High-performance eight-channel gateway based on IO-LINK communication protocol

Abstract

The utility model discloses a high-performance eight-channel gateway based on an IO-LINK communication protocol, and belongs to the technical field of gateway equipment. The gateway comprises a microcontroller module, an IO-LINK communication module, a field bus communication module, a power management control module, a data storage module, a current monitoring module and an indicating lamp module. The microcontroller module is connected with the IO-LINK communication module, the field bus communication module, the data storage module, the current monitoring module and the indicating lamp module. The power management control module supplies power to the microcontroller module, the IO-LINK communication module, the field bus communication module, the data storage module, the current monitoring module and the indicating lamp module. According to the IO-LINK slave station device, the bidirectional receiving and transmitting of data between the field control system and the IO-LINK slave station device can be realized quickly in real time.

Description

A high-performance eight-channel gateway based on the IO-LINK communication protocol Technical Field

[0001] This utility model relates to the field of gateway device technology, specifically to a high-performance eight-channel gateway based on the IO-LINK communication protocol. Background Technology

[0002] With the advancement of Industry 4.0 and smart manufacturing, IO-LINK technology will continue to evolve to meet the demands for higher communication speeds, lower latency, and enhanced diagnostic capabilities. Future IO-LINK devices may integrate more intelligent functions, such as self-diagnostics, self-configuration, and self-optimization, thereby further improving the efficiency and reliability of industrial automation.

[0003] IO-LINK is an industrial communication standard designed to simplify communication between sensors and actuators and control systems. It provides a standardized interface that enables seamless integration of devices from different manufacturers, thereby improving system flexibility and maintainability. With the continuous development of industrial automation, factories and enterprises are placing higher demands on real-time data acquisition, equipment monitoring, and system integration. Traditional point-to-point connection methods (such as analog and digital signals) suffer from complex wiring, difficult maintenance, and poor scalability. Therefore, the industry urgently needs a standardized and efficient communication solution. Summary of the Invention

[0004] The purpose of this invention is to provide a high-performance eight-channel gateway based on the IO-LINK communication protocol.

[0005] To solve the above technical problems, this utility model provides a high-performance eight-channel gateway based on the IO-LINK communication protocol, including a microcontroller module, an IO-LINK communication module, a fieldbus communication module, a power management control module, a data storage module, a current monitoring module, and an indicator light module.

[0006] The microcontroller module is connected to the IO-LINK communication module, the fieldbus communication module, the data storage module, the current monitoring module, and the indicator light module, respectively.

[0007] The power management control module provides power to the microcontroller module, IO-LINK communication module, fieldbus communication module, data storage module, current monitoring module, and indicator light module.

[0008] Preferably, the microcontroller module includes a control chip U7;

[0009] The control chip U7 includes 3 SPI communication interfaces, a USART serial communication interface, an ADC sampling channel, and IO pins;

[0010] The control chip U7 is connected to the IO-Link communication module, the fieldbus communication module, and the data storage module through three SPI communication interfaces; the IO-Link communication module has four channels, each used to manage two IO-Link communication link data.

[0011] The control chip U7 is connected to the current monitoring module and the indicator light module through IO pins.

[0012] Preferably, the IO-Link communication module includes a communication chip U41;

[0013] The A0 and A1 terminals of the communication chip U41 are grounded;

[0014] The +24V voltage input terminal US is connected to terminal 2 of MOSFET Q1 after passing through inductor L11;

[0015] Terminal 1 of the MOS transistor Q1 is connected to terminal G1A of the communication chip U41;

[0016] The two ends of the MOS transistor Q1 are divided into two paths. One path is connected to the SN1A end of the communication chip U41, and the other path is connected to the two ends of the MOS transistor Q3 and the SN2A end of the communication chip U41 respectively through the resistor R142.

[0017] Terminal 1 of the MOS transistor Q3 is connected to terminal G2A of the communication chip U41;

[0018] Terminal 3 of the MOS transistor Q3 is connected to terminal L+A of the communication chip U41 through resistor R144.

[0019] The CS, SCLK, SDO, and SDI terminals of the communication chip U41 are connected to the control chip U7.

[0020] Preferably, the fieldbus communication module includes a fieldbus communication chip U19C;

[0021] The PHY0_RXN terminal of the fieldbus communication chip U19C is connected to the NC3 terminal and Line-2 terminal of the ESD protection device U22.

[0022] The PHY0_RXP terminal of the fieldbus communication chip U19C is connected to the NC4 terminal and Line-1 terminal of the ESD protection device U22.

[0023] The PHY0_TXN terminal of the fieldbus communication chip U19C is connected to the NC1 terminal and Line-4 terminal of the ESD protection device U22.

[0024] The PHY0_TXP terminal of the fieldbus communication chip U19C is connected to the NC2 terminal and Line-3 terminal of the ESD protection device U22.

