Novel etching machine

Abstract

The utility model relates to a novel etching machine, and relates to the technical field of PCB production, the novel etching machine comprises a machine body, a conveying structure and a spraying structure, the machine body is hollow; the conveying structure is arranged in the machine body and is arranged in the horizontal direction, and the conveying structure can abut against and convey PCBs of different thicknesses; the spraying structures are arranged in the machine body and located on the two sides of the conveying structure in the height direction, and the spraying structures can spray micro-etching liquid medicine to the PCB. The micro-etching machine is used for solving the problem that an existing etching machine is difficult to adapt to PCBs with different thicknesses when carrying out micro-etching on the PCBs.

Description

A new type of etching machine Technical Field

[0001] This application relates to the field of PCB board manufacturing technology, and in particular to a novel etching machine. Background Technology

[0002] Etching machines are an indispensable key piece of equipment in the electronics manufacturing industry, widely used in the production process of printed circuit boards (PCBs). Existing PCB production processes may experience short circuits due to impurities remaining on the surface. Therefore, micro-etching and washing processes are added to remove residual copper oxide and copper mixtures from the PCB surface, reducing the likelihood of short circuits.

[0003] While existing spray etching machines can simultaneously transport and spray micro-etching solutions onto PCBs, they often struggle with precise positioning and stable transport when processing PCBs of varying thicknesses. This results in some PCBs easily shifting or being damaged during etching, severely impacting yield and product quality. Summary of the Invention

[0004] This application provides a novel etching machine to solve the problem that current etching machines are difficult to apply to PCBs of different thicknesses when performing micro-etching on PCBs.

[0005] A new type of etching machine includes:

[0006] The fuselage is hollow inside;

[0007] A conveying structure is located inside the machine body and is arranged in a horizontal direction. The conveying structure is capable of supporting and transporting PCB boards of different thicknesses.

[0008] A spray structure is located inside the machine body and on both sides of the conveying structure along the height direction. The spray structure is capable of spraying micro-etching solution onto the PCB board.

[0009] By adopting the above technical solution, the machine body provides the accommodating space, the conveying structure is responsible for supporting and horizontally conveying PCB boards of different thicknesses, and the spraying structure sprays micro-etching solution on the upper and lower sides of the conveying structure, which facilitates the etching of copper oxide and copper mixtures remaining on the surface of the PCB board, reducing the possibility of short circuits. This design realizes the integrated function of etching machine from board material conveying to chemical spraying, meeting the etching needs of PCB boards of different thicknesses.

[0010] In one embodiment, the conveying structure includes a plurality of upper conveying rollers and a plurality of lower conveying rollers arranged at intervals along the horizontal direction. The upper conveying rollers are all located above the lower conveying rollers, and PCB boards of different thicknesses can be placed between the upper conveying rollers and the lower conveying rollers and be conveyed by contact.

[0011] By adopting the above technical solution, the conveying structure consists of multiple upper and lower conveying rollers arranged at intervals. The PCB board is conveyed by the upper and lower rollers abutting against and rotating. This simple and straightforward structural design allows the etching machine to adapt to PCB boards of various thicknesses, enhancing the equipment's versatility and applicability, and reducing the cost of replacing equipment due to differences in PCB board thickness.

[0012] In one embodiment, the conveying structure further includes an adjustment component disposed above the upper conveying rollers and connected to each of the upper conveying rollers. The adjustment component enables the upper conveying rollers to move up and down to support PCB boards of different thicknesses.

[0013] By adopting the above technical solution, this design further optimizes the adaptability of the conveying structure to PCB boards of different thicknesses, eliminating the need for frequent manual replacement of rollers or adjustment of the conveying structure, and improving the automation level and production efficiency of the equipment.

[0014] In one embodiment, the adjusting assembly includes adjusting rods and transmission components. Two adjusting rods are arranged side-by-side, each extending horizontally to opposite ends of the machine body. The two adjusting rods are respectively connected to both ends of the upper conveying roller. The transmission components are arranged opposite each other on the machine body and fixed to the ends of the adjusting rods. The transmission components are capable of driving the adjusting rods to move up and down within the machine body.

