or malfunctions, with catastrophic consequences.

[0046] Therefore, a sealing gasket is provided between the cooling base 11 and the cooling cover plate 12 to fill the microscopic uneven gap between the mating surfaces of the two mechanical parts, and can withstand the clamping force generated by fastening (such as bolt connection) and the pressure inside the cooling system. The waterproof gasket 2 is arranged around the cooling chamber 111 in a circumferential manner to ensure that the seal is continuous and uninterrupted, and can prevent liquid in the chamber from leaking out from the joint between the base and the cover plate in all directions.

[0047] In some embodiments, the liquid cooling heat dissipation structure of this utility model further includes a waterproof groove, which is disposed on the side of the cooling cover plate 12 adjacent to the cooling base 11 and / or the side of the cooling base 11 adjacent to the cooling cover plate 12, and the waterproof groove is adapted to the waterproof gasket 2.

[0048] It is understandable that, such as Figure 1 As shown, a waterproof groove can be provided on the lower surface of the cooling cover plate 12, or a waterproof groove can be provided on the upper surface of the cooling base 11, or waterproof grooves can be provided on the lower surface of the cooling cover plate 12 and the upper surface of the cooling base 11 at corresponding positions, so as to facilitate fixing the position of the waterproof gasket 2 during installation and facilitate subsequent installation.

[0049] In other words, the size, shape, and position of the waterproof groove are adapted to the waterproof gasket 2. During use, when the cooling housing 1 is tightened or vibrates, the gasket is confined within the groove and cannot slide out of the sealing area laterally. When the pressure inside the cooling chamber increases, the liquid pressure attempts to squeeze the soft gasket material out of the gap at the joint surface. The sidewalls of the waterproof groove effectively block this extrusion effect, ensuring that the gasket maintains its shape and sealing function even under high pressure.

[0050] Furthermore, by controlling the depth and width of the groove, the compression amount of the gasket can be preset more precisely, so that it is in the optimal elastic deformation state after tightening, thus achieving uniform sealing line pressure.

[0051] In some embodiments, the liquid cooling heat dissipation structure of this utility model further includes a water-insulating rubber ring 3 and an insulating rubber ring 4. The cooling base 11 has a first protrusion 112 and a second protrusion 113. The first protrusion 112 extends toward the packaging substrate 101 and is connected to the packaging substrate 101 through the insulating rubber ring 4. The second protrusion 113 extends toward the center line of the cooling housing 1 and is connected to the upper wall of the chip structure 10 through the water-insulating rubber ring 3. The sidewall of the second protrusion 113 forms part of the sidewall of the through hole 110.

[0052] Specifically, such as Figure 1 As shown, the first protrusion 112 extends downward, so that the cooling base 11 is generally cup-shaped and inverted on the packaging substrate 101. The insulating rubber ring 4 is laid on the packaging substrate 101 and its shape is consistent with the outline of the first protrusion 112, so that the cooling base 11 can be bonded to the packaging substrate 101 through the first protrusion 112 and the insulating rubber ring 4.

[0053] Similarly, the second protrusion 113 extends toward the center line of the cooling housing 1, that is, the bottom surface of the second protrusion 113 and the upper surface of the chip structure 10 can be connected by the water-proof rubber ring 3, and the inner sidewall of the second protrusion 113 directly forms part of the sidewall of the through hole 110 (i.e. the cooling chamber 111). In other words, the second protrusion 113 surrounds the first cavity 1111.

[0054] In other words, the insulating rubber ring 4 seals the outer gap between the cooling base 11 and the packaging substrate 101; the waterproof gasket 2 seals the joint between the base and the cover plate. This constitutes a multi-layered, all-around sealing system, which greatly reduces the risk of leakage and ensures the safe and reliable operation of the electronic system.

[0055] In some embodiments, the cooling base 11 and the packaging substrate 101 define a sealed chamber 5 for introducing an inert gas.

[0056] It is understandable that, such as Figure 1 As shown, the sealed chamber 5 is located between the cooling base 11 and the packaging substrate 101, and is formed by the first protrusion 112 of the cooling base 11, the insulating ring 4, and the upper surface of the packaging substrate 101. That is, the cooling base 11 is pressed onto the insulating ring 4 by the first protrusion 112, and the insulating ring 4 is bonded or pressed onto the packaging substrate 101, thereby forming a sealed cavity below the cooling base 11 and around the chip.

[0057] Optionally, tiny gas injection holes / valve can be provided on the cooling base 11 or the packaging substrate 101 to evacuate and inject inert gas (such as nitrogen, argon, etc.) after system assembly. In other words, when high-power chips operate at high temperatures and the cooling system is at risk of minor leakage, oxygen and moisture in the air can accelerate the electrochemical corrosion and oxidation of metal solder joints and interconnects, leading to increased resistance, increased thermal resistance, and even open-circuit failure. The inert gas fills all gaps around the chip that could potentially cause creepage or short circuits due to humid air, providing additional electrical insulation.

[0058] In some embodiments, the liquid cooling heat dissipation structure of this utility model further includes a second control component (not shown in the figure). The second control component includes a second control valve and a second detection element. The cooling housing 1 also has a vent 13, which penetrates the cooling housing 1 and communicates with the sealed chamber 5. The second control component is disposed in the vent 13. The second detection element is used to monitor the gas pressure in the sealed chamber 5. Inert gas is used to be introduced into the sealed chamber 5 through the second control valve.

[0059] It is understandable that, such as Figure 1 As shown, the vent 13 can be located on the side wall or top wall of the cooling base 11, meaning one end of the vent 13 is connected to the external environment (or an inert gas source), and the other end is connected to the sealed chamber 5. The second control valve (such as a miniature solenoid valve or a piezoelectric valve) and the second detection element (such as a pressure sensor) are integrated and installed in or adjacent to the vent 13 to form a closed-loop pressure management system.