[0025] The NC4 terminal of the ESD protection device U22 is connected to terminal 1 of the network transformer U21A;

[0026] The NC3 terminal of the ESD protection device U22 is connected to the 3 terminal of the network transformer U21A;

[0027] The NC2 terminal of the ESD protection device U22 is connected to the 6 terminal of the network transformer U21B;

[0028] The NC1 terminal of the ESD protection device U22 is connected to the 8 terminal of the network transformer U21B;

[0029] The network transformer U21A's terminals 14 and 16 are connected to the RD- and RD+ terminals of the switch T14, respectively.

[0030] The network transformer U21B's 9th and 11th terminals are connected to the TD- and TD+ terminals of the switch T14, respectively.

[0031] The PHY1_RXN terminal of the fieldbus communication chip U19C is connected to the NC2 terminal and Line-4 terminal of the ESD protection device U24.

[0032] The PHY1_RXP terminal of the fieldbus communication chip U19C is connected to the NC1 terminal and Line-3 terminal of the ESD protection device U24.

[0033] The PHY1_TXN terminal of the fieldbus communication chip U19C is connected to the NC4 terminal and Line-1 terminal of the ESD protection device U24.

[0034] The PHY1_TXP terminal of the fieldbus communication chip U19C is connected to the NC3 terminal and Line-2 terminal of the ESD protection device U24.

[0035] The Line-4 terminal of the ESD protection device U24 is connected to terminal 1 of the network transformer U23A;

[0036] The Line-3 terminal of the ESD protection device U24 is connected to terminal 3 of the network transformer U23A;

[0037] The Line-2 terminal of the ESD protection device U24 is connected to terminal 6 of the network transformer U24B;

[0038] The Line-1 terminal of the ESD protection device U24 is connected to terminal 8 of the network transformer U24B;

[0039] The network transformer U23A's terminals 14 and 16 are connected to the RD- and RD+ terminals of the switch T14, respectively.

[0040] The 9th and 11th terminals of the network transformer U24B are connected to the TD- and TD+ terminals of the switch T14, respectively.

[0041] Preferably, the power management module includes power chip U6, power chip U7 and power chip U8;

[0042] The +24V voltage input terminal US is split into two paths after passing through the reverse voltage protection circuit and the overvoltage protection circuit. One path is connected to the VIN terminal of the power chip U6, and the other path is connected to the ENA terminal of the power chip U6 through the resistor R9.

[0043] The BOOT terminal of the power chip U6 is connected to the 5V voltage output terminal through inductor L3.

[0044] The VSENSE terminal of the power chip U6 is divided into two paths. One path is connected to the 5V voltage output terminal through resistor R8, and the other path is connected to the 5V voltage output terminal through resistor R10 and Zener diode D8. The third path is connected to the 5V voltage output terminal through resistor R8.

[0045] The BOOT terminal of the power chip U6 is connected to the 5V voltage output terminal through a polarized capacitor C10 and an inductor L3.

[0046] The 5V voltage output terminal is connected to the VSS terminal of the power chip U7 through two polarized capacitors C19 and C18 connected in parallel.

[0047] The 5V voltage output terminal is connected to the VIN terminal of the power chip U7;

[0048] The VOUT terminal of the power chip U7 is connected to the 3.3V voltage output terminal of the fieldbus;

[0049] The 3.3V voltage output terminal of the fieldbus is grounded through a parallel connection of a polarized capacitor C21, a polarized capacitor C22, and a Zener diode D8.

[0050] The 5V voltage output terminal is connected to the VSS terminal of the power chip U8 through two polarized capacitors C20 and C23 connected in parallel.

[0051] The 5V voltage output terminal is connected to the VIN terminal of the power chip U8;

[0052] The VOUT terminal of the power chip U8 is connected to the 3.3V voltage output terminal of the microcontroller;

[0053] The 3.3V voltage output terminal of the microcontroller is grounded through a parallel connection of a polarized capacitor C24, a polarized capacitor C25, and a Zener diode D10.

[0054] The +24V voltage input terminal UA is connected to terminal A of optocoupler U5 through Zener diode D7 and resistor R7.

[0055] The C terminal of the optocoupler U5 is connected to the 3.3V voltage output terminal of the indicator light through resistor R6.

[0056] Preferably, the data storage module includes a fieldbus storage chip U75 and a microcontroller storage chip U25;

[0057] The 3.3V voltage output terminal of the fieldbus is connected to the VDD terminal of the fieldbus storage chip U75;

[0058] The fieldbus storage chip U75 is connected to the fieldbus communication chip U19C via a memory interface.

[0059] The 3.3V voltage output terminal of the microcontroller is connected to the VCC terminal of the microcontroller storage chip U25;

[0060] The CS, CLK, and CKE terminals of the microcontroller storage chip U25 are connected to the control chip U7.