[0015] By adopting the above technical solution, the transmission component fixes both ends of the adjusting rod to the machine body. One adjusting rod can be connected to the same end of the upper conveying roller, and the other adjusting rod is fully connected to the other end of the upper conveying roller. By moving up and down separately or simultaneously, the adjusting rod can drive the upper conveying roller to adjust its height, thereby supporting PCB boards of different thicknesses.

[0016] In one embodiment, the transmission component includes a first moving component, a second moving component, and a driving component. The first moving component is disposed on the machine body, the second moving component is connected to the first moving component, the driving component is disposed on the first moving component, and the adjusting rod is hinged to the second moving component.

[0017] By adopting the above technical solution, the driving component can drive the second moving component to move on the first moving component, thereby driving the adjusting rod to move up and down. Through the coordinated connection of the three components, precise control of the adjusting rod can be achieved. This design makes the operation of the adjusting component more flexible, and the position of the upper conveyor roller can be precisely adjusted according to the actual thickness of the PCB board, further improving the equipment's adaptability to PCB boards of different thicknesses.

[0018] In one embodiment, the conveying structure further includes a support member and a rotating member. The support member extends horizontally and is fixed to the machine body. The support member is connected to the corresponding upper conveying roller and lower conveying roller. The adjusting rod passes through the support member and is connected to the upper conveying roller. The rotating member is rotatably connected to the upper conveying roller and the lower conveying roller, respectively.

[0019] By adopting the above technical solution, the support component can fix the lower conveying roller and prevent the upper conveying roller from shifting in the horizontal direction. The rotating component is rotatably connected to the upper and lower conveying rollers respectively, so that it can control the speed and direction of the upper and lower conveying rollers respectively. This not only enhances the overall stability of the conveying structure, but also ensures the smooth rotation of the upper and lower conveying rollers, and guarantees the stability of the PCB board conveying process.

[0020] In one embodiment, the adjusting rod is provided with a plurality of fixed rods and fixed blocks corresponding one-to-one with the upper conveying rollers. One end of the fixed rod is connected to the adjusting rod, and the other end is connected to the fixed block. The fixed block is sleeved on the end of the upper conveying roller, and the rotating member is disposed on the fixed block and rotatably connected to the upper conveying roller.

[0021] By adopting the above technical solution, this connection method enhances the stability of the connection between the adjusting rod and the upper conveying roller, ensuring that the connection will not loosen during the adjustment of the position of the upper conveying roller and the conveying of PCB boards, thus guaranteeing the reliability of the equipment operation; at the same time, the use of a rotating component on the fixed block allows the upper conveying roller to rotate while moving up and down, which is convenient for supporting and transporting PCB boards of different thicknesses.

[0022] In one embodiment, the spraying structure includes an upper spray pipe and a lower spray pipe. The upper spray pipe is located above the upper conveying roller and has multiple upper nozzles, all of which face the upper conveying roller. The lower spray pipe is located below the lower conveying roller and has multiple lower nozzles, all of which face the lower conveying roller. The micro-etching solution can flow into the upper spray pipe and the lower spray pipe.

[0023] By adopting the above technical solution, this layout can ensure that the micro-etching solution is sprayed evenly and comprehensively onto the upper and lower surfaces of the PCB board from the upper and lower nozzles, ensuring comprehensive treatment of the PCB board by the etching process and improving the consistency of the etching effect.

[0024] In one embodiment, the spray structure further includes an upper fixed frame and a lower fixed frame. The two ends of the upper fixed frame are fixed to the machine body and located on the upper side of the upper conveying roller. The upper spray pipe is located on the upper fixed frame. The two ends of the lower fixed frame are fixed to the machine body and located on the lower side of the lower conveying roller. The lower spray pipe is located on the lower fixed frame.

[0025] By adopting the above technical solution, the fixing frame provides a stable support structure for the spray nozzle, ensuring that the spray nozzle can maintain a fixed position during the spraying process, avoiding displacement of the spray nozzle due to vibration or other external forces, thereby ensuring the accuracy and stability of the spraying.