[0060] The second detection element can monitor the inert gas pressure in the sealed chamber 5 in real time. The second control valve is opened or closed according to the signal transmitted by the second detection element (preset pressure threshold or signal from the sensor), thereby controlling the gas passage between the external inert gas source and the sealed chamber 5, so that the pressure in the sealed chamber 5 is maintained within a preset optimal range.

[0061] Preferably, such as Figure 1 As shown, the vent 13 is opened on the top of the cooling base 11, and the cooling cover plate 12 also has a vent 13, so that inert gas can be injected from the top of the cooling housing 1, avoiding occupying the side space of the cooling housing 1 and facilitating the injection of gas.

[0062] In some embodiments, the liquid cooling heat dissipation structure of this utility model further includes a warning element (not shown in the figure), which is electrically connected to a second detection element. When the pressure value detected by the second detection element is lower than a preset value, the warning element issues a warning signal.

[0063] Understandably, the warning device (such as an indicator light, buzzer, or communication module that communicates with the system's main controller) is electrically connected to the second detection device (pressure sensor). This connection can be logically processed by a control unit (such as a microcontroller). The control unit continuously reads data from the pressure sensor.

[0064] When the inert gas pressure in the sealed chamber 5 is detected to be consistently below a preset threshold, an abnormal leak is identified (the leak rate exceeds the normal compensation capacity of the second control valve). At this time, the control unit triggers an alarm to issue a warning signal.

[0065] In other words, when the leakage rate is within the compensation capacity of the control valve, pressurized gas can be continuously introduced into the sealed chamber 5 to maintain pressure stability within the sealed chamber 5. Once the leakage worsens (such as visible cracks appearing in the sealing ring or loosening of the interface), the pressure drop will trigger an alarm. This is equivalent to adding a safety redundancy to the system, ensuring that any faults exceeding the design tolerance can be detected in a timely manner, thereby avoiding potential cascading failures (such as ultimately leading to coolant leakage).

[0066] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0067] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0068] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0069] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0070] In this utility model, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0071] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A liquid-cooled heat dissipation structure, characterized in that, include: A cooling housing includes a cooling base and a cooling cover. The cooling base is connected to the packaging substrate of the chip structure. The cooling base has a through hole. The sidewall of the through hole and the upper wall of the chip structure define a cooling chamber. The cooling chamber is used to introduce a cooling medium. The cooling chamber includes a first chamber and a second chamber. In the height direction of the cooling housing, the first chamber is located above the second chamber, and the space capacity of the first chamber is greater than that of the second chamber. The cooling cover plate is detachably connected to the cooling base. The cooling cover plate has a cooling inlet and a cooling outlet. Both the cooling inlet and the cooling outlet are connected to the cooling chamber. The cooling medium enters the cooling chamber through the cooling inlet, contacts the chip for heat exchange, and then flows out through the cooling outlet.

2. The liquid cooling heat dissipation structure according to claim 1, characterized in that, In a plane orthogonal to the height direction of the cooling housing, the projected area of ​​the first cavity is greater than that of the second cavity, and the projected profile of the second cavity is approximately equal to the projected profile of the upper wall of the chip structure.

3. The liquid cooling heat dissipation structure according to claim 1, characterized in that, It also includes a first control component, which includes a first detection element and a first control valve. The first control valve is located at at least one of the cooling inlet and the cooling outlet. The first detection element is located in the cooling chamber and connected to the cooling base. The first detection element is arranged adjacent to the chip structure to monitor the temperature change of the chip structure. The first detection element is electrically connected to the first control valve so that the first control valve can adjust the flow rate of the cooling medium according to the temperature information transmitted by the first detection element.

4. The liquid cooling heat dissipation structure according to claim 1, characterized in that, It also includes a waterproof gasket, which is arranged around the cooling chamber circumferentially, and in the height direction of the cooling housing, the waterproof gasket is disposed between the cooling base and the cooling cover plate.

5. The liquid cooling heat dissipation structure according to claim 4, characterized in that, It also includes a waterproof groove, which is located on the side of the cooling cover plate adjacent to the cooling base and / or on the side of the cooling base adjacent to the cooling cover plate, and the waterproof groove is adapted to the waterproof gasket.

6. The liquid cooling heat dissipation structure according to claim 1, characterized in that, It also includes a water-resistant rubber ring and an insulating rubber ring. The cooling base has a first protrusion and a second protrusion. The first protrusion extends toward the packaging substrate and is connected to the packaging substrate through the insulating rubber ring. The second protrusion extends toward the centerline of the cooling housing and is connected to the upper wall of the chip structure through the water-resistant rubber ring. The sidewall of the second protrusion forms part of the sidewall of the through hole.

7. The liquid cooling heat dissipation structure according to claim 6, characterized in that, The cooling base and the packaging substrate define a sealed chamber for introducing an inert gas.

8. The liquid cooling heat dissipation structure according to claim 7, characterized in that, It also includes a second control component, which includes a second control valve and a second detection element. The cooling housing also has a vent hole that penetrates the cooling housing and communicates with the sealed chamber. The second control component is disposed in the vent hole. The second detection element is used to monitor the gas pressure in the sealed chamber. The inert gas is used to be introduced into the sealed chamber through the second control valve.

9. The liquid cooling heat dissipation structure according to claim 8, characterized in that, It also includes a warning element, which is electrically connected to the second detection element. When the pressure value detected by the second detection element is lower than a preset value, the warning element issues a warning signal.

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