[0061] Preferably, the circuit monitoring module includes a dual operational amplifier integrated circuit U9, which integrates a first operational amplifier and a second operational amplifier;

[0062] The +24V voltage input terminal UA is connected to the 1IN- terminal of the first operational amplifier;

[0063] The DET_I1 terminal is connected to the 1IN+ terminal of the first operational amplifier through resistor R18;

[0064] The 1OUT terminal of the first operational amplifier is divided into two paths. One path is connected to the 1IN- terminal of the first operational amplifier through a parallel polarized capacitor C34 and a resistor R15. The other path is connected to the 2IN+ terminal of the second operational amplifier through a resistor R28.

[0065] The 5V voltage output terminal is connected to the VCC terminal of the dual operational amplifier integrated circuit U9;

[0066] The MCU_DET_I1 terminal is connected in parallel with the 2OUT terminal of the dual op-amp integrated circuit U9 through resistor R13, and then connected to the 2IN- terminal of the amplifier chip U9 through the parallel polarized capacitor C36 and resistor R19.

[0067] Preferably, the indicator module includes LED D59 and LED D62;

[0068] The operating status signal output terminal of the control chip U7 is connected to the 3.3V voltage output terminal of the indicator light through LED D59 and resistor R238;

[0069] The fault / abnormal signal output terminal of the control chip U7 is connected to the 3.3V voltage output terminal of the indicator light through LED D62 and resistor R241.

[0070] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0071] This invention integrates four IO-Link communication modules onto a single SPI bus. Each IO-Link module manages two IO-Link communication link data channels, thereby achieving eight-channel IO-Link communication. The fieldbus communication chip has an internal integrated switch for serializing fieldbus devices. It connects to a microcontroller module via an SPI interface, allowing for free switching between fieldbus protocols such as Ethernet / IP, EtherCAT, Profinet, CC-Link IE, and Modubus TCP.

[0072] This invention enables one master gateway to exchange data with eight sensors / actuators simultaneously. Each pair of sensors / actuators corresponds to one IO-LINK communication module, forming a gateway with secure and reliable IO-LINK communication protocol in software. This allows for rapid and real-time bidirectional data transmission and reception between the field control system and IO-LINK slave devices. Attached Figure Description

[0073] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings.

[0074] Figure 1 is a block diagram of the implementation of the high-performance eight-channel gateway based on the IO-LINK communication protocol of this utility model.

[0075] Figure 2 is a schematic diagram of the operation of the high-performance eight-channel gateway based on the IO-LINK communication protocol of this utility model;

[0076] Figure 3 is a circuit diagram of the microcontroller module;

[0077] Figure 4 is a circuit diagram of the IO-Link communication module;

[0078] Figure 5 is a circuit diagram of the fieldbus communication chip U19C of the fieldbus communication module;

[0079] Figure 6 is a circuit diagram of the peripheral circuit of the fieldbus communication module;

[0080] Figure 7 is a circuit diagram of the reverse voltage protection and overvoltage protection of the power management module;

[0081] Figure 8 is a circuit diagram of the step-down circuit of the power management module;

[0082] Figure 9 is a circuit diagram of the data storage module;

[0083] Figure 10 is a circuit diagram of the current monitoring module;

[0084] Figure 11 is a circuit diagram of the indicator light module. Detailed Implementation

[0085] Many specific details are set forth in the following description to provide a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0086] The terminology used in one or more embodiments of this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the one or more embodiments of this specification. The singular forms “a,” “described,” and “the” as used in one or more embodiments of this specification and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in one or more embodiments of this specification refers to and includes any or all possible combinations of one or more associated listed items.

[0087] It should be understood that although the terms first, second, etc., may be used to describe various information in one or more embodiments of this specification, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, first may also be referred to as second without departing from the scope of one or more embodiments of this specification, and similarly, second may also be referred to as first. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to a determination."

[0088] The present invention will now be described in further detail with reference to the accompanying drawings:

[0089] As shown in Figures 1 and 2, this utility model provides a high-performance eight-channel gateway based on the IO-LINK communication protocol, including a microcontroller module, an IO-LINK communication module, a fieldbus communication module, a power management control module, a data storage module, a current monitoring module, and an indicator light module.

[0090] The microcontroller module is connected to the IO-LINK communication module, the fieldbus communication module, the data storage module, the current monitoring module, and the indicator light module, respectively.

[0091] The power management control module provides power to the microcontroller module, IO-LINK communication module, fieldbus communication module, data storage module, current monitoring module, and indicator light module.

[0092] Preferably, the microcontroller module includes a control chip U7;

[0093] The control chip U7 includes 3 SPI communication interfaces, a USART serial communication interface, an ADC sampling channel, and IO pins;

[0094] The control chip U7 is connected to the IO-Link communication module, the fieldbus communication module, and the data storage module through three SPI communication interfaces; the IO-Link communication module has four channels, each used to manage two IO-Link communication link data.

[0095] The control chip U7 is connected to the current monitoring module and the indicator light module through IO pins.