[0026] In one embodiment, the novel etching machine further includes a water pumping structure, which includes a water pump and a delivery pipe. The micro-etching solution is disposed inside the machine body. The water pump extends into the micro-etching solution and is connected to one end of the delivery pipe. The other end of the delivery pipe is connected to the upper spray pipe and the lower spray pipe.

[0027] By adopting the above technical solution, the water pump can draw the chemical solution into the delivery pipe, which then connects to the upper and lower spray pipes. This simple yet effective design clarifies the working principle of the pumping structure, ensuring that the micro-etching chemical solution can be accurately delivered from the storage location to the spraying location, providing a reliable power transmission path for the normal operation of the etching machine.

[0028] In summary, this application includes at least one beneficial effect:

[0029] 1. The machine body provides the space to accommodate PCBs of different thicknesses. The conveying structure is responsible for supporting and horizontally conveying PCBs of different thicknesses. The spraying structure sprays micro-etching solution on the upper and lower sides of the conveying structure, which facilitates the etching of residual copper oxide and copper mixture on the surface of the PCB, reducing the possibility of short circuits. This design realizes the integrated function of etching machine from board material conveying to solution spraying, meets the etching needs of PCBs of different thicknesses, and provides the basic framework for subsequent etching processes.

[0030] 2. The transmission component fixes both ends of the adjusting rod to the machine body. One adjusting rod can be connected to the same end of the upper conveyor roller, and the other adjusting rod is fully connected to the other end of the upper conveyor roller. By moving up and down separately or simultaneously through the transmission component, the adjusting rod can drive the upper conveyor roller to adjust its height, thereby supporting PCB boards of different thicknesses.

[0031] 3. This connection method enhances the stability of the connection between the adjusting rod and the upper conveying roller, ensuring that the connection will not loosen during the adjustment of the position of the upper conveying roller and the conveying of PCB boards, thus guaranteeing the reliability of the equipment operation; at the same time, the use of a rotating component on the fixed block allows the upper conveying roller to rotate while moving up and down, which is convenient for supporting and transporting PCB boards of different thicknesses. Attached Figure Description

[0032] Figure 1 is a front view of a novel etching machine provided in an embodiment of this application;

[0033] Figure 2 is a side view of a novel etching machine provided in an embodiment of this application;

[0034] Figure 3 is a top view of a novel etching machine provided in an embodiment of this application.

[0035] Explanation of reference numerals in the attached drawings: 1. New type of etching machine; 11. Machine body; 12. Conveying structure; 121. Upper conveying roller; 122. Lower conveying roller; 123. Adjusting component; 124. Adjusting rod; 1241. Fixing rod; 1242. Fixing block; 125. Transmission component; 1251. First moving component; 1252. Second moving component; 1253. Driving component; 126. Support component; 127. Rotating component; 13. Spraying structure; 131. Upper spray pipe; 132. Lower spray pipe; 133. Upper nozzle; 134. Lower nozzle; 135. Upper fixed frame; 136. Lower fixed frame; 14. Water pumping structure; 141. Water pump; 142. Conveying pipe; 143. Filtering device. Detailed Implementation

[0036] The novel etching machine provided in this application will be further described in detail below with reference to Figures 1-3.

[0037] Example 1

[0038] Please refer to Figures 1-3. The novel etching machine 1 provided in this application embodiment includes a machine body 11, a conveying structure 12, and a spraying structure 13.

[0039] As shown in Figure 1, the body 11 is hollow and can be made of stainless steel, providing excellent corrosion resistance and durability. The inner wall of the body 11 can be coated with an anti-corrosion layer to prevent damage from chemical corrosion after prolonged use. Additionally, an observation window can be installed on the body 11 to allow operators to monitor the etching process in real time.

[0040] The conveying structure 12 is located inside the machine body 11 and is arranged horizontally, capable of supporting and conveying PCBs of different thicknesses. Specifically, the conveying structure 12 includes multiple upper conveying rollers 121 and multiple lower conveying rollers 122, which are arranged horizontally at intervals and are all rotatable. The upper conveying rollers 121 are located above the lower conveying rollers 122, and the PCBs are placed between the upper and lower conveying rollers 121 and can be supported and conveyed. The upper and lower conveying rollers 121 and 122 can be made of wear-resistant materials, such as polyurethane or rubber, to reduce wear on the PCBs; alternatively, they can be made of elastic materials, which, when facing PCBs of different thicknesses, are compressed and thus support the PCBs through elastic reaction force, while also reducing wear on the PCBs. The diameter of the rollers can be adjusted according to actual needs, generally between 20 mm and 50 mm. In addition, the conveying structure 12 can also be equipped with a tensioning device to ensure that the rollers always maintain appropriate tension and prevent loosening or slippage.