[0096] Preferably, the IO-Link communication module includes a communication chip U41;

[0097] The A0 and A1 terminals of the communication chip U41 are grounded;

[0098] The +24V voltage input terminal US is connected to terminal 2 of MOSFET Q1 after passing through inductor L11;

[0099] Terminal 1 of the MOS transistor Q1 is connected to terminal G1A of the communication chip U41;

[0100] The two ends of the MOS transistor Q1 are divided into two paths. One path is connected to the SN1A end of the communication chip U41, and the other path is connected to the two ends of the MOS transistor Q3 and the SN2A end of the communication chip U41 respectively through the resistor R142.

[0101] Terminal 1 of the MOS transistor Q3 is connected to terminal G2A of the communication chip U41;

[0102] Terminal 3 of the MOS transistor Q3 is connected to terminal L+A of the communication chip U41 through resistor R144.

[0103] The CS, SCLK, SDO, and SDI terminals of the communication chip U41 are connected to the control chip U7.

[0104] Preferably, the fieldbus communication module includes a fieldbus communication chip U19C;

[0105] The PHY0_RXN terminal of the fieldbus communication chip U19C is connected to the NC3 terminal and Line-2 terminal of the ESD protection device U22.

[0106] The PHY0_RXP terminal of the fieldbus communication chip U19C is connected to the NC4 terminal and Line-1 terminal of the ESD protection device U22.

[0107] The PHY0_TXN terminal of the fieldbus communication chip U19C is connected to the NC1 terminal and Line-4 terminal of the ESD protection device U22.

[0108] The PHY0_TXP terminal of the fieldbus communication chip U19C is connected to the NC2 terminal and Line-3 terminal of the ESD protection device U22.

[0109] The NC4 terminal of the ESD protection device U22 is connected to terminal 1 of the network transformer U21A;

[0110] The NC3 terminal of the ESD protection device U22 is connected to the 3 terminal of the network transformer U21A;

[0111] The NC2 terminal of the ESD protection device U22 is connected to the 6 terminal of the network transformer U21B;

[0112] The NC1 terminal of the ESD protection device U22 is connected to the 8 terminal of the network transformer U21B;

[0113] The network transformer U21A's terminals 14 and 16 are connected to the RD- and RD+ terminals of the switch T14, respectively.

[0114] The network transformer U21B's 9th and 11th terminals are connected to the TD- and TD+ terminals of the switch T14, respectively.

[0115] The PHY1_RXN terminal of the fieldbus communication chip U19C is connected to the NC2 terminal and Line-4 terminal of the ESD protection device U24.

[0116] The PHY1_RXP terminal of the fieldbus communication chip U19C is connected to the NC1 terminal and Line-3 terminal of the ESD protection device U24.

[0117] The PHY1_TXN terminal of the fieldbus communication chip U19C is connected to the NC4 terminal and Line-1 terminal of the ESD protection device U24.

[0118] The PHY1_TXP terminal of the fieldbus communication chip U19C is connected to the NC3 terminal and Line-2 terminal of the ESD protection device U24.

[0119] The Line-4 terminal of the ESD protection device U24 is connected to terminal 1 of the network transformer U23A;

[0120] The Line-3 terminal of the ESD protection device U24 is connected to terminal 3 of the network transformer U23A;

[0121] The Line-2 terminal of the ESD protection device U24 is connected to terminal 6 of the network transformer U24B;

[0122] The Line-1 terminal of the ESD protection device U24 is connected to terminal 8 of the network transformer U24B;

[0123] The network transformer U23A's terminals 14 and 16 are connected to the RD- and RD+ terminals of the switch T14, respectively.

[0124] The 9th and 11th terminals of the network transformer U24B are connected to the TD- and TD+ terminals of the switch T14, respectively.

[0125] Preferably, the power management module includes power chip U6, power chip U7 and power chip U8;

[0126] The +24V voltage input terminal US is split into two paths after passing through the reverse voltage protection circuit and the overvoltage protection circuit. One path is connected to the VIN terminal of the power chip U6, and the other path is connected to the ENA terminal of the power chip U6 through the resistor R9.

[0127] The BOOT terminal of the power chip U6 is connected to the 5V voltage output terminal through inductor L3.

[0128] The VSENSE terminal of the power chip U6 is divided into two paths. One path is connected to the 5V voltage output terminal through resistor R8, and the other path is connected to the 5V voltage output terminal through resistor R10 and Zener diode D8. The third path is connected to the 5V voltage output terminal through resistor R8.

[0129] The BOOT terminal of the power chip U6 is connected to the 5V voltage output terminal through a polarized capacitor C10 and an inductor L3.

[0130] The 5V voltage output terminal is connected to the VSS terminal of the power chip U7 through two polarized capacitors C19 and C18 connected in parallel.

[0131] The 5V voltage output terminal is connected to the VIN terminal of the power chip U7;

[0132] The VOUT terminal of the power chip U7 is connected to the 3.3V voltage output terminal of the fieldbus;

[0133] The 3.3V voltage output terminal of the fieldbus is grounded through a parallel connection of a polarized capacitor C21, a polarized capacitor C22, and a Zener diode D8.

[0134] The 5V voltage output terminal is connected to the VSS terminal of the power chip U8 through two polarized capacitors C20 and C23 connected in parallel.

[0135] The 5V voltage output terminal is connected to the VIN terminal of the power chip U8;

[0136] The VOUT terminal of the power chip U8 is connected to the 3.3V voltage output terminal of the microcontroller;

[0137] The 3.3V voltage output terminal of the microcontroller is grounded through a parallel connection of a polarized capacitor C24, a polarized capacitor C25, and a Zener diode D10.

[0138] The +24V voltage input terminal UA is connected to terminal A of optocoupler U5 through Zener diode D7 and resistor R7.

[0139] The C terminal of the optocoupler U5 is connected to the 3.3V voltage output terminal of the indicator light through resistor R6.

[0140] Preferably, the data storage module includes a fieldbus storage chip U75 and a microcontroller storage chip U25;

[0141] The 3.3V voltage output terminal of the fieldbus is connected to the VDD terminal of the fieldbus storage chip U75;

[0142] The fieldbus storage chip U75 is connected to the fieldbus communication chip U19C via a memory interface.

[0143] The 3.3V voltage output terminal of the microcontroller is connected to the VCC terminal of the microcontroller storage chip U25;

[0144] The CS, CLK, and CKE terminals of the microcontroller storage chip U25 are connected to the control chip U7.

[0145] Preferably, the circuit monitoring module includes a dual operational amplifier integrated circuit U9, which integrates a first operational amplifier and a second operational amplifier;

[0146] The +24V voltage input terminal UA is connected to the 1IN- terminal of the first operational amplifier;

[0147] The DET_I1 terminal is connected to the 1IN+ terminal of the first operational amplifier through resistor R18;

[0148] The 1OUT terminal of the first operational amplifier is divided into two paths. One path is connected to the 1IN- terminal of the first operational amplifier through a parallel polarized capacitor C34 and a resistor R15. The other path is connected to the 2IN+ terminal of the second operational amplifier through a resistor R28.

[0149] The 5V voltage output terminal is connected to the VCC terminal of the dual operational amplifier integrated circuit U9;

[0150] The MCU_DET_I1 terminal is connected in parallel with the 2OUT terminal of the dual op-amp integrated circuit U9 through resistor R13, and then connected to the 2IN- terminal of the amplifier chip U9 through the parallel polarized capacitor C36 and resistor R19.

[0151] Preferably, the indicator module includes LED D59 and LED D62;

[0152] The operating status signal output terminal of the control chip U7 is connected to the 3.3V voltage output terminal of the indicator light through LED D59 and resistor R238;

[0153] The fault / abnormal signal output terminal of the control chip U7 is connected to the 3.3V voltage output terminal of the indicator light through LED D62 and resistor R241.

[0154] With the advancement of Industry 4.0 and smart manufacturing, IO-LINK technology will continue to evolve to meet the demands for higher communication speeds, lower latency, and enhanced diagnostic capabilities. Future IO-LINK devices may integrate more intelligent functions, such as self-diagnostics, self-configuration, and self-optimization, thereby further improving the efficiency and reliability of industrial automation.

[0155] IO-LINK is an industrial communication standard designed to simplify communication between sensors and actuators and control systems. It provides a standardized interface that enables seamless integration of devices from different manufacturers, thereby improving system flexibility and maintainability. With the continuous development of industrial automation, factories and enterprises are placing higher demands on real-time data acquisition, equipment monitoring, and system integration. Traditional point-to-point connection methods (such as analog and digital signals) suffer from complex wiring, difficult maintenance, and poor scalability. Therefore, the industry urgently needs a standardized and efficient communication solution.

[0156] The IO-LINK protocol uses master / slave technology for communication between devices. This means that any application using the IO-LINK protocol will have one IO-LINK master and at least one IO-LINK slave. An IO-LINK master is a high-performance eight-channel gateway based on the IO-LINK communication protocol; it communicates with one or more IO-LINK slave devices, supporting up to eight devices communicating simultaneously.

[0157] An IO-LINK slave device is a device that performs system parameter measurement and controls the on / off states of devices in the system. To perform these tasks, the IO-LINK master sends a message to the IO-LINK slave, requesting the execution of a specific task.

[0158] The IO-LINK protocol uses formatted messages to communicate between the master and slave devices. Messages are initiated by the system's IO-LINK master and sent to the IO-LINK slave device. The slave then responds with the requested data or acknowledges that it has performed the requested function. IO-LINK also enhances diagnostic capabilities, enabling real-time monitoring of device status and providing fault warnings and maintenance.