[0041] As shown in Figure 2, the conveying structure 12 also includes an adjustment component 123. The adjustment component 123 is located above the upper conveying rollers 121 and connected to each upper conveying roller 121. The adjustment component 123 enables the upper conveying rollers 121 to move up and down to support PCB boards of different thicknesses. Specifically, the adjustment component 123 may include an adjustment rod 124 and a transmission component 125. Two adjustment rods 124 are arranged side by side and extend horizontally to opposite ends of the machine body 11. One adjustment rod 124 is connected to the same end of each upper conveying roller 121, and the other adjustment rod 124 is connected to the other end of each upper conveying roller 121. The transmission components 125 are arranged opposite each other on the machine body 11 and are fixed to the two ends of the adjustment rods 124 respectively. The transmission components 125 can drive the adjustment rods 124 to move up and down within the machine body 11.

[0042] The transmission component 125 may include a first moving component 1251, a second moving component 1252, and a driving component 1253. The first moving component 1251 is disposed on the body 11, the second moving component 1252 is connected to the first moving component 1251, the driving component 1253 is disposed on the first moving component 1251, and the end of the adjusting rod 124 is hinged to the second moving component 1252. In this embodiment, the first moving component 1251 is a sliding plate, which is fixed to the body 11 and is provided with a slide rail. The second moving component 1252 is a slider, which is connected to the slide rail. A rack extends along the height direction on the slider. The driving component 1253 is a motor, which is provided with gears on its exterior. The rack is connected to the gears. When the motor is turned on, it drives the gears to rotate, thereby causing the slider as a whole to move the adjusting rod 124 up and down. This enables one end of the adjusting rod 124 to move relative to the other end or to move simultaneously; and also enables relative or simultaneous movement between the two adjusting rods 124.

[0043] The conveying structure 12 may further include a support member 126 and a rotating member 127. The support member 126 extends horizontally and is fixed to the machine body 11. The support member 126 is connected to the corresponding upper conveying roller 121 and lower conveying roller 122. An adjusting rod 124 passes through the support member 126 and is connected to the upper conveying roller 121. The rotating member 127 is rotatably connected to both the upper conveying roller 121 and the lower conveying roller 122. The support member 126 may be made of high-strength plastic. The support member 126 has a recessed through groove to facilitate the adjustment rod 124 passing through the support member 126 and to allow the upper conveying roller 121 to move up and down within the support member 126. At the same time, the support member 126 can limit the horizontal deviation of the upper conveying roller 121. In this embodiment, the adjusting rod 124 is provided with multiple fixed rods 1241 and fixed blocks 1242 corresponding one-to-one with the upper conveying rollers 121. One end of the fixed rod 1241 is connected to the adjusting rod 124, and the other end is connected to the fixed block 1242. The fixed block 1242 is fitted over the end of the upper conveying roller 121. The rotating member 127 is disposed in the fixed block 1242 and rotatably connected to the upper conveying roller 121. Therefore, the upper conveying roller 121 can rotate within the fixed block following the rotating member 127 to transport the PCB board. In addition, it can also be moved up and down by the fixed block 1242 according to the movement of the adjusting rod 124, which is convenient for supporting PCB boards of different thicknesses. The fixed rods 1241 can be made of carbon steel and have a chrome-plated surface to increase hardness and corrosion resistance. Meanwhile, the rotating component 127 is also located at the end of the support component 126 away from the lower conveying roller 122 and is rotatably connected to the lower conveying roller 122. The support component 126 is used to fix the lower conveying roller 122, and the rotating component 127 can drive the lower conveying roller 122 to rotate.