[0159] To better illustrate the technical effects of this utility model, the present utility model provides the following specific embodiments to explain the above technical process:

[0160] Example 1: A high-performance eight-channel gateway based on the IO-LINK communication protocol. The gateway includes a microcontroller module, an IO-LINK communication module, a fieldbus communication module, a power management control module, a data storage module, a current monitoring module, and an indicator light module.

[0161] The power management control module provides power to the entire gateway by controlling the power chip.

[0162] The IO-LINK communication module and the fieldbus communication module are connected to the port of the microcontroller module through the chip communication interface;

[0163] The data storage module is used to store information such as the main station's own parameters and the configuration parameters of the connected slave devices;

[0164] The microcontroller includes a single-chip microcomputer and matching circuitry around the microcontroller. It is used to forward data from the slave station to the fieldbus communication module via the IO-LINK communication module, process the data, and output it to the fieldbus communication module. The fieldbus communication module is also used to upload data to the field control system. The microcontroller can also receive data from the field control system via the fieldbus communication module and forward it to the IO-LINK slave station for processing. If the transmission link is down, the data is stored in the data storage module.

[0165] The fieldbus in the communication module transmits data to and receives data from the field control devices via data transmission lines. The IO-LINK communication module exchanges data with the microcontroller module via data transmission lines. The current monitoring module monitors the additional power supply current of the eight communication ports through operational amplifiers and monitoring resistors.

[0166] The gateway conducts contact-based bidirectional data communication via a wired connection. It uses the IO-LINK communication module to send and receive data from the IO-LINK slave stations. After processing by the microcontroller module, the data is forwarded to the field control system via the fieldbus, thereby achieving the purpose of data exchange. The field control system can also issue command data, which is forwarded to the corresponding IO-LINK slave station for processing through the gateway.

[0167] The power management control circuit filters the voltage through capacitors, steps down the voltage through a power chip, connects the voltage output to the microcontroller port, and uses NMOS transistors, Zener diodes, etc. to complete reverse connection and overvoltage protection.

[0168] The current monitoring circuit monitors the power supply current at each port through an operational amplifier and a monitoring resistor.

[0169] By adopting the technical solution of this utility model, this utility model can realize data exchange between one master station gateway and eight sensors / actuators at the same time. Each pair of sensors / actuators corresponds to one IO-LINK communication module, forming a gateway with IO-LINK communication protocol with secure and reliable communication function in software. It can quickly and in real time realize bidirectional data transmission and reception between the field control system and IO-LINK slave devices.

[0170] 1. Microcontroller module description, as shown in Figure 3;

[0171] The microcontroller module includes a control chip U7, whose core uses the GD32F425RGT6 microcontroller chip manufactured by GigaDevice, which is an ARM Cortex M4 core with a main frequency of up to 200MHz. It supports DSP operation instructions and floating-point operation instructions, and has 3 SPI communication interfaces, 2 USART serial communication interfaces, 16 ADC sampling channels and 20 general-purpose I / O pins. It can simultaneously communicate with the fieldbus module, communicate with 4 IO-Link communication modules, sample current through 10 current sampling modules, and perform output control and input signal acquisition through general-purpose I / O ports, meeting the requirements of high-load operation and control.

[0172] 2. Description of the IO-Link communication module, as shown in Figure 4;

[0173] The IO-Link communication module consists of a communication chip U41 and peripheral circuits. The communication chip U41 can be a Maxim Integrated MAX14819 chip, which is connected to the microcontroller module through the SPI communication interface. The internal SPI communication address can be set through the A0 and A1 terminals, allowing four IO-Link communication modules to be connected on one SPI bus. Each IO-Link communication module manages two IO-Link communication link data, thereby realizing eight-channel IO-Link communication.

[0174] 3. Fieldbus communication module description, as shown in Figures 5-6;

[0175] The fieldbus communication module consists of a fieldbus communication chip U19C and peripheral circuits. The fieldbus communication chip U19C can be a Hertz netX90 chip. Its internal integrated switch can connect fieldbus devices in series. It is connected to the microcontroller module through the SPI interface. The microcontroller module can control the fieldbus protocol to switch freely to Ethernet / IP, EtherCAT, Profinet, CC-Link IE, Modubus TCP and other protocols.

[0176] 4. Description of the power management module, as shown in Figures 7 and 8;

[0177] The power management module uses power chip U6 to step down the 24V power supply to 5V via a DC-DC converter, and then uses two power chips U7 and U8 to step down the voltage to 3.3V via an LDO. One of these power chips supplies the fieldbus module, and the other supplies the microcontroller module. For power protection, reverse voltage protection is achieved using NCE4012S and 1SMA5927A, and overvoltage protection is achieved using 1SMA475AG and TL1812A470K. Power chip U6 can be a Texas Instruments TPS5430DDAR chip, and power chips U7 and U8 can be Shanghai Silicon Power H7651 chips.