[0044] The spray structure 13 is located inside the machine body 11 and on both sides of the conveying structure 12 along the height direction, capable of spraying micro-etching solution onto the PCB board. Specifically, the spray structure 13 includes an upper spray pipe 131 and a lower spray pipe 132, respectively located above the upper conveying roller 121 and below the lower conveying roller 122. The upper spray pipe 131 has an upper nozzle 133 facing the upper conveying roller 121; the lower spray pipe 132 has a lower nozzle 134 facing the lower conveying roller 122. In this embodiment, the spacing between the upper nozzles 133 and the lower nozzles 134 facing the spacing between the lower conveying rollers 122 facilitates better spraying of the micro-etching solution onto the PCB surface. The nozzles can be atomizing nozzles, causing the solution to form fine droplets for better coverage of the PCB board surface. The nozzle orifice diameter can be between 0.1 mm and 0.3 mm to ensure spraying effect. The spray structure 13 also includes an upper fixed frame 135 and a lower fixed frame 136. The two ends of the upper fixed frame 135 are fixed to the machine body 11 and are located on the upper side of the upper conveyor roller 121. The upper spray pipe 131 is located on the upper fixed frame 135. The two ends of the lower fixed frame 136 are fixed to the machine body 11 and are located on the lower side of the lower conveyor roller 122. The lower spray pipe 132 is located on the lower fixed frame 136. The fixed frames can be made of aluminum alloy, which is lightweight and strong, and easy to install and maintain.

[0045] The main components of the micro-etching solution can be hydrogen peroxide (H2O2) and sulfuric acid (H2SO4), with the H2SO4 content controlled at 50 mL / L ± 10 mL / L and the H2O2 content controlled at 35 mL / L ± 10 mL / L; the temperature range is 30°C ± 2°C. Alternatively, the solution can consist of sodium sulfite (Na2S2O8) and sulfuric acid (H2SO4), with the H2SO4 content controlled at 20 mL / L ± 5 mL / L and the Na2S2O8 content controlled at 90 g / L ± 10 g / L; the temperature is between 25°C and 30°C. Both solutions can effectively etch the copper and copper oxide mixture on the PCB board surface, thereby preventing short circuits. The reaction time during the micro-etching process is generally 40 to 60 seconds, and the thickness of the etched copper is approximately 1.0 μm.

[0046] As shown in Figure 3, to further improve the recycling efficiency of the chemical solution, the new etching machine 1 also includes a water pumping structure 14. The chemical solution is located at the bottom inside the machine body 11, and the water pumping structure 14 can pump the chemical solution into the upper spray pipe 131 and the lower spray pipe 132. Specifically, the water pumping structure 14 can include a water pump 141 and a delivery pipe 142. The water pump 141 extends into the chemical solution and is connected to one end of the delivery pipe 142, while the other end of the delivery pipe 142 is connected to both the upper spray pipe 131 and the lower spray pipe 132. The pump body can be driven by a brushless DC motor, which operates smoothly and with low noise. The delivery pipe 142 can be made of flexible PVC pipe, which has good flexibility and pressure resistance. In addition, the water pumping structure 14 also includes a filter device 143 connected to the delivery pipe 142, which is used to filter out impurities in the chemical solution and prevent nozzle clogging. The filter device 143 can use a multi-layer filter screen, with the mesh size of each layer gradually decreasing to achieve fine filtration.

[0047] The implementation principle of this embodiment is as follows: the transmission component 125 on the machine body 11 drives one or both ends of the adjusting rod 124 to move up and down, thereby adjusting the height of the upper conveying roller 121, so that the upper conveying roller 121 and the lower conveying roller 122 can support and transport PCB boards of different thicknesses, ensuring that they remain stable during the transport process and avoiding deviation and damage; at the same time, the design of the spray structure 13 allows the chemical solution to evenly cover the entire surface of the PCB board, improving the consistency and reliability of the etching effect.

[0048] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A novel etching machine, characterized in that, include: The machine body (11) is hollow inside; the conveying structure (12) is located inside the machine body (11) and is arranged in the horizontal direction. The conveying structure (12) can support and transport PCB boards of different thicknesses; the spraying structure (13) is located inside the machine body (11) and is located on both sides of the conveying structure (12) in the height direction. The spraying structure (13) can spray micro-etching solution onto the PCB board.

2. The novel etching machine according to claim 1, characterized in that, The conveying structure (12) includes a plurality of upper conveying rollers (121) and a plurality of lower conveying rollers (122) arranged at intervals along the horizontal direction. The upper conveying rollers (121) are all located on the upper side of the lower conveying rollers (122). PCB boards of different thicknesses can be placed between the upper conveying rollers (121) and the lower conveying rollers (122) and conveyed by contact.

3. The novel etching machine according to claim 2, characterized in that, The conveying structure (12) further includes an adjustment component (123), which is located on the upper side of the upper conveying roller (121) and connected to each of the upper conveying rollers (121). The adjustment component (123) enables the upper conveying rollers (121) to move up and down to support PCB boards of different thicknesses.

4. A novel etching machine according to claim 3, characterized in that, The adjustment assembly (123) includes an adjustment rod (124) and a transmission component (125). Two adjustment rods (124) are arranged side by side and extend horizontally to opposite ends of the machine body (11). The two adjustment rods (124) are respectively connected to the two ends of the upper conveying roller (121). The transmission components (125) are arranged opposite to each other on the machine body (11) and fixed to the two ends of the adjustment rods (124). The transmission components (125) can drive the adjustment rods (124) to move up and down within the machine body (11).

5. A novel etching machine according to claim 4, characterized in that, The transmission component (125) includes a first moving component (1251), a second moving component (1252), and a driving component (1253). The first moving component (1251) is disposed on the body (11), the second moving component (1252) is connected to the first moving component (1251), the driving component (1253) is disposed on the first moving component (1251), and the adjusting rod (124) is hinged to the second moving component (1252).

6. A novel etching machine according to claim 5, characterized in that, The conveying structure (12) further includes a support member (126) and a rotating member (127). The support member (126) extends horizontally and is fixed to the machine body (11). The support member (126) is connected to the corresponding upper conveying roller (121) and lower conveying roller (122). The adjusting rod (124) passes through the support member (126) and is connected to the upper conveying roller (121). The rotating member (127) is rotatably connected to the upper conveying roller (121) and the lower conveying roller (122) respectively.

7. A novel etching machine according to claim 6, characterized in that, The adjusting rod (124) is provided with a plurality of fixed rods (1241) and fixed blocks (1242) corresponding one-to-one with the upper conveying roller (121). One end of the fixed rod (1241) is connected to the adjusting rod (124), and the other end is connected to the fixed block (1242). The fixed block (1242) is sleeved on the end of the upper conveying roller (121). The rotating member (127) is provided on the fixed block (1242) and is rotatably connected to the upper conveying roller (121).

8. A novel etching machine according to claim 3, characterized in that, The spray structure (13) includes an upper spray pipe (131) and a lower spray pipe (132). The upper spray pipe (131) is located on the upper side of the adjusting component. The upper spray pipe (131) is provided with a plurality of upper nozzles (133), all of which face the upper conveying roller (121). The lower spray pipe (132) is located on the lower side of the lower conveying roller (122). The lower spray pipe (132) is provided with a plurality of lower nozzles (134), all of which face the lower conveying roller (122). The micro-etching solution can flow into the upper spray pipe (131) and the lower spray pipe (132).

9. A novel etching machine according to claim 8, characterized in that, The spray structure (13) further includes an upper fixed frame (135) and a lower fixed frame (136). The two ends of the upper fixed frame (135) are fixed to the machine body (11) and located on the upper side of the upper conveying roller (121). The upper spray pipe (131) is located on the upper fixed frame (135). The two ends of the lower fixed frame (136) are fixed to the machine body (11) and located on the lower side of the lower conveying roller (122). The lower spray pipe (132) is located on the lower fixed frame (136).

10. A novel etching machine according to claim 9, characterized in that, The novel etching machine (1) also includes a water pumping structure (14), which includes a water pump (141) and a delivery pipe (142). The micro-etching solution is located inside the machine body. The water pump (141) extends into the micro-etching solution and is connected to one end of the delivery pipe (142). The other end of the delivery pipe (142) is connected to the upper spray pipe (131) and the lower spray pipe (132).

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