[0178] 5. Data storage module description, as shown in Figure 9;

[0179] The data storage module consists of storage chip U75 and storage chip U25. Storage chip U75 can be the American SDRAM chip IS42S16160J-7BLI, and storage chip U25 can be the Winbond Nor Flash chip W25Q32FVSIG. The SDRAM chip is connected to the fieldbus communication module through a memory interface to provide memory for fieldbus protocol switching. The Nor Flash is connected to the microcontroller module through an SPI interface to provide storage area for fieldbus protocol stack software and system parameters.

[0180] 6. Description of the current monitoring module, as shown in Figure 10;

[0181] The circuit monitoring module consists of an operational amplifier chip U9 and a sensing resistor. The operational amplifier chip U9 can be a Texas Instruments LM358 operational amplifier chip. Its principle is to measure the voltage across the sensing resistor and then calculate the current value based on the resistance value. Since the voltage across the sensing resistor is relatively small, the signal needs to be amplified by the LM358 and then the signal measurement is completed through the analog sampling port of the microcontroller module.

[0182] 7. Indicator light module, as shown in Figure 11;

[0183] The indicator module consists of a green LED and a red LED. The green LED indicates the power supply and system operating status, respectively, while the red LED indicates a current fault / abnormality.

[0184] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A high-performance eight-channel gateway based on the IO-LINK communication protocol, characterized in that, The gateway includes a microcontroller module, an IO-LINK communication module, a fieldbus communication module, a power management control module, a data storage module, a current monitoring module, and an indicator light module. The microcontroller module is connected to the IO-LINK communication module, the fieldbus communication module, the data storage module, the current monitoring module, and the indicator light module, respectively. The power management control module supplies power to the microcontroller module, the IO-LINK communication module, the fieldbus communication module, the data storage module, the current monitoring module, and the indicator light module.

2. The high-performance eight-channel gateway based on the IO-LINK communication protocol according to claim 1, characterized in that, The microcontroller module includes a control chip U7; the control chip U7 includes three SPI communication interfaces, a USART serial communication interface, an ADC sampling channel, and I / O pins; the control chip U7 is connected to the IO-Link communication module, the fieldbus communication module, and the data storage module through the three SPI communication interfaces respectively; the IO-Link communication module has four channels, each used to manage two IO-Link communication link data; the control chip U7 is connected to the current monitoring module and the indicator light module through the I / O pins.

3. The high-performance eight-channel gateway based on the IO-LINK communication protocol according to claim 2, characterized in that, The IO-Link communication module includes a communication chip U41; the A0 and A1 terminals of the communication chip U41 are grounded; the +24V voltage input terminal US is connected to terminal 2 of MOSFET Q1 through inductor L11; terminal 1 of MOSFET Q1 is connected to terminal G1A of the communication chip U41; terminal 2 of MOSFET Q1 is divided into two paths, one connected to terminal SN1A of the communication chip U41, and the other connected to terminal 2 of MOSFET Q3 and terminal SN2A of the communication chip U41 through resistor R142; terminal 1 of MOSFET Q3 is connected to terminal G2A of the communication chip U41; terminal 3 of MOSFET Q3 is connected to terminal L+A of the communication chip U41 through resistor R144; the CS, SCLK, SDO, and SDI terminals of the communication chip U41 are connected to the control chip U7.

4. The high-performance eight-channel gateway based on the IO-LINK communication protocol according to claim 3, characterized in that, The fieldbus communication module includes a fieldbus communication chip U19C; the PHY0_RXN terminal of the fieldbus communication chip U19C is connected to the NC3 terminal and Line-2 terminal of the ESD protection device U22; the PHY0_RXP terminal of the fieldbus communication chip U19C is connected to the NC4 terminal and Line-1 terminal of the ESD protection device U22; the PHY0_TXN terminal of the fieldbus communication chip U19C is connected to the NC1 terminal and Line-4 terminal of the ESD protection device U22; the PHY0_TXP terminal of the fieldbus communication chip U19C is connected to the NC2 terminal of the ESD protection device U22. The following connections are made: Terminal 1 and Line-3 of the ESD protection device U22 are connected; Terminal NC4 of the ESD protection device U22 is connected to Terminal 1 of the network transformer U21A; Terminal NC3 of the ESD protection device U22 is connected to Terminal 3 of the network transformer U21A; Terminal NC2 of the ESD protection device U22 is connected to Terminal 6 of the network transformer U21B; Terminal NC1 of the ESD protection device U22 is connected to Terminal 8 of the network transformer U21B; Terminals 14 and 16 of the network transformer U21A are connected to the RD- and RD+ terminals of the switch T14, respectively; Terminals 9 and 11 of the network transformer U21B are connected to the TD- and RD+ terminals of the switch T14, respectively. The TD+ terminal is connected; the PHY1_RXN terminal of the fieldbus communication chip U19C is connected to the NC2 terminal and Line-4 terminal of the ESD protection device U24; the PHY1_RXP terminal of the fieldbus communication chip U19C is connected to the NC1 terminal and Line-3 terminal of the ESD protection device U24; the PHY1_TXN terminal of the fieldbus communication chip U19C is connected to the NC4 terminal and Line-1 terminal of the ESD protection device U24; the PHY1_TXP terminal of the fieldbus communication chip U19C is connected to the NC3 terminal and Line-2 terminal of the ESD protection device U24; the ESD protection... The Line-4 terminal of device U24 is connected to the 1 terminal of network transformer U23A; the Line-3 terminal of the ESD protection device U24 is connected to the 3 terminal of network transformer U23A; the Line-2 terminal of the ESD protection device U24 is connected to the 6 terminal of network transformer U24B; the Line-1 terminal of the ESD protection device U24 is connected to the 8 terminal of network transformer U24B; the 14 and 16 terminals of network transformer U23A are connected to the RD- and RD+ terminals of switch T14, respectively; the 9 and 11 terminals of network transformer U24B are connected to the TD- and TD+ terminals of switch T14, respectively.

5. The high-performance eight-channel gateway based on the IO-LINK communication protocol according to claim 4, characterized in that, The power management control module includes power chips U6, U7, and U8. The +24V input terminal US is split into two paths after passing through a reverse voltage protection circuit and an overvoltage protection circuit. One path connects to the VIN terminal of power chip U6, and the other path connects to the ENA terminal of power chip U6 via resistor R9. The BOOT terminal of power chip U6 is connected to the 5V output terminal via inductor L3. The VSENSE terminal of power chip U6 is split into two paths: one path connects to the 5V output terminal via resistor R8, and the other path connects to the 5V output terminal via resistor R10 and Zener diode D8. The BOOT terminal of power chip U6 is connected to the 5V output terminal via a polarized capacitor C10 and inductor L3. The 5V output terminal is connected to the VSS terminal of power chip U7 via parallel polarized capacitors C19 and C18. The voltage output terminal is connected to the VIN terminal of power chip U7; the VOUT terminal of power chip U7 is connected to the 3.3V voltage output terminal of the fieldbus; the 3.3V voltage output terminal of the fieldbus is grounded through parallel polarized capacitors C21 and C22 and Zener diode D8; the 5V voltage output terminal is connected to the VSS terminal of power chip U8 through parallel polarized capacitors C20 and C23; the 5V voltage output terminal is connected to the VIN terminal of power chip U8; the VOUT terminal of power chip U8 is connected to the 3.3V voltage output terminal of microcontroller; the 3.3V voltage output terminal of microcontroller is grounded through parallel polarized capacitors C24 and C25 and Zener diode D10; the +24V voltage input terminal UA is connected to the A terminal of optocoupler U5 through Zener diode D7 and resistor R7; the C terminal of optocoupler U5 is connected to the 3.3V voltage output terminal of indicator light through resistor R6.

6. The high-performance eight-channel gateway based on the IO-LINK communication protocol according to claim 5, characterized in that, The data storage module includes a fieldbus storage chip U75 and a microcontroller storage chip U25; the 3.3V voltage output terminal of the fieldbus is connected to the VDD terminal of the fieldbus storage chip U75; the fieldbus storage chip U75 is connected to the fieldbus communication chip U19C via a memory interface; the 3.3V voltage output terminal of the microcontroller is connected to the VCC terminal of the microcontroller storage chip U25; the CS, CLK, and CKE terminals of the microcontroller storage chip U25 are connected to the control chip U7.

7. The high-performance eight-channel gateway based on the IO-LINK communication protocol according to claim 6, characterized in that, The current monitoring module includes a dual operational amplifier integrated circuit U9, which integrates a first operational amplifier and a second operational amplifier. The +24V voltage input terminal UA is connected to the 1IN- terminal of the first operational amplifier. The DET_I1 terminal is connected to the 1IN+ terminal of the first operational amplifier through a resistor R18. The 1OUT terminal of the first operational amplifier is divided into two paths: one path is connected to the 1IN- terminal of the first operational amplifier through a parallel polarized capacitor C34 and a resistor R15, and the other path is connected to the 2IN+ terminal of the second operational amplifier through a resistor R28. The 5V voltage output terminal is connected to the VCC terminal of the dual operational amplifier integrated circuit U9. The MCU_DET_I1 terminal is connected in parallel with the 2OUT terminal of the dual operational amplifier integrated circuit U9 through a resistor R13, and then connected to the 2IN- terminal of the amplifier chip U9 through a parallel polarized capacitor C36 and a resistor R19.

8. The high-performance eight-channel gateway based on the IO-LINK communication protocol according to claim 7, characterized in that, The indicator module includes LED D59 and LED D62; the operating status signal output terminal of the control chip U7 is connected to the 3.3V voltage output terminal of the indicator through LED D59 and resistor R238; the fault / abnormal signal output terminal of the control chip U7 is connected to the 3.3V voltage output terminal of the indicator through LED D62 and resistor R241.

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